JP2021116347A - Radical curable composition and cured product - Google Patents
Radical curable composition and cured product Download PDFInfo
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- JP2021116347A JP2021116347A JP2020010396A JP2020010396A JP2021116347A JP 2021116347 A JP2021116347 A JP 2021116347A JP 2020010396 A JP2020010396 A JP 2020010396A JP 2020010396 A JP2020010396 A JP 2020010396A JP 2021116347 A JP2021116347 A JP 2021116347A
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- carbon
- curable composition
- radical
- addition
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Links
- 239000000203 mixture Substances 0.000 title claims abstract description 69
- -1 polycyclic hydrocarbon Chemical class 0.000 claims abstract description 49
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 36
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 35
- 150000001875 compounds Chemical class 0.000 claims abstract description 35
- 238000007259 addition reaction Methods 0.000 claims abstract description 32
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims abstract description 29
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 25
- 239000004215 Carbon black (E152) Substances 0.000 claims abstract description 21
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 19
- 150000002430 hydrocarbons Chemical group 0.000 claims abstract description 17
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 9
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 6
- 239000000047 product Substances 0.000 claims description 20
- 150000001451 organic peroxides Chemical group 0.000 claims description 18
- INYHZQLKOKTDAI-UHFFFAOYSA-N 5-ethenylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C=C)CC1C=C2 INYHZQLKOKTDAI-UHFFFAOYSA-N 0.000 claims description 14
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 13
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 10
- 239000003999 initiator Substances 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 30
- 150000003254 radicals Chemical class 0.000 description 20
- 239000002096 quantum dot Substances 0.000 description 18
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 16
- 238000001723 curing Methods 0.000 description 15
- 239000000463 material Substances 0.000 description 10
- 239000007789 gas Substances 0.000 description 9
- 239000003566 sealing material Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 229920001296 polysiloxane Polymers 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 229910052697 platinum Inorganic materials 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 5
- 238000006459 hydrosilylation reaction Methods 0.000 description 5
- 239000012299 nitrogen atmosphere Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 3
- 238000013006 addition curing Methods 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 2
- UHXCHUWSQRLZJS-UHFFFAOYSA-N (4-dimethylsilylidenecyclohexa-2,5-dien-1-ylidene)-dimethylsilane Chemical compound C[Si](C)C1=CC=C([Si](C)C)C=C1 UHXCHUWSQRLZJS-UHFFFAOYSA-N 0.000 description 2
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 2
- SPSPIUSUWPLVKD-UHFFFAOYSA-N 2,3-dibutyl-6-methylphenol Chemical compound CCCCC1=CC=C(C)C(O)=C1CCCC SPSPIUSUWPLVKD-UHFFFAOYSA-N 0.000 description 2
- OGFPIZPNFPWPOO-UHFFFAOYSA-H C(=C)[Si](O[Si](C=C)(C)C)(C)C.[Pt](Cl)(Cl)(Cl)(Cl)(Cl)Cl Chemical compound C(=C)[Si](O[Si](C=C)(C)C)(C)C.[Pt](Cl)(Cl)(Cl)(Cl)(Cl)Cl OGFPIZPNFPWPOO-UHFFFAOYSA-H 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- JUIBLDFFVYKUAC-UHFFFAOYSA-N [5-(2-ethylhexanoylperoxy)-2,5-dimethylhexan-2-yl] 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C(CC)CCCC JUIBLDFFVYKUAC-UHFFFAOYSA-N 0.000 description 2
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 125000000732 arylene group Chemical group 0.000 description 2
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 239000007809 chemical reaction catalyst Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical compound [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- OTTZHAVKAVGASB-UHFFFAOYSA-N hept-2-ene Chemical compound CCCCC=CC OTTZHAVKAVGASB-UHFFFAOYSA-N 0.000 description 2
- 230000009545 invasion Effects 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- SYSQUGFVNFXIIT-UHFFFAOYSA-N n-[4-(1,3-benzoxazol-2-yl)phenyl]-4-nitrobenzenesulfonamide Chemical class C1=CC([N+](=O)[O-])=CC=C1S(=O)(=O)NC1=CC=C(C=2OC3=CC=CC=C3N=2)C=C1 SYSQUGFVNFXIIT-UHFFFAOYSA-N 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000002574 poison Substances 0.000 description 2
- 231100000614 poison Toxicity 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- ZICNIEOYWVIEQJ-UHFFFAOYSA-N (2-methylbenzoyl) 2-methylbenzenecarboperoxoate Chemical compound CC1=CC=CC=C1C(=O)OOC(=O)C1=CC=CC=C1C ZICNIEOYWVIEQJ-UHFFFAOYSA-N 0.000 description 1
- AGKBXKFWMQLFGZ-UHFFFAOYSA-N (4-methylbenzoyl) 4-methylbenzenecarboperoxoate Chemical compound C1=CC(C)=CC=C1C(=O)OOC(=O)C1=CC=C(C)C=C1 AGKBXKFWMQLFGZ-UHFFFAOYSA-N 0.000 description 1
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- RMSGQZDGSZOJMU-UHFFFAOYSA-N 1-butyl-2-phenylbenzene Chemical group CCCCC1=CC=CC=C1C1=CC=CC=C1 RMSGQZDGSZOJMU-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- QYXVDGZUXHFXTO-UHFFFAOYSA-L 3-oxobutanoate;platinum(2+) Chemical compound [Pt+2].CC(=O)CC([O-])=O.CC(=O)CC([O-])=O QYXVDGZUXHFXTO-UHFFFAOYSA-L 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- SAJZVGCCGDKDEA-UHFFFAOYSA-N C1(=CC=C(C=C1)OOC(=O)OCCCCCCOC(=O)OOC1=CC=C(C=C1)C)C Chemical compound C1(=CC=C(C=C1)OOC(=O)OCCCCCCOC(=O)OOC1=CC=C(C=C1)C)C SAJZVGCCGDKDEA-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- OVXYRNUGKHWZBC-UHFFFAOYSA-N [5-(2-ethylhexanoylperoxy)-2,5-dimethoxyhexan-2-yl] 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(CCC(C)(OC)OOC(=O)C(CC)CCCC)OC OVXYRNUGKHWZBC-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000002877 alkyl aryl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 125000002529 biphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C12)* 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- QZYRMODBFHTNHF-UHFFFAOYSA-N ditert-butyl benzene-1,2-dicarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1C(=O)OOC(C)(C)C QZYRMODBFHTNHF-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000001298 n-hexoxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000004957 naphthylene group Chemical group 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000001782 photodegradation Methods 0.000 description 1
- DOIRQSBPFJWKBE-UHFFFAOYSA-N phthalic acid di-n-butyl ester Natural products CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
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Abstract
Description
本発明は、ラジカル硬化型組成物及び硬化物に関する。 The present invention relates to radically curable compositions and cured products.
発光ダイオード(LED)は、その発光効率の目覚ましい向上を背景とし、低い消費電力、高寿命、意匠性などを特徴として液晶ディスプレイ(LCD)のバックライト向けや車のヘッドライト等の車載分野ばかりではなく一般照明向けでも急激に市場を拡大しつつある。このようなLEDライトは、基板に実装されたLED素子を透明な樹脂からなる封止材で封止した構成である。このLEDを封止する封止材としては、優れた耐熱性を有する点から、付加硬化型シリコーン組成物が幅広く使用されている(特許文献1)。しかしながら、シリコーン組成物からなる封止材料は、ガスバリア性が低いために、外部からの腐食性ガスの侵入により銀電極が変色し、LEDの輝度が低下してしまう場合がある。 Light emitting diodes (LEDs) are characterized by low power consumption, long life, design, etc. against the background of remarkable improvement in luminous efficiency, and are not limited to in-vehicle fields such as liquid crystal display (LCD) backlights and car headlights. The market is expanding rapidly even for general lighting. Such an LED light has a configuration in which an LED element mounted on a substrate is sealed with a sealing material made of a transparent resin. As a sealing material for sealing this LED, an addition-curing silicone composition is widely used because it has excellent heat resistance (Patent Document 1). However, since the sealing material made of the silicone composition has a low gas barrier property, the silver electrode may be discolored due to the intrusion of corrosive gas from the outside, and the brightness of the LED may be lowered.
そのため、多環式炭化水素骨格を有する有機変性付加硬化型シリコーン組成物を用いた光学素子用封止材料が提案されている。このような組成物から得られる封止材料は、高いガスバリア性を有するため、外部からの腐食ガスの侵入を防ぎ、銀電極の変色を抑えることが可能である(特許文献2,3)。 Therefore, a sealing material for an optical element using an organically modified addition-curable silicone composition having a polycyclic hydrocarbon skeleton has been proposed. Since the sealing material obtained from such a composition has a high gas barrier property, it is possible to prevent the invasion of corrosive gas from the outside and suppress the discoloration of the silver electrode (Patent Documents 2 and 3).
近年、波長変換材として、優れた波長変換効率を有する量子ドットが注目されている。量子ドットは水分に弱いため、ガスバリア性の高い材料で封止する必要がある。一方、量子ドットには付加反応の触媒毒が含まれていることが多く、量子ドットのバインダー材料として付加硬化型の組成物を用いると硬化不良が発生する場合があった。さらに、量子ドットは耐熱性が低いため、付加硬化型材料の硬化条件には耐えることが困難である。 In recent years, as a wavelength conversion material, quantum dots having excellent wavelength conversion efficiency have been attracting attention. Since quantum dots are sensitive to moisture, they must be sealed with a material with high gas barrier properties. On the other hand, quantum dots often contain a catalytic poison of an addition reaction, and when an addition-curing composition is used as a binder material for the quantum dots, curing defects may occur. Further, since quantum dots have low heat resistance, it is difficult to withstand the curing conditions of an addition-curable material.
本発明は、上記事情に鑑みなされたものであって、低温で硬化可能なラジカル硬化型組成物を提供することを目的とする。 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a radical-curable composition that can be cured at a low temperature.
上記課題を解決するために、本発明では、(A)(a)下記式(1)で表されるSi−H基含有化合物と、(b)付加反応性炭素−炭素二重結合を1分子中に2個有する多環式炭化水素との付加反応生成物からなる骨格を有し、かつ、(メタ)アクリル基を片方または両方の分子末端に有する(メタ)アクリル基含有化合物、及び、
(B)重合開始剤
を含有するものであることを特徴とするラジカル硬化型組成物を提供する。
In order to solve the above problems, in the present invention, one molecule of (A) (a) a Si—H group-containing compound represented by the following formula (1) and (b) an addition-reactive carbon-carbon double bond A (meth) acrylic group-containing compound having a skeleton consisting of an addition reaction product with two polycyclic hydrocarbons contained therein and having a (meth) acrylic group at the end of one or both molecules, and a compound containing a (meth) acrylic group.
(B) Provided is a radical curable composition characterized by containing a polymerization initiator.
本発明のラジカル硬化型組成物であれば、低温での硬化が可能である。 The radically curable composition of the present invention can be cured at a low temperature.
本発明のラジカル硬化型組成物は、前記(A)成分が、付加反応性炭素−炭素二重結合を1分子中に2個有するケイ素含有付加反応生成物と、(c)下記式(2)で表されるシロキサン化合物との付加反応生成物である(メタ)アクリル基含有化合物であって、
前記ケイ素含有付加反応生成物が、(a)前記Si−H基含有化合物と、(b)前記多環式炭化水素との付加反応生成物であることが好ましい。
It is preferable that the silicon-containing addition reaction product is (a) an addition reaction product of the Si—H group-containing compound and (b) the polycyclic hydrocarbon.
このようなラジカル硬化型組成物であれば、より硬化性に優れる。 Such a radical curable composition is more excellent in curability.
本発明のラジカル硬化型組成物は、前記多環式炭化水素が、5−ビニルビシクロ[2.2.1]ヘプト−2−エン、及び6―ビニルビシクロ[2.2.1]ヘプト−2−エンのいずれか、またはこれらの組み合わせであることがより好ましい。 In the radical curable composition of the present invention, the polycyclic hydrocarbons are 5-vinylbicyclo [2.2.1] hept-2-ene and 6-vinylbicyclo [2.2.1] hept-2. -Any of the en, or a combination thereof, is more preferable.
このようなラジカル硬化型組成物であれば、硬度、耐クラック性、耐熱性、ガスバリア性に優れた硬化物を得ることができる。 With such a radical curable composition, a cured product having excellent hardness, crack resistance, heat resistance, and gas barrier property can be obtained.
本発明のラジカル硬化型組成物は、前記(A)成分が、下記式(3)で表される化合物であることがより一層好ましい。
このようなラジカル硬化型組成物であれば、硬度、耐クラック性、耐熱性、ガスバリア性により優れた硬化物を得ることができる。 With such a radical curable composition, a cured product having more excellent hardness, crack resistance, heat resistance, and gas barrier property can be obtained.
本発明のラジカル硬化型組成物は、前記重合開始剤が、有機過酸化物、又は、光重合開始剤であることが好ましい。 In the radical curable composition of the present invention, it is preferable that the polymerization initiator is an organic peroxide or a photopolymerization initiator.
このような重合開始剤は、本発明の組成物をより効果的に硬化させることができる。 Such a polymerization initiator can cure the composition of the present invention more effectively.
この場合、前記有機過酸化物が、10時間半減期温度50〜150℃のものであることがより好ましい。 In this case, it is more preferable that the organic peroxide has a 10-hour half-life temperature of 50 to 150 ° C.
このような有機過酸化物であれば、組成物の保存安定性および硬化性の制御性に優れる。 Such an organic peroxide is excellent in storage stability and curability controllability of the composition.
また、本発明は、上記ラジカル硬化型組成物の硬化物を提供する。 The present invention also provides a cured product of the radical curable composition.
本発明の硬化物は、優れた透明性と良好な硬度を備えているため、光学素子の封止材やフィルター等の用途に有用である。 Since the cured product of the present invention has excellent transparency and good hardness, it is useful for applications such as encapsulants and filters for optical elements.
本発明のラジカル硬化型シリコーン組成物は、ラジカル硬化により低温での硬化が可能であるため、量子ドットのバインダー材料として有用であり、本発明のラジカル硬化型組成物を硬化して得られる硬化物は優れた透明性と良好な硬度を有するため、LED素子の封止材や波長変換フィルター等の用途に有用である。 Since the radical-curable silicone composition of the present invention can be cured at a low temperature by radical curing, it is useful as a binder material for quantum dots, and is a cured product obtained by curing the radical-curable composition of the present invention. Has excellent transparency and good hardness, and is therefore useful for applications such as encapsulants for LED elements and wavelength conversion filters.
本発明者らは、上記目的を達成するために鋭意検討した結果、後述する(A)及び(B成分を含むラジカル硬化型組成物であれば、上記課題を解決できることを見出し、本発明を完成させた。 As a result of diligent studies to achieve the above object, the present inventors have found that the above-mentioned problems can be solved if the radical-curable composition containing the components (A) and (B) described later is used, and the present invention is completed. I let you.
即ち、本発明は、
(A)(a)下記式(1)で表されるSi−H基含有化合物と、(b)付加反応性炭素−炭素二重結合を1分子中に2個有する多環式炭化水素との付加反応生成物からなる骨格を有し、かつ、(メタ)アクリル基を片方または両方の分子末端に有する(メタ)アクリル基含有化合物、及び、
(B)重合開始剤
を含有するものであることを特徴とするラジカル硬化型組成物である。
That is, the present invention
(A) (a) A Si—H group-containing compound represented by the following formula (1) and (b) a polycyclic hydrocarbon having two addition-reactive carbon-carbon double bonds in one molecule. A (meth) acrylic group-containing compound having a skeleton consisting of an addition reaction product and having a (meth) acrylic group at one or both molecular ends, and
(B) A radical-curable composition characterized by containing a polymerization initiator.
以下、本発明について詳細に説明するが、本発明はこれらに限定されるものではない。 Hereinafter, the present invention will be described in detail, but the present invention is not limited thereto.
[ラジカル硬化型組成物]
本発明のラジカル硬化型組成物は、後述する(A)および(B)成分を必須成分として含有するものである。この組成物は、前記必須成分以外に必要に応じて任意の成分を更に含むことができる。
[Radical curable composition]
The radically curable composition of the present invention contains the components (A) and (B) described later as essential components. This composition may further contain any component other than the essential component, if necessary.
以下、各成分について詳細に説明する。 Hereinafter, each component will be described in detail.
[(A)成分]
(A)成分は、(a)下記式(1)で表されるSi−H基含有化合物と、(b)付加反応性炭素−炭素二重結合を1分子中に2個有する多環式炭化水素との付加反応生成物からなる分子鎖を有し、かつ、(メタ)アクリル基を分子鎖の片方の末端または両方の末端に有する(メタ)アクリル基含有化合物である。このような(メタ)アクリル基含有化合物は、(a)前記Si−H基含有化合物と、(b)前記多環式炭化水素との付加反応生成物からなる骨格を有し、かつ、(メタ)アクリル基を片方または両方の分子末端に有する。
なお、本発明において「付加反応性」とは、ケイ素原子に結合した水素原子と周知のヒドロシリル化反応により付加反応し得る性質を意味する。
The component (A) is a polycyclic hydrocarbon having (a) a Si—H group-containing compound represented by the following formula (1) and (b) two addition-reactive carbon-carbon double bonds in one molecule. It is a (meth) acrylic group-containing compound having a molecular chain composed of an addition reaction product with hydrogen and having a (meth) acrylic group at one end or both ends of the molecular chain. Such a (meth) acrylic group-containing compound has a skeleton composed of (a) an addition reaction product of the Si—H group-containing compound and (b) the polycyclic hydrocarbon, and (meth). ) It has an acrylic group at the end of one or both molecules.
In the present invention, the term "addition reactivity" means a property that allows an addition reaction with a hydrogen atom bonded to a silicon atom by a well-known hydrosilylation reaction.
<(a)成分>
(a)成分は、下記式(1)で表されるSi−H基含有化合物である。
The component (a) is a Si—H group-containing compound represented by the following formula (1).
R1の炭素原子数1〜12の1価炭化水素基の具体例としては、メチル、エチル、n−プロピル、イソプロピル、n−ブチル、イソブチル、sec−ブチル、tert−ブチル、n−ペンチル、n−ヘキシル、n−オクチル、n−デシル、シクロペンチル、シクロヘキシル基等の炭素原子数1〜12のアルキル基;フェニル、ナフチル基等の炭素原子数6〜12のアリール基;トリル、キシリル、エチルフェニル、プロピルフェニル、ブチルフェニル、ペンチルフェニル、ヘキシルフェニル基等の炭素原子数7〜12のアルキルアリール基;ベンジル、フェネチル基等の炭素原子数7〜12のアラルキル基などが挙げられる。 Specific examples of the monovalent hydrocarbon group having 1 to 12 carbon atoms of R 1 include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, n. Alkyl groups having 1 to 12 carbon atoms such as −hexyl, n-octyl, n-decyl, cyclopentyl and cyclohexyl groups; aryl groups having 6 to 12 carbon atoms such as phenyl and naphthyl groups; tolyl, xsilyl, ethylphenyl, Alkylaryl groups having 7 to 12 carbon atoms such as propylphenyl, butylphenyl, pentylphenyl and hexylphenyl groups; and aralkyl groups having 7 to 12 carbon atoms such as benzyl and phenethyl groups can be mentioned.
また、炭素原子数1〜6のアルコキシ基の具体例としては、メトキシ、エトキシ、n−プロポキシ、i−プロポキシ、n−ブトキシ、sec−ブトキシ、t−ブトキシ、n−ペンチルオキシ、n−ヘキシルオキシ、シクロペンチルオキシ、シクロヘキシルオキシ基等が挙げられる。 Specific examples of the alkoxy group having 1 to 6 carbon atoms include methoxy, ethoxy, n-propoxy, i-propoxy, n-butoxy, sec-butoxy, t-butoxy, n-pentyloxy, and n-hexyloxy. , Cyclopentyloxy, cyclohexyloxy group and the like.
これらの中でも、R1としては、炭素原子数1〜8のアルキル基が好ましく、メチル基がより好ましい。 Among these, R 1, preferably an alkyl group having 1 to 8 carbon atoms, more preferably a methyl group.
一方、R2の炭素原子数1〜12の2価炭化水素基の具体例としては、メチレン、エチレン、プロピレン、トリメチレン、ペンタメチレン、ヘキサメチレン、ヘプタメチレン、オクタメチレン、ノナメチレン、デカメチレン基等の炭素原子数1〜12の直鎖、分岐または環状のアルキレン基;フェニレン、ビフェニレン、ナフチレン基等の炭素原子数6〜12のアリーレン基、フェニレンメチレン、メチレンフェニレンメチレン基等の炭素原子数7〜12のアラルキレン基などが挙げられる。 On the other hand, specific examples of the divalent hydrocarbon group having 1 to 12 carbon atoms of R 2 include carbons such as methylene, ethylene, propylene, trimethylene, pentamethylene, hexamethylene, heptamethylene, octamethylene, nonamethylene and decamethylene groups. Linear, branched or cyclic alkylene group having 1 to 12 atoms; arylene group having 6 to 12 carbon atoms such as phenylene, biphenylene and naphthylene group, and phenylene methylene, methylene phenylene methylene group having 7 to 12 carbon atoms. Examples include an aralkylene group.
これらの中でも、炭素原子数6〜12のアリーレン基が好ましく、フェニレン基がより好ましい。 Among these, an arylene group having 6 to 12 carbon atoms is preferable, and a phenylene group is more preferable.
(a)成分の具体例としては、下記式で示されるものが挙げられるが、これらに限定されるものではない。なお、Meはメチル基を表す。
なお、式(1)で表される化合物は、1種単独で用いても、2種以上組み合わせて用いてもよい。 The compound represented by the formula (1) may be used alone or in combination of two or more.
<(b)成分>
(b)成分は、付加反応性炭素−炭素二重結合を1分子中に2個有する多環式炭化水素である。
<(B) component>
The component (b) is a polycyclic hydrocarbon having two addition-reactive carbon-carbon double bonds in one molecule.
(b)成分の付加反応性炭素−炭素二重結合を1分子中に2個有する多環式炭化水素としては、(i)多環式炭化水素の骨格を形成している炭素原子のうち、隣接する2つの炭素原子間に付加反応性炭素−炭素二重結合が形成されているもの、(ii)多環式炭化水素の骨格を形成している炭素原子に結合した水素原子が、付加反応性炭素−炭素二重結合含有基によって置換されているもの、(iii)多環式炭化水素の骨格を形成している炭素原子のうち、隣接する2つの炭素原子間に付加反応性炭素−炭素二重結合が形成されており、かつ、多環式炭化水素の骨格を形成している炭素原子に結合した水素原子が付加反応性炭素−炭素二重結合含有基によって置換されているもの等を用いることができる。 Examples of the polycyclic hydrocarbon having two addition-reactive carbon-carbon double bonds of the component (b) in one molecule include (i) carbon atoms forming the skeleton of the polycyclic hydrocarbon. An addition-reactive carbon-carbon double bond is formed between two adjacent carbon atoms, and (ii) a hydrogen atom bonded to a carbon atom forming the backbone of a polycyclic hydrocarbon is an addition reaction. Addition-reactive carbon-carbon between two adjacent carbon atoms among the carbon atoms substituted by the sex carbon-carbon double bond-containing group and the carbon atoms forming the framework of (iii) polycyclic hydrocarbons. Those in which a double bond is formed and the hydrogen atom bonded to the carbon atom forming the backbone of the polycyclic hydrocarbon is replaced by an addition-reactive carbon-carbon double bond-containing group, etc. Can be used.
上記多環式炭化水素の具体例としては、下記式(3)で表される5−ビニルビシクロ[2.2.1]ヘプト−2−エン、式(4)で表される6−ビニルビシクロ[2.2.1]ヘプト−2−エン等が挙げられ、これらは混合物として用いることもできる(以下、これらを区別する必要がない場合は、「ビニルノルボルネン」と総称することがある)。
なお、上記ビニルノルボルネンのビニル基の置換位置は、シス配置(エキソ型)またはトランス配置(エンド型)のいずれであってもよく、また、これらの配置の相違によって化合物の反応性等に特段の差異がないことから、両配置の異性体の組み合わせであってもよい。 The vinyl group substitution position of the vinyl norbornene may be either a cis configuration (exo type) or a trans configuration (end type), and the difference in these arrangements may cause the reactivity of the compound to be particularly different. Since there is no difference, it may be a combination of isomers of both configurations.
また、ビニルノルボルネン以外の上記多環式炭化水素の具体例としては、ジシクロペンタジエン及びその誘導体が挙げられる。 Specific examples of the polycyclic hydrocarbon other than vinylnorbornene include dicyclopentadiene and its derivatives.
(a)成分と(b)成分との付加反応生成物としては、特に限定されるものではないが、下記式(5)で表されるものが好ましく、特に、R1がメチル基である下記式(6)で表されるものがより好ましい。
(a)成分と(b)成分との付加反応生成物からなる骨格は、前記付加反応性炭素−炭素二重結合に由来する結合を有する二価の残基から構成される。例えば、上記式(5)で表される付加反応生成物からなる骨格は、下記の式で表される。
このような多環式炭化水素およびフェニレン基を含有する付加反応生成物を主骨格とした化合物は、硬度、耐クラック性、耐熱性に優れる硬化物を与えるため、特に好適に用いることができる。 Such a compound having an addition reaction product containing a polycyclic hydrocarbon and a phenylene group as a main skeleton can be particularly preferably used because it gives a cured product having excellent hardness, crack resistance, and heat resistance.
(a)成分と(b)成分との付加反応生成物は、例えば、特開2005−133073号公報に記載の方法によって合成することができる。 The addition reaction product of the component (a) and the component (b) can be synthesized, for example, by the method described in JP-A-2005-133073.
一例としては、(a)成分1モルに対し、(b)成分を1モル超10モル以下、好ましくは1モル超5モル以下の量で、ヒドロシリル化反応触媒の存在下で付加反応させることにより調製できる。 As an example, by adding reaction of the component (b) to 1 mol of the component (a) in an amount of more than 1 mol and 10 mol or less, preferably more than 1 mol and 5 mol or less in the presence of a hydrosilylation reaction catalyst. Can be prepared.
この場合、ヒドロシリル化反応触媒としては、公知のものを使用することができ、その具体例としては、白金金属を担持したカーボン粉末、白金黒、塩化第2白金、塩化白金酸、塩化白金酸と一価アルコールとの反応生成物、塩化白金酸とオレフィン類との錯体、白金ビスアセトアセテート等の白金系触媒;パラジウム系触媒、ロジウム系触媒などの白金族金属系触媒などが挙げられる。また、付加反応条件、溶媒の使用等については、特に限定されず公知のとおりとすればよい。 In this case, known hydrosilylation reaction catalysts can be used, and specific examples thereof include carbon powder carrying a platinum metal, platinum black, second platinum chloride, platinum chloride acid, and platinum chloride acid. Examples thereof include reaction products with monovalent alcohols, complexes of platinum chloride acid and olefins, platinum-based catalysts such as platinum bisacetoacetate; platinum-based metal catalysts such as palladium-based catalysts and rhodium-based catalysts. The addition reaction conditions, the use of the solvent, and the like are not particularly limited and may be as known.
上記反応では、(a)式(1)で表される化合物に対して過剰モル量の(b)多環式炭化水素を反応させることから、(A)成分の付加反応生成物は、(b)多環式炭化水素に由来する付加反応性炭素−炭素二重結合を1分子中に2個有することができる。 In the above reaction, an excess molar amount of the polycyclic hydrocarbon (b) is reacted with the compound represented by the formula (a) (1), so that the addition reaction product of the component (A) is (b). ) It is possible to have two addition-reactive carbon-carbon double bonds derived from polycyclic hydrocarbons in one molecule.
<(c)成分>
(A)成分は、例えば、(a)成分と(b)成分との付加反応生成物の1分子中に2個(両末端に)存在する付加反応性炭素−炭素二重結合のいずれか一方、または両方と、(c)下記式(2)で表されるシロキサン化合物のSiH基とをヒドロシリル化反応させることにより得ることができる。
The component (A) is, for example, one of two addition-reactive carbon-carbon double bonds (at both ends) present in one molecule of the addition reaction product of the component (a) and the component (b). , Or both, and (c) the SiH group of the siloxane compound represented by the following formula (2) can be obtained by hydrosilylation reaction.
また、(A)成分は、まず(a)成分と(b)成分との付加反応により付加反応性炭素−炭素二重結合を1分子中に2個有するケイ素含有付加反応生成物を得て、次いで得られた生成物の分子両末端に存在する2つの付加反応性炭素−炭素二重結合の両方と、(c)成分のシロキサン化合物のSiH基とをヒドロシリル化反応させることにより得ることができる。
この場合、(A)成分は、付加反応性炭素−炭素二重結合を1分子中に2個有するケイ素含有付加反応生成物と、(c)上記式(2)で表されるシロキサン化合物との付加反応生成物である(メタ)アクリル基含有化合物であって、前記ケイ素含有付加反応生成物が、(a)前記Si−H基含有化合物と、(b)前記多環式炭化水素との付加反応生成物となる。本発明の(A)成分としては、このような(メタ)アクリル基を両方の分子末端に有する(メタ)アクリル基含有化合物が好ましい。
Further, as the component (A), first, a silicon-containing addition reaction product having two addition-reactive carbon-carbon double bonds in one molecule was obtained by an addition reaction between the component (a) and the component (b). It can then be obtained by hydrosilylating both of the two addition-reactive carbon-carbon double bonds present at both ends of the molecule of the obtained product with the SiH group of the siloxane compound of component (c). ..
In this case, the component (A) is a silicon-containing addition reaction product having two addition-reactive carbon-carbon double bonds in one molecule, and (c) a siloxane compound represented by the above formula (2). An addition reaction product, which is a (meth) acrylic group-containing compound, wherein the silicon-containing addition reaction product is addition of (a) the Si—H group-containing compound and (b) the polycyclic hydrocarbon. It becomes a reaction product. As the component (A) of the present invention, a (meth) acrylic group-containing compound having such a (meth) acrylic group at both molecular ends is preferable.
(c)成分としては、例えば下記式(7)で表されるシロキサン化合物が挙げられる。
ヒドロシリル化反応条件、溶媒の使用等については、特に限定されず公知のとおりとすればよい。 The hydrosilylation reaction conditions, the use of the solvent, and the like are not particularly limited and may be as known.
<(d)成分>
また、(A)成分は、(a)成分と(b)成分との付加反応生成物の両末端に存在する付加反応性炭素−炭素二重結合の一方、または両方と、(d)下記式(8)で表される含ハロゲンシロキサン化合物のSiH基とをヒドロシリル化反応させ、次いで、水酸基型アクリル酸エステル化合物を反応させることによっても得ることができる。
R5 3−mXmSiH (8)
(式中、R5はそれぞれ独立に、付加反応性炭素−炭素二重結合を含まない炭素原子数1〜6の1価炭化水素基を表し、Xはハロゲン原子であり、mは1または2である。)
<Ingredient (d)>
In addition, the component (A) includes one or both of the addition-reactive carbon-carbon double bonds present at both ends of the addition reaction product of the component (a) and the component (b), and (d) the following formula. It can also be obtained by hydrosilylating the SiH group of the halogen-containing siloxane compound represented by (8) and then reacting it with a hydroxyl group acrylic acid ester compound.
R 5 3-m X m SiH (8)
(In the formula, R 5 independently represents a monovalent hydrocarbon group having 1 to 6 carbon atoms that does not contain an addition-reactive carbon-carbon double bond, X is a halogen atom, and m is 1 or 2. Is.)
Xのハロゲン原子の具体例としては、塩素、臭素、ヨウ素等が挙げられ、塩素が好ましい。 Specific examples of the halogen atom of X include chlorine, bromine, iodine and the like, and chlorine is preferable.
R5の付加反応性炭素−炭素二重結合を含まない炭素原子数1〜6の1価炭化水素基の具体例としては、メチル、エチル、n−プロピル、イソプロピル、n−ブチル、イソブチル、sec−ブチル、tert−ブチル、n−ペンチル、n−ヘキシル、シクロヘキシル基等のアルキル基;フェニル基が挙げられ、特にメチル基、フェニル基が好ましい。 Specific examples of a monovalent hydrocarbon group having 1 to 6 carbon atoms that does not contain an addition-reactive carbon-carbon double bond of R 5 include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, and sec. Alkyl groups such as −butyl, tert-butyl, n-pentyl, n-hexyl, cyclohexyl group; phenyl group is mentioned, and methyl group and phenyl group are particularly preferable.
(d)成分の具体例としては、下記式で表されるものが挙げられるが、これらに限定されるものではない。
水酸基型アクリル酸エステル化合物としては、2−ヒドロキシエチルアクリレート、2−ヒドロキシプロピルアクリレート、2−ヒドロキシエチルメタクリレート、2−ヒドロキシプロピルメタクリレート、4−ヒドロキシブチルアクリレート等が挙げられ、2−ヒドロキシアルキルアクリレートが好ましい。 Examples of the hydroxyl group type acrylic acid ester compound include 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 4-hydroxybutyl acrylate and the like, and 2-hydroxyalkyl acrylate is preferable. ..
(A)成分の好ましい具体例としては、下記式で表されるもの等が挙げられるが、これらに限定されるものではない。
(A)成分は、下記式(3)で表される化合物が特に好ましい。
(A)成分は1種単独で又は2種以上を組み合わせて用いることができる。 The component (A) can be used alone or in combination of two or more.
[(B)成分]
(B)成分は(A)成分の(メタ)アクリル基等重合性官能基を重合させる重合開始剤であり、(B)成分としては、熱によりラジカルを発生させる有機過酸化物、もしくは紫外線等の光によりラジカルを発生させる光重合開始剤を用いることができる。
[(B) component]
The component (B) is a polymerization initiator that polymerizes a polymerizable functional group such as a (meth) acrylic group of the component (A), and the component (B) is an organic peroxide that generates radicals by heat, ultraviolet rays, or the like. A photopolymerization initiator that generates radicals by the light of the above can be used.
(有機過酸化物)
有機過酸化物としては、組成物の保存安定性および硬化性の制御の点、ならびに量子ドットの耐熱温度の点から、10時間半減期温度が50〜150℃の有機化過酸化物が好ましく、より好ましくは60〜110℃の有機過酸化物である。
(Organic peroxide)
As the organic peroxide, an organic peroxide having a 10-hour half-life temperature of 50 to 150 ° C. is preferable from the viewpoint of controlling the storage stability and curability of the composition and the heat-resistant temperature of the quantum dots. More preferably, it is an organic peroxide at 60 to 110 ° C.
有機過酸化物の具体例としては、ベンゾイルパーオキサイド、t−ブチルパーベンゾエート、o−メチルベンゾイルパーオキサイド、p−メチルベンゾイルパーオキサイド、ジ−t−ブチルパーオキサイド、ジクミルパーオキサイド、1,1−ビス(t−ブチルパーオキシ)−3,3,5−トリメチルシクロヘキサン、1,1−ジーテトラブチルパーオキシ−シクロヘキサン、2,5−ジメチル−2,5−ジ(t−ブチルパーオキシ)ヘキサン、2,5−ジメチル−2,5−ジ(t−ブチルパーオキシ)ヘキシン、1,6−ビス(p−トルオイルパーオキシカルボニルオキシ)ヘキサン、ジ(4−メチルベンゾイルパーオキシ)ヘキサメチレンビスカーボネート、2,5−ジメトキシ−2,5―ジ(2−エチルヘキサノイルパーオキシ)ヘキサン、2,5−ジメチル−2,5―ジ(2−エチルヘキサノイルパーオキシ)ヘキサン等が挙げられる。 Specific examples of the organic peroxide include benzoyl peroxide, t-butyl perbenzoate, o-methylbenzoyl peroxide, p-methylbenzoyl peroxide, di-t-butyl peroxide, dicumyl peroxide, 1,1 -Bis (t-butylperoxy) -3,3,5-trimethylcyclohexane, 1,1-ditetrabutylperoxy-cyclohexane, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane , 2,5-Dimethyl-2,5-di (t-butylperoxy) hexin, 1,6-bis (p-toluyl peroxycarbonyloxy) hexane, di (4-methylbenzoylperoxy) hexamethylenebis Examples thereof include carbonate, 2,5-dimethoxy-2,5-di (2-ethylhexanoylperoxy) hexane, and 2,5-dimethyl-2,5-di (2-ethylhexanoylperoxy) hexane.
また、有機過酸化物は商業的にも入手でき、例えば、日油株式会社から入手することができる。具体的には、パーブチルNHP(50.6)、パーヘキシルPV(53.2)、パーブチルPV(54.6)、パーロイル355(59.4)、パーロイルL(61.6)、パーオクタO(65.3)、パーロイルSA(65.9)、パーヘキサ25O(66.2)、パーヘキシルO(69.9)、ナイパ−PMB(70.6)、パーブチルO(72.1)、ナイパーBMT(73.1)、ナイパーBW(73.6)、パーヘキサMC(83.2)、パーヘキサTMH(86.7)、パーヘキサHC(87.1)、パーヘキサC(90.7)、パーテトラA(94.7)、パーヘキシルI(95.0)、パーブチルMA(96.1)、パーブチル355(97.1)、パーブチルL(98.3)、パーブチルI(98.7)、パーブチルE(99.0)、パーヘキシルZ(99.4)、パーヘキサ25Z(99.7)、パーブチルA(101.9)、パーヘキサ22(103.1)、パーブチルZ(104.3)、パーヘキサV(104.5)、パーブチルP(119.2)、パークミルD(116.4)、パーヘキシルD(116.4)、パーヘキサ25B(117.9)、パーブチルC(119.5)、パーブチルD(123.7)、パーメンタH(128.0)、パーヘキシン25B(128.4)、パークミルP(145.1)などがある。なお、上記化合物名に続く括弧内の数字は、それぞれの10時間半減期温度(単位:℃)である。 Organic peroxides are also commercially available, for example from NOF CORPORATION. Specifically, perbutyl NHP (50.6), perhexyl PV (53.2), perbutyl PV (54.6), perloyl 355 (59.4), perloyl L (61.6), perocta O (65. 3), Perloyl SA (65.9), Perhexa 25O (66.2), Perhexyl O (69.9), Niper-PMB (70.6), Perbutyl O (72.1), Niper BMT (73.1) ), Niper BW (73.6), Perhexa MC (83.2), Perhexa TMH (86.7), Perhexa HC (87.1), Perhexa C (90.7), Pertetra A (94.7), Perhexyl I (95.0), Perbutyl MA (96.1), Perbutyl355 (97.1), Perbutyl L (98.3), Perbutyl I (98.7), Perbutyl E (99.0), Perhexyl Z (99.4), Perhexa 25Z (99.7), Perbutyl A (101.9), Perhexa 22 (103.1), Perbutyl Z (104.3), Perhexa V (104.5), Perbutyl P (119). .2), Park Mill D (116.4), Perhexyl D (116.4), Perhexa 25B (117.9), Perbutyl C (119.5), Perbutyl D (123.7), Permenta H (128.0). ), Perhexin 25B (128.4), Park Mill P (145.1) and the like. The numbers in parentheses following the compound name are the respective 10-hour half-life temperatures (unit: ° C.).
上記有機過酸化物のうち、(A)成分との相溶性および10時間半減期温度の観点から、好ましくは、2,5−ジメチル−2,5―ジ(2−エチルヘキサノイルパーオキシ)ヘキサン(日油(株)製、パーヘキサ(登録商標)25O、10時間半減期温度66.2℃)である。 Of the above organic peroxides, 2,5-dimethyl-2,5-di (2-ethylhexanoylperoxy) hexane is preferable from the viewpoint of compatibility with the component (A) and a 10-hour half-life temperature. (Perhexa® 25O, manufactured by Nichiyu Co., Ltd., 10-hour half-life temperature 66.2 ° C.).
これらの有機過酸化物は1種単独で又は2種以上を組み合わせて用いることができる。 These organic peroxides can be used alone or in combination of two or more.
有機過酸化物の添加量は、有効量でよいが、通常、(A)成分100質量部に対して0.01〜10質量部、より好ましくは0.1〜5質量部である。 The amount of the organic peroxide added may be an effective amount, but is usually 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass with respect to 100 parts by mass of the component (A).
(光重合開始剤)
光重合開始剤の具体例としては、2,2−ジエトキシアセトフェノン、2,2−ジメトキシ−1,2−ジフェニルエタン−1−オン、1−ヒドロキシ−シクロヘキシル−フェニル−ケトン、2−ヒドロキシ−2−メチル−1−フェニル−プロパン−1−オン、2−ヒドロキシ−1−{4−[4−(2−ヒドロキシ−2−メチループロピオニル)−ベンジル]−フェニル}−2−メチループロパン−1−オン、フェニルグリオキシリックアシッドメチルエステル、2−メチル−1−[4−(メチルチオ)フェニル]−2−モルフォリノプロパン−1−オン、2−ベンジル−2−ジメチルアミノ−1−(4−モルフォリノフェニル)−1−ブタノン、ビス(2,4,6−トリメチルベンゾイル)−フェニルフォスフィンオキサイド、2,4,6−トリメチルベンゾイル−ジフェニル−フォスフィンオキサイド等が挙げられる。
(Photopolymerization initiator)
Specific examples of the photopolymerization initiator include 2,2-diethoxyacetophenone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, and 2-hydroxy-2. -Methyl-1-phenyl-propane-1-one, 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] -phenyl} -2-methyl-propane-1 -On, phenylglycylic acid methyl ester, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-) Examples thereof include morpholinophenyl) -1-butanone, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide and the like.
上記光重合開始剤のうち、(A)成分との相溶性の観点から好ましくは、2,2−ジエトキシアセトフェノン、2−ヒドロキシ−2−メチル−1−フェニル−プロパン−1−オン(IGM Resins B.V製Omnirad 1173)、ビス(2,4,6−トリメチルベンゾイル)−フェニルフォスフィンオキサイド(IGM Resins B.V製Omnirad 819)、2,4,6−トリメチルベンゾイル−ジフェニル−フォスフィンオキサイド(IGM Resins B.V製Omnirad TPO H)である。 Of the above photopolymerization initiators, 2,2-diethoxyacetophenone and 2-hydroxy-2-methyl-1-phenyl-propane-1-one (IGM Resins) are preferable from the viewpoint of compatibility with the component (A). B.V. Omnirad 1173), Bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide (IGM Resins B.V. Omnirad 819), 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide (2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide) IGM Resins B.V. Omnirad TPO H).
これらの光重合開始剤は1種単独で又は2種以上を組み合わせて用いることができる。 These photopolymerization initiators can be used alone or in combination of two or more.
光重合開始剤の添加量は、硬化性の観点から、(A)成分100質量部に対して0.1〜10質量部が好ましい。 The amount of the photopolymerization initiator added is preferably 0.1 to 10 parts by mass with respect to 100 parts by mass of the component (A) from the viewpoint of curability.
[その他の成分]
本発明のラジカル硬化型組成物には、硬化物の着色、白濁、酸化劣化等の発生を抑えるために、2,6−ジ−t−ブチル−4−メチルフェノール等の公知の酸化防止剤を配合してもよい。また、光劣化に対する抵抗性を付与するために、ヒンダードアミン系安定剤等の光安定剤を配合してもよい。さらに、必要に応じて、強度を向上させるためにヒュームドシリカ等の無機質充填剤を配合してもよいし、染料、顔料、難燃剤等を配合してもよい。接着力を向上させるために接着助剤(シランカップリング剤等)を配合してもよい。
[Other ingredients]
The radical-curable composition of the present invention contains a known antioxidant such as 2,6-di-t-butyl-4-methylphenol in order to suppress the occurrence of coloring, cloudiness, oxidative deterioration, etc. of the cured product. It may be blended. Further, in order to impart resistance to photodegradation, a light stabilizer such as a hindered amine-based stabilizer may be added. Further, if necessary, an inorganic filler such as fumed silica may be blended in order to improve the strength, or a dye, a pigment, a flame retardant or the like may be blended. An adhesive aid (silane coupling agent, etc.) may be added to improve the adhesive strength.
また、本発明のラジカル硬化型組成物には、波長変換材料として蛍光体や量子ドットを配合してもよい。量子ドットは通常、平均粒径が20nm以下の粒子であり、光エネルギーを吸収・変換することができる。量子ドットはその粒径を変えることで光の色を調整することができる。粒径の大きさによりバンドギャップが決まるため、粒径を揃えることで色純度の高い光を得ることができる。 Further, the radical curable composition of the present invention may contain a phosphor or quantum dots as a wavelength conversion material. Quantum dots are usually particles having an average particle size of 20 nm or less, and can absorb and convert light energy. The color of light can be adjusted by changing the particle size of quantum dots. Since the band gap is determined by the size of the particle size, it is possible to obtain light with high color purity by making the particle size uniform.
量子ドットは、可視光域で放射するのもとしては、CdSやZnSe、ZnSのようなシェルを有するCdSe系粒子が挙げられる。また、InP、CuInS2、AgInS2、Te、PbS、InAsなどのカドミウムフリーの量子ドットも用いることができる。本発明では従来のいかなる種類の量子ドットも使用することができる。 Quantum dots radiate in the visible light region, and examples thereof include CdSe-based particles having shells such as CdS, ZnSe, and ZnS. Cadmium-free quantum dots such as InP, CuInS 2 , AgInS 2 , Te, PbS, and InAs can also be used. Any conventional quantum dot can be used in the present invention.
上述のように、一般に量子ドットには付加反応の触媒毒が含まれていることが多く、量子ドットのバインダー材料として付加硬化型の組成物を用いると硬化不良が発生する場合がある。さらに、量子ドットは耐熱性が低いため、付加硬化型材料の硬化条件には耐えることが困難である。
一方、本発明のラジカル硬化型シリコーン組成物は、ラジカル硬化により低温での硬化が可能であるため、付加硬化型組成物を用いた場合の上記問題点を回避でき、量子ドットのバインダー材料として有用である。
As described above, quantum dots generally contain a catalytic poison of an addition reaction, and if an addition-curing composition is used as a binder material for the quantum dots, curing failure may occur. Further, since quantum dots have low heat resistance, it is difficult to withstand the curing conditions of an addition-curable material.
On the other hand, since the radical-curable silicone composition of the present invention can be cured at a low temperature by radical curing, the above-mentioned problems when the addition-curable composition is used can be avoided, and it is useful as a binder material for quantum dots. Is.
[硬化物]
本発明は、上記ラジカル硬化型組成物の硬化物も提供する。
本発明のラジカル硬化型シリコーン組成物は、ラジカル硬化により低温での硬化が可能であり、本発明のラジカル硬化型組成物を硬化して得られる硬化物は優れた透明性と良好な硬度を有するため、LED素子の封止材や波長変換フィルター等の用途に有用である。
また、多環式炭化水素骨格を有する本発明のラジカル硬化型シリコーン組成物を光学素子用封止材料に用いると、得られる封止材料(硬化物)は、高いガスバリア性を有するため、外部からの腐食ガスの侵入を防ぐことができる。そして、水分に弱い量子ドットを封止するための材料としても有用である。
[Cured product]
The present invention also provides a cured product of the radical curable composition.
The radical-curable silicone composition of the present invention can be cured at a low temperature by radical curing, and the cured product obtained by curing the radical-curable composition of the present invention has excellent transparency and good hardness. Therefore, it is useful for applications such as a sealing material for LED elements and a wavelength conversion filter.
Further, when the radical curable silicone composition of the present invention having a polycyclic hydrocarbon skeleton is used as a sealing material for an optical element, the obtained sealing material (cured product) has a high gas barrier property, so that it can be obtained from the outside. It is possible to prevent the invasion of corrosive gas. It is also useful as a material for sealing quantum dots that are sensitive to moisture.
[硬化方法および硬化条件]
本発明のラジカル硬化型組成物のうち、有機過酸化物を含有する熱ラジカル硬化タイプの硬化方法および硬化条件としては、公知の方法および条件を採用することができる。一例を挙げると、窒素雰囲気下、70〜150℃において10分〜5時間の条件で硬化させることができる。特に、重合開始剤が、10時間半減期温度50〜150℃の有機過酸化物である場合は、より低温硬化が可能であり好ましい。
[Curing method and conditions]
Among the radical-curable compositions of the present invention, known methods and conditions can be adopted as the curing method and curing conditions of the thermal radical curing type containing an organic peroxide. As an example, it can be cured in a nitrogen atmosphere at 70 to 150 ° C. for 10 minutes to 5 hours. In particular, when the polymerization initiator is an organic peroxide having a 10-hour half-life temperature of 50 to 150 ° C., it is preferable because it can be cured at a lower temperature.
また、光重合開始剤を含有する光硬化タイプのラジカル硬化型組成物については、紫外線等の光を照射することで硬化させることができる。紫外線の光源として、例えば、UVLEDランプ、高圧水銀灯、超高圧水銀灯、メタルハライドランプ、カーボンアークランプ、及びキセノンランプ等が挙げられる。紫外線の照射量(積算光量)は、例えば、本発明の組成物を2.0mm程度の厚みに成形したシートに対して、好ましくは1〜10,000mJ/cm2であり、より好ましくは10〜9,000mJ/cm2である。即ち、照度100mW/cm2の紫外線を用いた場合、0.01〜100秒程度紫外線を照射することで硬化させることができる。 Further, a photocurable type radical curable composition containing a photopolymerization initiator can be cured by irradiating with light such as ultraviolet rays. Examples of the light source of ultraviolet rays include UV LED lamps, high-pressure mercury lamps, ultra-high pressure mercury lamps, metal halide lamps, carbon arc lamps, xenon lamps and the like. The irradiation amount (integrated light amount) of ultraviolet rays is, for example, preferably 1 to 10,000 mJ / cm 2 and more preferably 10 to 10 with respect to a sheet obtained by molding the composition of the present invention into a thickness of about 2.0 mm. It is 9,000 mJ / cm 2 . That is, when ultraviolet rays having an illuminance of 100 mW / cm 2 are used, they can be cured by irradiating the ultraviolet rays for about 0.01 to 100 seconds.
以下、実施例を用いて本発明を具体的に説明するが、これらの実施例は本発明を何ら制限するものではない。なお、以下において、反応生成物のFT−IR、NMR、およびGPCは常法により測定し、25℃における粘度は、B型回転式粘度計により測定した。 Hereinafter, the present invention will be specifically described with reference to Examples, but these Examples do not limit the present invention in any way. In the following, the reaction products FT-IR, NMR, and GPC were measured by a conventional method, and the viscosity at 25 ° C. was measured by a B-type rotary viscometer.
[合成例1]
撹拌装置、冷却管、滴下ロートおよび温度計を備えた5Lの4つ口フラスコに、ビニルノルボルネン(商品名:V0062、東京化成工業(株)製;5−ビニルビシクロ[2.2.1]ヘプト−2−エンと6−ビニルビシクロ[2.2.1]ヘプト−2−エンとの略等モル量の異性体混合物)1,785g(14.88モル)、およびトルエン455gを加え、オイルバスを用いて85℃に加熱した。
これに5%質量の白金金属を担持したカーボン粉末3.6gを添加し、撹拌しながら1,4−ビス(ジメチルシリル)ベンゼン1,698g(8.75モル)を180分かけて滴下した。滴下終了後、110℃で24時間撹拌した後、25℃まで冷却した。その後、白金金属担持カーボンを濾過して除去し、トルエンおよび過剰のビニルノルボルネンを減圧留去して、無色透明なオイル状の反応生成物(ab−1)(25℃における粘度:12,820mPa・s)3,362gを得た。
反応生成物のFT−IR、NMR、およびGPC分析の結果、下記式(9)においてn=0の化合物が約41モル%、n=1の化合物が約32モル%、n=2の化合物が約27モル%の混合物であった。また、混合物中の付加反応性炭素−炭素二重結合の含有量は0.36モル/100gであった。
Vinyl norbornene (trade name: V0062, manufactured by Tokyo Chemical Industry Co., Ltd .; 5-vinylbicyclo [2.2.1] Hept Add 1,785 g (14.88 mol) of an isomer mixture of -2-ene and 6-vinylbicyclo [2.2.1] hept-2-ene in approximately equal molar amounts, and 455 g of toluene, and add an oil bath. Was heated to 85 ° C.
3.6 g of carbon powder carrying a 5% mass of platinum metal was added thereto, and 1,698 g (8.75 mol) of 1,4-bis (dimethylsilyl) benzene was added dropwise over 180 minutes with stirring. After completion of the dropping, the mixture was stirred at 110 ° C. for 24 hours and then cooled to 25 ° C. Then, the platinum metal-supported carbon was filtered off, and toluene and excess vinyl norbornene were distilled off under reduced pressure to obtain a colorless and transparent oily reaction product (ab-1) (viscosity at 25 ° C.: 12,820 mPa. s) 3,362 g was obtained.
As a result of FT-IR, NMR, and GPC analysis of the reaction product, in the following formula (9), about 41 mol% of the compound with n = 0, about 32 mol% of the compound with n = 1, and the compound with n = 2. It was a mixture of about 27 mol%. The content of the addition-reactive carbon-carbon double bond in the mixture was 0.36 mol / 100 g.
[合成例2]
撹拌装置、冷却管、滴下ロートおよび温度計を備えた1Lの4つ口フラスコに、合成例1で得られた(ab−1)200gをトルエン100gに溶解させ、ジブチルヒドロキシトルエン0.2gを添加し、オイルバスを用いて80℃に加熱した。これに六塩化白金1,3−ジビニルテトラメチルジシロキサンのトルエン溶液(白金換算で0.5質量%)を0.15g添加し、撹拌しながら、下記式(10)で表されるオルガノハイドロジェンジシロキサン189.6gを滴下した。滴下終了後、95℃で2時間撹拌した後、トルエンを減圧留去して、無色透明なオイル状の反応生成物(A−1)(25℃における粘度:870mPa・s)376.7gを得た。
200 g of (ab-1) obtained in Synthesis Example 1 was dissolved in 100 g of toluene and 0.2 g of dibutylhydroxytoluene was added to a 1 L four-necked flask equipped with a stirrer, a cooling tube, a dropping funnel and a thermometer. Then, it was heated to 80 ° C. using an oil bath. To this, 0.15 g of a toluene solution of platinum hexachloride 1,3-divinyltetramethyldisiloxane (0.5% by mass in terms of platinum) was added, and while stirring, the organohydrogen represented by the following formula (10) was added. 189.6 g of disiloxane was added dropwise. After completion of the dropping, the mixture was stirred at 95 ° C. for 2 hours, and then toluene was distilled off under reduced pressure to obtain 376.7 g of a colorless and transparent oily reaction product (A-1) (viscosity at 25 ° C.: 870 mPa · s). rice field.
[合成例3]
撹拌装置、冷却管、滴下ロートおよび温度計を備えた5Lの4つ口フラスコに、ビニルノルボルネン(商品名:V0062、東京化成工業(株)製;5−ビニルビシクロ[2.2.1]ヘプト−2−エンと6−ビニルビシクロ[2.2.1]ヘプト−2−エンとの略等モル量の異性体混合物)270g(2.25モル)、およびトルエン2.5gを加え、オイルバスを用いて85℃に加熱した。
これに5%質量の白金金属を担持したカーボン粉末0.19gを添加し、撹拌しながら1,4−ビス(ジメチルシリル)ベンゼン174.5g(0.90モル)を滴下した。滴下終了後、110℃で24時間撹拌した後、25℃まで冷却した。その後、白金金属担持カーボンを濾過して除去し、トルエンおよび過剰のビニルノルボルネンを減圧留去して、無色透明なオイル状の反応生成物(ab−2)(25℃における粘度:1,710mPa・s)311gを得た。
反応生成物のFT−IR、NMR、およびGPC分析の結果、前記式(9)においてn=0の化合物が約74モル%、n=1の化合物が約21モル%、n=2の化合物が約5モル%の混合物であった。また、混合物中の付加反応性炭素−炭素二重結合の含有量は0.37モル/100gであった。
[Synthesis Example 3]
Vinyl norbornene (trade name: V0062, manufactured by Tokyo Chemical Industry Co., Ltd .; 5-vinylbicyclo [2.2.1] Hept Add 270 g (2.25 mol) of a mixture of -2-ene and 6-vinylbicyclo [2.2.1] hepto-2-ene in approximately equal molar amounts of isomers, and 2.5 g of toluene, and add an oil bath. Was heated to 85 ° C.
To this, 0.19 g of carbon powder carrying a 5% mass of platinum metal was added, and 174.5 g (0.90 mol) of 1,4-bis (dimethylsilyl) benzene was added dropwise with stirring. After completion of the dropping, the mixture was stirred at 110 ° C. for 24 hours and then cooled to 25 ° C. Then, the platinum metal-supported carbon was filtered off, and toluene and excess vinyl norbornene were distilled off under reduced pressure to obtain a colorless and transparent oily reaction product (ab-2) (viscosity at 25 ° C.: 1,710 mPa. s) 311 g was obtained.
As a result of FT-IR, NMR, and GPC analysis of the reaction product, the compound of n = 0 was about 74 mol%, the compound of n = 1 was about 21 mol%, and the compound of n = 2 was found in the above formula (9). It was a mixture of about 5 mol%. The content of the addition-reactive carbon-carbon double bond in the mixture was 0.37 mol / 100 g.
[合成例4]
撹拌装置、冷却管、滴下ロートおよび温度計を備えた500mLの4つ口フラスコに、合成例3で得られた反応生成物(ab−2)50gをトルエン25gに溶解させ、ジブチルヒドロキシトルエン0.05gを添加し、オイルバスを用いて80℃に加熱した。これに六塩化白金1,3−ジビニルテトラメチルジシロキサンのトルエン溶液(白金換算で0.5質量%)を0.025g添加し、撹拌しながら前記式(10)で表されるオルガノハイドロジェンジシロキサン48.7gを滴下した。滴下終了後、95℃で2時間撹拌した後、トルエンを減圧留去して、無色透明なオイル状の反応生成物(A−2)(25℃における粘度:530mPa・s)90gを得た。
[Synthesis Example 4]
In a 500 mL four-necked flask equipped with a stirrer, a condenser, a dropping funnel and a thermometer, 50 g of the reaction product (ab-2) obtained in Synthesis Example 3 was dissolved in 25 g of toluene, and dibutylhydroxytoluene 0. 05 g was added and heated to 80 ° C. using an oil bath. To this, 0.025 g of a toluene solution of platinum hexachloride 1,3-divinyltetramethyldisiloxane (0.5% by mass in terms of platinum) was added, and the organohydrogenge represented by the above formula (10) was stirred with stirring. 48.7 g of siloxane was added dropwise. After completion of the dropping, the mixture was stirred at 95 ° C. for 2 hours, and then toluene was distilled off under reduced pressure to obtain 90 g of a colorless and transparent oily reaction product (A-2) (viscosity at 25 ° C.: 530 mPa · s).
[実施例1〜4および比較例1、2]
前記合成例で得られた(ab−1)、(A−1)、(A−2)成分と、下記(B)成分とを、表1に示す配合量(数値は質量部を表す)でそれぞれ混合し、ラジカル硬化型組成物(熱硬化型及び紫外線硬化型)を調製した。
[Examples 1 to 4 and Comparative Examples 1 and 2]
The components (ab-1), (A-1), and (A-2) obtained in the above synthesis example and the component (B) below are blended in the amounts shown in Table 1 (numerical values represent parts by mass). Each was mixed to prepare a radical curable composition (thermosetting type and ultraviolet curable type).
(B)成分:
(有機過酸化物)
(B−1)パーヘキサ(登録商標)25O(日油(株)製、10時間半減期温度66.2℃)
(光重合開始剤)
(B−2)Omnirad 1173(IGM Resins B.V.社製)
(B) Ingredient:
(Organic peroxide)
(B-1) Perhexa (registered trademark) 25O (manufactured by NOF CORPORATION, 10-hour half-life temperature 66.2 ° C)
(Photopolymerization initiator)
(B-2) Omnirad 1173 (manufactured by IGM Resins VV)
実施例および比較例で得られた組成物を以下の方法で評価し、結果を表2に示した。 The compositions obtained in Examples and Comparative Examples were evaluated by the following methods, and the results are shown in Table 2.
[硬さ]
・熱硬化型
組成物を窒素雰囲気下で80℃の熱風循環式オーブンで2時間加熱することにより作製した厚さ2mmの硬化物の硬度について、23℃におけるタイプA硬度の測定を行った。
[Hardness]
-The hardness of the cured product having a thickness of 2 mm prepared by heating the thermosetting composition in a hot air circulation oven at 80 ° C. for 2 hours in a nitrogen atmosphere was measured for type A hardness at 23 ° C.
・紫外線硬化型
組成物をアイグラフィックス(株)製アイUV電子制御装置(型式UBX0601−01)を用い、窒素雰囲気下、25℃で、波長365nmの紫外光での照射量が8,000mJ/cm2となるように紫外線を照射し、硬化させた2mm厚の硬化物の硬度について、23℃におけるタイプA硬度の測定を行った。
-The ultraviolet curable composition is irradiated with ultraviolet light having a wavelength of 365 nm at 25 ° C. in a nitrogen atmosphere using an eye UV electronic controller (model UBX0601-01) manufactured by Eye Graphics Co., Ltd. 8,000 mJ / The hardness of the cured product having a thickness of 2 mm, which was cured by irradiating ultraviolet rays so as to be cm 2, was measured for type A hardness at 23 ° C.
[光透過率]
・熱硬化型
組成物を窒素雰囲気下で80℃の熱風循環式オーブンで2時間加熱することにより作製した厚さ2mmの硬化物の光透過率について、25℃における波長400nmの直進光の光透過率を分光光度計U−3900(日立ハイテクサイエンス社製)を用いてそれぞれ測定した。
[Light transmittance]
-For the light transmittance of a cured product having a thickness of 2 mm produced by heating a heat-curable composition in a hot air circulation oven at 80 ° C. in a nitrogen atmosphere for 2 hours, the light transmittance of straight light having a wavelength of 400 nm at 25 ° C. The rates were measured using a spectrophotometer U-3900 (manufactured by Hitachi High-Tech Science).
・紫外線硬化型
組成物をアイグラフィックス(株)製アイUV電子制御装置(型式UBX0601−01)を用い、窒素雰囲気下、25℃で、波長365nmの紫外光での照射量が8,000mJ/cm2となるように紫外線を照射し、硬化させた2mm厚の硬化物の硬度について、25℃における波長400nmの直進光の光透過率を分光光度計U−3900(日立ハイテクサイエンス社製)を用いてそれぞれ測定した。
-The ultraviolet curable composition is irradiated with ultraviolet light having a wavelength of 365 nm at 25 ° C. in a nitrogen atmosphere using an eye UV electronic controller (model UBX0601-01) manufactured by Eye Graphics Co., Ltd. 8,000 mJ / For the hardness of a 2 mm thick cured product that was cured by irradiating it with ultraviolet rays so that it became cm 2 , the light transmission rate of straight light with a wavelength of 400 nm at 25 ° C was measured with a spectrophotometer U-3900 (manufactured by Hitachi High-Tech Science). Each was measured using.
表2に示されるように、本発明のラジカル硬化型組成物を用いた実施例1〜4では、低温かつ短時間で硬化し高い透明性を有している。一方、(メタ)アクリル基を有しない組成物を用いた比較例1〜2では、上記硬化条件において硬化が起こらなかった。 As shown in Table 2, Examples 1 to 4 using the radically curable composition of the present invention cure at a low temperature in a short time and have high transparency. On the other hand, in Comparative Examples 1 and 2 using the composition having no (meth) acrylic group, curing did not occur under the above curing conditions.
なお、本発明は、上記実施形態に限定されるものではない。上記実施形態は例示であり、本発明の特許請求の範囲に記載された技術的思想と実質的に同一な構成を有し、同様な作用効果を奏するものは、いかなるものであっても本発明の技術的範囲に包含される。 The present invention is not limited to the above embodiment. The above-described embodiment is an example, and any object having substantially the same configuration as the technical idea described in the claims of the present invention and exhibiting the same effect and effect is the present invention. Is included in the technical scope of.
Claims (7)
(B)重合開始剤
を含有するものであることを特徴とするラジカル硬化型組成物。 (A) (a) A Si—H group-containing compound represented by the following formula (1) and (b) a polycyclic hydrocarbon having two addition-reactive carbon-carbon double bonds in one molecule. A (meth) acrylic group-containing compound having a skeleton consisting of an addition reaction product and having a (meth) acrylic group at one or both molecular ends, and
(B) A radical curable composition containing a polymerization initiator.
前記ケイ素含有付加反応生成物が、(a)前記Si−H基含有化合物と、(b)前記多環式炭化水素との付加反応生成物であることを特徴とする請求項1記載のラジカル硬化型組成物。
The radical curing according to claim 1, wherein the silicon-containing addition reaction product is (a) an addition reaction product of the Si—H group-containing compound and (b) the polycyclic hydrocarbon. Mold composition.
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JP2019011390A (en) * | 2017-06-29 | 2019-01-24 | 信越化学工業株式会社 | Poly(meth)acrylate, and coating composition and coated article containing the same |
JP2020524188A (en) * | 2017-06-20 | 2020-08-13 | モメンティブ パフォーマンス マテリアルズ インコーポレイテッドMomentive Performance Materials Inc. | Curable silicone composition and its uses and uses |
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JPS6040106A (en) * | 1983-07-20 | 1985-03-02 | ロクタイト.コーポレーシヨン | Method of rendering alpha-alkyl acrylate functionality and polymer therefor |
JP2013185066A (en) * | 2012-03-08 | 2013-09-19 | Shin-Etsu Chemical Co Ltd | Modified polycycloolefin, ultraviolet cure composition, and cured product thereof |
JP2020524188A (en) * | 2017-06-20 | 2020-08-13 | モメンティブ パフォーマンス マテリアルズ インコーポレイテッドMomentive Performance Materials Inc. | Curable silicone composition and its uses and uses |
JP2019011390A (en) * | 2017-06-29 | 2019-01-24 | 信越化学工業株式会社 | Poly(meth)acrylate, and coating composition and coated article containing the same |
JP2021001296A (en) * | 2019-06-24 | 2021-01-07 | 信越化学工業株式会社 | Radical curable silicone composition and cured product |
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