JP6923474B2 - 半導体素子用パッケージおよび半導体装置 - Google Patents

半導体素子用パッケージおよび半導体装置 Download PDF

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JP6923474B2
JP6923474B2 JP2018056149A JP2018056149A JP6923474B2 JP 6923474 B2 JP6923474 B2 JP 6923474B2 JP 2018056149 A JP2018056149 A JP 2018056149A JP 2018056149 A JP2018056149 A JP 2018056149A JP 6923474 B2 JP6923474 B2 JP 6923474B2
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plate
substrate
semiconductor device
wiring
semiconductor element
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JP2019169607A (ja
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茂典 高谷
茂典 高谷
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Kyocera Corp
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Kyocera Corp
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JP2018056149A 2018-03-23 2018-03-23 半導体素子用パッケージおよび半導体装置 Active JP6923474B2 (ja)

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JP2018056149A JP6923474B2 (ja) 2018-03-23 2018-03-23 半導体素子用パッケージおよび半導体装置
JP2021123462A JP7196249B2 (ja) 2018-03-23 2021-07-28 半導体素子用パッケージおよび半導体装置

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JP2018056149A JP6923474B2 (ja) 2018-03-23 2018-03-23 半導体素子用パッケージおよび半導体装置

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JP2019169607A JP2019169607A (ja) 2019-10-03
JP6923474B2 true JP6923474B2 (ja) 2021-08-18

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JP2018056149A Active JP6923474B2 (ja) 2018-03-23 2018-03-23 半導体素子用パッケージおよび半導体装置
JP2021123462A Active JP7196249B2 (ja) 2018-03-23 2021-07-28 半導体素子用パッケージおよび半導体装置

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Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4480598B2 (ja) * 2004-02-26 2010-06-16 京セラ株式会社 電子部品収納用パッケージおよび電子装置
JP2006128261A (ja) * 2004-10-27 2006-05-18 Kyocera Corp 入出力端子ならびにこれを用いた電子部品収納用パッケージおよび電子装置
JP2006128267A (ja) 2004-10-27 2006-05-18 Kyocera Corp 入出力端子ならびにこれを用いた電子部品収納用パッケージおよび電子装置
JP2007005636A (ja) * 2005-06-24 2007-01-11 Kyocera Corp 入出力端子および電子部品収納用パッケージならびに電子装置
JP2009158511A (ja) * 2007-12-25 2009-07-16 Sumitomo Metal Electronics Devices Inc 入出力端子及び半導体素子収納用パッケージ
US9408307B2 (en) * 2012-03-22 2016-08-02 Kyocera Corporation Device housing package
JP6853034B2 (ja) * 2015-12-25 2021-03-31 京セラ株式会社 光半導体素子収納用パッケージおよび光半導体装置

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JP7196249B2 (ja) 2022-12-26
JP2019169607A (ja) 2019-10-03
JP2021170675A (ja) 2021-10-28

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