TW202146489A - Radically curable composition and cured product - Google Patents
Radically curable composition and cured product Download PDFInfo
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- TW202146489A TW202146489A TW110102231A TW110102231A TW202146489A TW 202146489 A TW202146489 A TW 202146489A TW 110102231 A TW110102231 A TW 110102231A TW 110102231 A TW110102231 A TW 110102231A TW 202146489 A TW202146489 A TW 202146489A
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- 239000000203 mixture Substances 0.000 title claims abstract description 68
- -1 polycyclic hydrocarbon Chemical class 0.000 claims abstract description 48
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 38
- 150000001875 compounds Chemical class 0.000 claims abstract description 37
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 35
- 238000007259 addition reaction Methods 0.000 claims abstract description 31
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims abstract description 29
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 21
- 239000004215 Carbon black (E152) Substances 0.000 claims abstract description 17
- 150000002430 hydrocarbons Chemical group 0.000 claims abstract description 17
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 9
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 6
- 239000000047 product Substances 0.000 claims description 20
- 150000001451 organic peroxides Chemical group 0.000 claims description 18
- INYHZQLKOKTDAI-UHFFFAOYSA-N 5-ethenylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C=C)CC1C=C2 INYHZQLKOKTDAI-UHFFFAOYSA-N 0.000 claims description 16
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 16
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 14
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 10
- 239000003999 initiator Substances 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 7
- 150000001336 alkenes Chemical class 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 32
- 239000002096 quantum dot Substances 0.000 description 18
- 150000003254 radicals Chemical class 0.000 description 18
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 15
- 238000001723 curing Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 239000003566 sealing material Substances 0.000 description 10
- 239000007789 gas Substances 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000006459 hydrosilylation reaction Methods 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 239000012299 nitrogen atmosphere Substances 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- OTTZHAVKAVGASB-UHFFFAOYSA-N hept-2-ene Chemical compound CCCCC=CC OTTZHAVKAVGASB-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 2
- UHXCHUWSQRLZJS-UHFFFAOYSA-N (4-dimethylsilylidenecyclohexa-2,5-dien-1-ylidene)-dimethylsilane Chemical compound C[Si](C)C1=CC=C([Si](C)C)C=C1 UHXCHUWSQRLZJS-UHFFFAOYSA-N 0.000 description 2
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 2
- SPSPIUSUWPLVKD-UHFFFAOYSA-N 2,3-dibutyl-6-methylphenol Chemical compound CCCCC1=CC=C(C)C(O)=C1CCCC SPSPIUSUWPLVKD-UHFFFAOYSA-N 0.000 description 2
- LESMLVDJJCWZAJ-UHFFFAOYSA-N 2-(diphenylphosphorylmethyl)-1,3,5-trimethylbenzene Chemical compound CC1=CC(C)=CC(C)=C1CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 LESMLVDJJCWZAJ-UHFFFAOYSA-N 0.000 description 2
- OGFPIZPNFPWPOO-UHFFFAOYSA-H C(=C)[Si](O[Si](C=C)(C)C)(C)C.[Pt](Cl)(Cl)(Cl)(Cl)(Cl)Cl Chemical compound C(=C)[Si](O[Si](C=C)(C)C)(C)C.[Pt](Cl)(Cl)(Cl)(Cl)(Cl)Cl OGFPIZPNFPWPOO-UHFFFAOYSA-H 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- HSLFISVKRDQEBY-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclohexane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCC1 HSLFISVKRDQEBY-UHFFFAOYSA-N 0.000 description 1
- HGCMSCWGVAYWHR-UHFFFAOYSA-N 1,3,5-trimethyl-2-[[phenyl-[(2,4,6-trimethylphenyl)methyl]phosphoryl]methyl]benzene Chemical compound CC1=CC(C)=CC(C)=C1CP(=O)(C=1C=CC=CC=1)CC1=C(C)C=C(C)C=C1C HGCMSCWGVAYWHR-UHFFFAOYSA-N 0.000 description 1
- RMSGQZDGSZOJMU-UHFFFAOYSA-N 1-butyl-2-phenylbenzene Chemical group CCCCC1=CC=CC=C1C1=CC=CC=C1 RMSGQZDGSZOJMU-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- FRXUBIFYAYIGHS-UHFFFAOYSA-N 1-methyl-2-[(2-methylphenyl)methylperoxymethyl]benzene Chemical compound CC1=CC=CC=C1COOCC1=CC=CC=C1C FRXUBIFYAYIGHS-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- HQOVXPHOJANJBR-UHFFFAOYSA-N 2,2-bis(tert-butylperoxy)butane Chemical compound CC(C)(C)OOC(C)(CC)OOC(C)(C)C HQOVXPHOJANJBR-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- QNLVSEVOEORLBH-UHFFFAOYSA-N 2,5-bis(2-ethylhexylperoxy)-2,5-dimethylhexane Chemical compound CCCCC(CC)COOC(C)(C)CCC(C)(C)OOCC(CC)CCCC QNLVSEVOEORLBH-UHFFFAOYSA-N 0.000 description 1
- ODBCKCWTWALFKM-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhex-3-yne Chemical compound CC(C)(C)OOC(C)(C)C#CC(C)(C)OOC(C)(C)C ODBCKCWTWALFKM-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- WTBPWOVBWKJVPF-UHFFFAOYSA-N 3-(2-ethylhexylperoxymethyl)heptane Chemical compound CCCCC(CC)COOCC(CC)CCCC WTBPWOVBWKJVPF-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- PCYMUVRNLPDJJW-UHFFFAOYSA-N 6-carboxyoxyhexyl hydrogen carbonate Chemical compound OC(=O)OCCCCCCOC(O)=O PCYMUVRNLPDJJW-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- WZOLEAVHOKOYST-UHFFFAOYSA-L C(C)(=O)C(C(=O)[O-])C(C)=O.[Pt+2].C(C)(=O)C(C(=O)[O-])C(C)=O Chemical compound C(C)(=O)C(C(=O)[O-])C(C)=O.[Pt+2].C(C)(=O)C(C(=O)[O-])C(C)=O WZOLEAVHOKOYST-UHFFFAOYSA-L 0.000 description 1
- SAJZVGCCGDKDEA-UHFFFAOYSA-N C1(=CC=C(C=C1)OOC(=O)OCCCCCCOC(=O)OOC1=CC=C(C=C1)C)C Chemical compound C1(=CC=C(C=C1)OOC(=O)OCCCCCCOC(=O)OOC1=CC=C(C=C1)C)C SAJZVGCCGDKDEA-UHFFFAOYSA-N 0.000 description 1
- DXXKXXKZDFUGFI-UHFFFAOYSA-N CCCCC(CC)COOC(C)(CCC(C)(OC)OOCC(CC)CCCC)OC Chemical compound CCCCC(CC)COOC(C)(CCC(C)(OC)OOCC(CC)CCCC)OC DXXKXXKZDFUGFI-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- KQNZLOUWXSAZGD-UHFFFAOYSA-N benzylperoxymethylbenzene Chemical compound C=1C=CC=CC=1COOCC1=CC=CC=C1 KQNZLOUWXSAZGD-UHFFFAOYSA-N 0.000 description 1
- 125000002529 biphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C12)* 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical compound COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 description 1
- 125000006606 n-butoxy group Chemical group 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003506 n-propoxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000004957 naphthylene group Chemical group 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000001639 phenylmethylene group Chemical group [H]C(=*)C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- 239000002574 poison Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 231100000572 poisoning Toxicity 0.000 description 1
- 230000000607 poisoning effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- VSJBBIJIXZVVLQ-UHFFFAOYSA-N tert-butyl 3,5,5-trimethylhexaneperoxoate Chemical compound CC(C)(C)CC(C)CC(=O)OOC(C)(C)C VSJBBIJIXZVVLQ-UHFFFAOYSA-N 0.000 description 1
- VNJISVYSDHJQFR-UHFFFAOYSA-N tert-butyl 4,4-dimethylpentaneperoxoate Chemical compound CC(C)(C)CCC(=O)OOC(C)(C)C VNJISVYSDHJQFR-UHFFFAOYSA-N 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 230000017105 transposition Effects 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
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- C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
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- C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
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- C08F230/08—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
- C08F230/085—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon the monomer being a polymerisable silane, e.g. (meth)acryloyloxy trialkoxy silanes or vinyl trialkoxysilanes
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- C08F2/00—Processes of polymerisation
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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Abstract
Description
本發明有關自由基硬化型組成物及硬化物。The present invention relates to a radical-curable composition and a cured product.
發光二極體(LED)係以驚人提高其發光效率為背景,不僅有利用於以低消耗電力、高壽命、設計性等為特徵之液晶顯示器(LCD)之背光及車用頭燈等之車載領域,於一般照明的市場亦急遽擴大。此等LED燈係將安裝於基板之LED元件以由透明樹脂所成之密封材密封之構成。作為密封此LED之密封材,基於具有優異耐熱性之觀點,已廣泛使用加成硬化型矽氧組成物(專利文獻1)。然而,由矽氧組成物所成之密封材料由於氣體阻隔性低,故有因自外部之腐蝕性氣體侵入而使銀電極變色,使LED亮度降低之情況。Light-emitting diodes (LEDs) are not only useful for backlights of liquid crystal displays (LCDs) and automotive headlights, which are characterized by low power consumption, long life, and design, with the background of dramatically improving their luminous efficiency. In the field, the market for general lighting has also expanded rapidly. These LED lamps are constituted by sealing LED elements mounted on a substrate with a sealing material made of a transparent resin. As a sealing material for sealing this LED, an addition hardening type silicon oxide composition has been widely used from the viewpoint of having excellent heat resistance (Patent Document 1). However, since the sealing material made of a silicon oxide composition has low gas barrier properties, the silver electrode may be discolored due to the intrusion of corrosive gas from the outside, and the brightness of the LED may be lowered.
因此,提案有使用具有多環式烴骨架之有機改質加成硬化型矽氧組成物之光學元件用密封材料。由此等組成物所得之密封材料由於具有高的體阻隔性,故可防止自外部之腐蝕氣體侵入,可抑制銀電極變色(專利文獻2、3)。Therefore, a sealing material for optical elements using an organically modified addition-curable silicone composition having a polycyclic hydrocarbon skeleton has been proposed. Since the sealing material obtained from these compositions has high bulk barrier properties, it can prevent the intrusion of corrosive gas from the outside, and can suppress the discoloration of the silver electrode (Patent Documents 2 and 3).
近幾年來,作為波長轉換材,具有優異波長轉換效率之量子點備受矚目。量子點由於對水分抗性較弱,故必須以氣體阻隔性高的材料密封。另一方面,於量子點中多數含有加成反應之觸媒毒害,若使用加成硬化型之組成物作為量子點之黏合劑材料則有發生硬化不良之情況。再者,量子點由於耐熱性低,故難以耐受加成硬化型材料之硬化條件。 [先前技術文獻] [專利文獻]In recent years, quantum dots with excellent wavelength conversion efficiency have been attracting attention as wavelength conversion materials. Quantum dots must be sealed with materials with high gas barrier properties due to their weak resistance to moisture. On the other hand, most of the quantum dots contain the catalyst poison of the addition reaction. If the addition-hardening type composition is used as the adhesive material of the quantum dots, the curing failure may occur. Furthermore, since quantum dots have low heat resistance, it is difficult to withstand the hardening conditions of an addition hardening type material. [Prior Art Literature] [Patent Literature]
[專利文獻1] 日本特開2004-292714號公報 [專利文獻2] 日本特開2008-069210號公報 [專利文獻3] 日本特開2012-046604號公報[Patent Document 1] Japanese Patent Laid-Open No. 2004-292714 [Patent Document 2] Japanese Patent Laid-Open No. 2008-069210 [Patent Document 3] Japanese Patent Application Laid-Open No. 2012-046604
[發明欲解決之課題][The problem to be solved by the invention]
本發明係鑑於上述情況而完成者,目的在於提供可於低溫硬化之自由基硬化型聚矽氧組成物。 [用以解決課題之手段]The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide a radical-curable polysiloxane composition which can be cured at a low temperature. [means to solve the problem]
為了解決上述課題,本發明提供一種自由基硬化型組成物,其特徵係含有:(A)含(甲基)丙烯醯基之化合物,其具有由(a)以下述式(1)表示之含Si-H基之化合物與(b)1分子中具有2個加成反應性碳-碳雙鍵之多環式烴的加成反應生成物所成之骨架,且於單分子末端或兩分子末端具有(甲基)丙烯醯基,及 (式中,R1 分別獨立為不含加成反應性碳-碳雙鍵、取代或非取代之碳原子數1~12之1價烴基或碳原子數1~6之烷氧基,R2 表示取代或非取代之碳原子數1~12之2價烴基), (B)聚合起始劑。In order to solve the above-mentioned problems, the present invention provides a radically curable composition characterized by containing: (A) a (meth)acryloyl group-containing compound having a compound represented by (a) represented by the following formula (1). The skeleton formed by the addition reaction product of the Si-H group compound and the polycyclic hydrocarbon having two addition-reactive carbon-carbon double bonds in (b) 1 molecule, and at the single-molecule end or the two-molecule end has a (meth)acryloyl group, and (in the formula, R 1 is independently an addition-reactive carbon-carbon double bond, a substituted or unsubstituted monovalent hydrocarbon group with 1 to 12 carbon atoms, or an alkoxy group with 1 to 6 carbon atoms, R 2 Represents a substituted or unsubstituted divalent hydrocarbon group with 1 to 12 carbon atoms), (B) a polymerization initiator.
依據本發明之自由基硬化型組成物,可於低溫硬化。According to the radical hardening type composition of the present invention, it can be hardened at low temperature.
本發明之自由基硬化型組成物較佳前述(A)成分係1分子中具有2個加成反應性碳-碳雙鍵之含矽加成反應生成物與(c)以下述式(2)表示之矽氧烷化合物之加成反應生成物的含(甲基)丙烯醯基之化合物, 前述含矽加成反應生成物係(a)前述含Si-H基之化合物與(b)前述多環式烴之加成反應生成物。 (式中,R1 表示與上述相同意義,R3 為氫原子或甲基之任一者,R4 為取代或非取代之碳原子數1~8之二價烴基)。In the radical-hardening composition of the present invention, it is preferable that the aforementioned (A) component is a silicon-containing addition reaction product having two addition-reactive carbon-carbon double bonds in one molecule, and (c) is represented by the following formula (2) The (meth)acryloyl group-containing compound represented by the addition reaction product of the siloxane compound, the above-mentioned silicon-containing addition reaction product is (a) the above-mentioned Si-H group-containing compound and (b) the above-mentioned many Addition reaction products of cyclic hydrocarbons. (In the formula, R 1 represents the same meaning as above, R 3 is either a hydrogen atom or a methyl group, and R 4 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 8 carbon atoms).
依據本發明之自由基硬化型組成物,硬化性更優異。According to the radical-curable composition of the present invention, the curability is further excellent.
本發明之自由基硬化型組成物更佳前述多環式烴係5-乙烯基雙環[2.2.1]庚-2-烯及6-乙烯基雙環[2.2.1]庚-2-烯之任一者或該等之組合。The radical hardening composition of the present invention is more preferably any of the aforementioned polycyclic hydrocarbon-based 5-vinylbicyclo[2.2.1]hept-2-ene and 6-vinylbicyclo[2.2.1]hept-2-ene one or a combination of these.
依據本發明之自由基硬化型組成物,可獲得硬度、耐龜裂性、耐熱性、氣體阻隔性優異之硬化物。According to the radical-curable composition of the present invention, a cured product excellent in hardness, crack resistance, heat resistance, and gas barrier properties can be obtained.
本發明之自由基硬化型組成物又更佳前述(A)成分係以下述式(3)表示之化合物。 (式中,R3 為氫原子或甲基之任一者,n=0~10)。In the radical-curable composition of the present invention, it is more preferable that the component (A) is a compound represented by the following formula (3). (in the formula, R 3 is either a hydrogen atom or a methyl group, n=0-10).
依據本發明之自由基硬化型組成物,可獲得硬度、耐龜裂性、耐熱性、氣體阻隔性更優異之硬化物。According to the radical-curable composition of the present invention, a cured product having more excellent hardness, crack resistance, heat resistance, and gas barrier properties can be obtained.
本發明之自由基硬化型組成物較佳前述聚合起始劑係有機過氧化物或光聚合起始劑。In the radical hardening composition of the present invention, preferably, the aforementioned polymerization initiator is an organic peroxide or a photopolymerization initiator.
此等聚合起始劑可更有效使本發明之組成物硬化。These polymerization initiators can more effectively harden the composition of the present invention.
該情況,前述有機過氧化物係10小時半衰期溫度50~150℃者。In this case, the above-mentioned organic peroxide is a 10-hour half-life temperature of 50 to 150°C.
依據此等有機過氧化物,組成物之保存安定性及硬化性之控制性優異。According to these organic peroxides, the storage stability and curability of the composition are excellent in controllability.
又本發明提供上述自由基硬化型組成物的硬化物。The present invention also provides a cured product of the above-mentioned radical-curable composition.
本發明之硬化物由於具備優異透明性與良好硬度,故於光學元件之密封材及濾波器等之用途有用。 [發明效果]Since the cured product of the present invention has excellent transparency and good hardness, it is useful for applications such as sealing materials for optical elements and filters. [Inventive effect]
本發明之自由基硬化型矽氧組成物由於藉由自由基硬化而可於低溫硬化,故可使用作為量子點之黏合劑材料,使本發明之自由基硬化型組成物硬化所得之硬化物由於具有優異透明性與良好硬度,故於LED元件之密封材及波長轉換濾波器等之用途有用。The free radical hardening type silicone composition of the present invention can be hardened at low temperature by free radical hardening, so it can be used as a binder material for quantum dots, and the cured product obtained by curing the free radical hardening type composition of the present invention is due to It has excellent transparency and good hardness, so it is useful for applications such as sealing materials for LED elements and wavelength conversion filters.
本發明人等為了達成上述目的而積極檢討之結果,發現依據包含後述之(A)及(B)成分之自由基硬化型組成物可解決上述課題,因而完成本發明。The inventors of the present invention, as a result of earnestly examining in order to achieve the above-mentioned object, found that the above-mentioned problems can be solved by a radical-curable composition containing the components (A) and (B) described later, and thus completed the present invention.
亦即本發明係一種自由基硬化型組成物,其特徵係含有: (A)含(甲基)丙烯醯基之化合物,其具有由(a)以下述式(1)表示之含Si-H基之化合物與(b)1分子中具有2個加成反應性碳-碳雙鍵之多環式烴的加成反應生成物所成之骨架,且於單分子末端或兩分子末端具有(甲基)丙烯醯基,及 (式中,R1 分別獨立為不含加成反應性碳-碳雙鍵、取代或非取代之碳原子數1~12之1價烴基或碳原子數1~6之烷氧基,R2 表示取代或非取代之碳原子數1~12之2價烴基), (B)聚合起始劑。That is, the present invention is a radical hardening type composition characterized by containing: (A) a (meth)acryloyl group-containing compound having a Si-H-containing compound represented by (a) the following formula (1) The skeleton formed by the addition reaction product of the compound of the base and (b) a polycyclic hydrocarbon having two addition-reactive carbon-carbon double bonds in the molecule, and having (methyl) group) acrylyl group, and (in the formula, R 1 is independently an addition-reactive carbon-carbon double bond, a substituted or unsubstituted monovalent hydrocarbon group with 1 to 12 carbon atoms, or an alkoxy group with 1 to 6 carbon atoms, R 2 Represents a substituted or unsubstituted divalent hydrocarbon group with 1 to 12 carbon atoms), (B) a polymerization initiator.
以下針對本發明詳細說明,但本發明並非限定於此。The present invention will be described in detail below, but the present invention is not limited thereto.
[自由基硬化型組成物] 本發明之自由基硬化型組成物係含有後述之(A)及(B)成分作為必須成分者。該組成物除了前述必須成分以外,亦可根據需要進而含有任意成分。[Radical hardening type composition] The radical-curable composition of the present invention contains components (A) and (B) described later as essential components. In addition to the above-mentioned essential components, the composition may further contain optional components as necessary.
以下針對各成分詳細說明。Each component is explained in detail below.
[(A)成分] (A)成分係含(甲基)丙烯醯基之化合物,其具有由(a)以下述式(1)表示之含Si-H基之化合物與(b)1分子中具有2個加成反應性碳-碳雙鍵之多環式烴之加成反應生成物所成之分子鏈,且於單分子末端或兩分子末端具有(甲基)丙烯醯基。此等含(甲基)丙烯醯基之化合物具有由(a)前述含Si-H基之化合物與(b)前述多環式烴之加成反應生成物所成之骨架,且於單分子末端或兩分子末端具有(甲基)丙烯醯基。 又,本發明中,所謂加成反應性意指與鍵結至矽原子之氫原子藉由習知氫矽烷化反應而可進行加成反應之性質。 (式中,R1 分別獨立為不含加成反應性碳-碳雙鍵、取代或非取代之碳原子數1~12之1價烴基或碳原子數1~6之烷氧基,R2 表示取代或非取代之碳原子數1~12之2價烴基)。[Component (A)] Component (A) is a (meth)acryloyl group-containing compound having (a) a Si-H group-containing compound represented by the following formula (1) and (b) in 1 molecule A molecular chain formed by an addition reaction product of a polycyclic hydrocarbon having two addition-reactive carbon-carbon double bonds, and having a (meth)acryloyl group at one or both ends of the molecule. These (meth)acryloyl group-containing compounds have skeletons formed by addition reaction products of (a) the aforementioned Si-H group-containing compounds and (b) the aforementioned polycyclic hydrocarbons, and are located at the monomolecular terminals. Or it has a (meth)acryloyl group at both molecular ends. In addition, in the present invention, the term "addition reactivity" means the property that an addition reaction can be performed with a hydrogen atom bonded to a silicon atom by a conventional hydrosilylation reaction. (in the formula, R 1 is independently an addition-reactive carbon-carbon double bond, a substituted or unsubstituted monovalent hydrocarbon group with 1 to 12 carbon atoms, or an alkoxy group with 1 to 6 carbon atoms, R 2 Represents a substituted or unsubstituted divalent hydrocarbon group with 1 to 12 carbon atoms).
<(a)成分> (a)成分係以下述式(1)表示之含Si-H基之化合物。 (式中,R1 、R2 如上述)。<(a) component> (a) component is a Si-H group containing compound represented by following formula (1). (wherein, R 1 and R 2 are as described above).
作為R1 之碳原子數1~12之烴基之具體例舉例為甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、正戊基、正己基、正辛基、正癸基、環戊基、環己基等之碳原子數1~12之烷基;苯基、萘基等之碳原子數6~12之芳基;甲苯基、二甲苯基、乙基苯基、丙基苯基、丁基苯基、戊基苯基、己基苯基等之碳原子數7~12之烷基芳基;苄基、苯乙基等之碳原子數7~12之芳烷基等。Specific examples of the hydrocarbon group having 1 to 12 carbon atoms for R 1 include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-butyl Amyl, n-hexyl, n-octyl, n-decyl, cyclopentyl, cyclohexyl and other alkyl groups with 1 to 12 carbon atoms; phenyl, naphthyl and other aryl groups with 6 to 12 carbon atoms; toluene Alkyl aryl groups with 7 to 12 carbon atoms, such as base, xylyl, ethylphenyl, propylphenyl, butylphenyl, pentylphenyl, hexylphenyl, etc.; benzyl, phenethyl, etc. Aralkyl groups with 7 to 12 carbon atoms, etc.
又,作為碳原子數1~6之烷氧基之具體例舉例為甲氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基、第二丁氧基、第三丁氧基、正戊氧基、正己氧基、環戊氧基、環己氧基等。In addition, specific examples of the alkoxy group having 1 to 6 carbon atoms include a methoxy group, an ethoxy group, an n-propoxy group, an isopropoxy group, an n-butoxy group, a second butoxy group, and a third butyl group. oxy, n-pentyloxy, n-hexyloxy, cyclopentyloxy, cyclohexyloxy and the like.
該等中,作為R1 較佳為碳原子數1~8之烷基,更佳為甲基。Among these, as R 1 , an alkyl group having 1 to 8 carbon atoms is preferable, and a methyl group is more preferable.
另一方面,作為R2 之碳原子數1~12之2價烴基之具體例舉例為亞甲基、伸乙基、伸丙基、三亞甲基、五亞甲基、六亞甲基、七亞甲基、八亞甲基、九亞甲基、十亞甲基等之碳原子數1~12之直鏈、分支或環狀伸烷基;伸苯基、伸聯苯基、伸萘基等之碳原子數6~12之伸芳基;苯基亞甲基、亞甲基伸苯基亞甲基等之碳原子數7~12之伸芳烷基等。On the other hand, specific examples of the divalent hydrocarbon group having 1 to 12 carbon atoms in R 2 include methylene, ethylidene, propylidene, trimethylene, pentamethylene, hexamethylene, heptapethylene Linear, branched or cyclic alkylene with 1 to 12 carbon atoms, such as methylene, octamethylene, nonamethylene, decamethylene, etc.; phenylene, biphenylene, naphthylene Aryl group with 6 to 12 carbon atoms such as phenylmethylene; aralkyl group with 7 to 12 carbon atoms such as phenylmethylene, methylene phenylene methylene, etc.
該等中,較佳為碳原子數6~12之伸芳基,更佳為伸苯基。Among these, an aryl group having 6 to 12 carbon atoms is preferable, and a phenyl group is more preferable.
作為(a)成分之具體例舉例為以下述式表示者,但不限定於該等。又,Me表示甲基。 Although the specific example of (a) component is shown by the following formula, it is not limited to these. In addition, Me represents a methyl group.
又,式(1)表示之化合物可單獨使用1種,亦可組合2種以上使用。Moreover, the compound represented by Formula (1) may be used individually by 1 type, and may be used in combination of 2 or more types.
<(b)成分> (b)成分係1分子中具有2個加成反應性碳-碳雙鍵之多環式烴。<(b) Component> The component (b) is a polycyclic hydrocarbon having two addition-reactive carbon-carbon double bonds in one molecule.
作為(b)成分之1分子中具有2個加成反應性碳-碳雙鍵之多環式烴,可使用(i)形成多環式烴之骨架的碳原子中相鄰之2個碳原子間形成加成反應性碳-碳雙鍵者,(ii)鍵結於形成多環式烴之骨架的碳原子之氫原子經含加成反應性碳-碳雙鍵之基取代者,(iii)形成多環式烴之骨架的碳原子中相鄰之2個碳原子間形成加成反應性碳-碳雙鍵且鍵結於形成多環式烴之骨架的碳原子之氫原子經含加成反應性碳-碳雙鍵之基取代者等。As the polycyclic hydrocarbon having two addition-reactive carbon-carbon double bonds in one molecule of the component (b), two adjacent carbon atoms among the carbon atoms forming the skeleton of the polycyclic hydrocarbon (i) can be used which forms an addition-reactive carbon-carbon double bond, (ii) hydrogen atoms bonded to carbon atoms forming the skeleton of a polycyclic hydrocarbon are substituted by a group containing an addition-reactive carbon-carbon double bond, (iii) ) An addition-reactive carbon-carbon double bond is formed between two adjacent carbon atoms in the carbon atoms forming the skeleton of the polycyclic hydrocarbon, and the hydrogen atoms bound to the carbon atoms forming the skeleton of the polycyclic hydrocarbon are added Substitutes of reactive carbon-carbon double bonds, etc.
作為上述多環式烴之具體例舉例為以下述式(3)表示之5-乙烯基雙環[2.2.1]庚-2-烯、以式(4)表示之6-乙烯基雙環[2.2.1]庚-2-烯等,該等亦可作為混合物而使用(以下無必要區別該等時,有時總稱為「乙烯基降冰片烯」)。 Specific examples of the above-mentioned polycyclic hydrocarbons include 5-vinylbicyclo[2.2.1]hept-2-ene represented by the following formula (3), and 6-vinylbicyclo[2.2.2. 1] Hept-2-ene, etc., these can also be used as a mixture (Hereinafter, when it is unnecessary to distinguish these, it may be collectively referred to as "vinyl norbornene").
又,上述乙烯基降冰片烯之乙烯基的取代位置可為順式(exo型)或反式位置(endo型)之任一者,且由於化合物之反應性並未因該等之配置差異而有特別不同,故亦可將兩配置之異構物予以組合。In addition, the substitution position of the vinyl group of the above vinyl norbornene may be either cis (exo type) or trans position (endo type), and the reactivity of the compound is not affected by the difference in these configurations. There are special differences, so the isomers of the two configurations can also be combined.
又,作為乙烯基降冰片烯以外之上述多環式烴之具體例舉例為二環戊二烯及其衍生物。Moreover, as a specific example of the said polycyclic hydrocarbon other than vinyl norbornene, dicyclopentadiene and its derivative(s) are illustrated.
作為(a)成分與(b)成分之加成反應生成物並未特別限定,但較佳為以下述式(5)表示者,尤其更佳為R1 為甲基之以下述式(6)表示者。 (式中,R1 表示與上述相同意義,n=0~10)。The addition reaction product of the component (a) and the component (b) is not particularly limited, but it is preferably represented by the following formula (5), and particularly preferably represented by the following formula (6) in which R 1 is a methyl group expressor. (In the formula, R 1 has the same meaning as above, and n=0~10).
由(a)成分與(b)成分之加成反應生成物所成之骨架係由具有源自前述加成反應性碳-碳雙鍵之鍵的二價殘基所構成。例如由以上述式(5)表示之加成反應生成物所成之骨架係以下述式表示。 (式中,R1 表示與上述相同意義)。The skeleton formed by the addition reaction product of the component (a) and the component (b) consists of a divalent residue having a bond derived from the addition-reactive carbon-carbon double bond. For example, the skeleton formed by the addition reaction product represented by the above formula (5) is represented by the following formula. (In the formula, R 1 has the same meaning as described above).
以此等之多環式烴與含有伸苯基之加成反應生成物為主骨架之化合物,由於可賦予硬度、耐龜裂性、耐熱性優異之硬化物,故可替特別適宜使用。The compound having the main skeleton of the addition reaction product of such a polycyclic hydrocarbon and a phenylene group can be used as a hardened product excellent in hardness, crack resistance, and heat resistance.
(a)成分與(b)成分之加成反應生成物可藉由例如日本特開2005-133073號公報中記載之方法合成。The addition reaction product of the component (a) and the component (b) can be synthesized, for example, by the method described in JP-A No. 2005-133073.
作為一例,可藉由對(a)成分1莫耳,以(b)成分超過1莫耳且10莫耳以下,較佳超過1莫耳且5莫耳以下之量,於氫矽烷化反應觸媒存在下加成反應而調製。As an example, the amount of the component (b) is more than 1 mol and 10 mol or less, preferably more than 1 mol and 5 mol or less with respect to 1 mol of the component (a), in the hydrosilylation reaction. It is prepared by an addition reaction in the presence of a medium.
該情況,作為氫矽烷化觸媒可使用習知者,作為其具體例舉例為擔載鉑金屬之碳粉末、鉑黑、氯化鉑、氯化鉑酸、氯化鉑酸與一元醇之反應生成物、氯化鉑酸與烯烴類之錯合物、雙乙醯乙酸鉑等之鉑系觸媒;鈀系觸媒、銠系觸媒等之鉑族金屬系觸媒等。且關於加成反應條件、溶劑之使用等並未特別限定只要如習知者即可。In this case, a conventional one can be used as the hydrosilylation catalyst, and specific examples thereof include platinum metal-supported carbon powder, platinum black, platinum chloride, chloroplatinic acid, chloroplatinic acid and a monohydric alcohol. Reaction products, complexes of chloroplatinic acid and olefins, platinum-based catalysts such as platinum bisacetylacetate, platinum-based catalysts such as palladium-based catalysts, rhodium-based catalysts, etc. In addition, the conditions for the addition reaction, the use of the solvent, and the like are not particularly limited as long as they are conventionally known.
上述反應由於係相對於(a)以式(1)表示之化合物以過量莫耳量之(b)多環式烴反應,故(A)成分之加成反應生成物於1分子中可具有2個源自(b)多環式烴之加成反應性碳-碳雙鍵。Since the above-mentioned reaction is performed with an excess molar amount of the (b) polycyclic hydrocarbon with respect to the compound represented by the formula (1) in (a), the addition reaction product of the component (A) may have 2 in 1 molecule. Addition-reactive carbon-carbon double bonds derived from (b) polycyclic hydrocarbons.
<(c)成分> (A)成分可藉由使(a)成分與(b)成分之加成反應生成物之1分子中存在2個(於兩末端)之加成反應性碳-碳雙鍵之任一者或兩者與(c)以下述式(2)表示之矽氧烷化合物之SiH基進行氫矽烷化反應而獲得。 (式中,R1 表示與上述相同意義,R3 為氫原子或甲基之任一者,R4 為取代或非取代之碳原子數1~8之二價烴基)。<(c) Component> (A) Component can be obtained by adding two (at both ends) addition-reactive carbon-carbon dipoles in one molecule of the addition reaction product of (a) and (b) components. One or both of the bonds are obtained by subjecting (c) the SiH group of the siloxane compound represented by the following formula (2) to a hydrosilylation reaction. (In the formula, R 1 represents the same meaning as above, R 3 is either a hydrogen atom or a methyl group, and R 4 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 8 carbon atoms).
且(A)成分係藉由首先使(a)成分與(b)成分藉由加成反應獲得1分子中具有2個加成反應性碳-碳雙鍵之含矽加成反應生成物,其次使所得之生成物的分子兩末端存在之2個加成反應性碳-碳雙鍵之兩者與(c)成分之矽氧烷化合物之SiH基進行氫矽烷化反應而獲得。 該情況,(A)成分較佳係1分子中具有2個加成反應性碳-碳雙鍵之含矽加成反應生成物與(c)以上述式(2)表示之矽氧烷化合物之加成反應生成物的含(甲基)丙烯醯基之化合物,前述含矽加成反應生成物係(a)前述含Si-H基之化合物與(b)前述多環式烴之加成反應生成物。作為本發明之(A)成分,較佳為於兩端之分子末端具有此等(甲基)丙烯醯基之含(甲基)丙烯醯基之化合物。And (A) component is obtained by first adding (a) component and (b) component to obtain a silicon-containing addition reaction product having two addition-reactive carbon-carbon double bonds in 1 molecule, and secondly The obtained product is obtained by subjecting both of the two addition-reactive carbon-carbon double bonds existing at both ends of the molecule to a hydrosilylation reaction with the SiH group of the siloxane compound of the component (c). In this case, the component (A) is preferably a combination of a silicon-containing addition reaction product having two addition-reactive carbon-carbon double bonds in one molecule and (c) a siloxane compound represented by the above formula (2). The (meth)acryloyl group-containing compound of the addition reaction product, the above-mentioned silicon-containing addition reaction product is the addition reaction of (a) the above-mentioned Si-H group-containing compound and (b) the above-mentioned polycyclic hydrocarbon product. As the component (A) of the present invention, a (meth)acryloyl group-containing compound having these (meth)acryloyl groups at the molecular terminals of both ends is preferable.
作為(c)成分,舉例為例如下述式(7)表示之矽氧烷化合物。 (式中,R3 為氫原子或甲基之任一者)。As the component (c), for example, a siloxane compound represented by the following formula (7) is exemplified. (In the formula, R 3 is either a hydrogen atom or a methyl group).
關於氫矽烷化反應條件、溶劑之使用等並未特別限定只要如習知者即可。The hydrosilylation reaction conditions, the use of the solvent, and the like are not particularly limited as long as they are conventionally known.
<(d)成分> 又,(A)成分可藉由使(a)成分與(b)成分之加成反應生成物的兩末端存在之加成反應性碳-碳雙鍵之一者或兩者與(d)以下述式(8)表示之含鹵素矽氧烷化合物之SiH基進行氫矽烷化反應,其次使羥基型丙烯酸酯化合物反應而獲得。 (式中,R5 分別獨立為不含加成反應性碳-碳雙鍵之碳原子數1~6之1價烴基,X為鹵素原子,m為1或2)。<Component (d)> In addition, the component (A) can be obtained by causing one or both of the addition-reactive carbon-carbon double bonds to exist at both ends of the addition reaction product of the component (a) and the component (b). It is obtained by performing a hydrosilylation reaction with the SiH group of the halogen-containing siloxane compound (d) represented by the following formula (8), and then reacting a hydroxyl type acrylate compound. (in the formula, R 5 is each independently a monovalent hydrocarbon group with 1 to 6 carbon atoms that does not contain an addition-reactive carbon-carbon double bond, X is a halogen atom, and m is 1 or 2).
作為X之鹵素原子之具體例,舉例為氯、溴、碘等,較佳為氯。Specific examples of the halogen atom of X include chlorine, bromine, iodine and the like, and chlorine is preferred.
作為R5 之不含加成反應性碳-碳雙鍵之碳原子數1~6之1價烴基之具體例,舉例為甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、正戊基、正己基、環己基等之烷基;苯基等,特佳為甲基、苯基。Specific examples of the monovalent hydrocarbon group with 1 to 6 carbon atoms that do not contain an addition-reactive carbon-carbon double bond for R 5 include methyl, ethyl, n-propyl, isopropyl, n-butyl, Alkyl groups such as isobutyl, sec-butyl, tert-butyl, n-pentyl, n-hexyl, and cyclohexyl; phenyl, etc., particularly preferred are methyl and phenyl.
作為(d)成分之具體例舉例為以下述式表示者,但不限定於該等。 (式中,Ph表示苯基)。As a specific example of (d) component, what is represented by the following formula is illustrated, but it is not limited to these. (in the formula, Ph represents a phenyl group).
作為羥基型丙烯酸酯化合物舉例為丙烯酸2-羥基乙酯、丙烯酸2-羥基丙酯、甲基丙烯酸2-羥基乙酯、甲基丙烯酸2-羥基丙酯、丙烯酸4-羥基丁酯等,較佳為丙烯酸2-羥基烷酯。Examples of the hydroxyl-type acrylate compound include 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 4-hydroxybutyl acrylate, and the like, preferably It is 2-hydroxyalkyl acrylate.
作為(A)成分之較佳具體例舉例為下述式表示者等,但不限定於該等。 (式中,n=0~10)。Although a preferable specific example of (A) component is illustrated by the following formula, etc., it is not limited to these. (in the formula, n=0~10).
(A)成分特佳為以下述式(3)表示之化合物。 (式中,R3 為氫原子或甲基之任一者,n=0~10)。The component (A) is particularly preferably a compound represented by the following formula (3). (in the formula, R 3 is either a hydrogen atom or a methyl group, n=0-10).
(A)成分可單獨使用1種,亦可組合2種以上使用。(A) A component may be used individually by 1 type, and may be used in combination of 2 or more types.
[(B)成分] (B)成分係使(A)成分之(甲基)丙烯醯基等之聚合性官能基聚合之聚合起始劑,作為(B)成分,可使用藉由熱產生自由基之有機過氧化物,或藉由紫外線等之光產生自由基之光聚合起始劑。[(B) Ingredient] The component (B) is a polymerization initiator that polymerizes a polymerizable functional group such as the (meth)acryloyl group of the component (A). As the component (B), an organic peroxide that generates radicals by heat can be used. , or a photopolymerization initiator that generates free radicals by light such as ultraviolet rays.
(有機過氧化物) 作為有機過氧化物,基於組成物之保存安定性及控制硬化性之觀點、以及量子點之耐熱溫度之觀點,較佳為10小時半衰期溫度為50~150℃之有機過氧化物,更佳為60~110℃之有機過氧化物。(organic peroxide) The organic peroxide is preferably an organic peroxide having a half-life temperature of 50 to 150°C for 10 hours, more preferably from the viewpoints of the storage stability and curability of the composition, and the heat resistance temperature of the quantum dots. 60~110℃ organic peroxide.
作為有機過氧化物之具體例可舉例為苯甲醯基過氧化物、第三丁基過氧苯甲酸酯、鄰-甲基苯甲醯基過氧化物、對-甲基苯甲醯基過氧化物、二-第三丁基過氧化物、二異丙苯基過氧化物、1,1-雙(第三丁基過氧基)-3,3,5-三甲基環己烷、1,1-二-四丁基過氧基-環己烷、2,5-二甲基-2,5-二(第三丁基過氧基)己烷、2,5-二甲基-2,5-二(第三丁基過氧基)己炔、1,6-雙(對-甲苯醯基過氧羰氧基)己烷、二(4-甲基苯甲醯基過氧基)六亞甲基雙碳酸酯、2,5-二甲氧基-2,5-二(2-乙基己醯基過氧基)己烷、2,5-二甲基-2,5-二(2-乙基己醯基過氧基)己烷等。Specific examples of organic peroxides include benzyl peroxide, tert-butyl peroxybenzoate, o-methylbenzyl peroxide, p-methylbenzyl peroxide Peroxide, di-tert-butyl peroxide, dicumyl peroxide, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane , 1,1-di-tetrabutylperoxy-cyclohexane, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, 2,5-dimethyl -2,5-bis(tert-butylperoxy)hexyne, 1,6-bis(p-tolylperoxycarbonyloxy)hexane, bis(4-methylbenzylperoxy) base) hexamethylene biscarbonate, 2,5-dimethoxy-2,5-bis(2-ethylhexylperoxy)hexane, 2,5-dimethyl-2,5 -Di(2-ethylhexylperoxy)hexane, etc.
又,有機過氧化物亦可由商業上獲得,例如可自日油股份有限公司取得。具體舉例為PERBUTYL NHP (50.6)、PERHEXYL PV (53.2)、PERBUTYL PV(54.6)、PEROYL 355(59.4)、PEROYL L (61.6)、PEROCTA O(65.3)、PEROYL SA(65.9)、PERHEXA 25O (66.2)、PERHEXYL O(69.9)、NYPER PBM(70.6)、PERBUTYL O (72.1)、NYPER BMT(73.1)、NYPER BW(73.6)、PERHEXA MC (83.2)、PERHEXA TMH(86.7)、PERHEXA HC(87.1)、PERHEXA C (90.7)、PERTETRA A(94.7)、PERHEXYL I(95.0)、PERBUTYL MA(96.1)、PERBUTYL 355(97.1)、PERBUTYL L (98.3)、PERBUTYL I(98.7)、PERBUTYL E(99.0)、PERHEXYL Z (99.4)、PERHEXA 25Z (99.7)、PERBUTYL A(101.9)、PERHEXA 22 (103.1)、PERBUTYL Z(104.3)、PERHEXA V(104.5)、PERBUTYL P (119.2)、PERCUMYL D(116.4)、PERHEXYL D(116.4)、PERHEXA 25B(117.9)、PERBUTYL C(119.5)、PERBUTYL D(123.7)、PERMENTA H(128.0)、PERHEXYL 25B(128.4)、PERCUMYL P (145.1)等。又接續上述化合物名之括弧內數字分別為10小時半衰期溫度(單位:℃)。In addition, organic peroxides can also be obtained commercially, for example, from NOF Corporation. Specific examples are PERBUTYL NHP (50.6), PERHEXYL PV (53.2), PERBUTYL PV (54.6), PEROYL 355 (59.4), PEROYL L (61.6), PEROCTA O (65.3), PEROYL SA (65.9), PERHEXA 25O (66.2) , PERHEXYL O (69.9), NYPER PBM (70.6), PERBUTYL O (72.1), NYPER BMT (73.1), NYPER BW (73.6), PERHEXA MC (83.2), PERHEXA TMH (86.7), PERHEXA HC (87.1), PERHEXA C (90.7), PERTETRA A(94.7), PERHEXYL I(95.0), PERBUTYL MA(96.1), PERBUTYL 355(97.1), PERBUTYL L (98.3), PERBUTYL I(98.7), PERBUTYL E(99.0), PERHEXYL Z ( 99.4), PERHEXA 25Z (99.7), PERBUTYL A (101.9), PERHEXA 22 (103.1), PERBUTYL Z (104.3), PERHEXA V (104.5), PERBUTYL P (119.2), PERCUMYL D (116.4), PERHEXYL D (116.4) , PERHEXA 25B (117.9), PERBUTYL C (119.5), PERBUTYL D (123.7), PERMENTA H (128.0), PERHEXYL 25B (128.4), PERCUMYL P (145.1), etc. The numbers in parentheses following the above-mentioned compound names are respectively the 10-hour half-life temperature (unit: °C).
上述有機過氧化物中,基於與(A)成分之相溶性及10小時半衰期溫度之觀點,較佳為2,5-二甲氧基-2,5-二(2-乙基己醯基過氧基)己烷(日油(股)製,PERHEXA(註冊商標)25O,10小時半衰期溫度66.2℃)。Among the above-mentioned organic peroxides, 2,5-dimethoxy-2,5-bis(2-ethylhexyl peroxide) is preferred from the viewpoint of compatibility with the component (A) and a half-life temperature of 10 hours. oxy) hexane (manufactured by NOF Corporation, PERHEXA (registered trademark) 25O, 10-hour half-life temperature 66.2°C).
該等有機過氧化物可單獨使用1種,或可組合2種以上使用。These organic peroxides may be used alone or in combination of two or more.
有機過氧化物之添加量為有效量即可,但通常相對於(A)成分100質量份,為0.01~10質量份,更佳為0.1~5質量份。The addition amount of the organic peroxide may be an effective amount, but is usually 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass, with respect to 100 parts by mass of the (A) component.
(光聚合起始劑) 作為光聚合起始劑之具體例舉例為2,2-二乙氧基苯乙酮、2,2-二甲氧基-1,2-二苯基乙烷-1-酮、1-羥基-環己基-苯基酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、2-羥基-1-{4-[4-(2-羥基-2-甲基丙醯基)苄基]苯基}-2-甲基丙烷-1-酮、苯基乙醛酸甲酯、2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉基丙烷-1-酮、2-苄基-2-二甲胺基-1-(4-嗎啉基苯基)-1-丁酮、雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦、2,4,6-三甲基苯甲醯基-二苯基氧化膦等。(photopolymerization initiator) Specific examples of the photopolymerization initiator include 2,2-diethoxyacetophenone, 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxy- Cyclohexyl-phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropionyl )benzyl]phenyl}-2-methylpropan-1-one, methyl phenylglyoxylate, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinyl Propan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)-1-butanone, bis(2,4,6-trimethylbenzyl) )-phenylphosphine oxide, 2,4,6-trimethylbenzyl-diphenylphosphine oxide, etc.
上述光聚合起始劑中,基於與(A)成分之相溶性之觀點,較佳為2,2-二乙氧基苯乙酮、2-羥基-2-甲基-1-苯基丙烷-1-酮(IGM Resins B.V製Omnirad 1173)、雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦(IGM Resins B.V製Omnirad 819)、2,4,6-三甲基苯甲醯基-二苯基氧化膦(IGM Resins B.V製Omnirad TPO H)。Among the above-mentioned photopolymerization initiators, 2,2-diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropane- 1-keto (Omnirad 1173 manufactured by IGM Resins BV), bis(2,4,6-trimethylbenzyl)-phenylphosphine oxide (Omnirad 819 manufactured by IGM Resins BV), 2,4,6-trimethyl Benzyl-diphenylphosphine oxide (Omnirad TPO H from IGM Resins BV).
該等光聚合起始劑可單獨使用1種,或可組合2種以上使用。These photopolymerization initiators may be used alone or in combination of two or more.
光聚合起始劑之添加量,基於硬化性之觀點,相對於(A)成分100質量份,較佳為0.1~10質量份The amount of the photopolymerization initiator added is preferably 0.1 to 10 parts by mass relative to 100 parts by mass of the component (A) from the viewpoint of curability
[其他成分] 本發明之自由基硬化型組成物中,為了抑制硬化物著色、白濁、氧化劣化等發生,亦可調配2,6-二-第三丁基-4-甲基酚等之習知抗氧化劑。且,為了賦予對於光劣化之抵抗性,亦可調配受阻胺系安定劑等之光安定劑。再者,根據需要,為了提高強度亦可調配發煙氧化矽等之無機質填充劑,亦可調配染料、顏料、難燃劑等。為了提高接著力亦可調配接著助劑(矽烷偶合劑等)。[other ingredients] In the radical-curable composition of the present invention, conventional antioxidants such as 2,6-di-tert-butyl-4-methylphenol can also be blended in order to suppress the occurrence of coloration, cloudiness, and oxidative deterioration of the cured product. In addition, in order to impart resistance to light deterioration, a light stabilizer such as a hindered amine-based stabilizer may be formulated. Furthermore, if necessary, inorganic fillers such as fumed silica, dyes, pigments, flame retardants, etc. may also be prepared in order to increase the strength. Adhesion aids (silane coupling agents, etc.) may also be prepared in order to improve the adhesive force.
本發明之自由基硬化型組成物亦可調配螢光體或量子點作為波長轉換材料。量子點為通常平均粒徑為20nm以下之粒子,可吸收・轉換光能量。量子點可藉由改變其粒徑而調整光顏色。由於藉由粒徑大小決定帶隙,故藉由使粒徑一致可獲得色純度高的光。The radical hardening composition of the present invention can also be formulated with phosphors or quantum dots as wavelength conversion materials. Quantum dots are usually particles with an average particle size of 20 nm or less, which can absorb and convert light energy. Quantum dots can adjust the color of light by changing their particle size. Since the band gap is determined by the size of the particle size, light with high color purity can be obtained by making the particle size uniform.
量子點作為於可見光區域發射光者,舉例為具有如CdS或ZnSe、ZnS之殼的CdSe系粒子。且亦可使用InP、CuInS2 、AgInS2 、Te、PbS、InAs等之不含鎘之量子點。本發明亦可使用過去以來之任何種類之量子點。As quantum dots that emit light in the visible light region, for example, CdSe-based particles having a shell such as CdS, ZnSe, or ZnS are used. In addition, cadmium-free quantum dots such as InP, CuInS 2 , AgInS 2 , Te, PbS, and InAs can also be used. The present invention can also use any kind of quantum dots from the past.
如上述,一般量子點大多包含附加反應之觸媒毒害,若使用加成硬化型之組成物作為量子點之黏合劑材料,則有發生硬化不良之情況。再者,量子點由於耐熱性低,故難以耐受加成硬化型材料之硬化條件。 另一方面,本發明之自由基硬化型組成物由於藉由自由基硬化而可於低溫硬化,故可避免使用加成硬化型組成物之情況的上述問題點,於作為量子點之黏合劑材料有用。As mentioned above, most of the quantum dots contain catalyst poisoning of additional reactions. If an addition-hardening composition is used as the adhesive material of quantum dots, poor hardening may occur. Furthermore, since quantum dots have low heat resistance, it is difficult to withstand the hardening conditions of an addition hardening type material. On the other hand, the radical hardening composition of the present invention can be hardened at low temperature by radical hardening, so it can avoid the above-mentioned problems in the case of using an addition hardening composition, and can be used as a binder material for quantum dots. it works.
[硬化物] 本發明亦提供上述自由基硬化型組成物之硬化物。 本發明之自由基硬化型組成物可藉由自由基硬化而於低溫硬化,使本發明之自由基硬化型組成物硬化所得之硬化物由於具有優異之透明性與良好硬度,故於LED元件之密封材及波長轉換濾波器等之用途有用。 且具有多環式烴骨架之本發明之自由基硬化型組成物若使用於光學元件用密封材料,則所得之密封材料(硬化物)由於具有高的氣體阻隔性,故可防止自外部之腐蝕氣體之侵入。因此作為用以將不耐受水的量子點密封之材料亦有用。[hardened product] The present invention also provides a cured product of the above-mentioned radical-curable composition. The radical curing composition of the present invention can be cured at low temperature by radical curing. The cured product obtained by curing the radical curing composition of the present invention has excellent transparency and good hardness, so it is suitable for use in LED devices. Useful for applications such as sealing materials and wavelength conversion filters. In addition, if the radical-curable composition of the present invention having a polycyclic hydrocarbon skeleton is used as a sealing material for optical elements, the obtained sealing material (hardened product) can prevent corrosion from the outside due to its high gas barrier properties. Gas intrusion. Therefore, it is also useful as a material for sealing quantum dots that are not resistant to water.
[硬化方法及硬化條件] 本發明之自由基硬化型組成物中,作為含有有機過氧化物之熱自由基硬化型之硬化方法及硬化條件,可採用習知方法及條件。若舉一例,則可為在氮氣環境下,於70~150℃中10分鐘~5小時之條件硬化。尤其聚合起始劑為10小時半衰期溫度50~150℃的有機過氧化物之情況下,可於更低溫硬化而較佳。[Hardening method and hardening conditions] In the radical-curable composition of the present invention, conventional methods and conditions can be adopted as the curing method and curing conditions of the thermal radical-curing type containing organic peroxide. As an example, it can be hardened under the conditions of 10 minutes to 5 hours at 70 to 150° C. in a nitrogen atmosphere. In particular, when the polymerization initiator is an organic peroxide with a half-life temperature of 50 to 150° C. for 10 hours, it is preferable that it can be cured at a lower temperature.
又,針對含有光聚合起始劑之光硬化型之自由基硬化型組成物,可藉由照射紫外線等之光而硬化。作為紫外線之光源,舉例為例如UV LED燈、高壓水銀燈、超高壓水銀燈、金屬鹵素燈、碳弧燈及氙氣燈等。紫外線之照射量(累積光量)例如對於將本發明之組成物成形為2.0mm左右之厚度的薄片,較佳為1~10,000mJ/cm2 ,更佳為10~9,000mJ/cm2 。亦即,使用照度100mW/cm2 之紫外線之情況,藉由照射0.01~ 100秒左右紫外線而可硬化。 [實施例]Moreover, the radical hardening type composition of the photohardening type containing a photopolymerization initiator can be hardened by irradiating light, such as an ultraviolet-ray. As a light source of ultraviolet rays, for example, UV LED lamps, high-pressure mercury lamps, ultra-high pressure mercury lamps, metal halide lamps, carbon arc lamps, and xenon lamps are exemplified. The irradiation dose (cumulative light dose) of ultraviolet rays is, for example, when the composition of the present invention is formed into a sheet having a thickness of about 2.0 mm, preferably 1 to 10,000 mJ/cm 2 , more preferably 10 to 9,000 mJ/cm 2 . That is, in the case of using ultraviolet rays with an illuminance of 100 mW/cm 2 , it can be cured by irradiating ultraviolet rays for about 0.01 to 100 seconds. [Example]
以下使用實施例具體說明本發明,但該等實施例不對本發明有任何限制。又,以下中,反應生成物之FT-IR、NMR及GPC係藉由常用方法測定,於25℃之黏度係藉由B型旋轉式黏度計測定。The following examples are used to specifically illustrate the present invention, but these examples do not limit the present invention in any way. In addition, in the following, the FT-IR, NMR and GPC of the reaction product were measured by the usual method, and the viscosity at 25 degreeC was measured by the B-type rotational viscometer.
[合成例1] 於具備攪拌裝置、冷卻管、滴加漏斗及溫度計之5L 4頸燒瓶中,添加乙烯基降冰片烯(商品名:V0062,東京化成工業(股)製;5-乙烯基雙環[2.2.1]庚-2-烯與6-乙烯基雙環[2.2.1]庚-2-烯之約等莫耳量之異構物混合物) 1,785g(14.88莫耳)及甲苯455g,使用油浴加熱至85℃。 於其中添加3.6g之擔載5%質量鉑金屬之碳粉末,邊攪拌邊歷時180分鐘滴加1,4-雙(二甲基矽烷基)苯1,698g(8.75莫耳)。滴加結束後,於110℃攪拌24小時後,冷卻至25℃。隨後,過濾去除擔載鉑金屬之碳,減壓餾除甲苯及過量之乙烯基降冰片烯,獲得3,362g之無色透明油狀之反應生成物(ab-1)(於25℃之黏度:12,820 mPa・s)。 反應生成物之FT-IR、NMR及GPC分析結果,係下述式(9)中n=0之化合物約為41莫耳%,n=1之化合物約為32莫耳%,n=2之化合物約為27莫耳%之混合物。且混合物中之加成反應性碳-碳雙鍵之含量為0.36莫耳/100g。 [Synthesis Example 1] In a 5L 4-neck flask equipped with a stirring device, a cooling tube, a dropping funnel, and a thermometer, vinyl norbornene (trade name: V0062, manufactured by Tokyo Chemical Industry Co., Ltd.; 5-vinylbicyclo) was added [2.2.1] Hept-2-ene and 6-vinylbicyclo[2.2.1]hept-2-ene (about equimolar isomer mixture) 1,785g (14.88mol) and toluene 455g, used The oil bath was heated to 85°C. 3.6 g of carbon powder supporting 5% by mass of platinum metal was added thereto, and 1,698 g (8.75 moles) of 1,4-bis(dimethylsilyl)benzene was added dropwise over 180 minutes while stirring. After completion of the dropwise addition, the mixture was stirred at 110°C for 24 hours, and then cooled to 25°C. Then, the carbon carrying platinum metal was removed by filtration, and toluene and excess vinyl norbornene were distilled off under reduced pressure to obtain 3,362 g of a colorless and transparent oily reaction product (ab-1) (viscosity at 25°C: 12,820 mPa·s). The results of FT-IR, NMR and GPC analysis of the reaction product show that in the following formula (9), the compound with n=0 is about 41 mol%, the compound with n=1 is about 32 mol%, and the compound with n=2 is about 32 mol%. Compounds are approximately 27 mol% mixture. And the content of addition-reactive carbon-carbon double bonds in the mixture was 0.36 mol/100 g.
[合成例2] 於具備攪拌裝置、冷卻管、滴加漏斗及溫度計之1L 4頸燒瓶中,將合成例1所得之(ab-1)200g溶解於甲苯100g,添加二丁基羥基甲苯0.2g,使用油浴加熱至80℃。於其中添加0.15g之六氯化鉑1,3-二乙烯基四甲基二矽氧烷之甲苯溶液(以鉑換算為0.5質量%),邊攪拌邊滴加以下述式(10)表示之有機氫二矽氧烷189.6g。滴加結束後,於95℃攪拌2小時後,減壓餾除甲苯,獲得376.7g之無色透明油狀反應生成物(A-1)(於25℃之黏度:870 mPa・s)。 [Synthesis Example 2] 200 g of (ab-1) obtained in Synthesis Example 1 was dissolved in 100 g of toluene in a 1 L 4-neck flask equipped with a stirring device, a cooling tube, a dropping funnel, and a thermometer, and 0.2 g of dibutylhydroxytoluene was added. , heated to 80°C using an oil bath. To this was added 0.15 g of a toluene solution of platinum hexachloride 1,3-divinyltetramethyldisiloxane (0.5 mass % in terms of platinum), and the following formula (10) was added dropwise while stirring. Organohydrogendisiloxane 189.6g. After the dropwise addition, the mixture was stirred at 95°C for 2 hours, and then toluene was distilled off under reduced pressure to obtain 376.7 g of a colorless and transparent oily reaction product (A-1) (viscosity at 25°C: 870 mPa·s).
[合成例3] 於具備攪拌裝置、冷卻管、滴加漏斗及溫度計之5L 4頸燒瓶中,添加乙烯基降冰片烯(商品名:V0062,東京化成工業(股)製;5-乙烯基雙環[2.2.1]庚-2-烯與6-乙烯基雙環[2.2.1]庚-2-烯之約等莫耳量之異構物混合物) 270g(2.25莫耳)及甲苯2.5g,使用油浴加熱至85℃。 於其中添加0.19g之擔載5%質量鉑金屬之碳粉末,邊攪拌邊滴加1,4-雙(二甲基矽烷基)苯174.5g(0.90莫耳)。滴加結束後,於110℃攪拌24小時後,冷卻至25℃。隨後,過濾去除擔載鉑金屬之碳,減壓餾除甲苯及過量之乙烯基降冰片烯,獲得311g之無色透明油狀之反應生成物(ab-2)(於25℃之黏度:1,710 mPa・s)。 反應生成物之FT-IR、NMR及GPC分析結果,係前述式(9)中n=0之化合物約為74莫耳%,n=1之化合物約為21莫耳%,n=2之化合物約為5莫耳%之混合物。且混合物中之加成反應性碳-碳雙鍵之含量為0.37莫耳/100g。[Synthesis Example 3] In a 5L 4-neck flask equipped with a stirring device, a cooling tube, a dropping funnel and a thermometer, add vinyl norbornene (trade name: V0062, manufactured by Tokyo Chemical Industry Co., Ltd.; 5-vinylbicyclo[2.2.1] Hept-2-ene and 6-vinylbicyclo[2.2.1]hept-2-ene (about equimolar isomer mixture) 270g (2.25mol) and toluene 2.5g, heated to 85g using an oil bath °C. 0.19 g of carbon powder supporting 5% by mass of platinum metal was added thereto, and 174.5 g (0.90 mol) of 1,4-bis(dimethylsilyl)benzene was added dropwise with stirring. After completion of the dropwise addition, the mixture was stirred at 110°C for 24 hours, and then cooled to 25°C. Subsequently, the carbon carrying platinum metal was removed by filtration, and toluene and excess vinyl norbornene were removed by vacuum distillation to obtain 311 g of a colorless and transparent oily reaction product (ab-2) (viscosity at 25°C: 1,710 mPa)・s). The results of FT-IR, NMR and GPC analysis of the reaction product show that the compound with n=0 in the aforementioned formula (9) is about 74 mol%, the compound with n=1 is about 21 mol%, and the compound with n=2 About 5 mol% of the mixture. And the content of addition-reactive carbon-carbon double bonds in the mixture was 0.37 mol/100 g.
[合成例4] 於具備攪拌裝置、冷卻管、滴加漏斗及溫度計之500mL 4頸燒瓶中,將合成例3所得之反應生成物(ab-2)50g溶解於甲苯25g,添加二丁基羥基甲苯0.05g,使用油浴加熱至80℃。於其中添加0.025g之六氯化鉑1,3-二乙烯基四甲基二矽氧烷之甲苯溶液(以鉑換算為0.5質量%),邊攪拌邊滴加以前述式(10)表示之有機氫二矽氧烷48.7g。滴加結束後,於95℃攪拌2小時後,減壓餾除甲苯,獲得90g之無色透明油狀反應生成物(A-2)(於25℃之黏度:530 mPa・s)。[Synthesis Example 4] In a 500 mL 4-neck flask equipped with a stirring device, a cooling tube, a dropping funnel, and a thermometer, 50 g of the reaction product (ab-2) obtained in Synthesis Example 3 was dissolved in 25 g of toluene, 0.05 g of dibutylhydroxytoluene was added, and the mixture was used. The oil bath was heated to 80°C. To this was added 0.025 g of a toluene solution of platinum hexachloride 1,3-divinyltetramethyldisiloxane (0.5 mass % in terms of platinum), and the organic compound represented by the formula (10) was added dropwise with stirring. Hydrodisiloxane 48.7g. After the dropwise addition, the mixture was stirred at 95°C for 2 hours, and then toluene was distilled off under reduced pressure to obtain 90 g of a colorless and transparent oily reaction product (A-2) (viscosity at 25°C: 530 mPa·s).
[實施例1~4及比較例1、2] 以表1所示之調配量(數值表示質量份)分別混合前述合成例所得之(ab-1)、(A-1)、(A-2)成分與下述(B)成分,調製自由基硬化型組成物(熱硬化型及紫外線硬化型)。[Examples 1 to 4 and Comparative Examples 1 and 2] The components (ab-1), (A-1), and (A-2) obtained in the above-mentioned synthesis examples and the following (B) components were respectively mixed in the preparation amounts shown in Table 1 (numerical values indicate parts by mass) to prepare radicals. Curable composition (thermo-curable and UV-curable).
(B)成分: (有機過氧化物) (B-1)PERHEXA(註冊商標)25O(日油(股)製,10小時半衰期溫度66.2℃) (光聚合起始劑) (B-2) Omnirad 1173(IGM Resins B.V.公司製)(B) Ingredient: (organic peroxide) (B-1) PERHEXA (registered trademark) 25O (manufactured by NOF Corporation, 10-hour half-life temperature 66.2°C) (photopolymerization initiator) (B-2) Omnirad 1173 (manufactured by IGM Resins B.V.)
藉以下方法評價實施例及比較例所得之組成物,結果示於表2。The compositions obtained in Examples and Comparative Examples were evaluated by the following methods, and the results are shown in Table 2.
[硬度] ・熱硬化型 針對藉由將組成物於氮氣環境下以80℃之熱風循環式烘箱加熱2小時而製作之厚度2mm之硬化物之硬度,進行23℃下之A型硬度之測定。[hardness] ・Thermosetting type With respect to the hardness of a hardened product having a thickness of 2 mm produced by heating the composition in a hot air circulating oven at 80° C. for 2 hours under a nitrogen atmosphere, the measurement of type A hardness at 23° C. was performed.
・紫外線硬化型 針對使用EYE GRAPHYTICS(股)製EYE UV電子控制裝置(型號UBX0601-01)將組成物於氮氣環境下、25℃,以波長365nm之紫外光的照射量成為8,000mJ/cm2 之方式照射紫外線,使之硬化之2mm厚的硬化物之硬度,進行23℃下之A型硬度之測定。・Ultraviolet curing type is for the use of EYE GRAPHYTICS Co., Ltd. EYE UV electronic control device (model UBX0601-01) to expose the composition to 8,000mJ/cm 2 of ultraviolet light with a wavelength of 365 nm in a nitrogen atmosphere at 25°C. The hardness of a 2mm thick cured product was irradiated with ultraviolet rays in a manner to measure the A-type hardness at 23°C.
[光透過率] ・熱硬化型 針對藉由將組成物於氮氣環境下以80℃之熱風循環式烘箱加熱2小時而製作之厚度2mm之硬化物之光透過率,使用分光光度計U-3900(日立高科技公司製)分別測定25℃下之波長400nm之直進光的光透過率。[Light transmittance] ・Thermosetting type The light transmittance of a cured product with a thickness of 2 mm produced by heating the composition in a hot air circulating oven at 80° C. for 2 hours in a nitrogen atmosphere was measured using a spectrophotometer U-3900 (manufactured by Hitachi High-Technologies). Light transmittance of straight light with a wavelength of 400nm at 25°C.
・紫外線硬化型 針對使用EYE GRAPHYTICS(股)製EYE UV電子控制裝置(型號UBX0601-01)將組成物於氮氣環境下、25℃,以波長365nm之紫外光的照射量成為8,000mJ/cm2 之方式照射紫外線,使之硬化之2mm厚的硬化物,使用分光光度計U-3900(日立高科技公司製)分別測定25℃下之波長400nm之直進光的光透過率。・Ultraviolet curing type is for the use of EYE GRAPHYTICS Co., Ltd. EYE UV electronic control device (model UBX0601-01) to expose the composition to 8,000mJ/cm 2 of ultraviolet light with a wavelength of 365 nm in a nitrogen atmosphere at 25°C. A 2 mm thick cured product was irradiated with ultraviolet rays to be cured, and the light transmittance of the straight incoming light with a wavelength of 400 nm at 25° C. was measured using a spectrophotometer U-3900 (manufactured by Hitachi High-Tech Co., Ltd.).
如表2所示,使用本發明之自由基硬化型組成物之實施例1~4,於低溫且短時間硬化且具有高的透明性。另一方面,使用不具有(甲基)丙烯醯基之組成物之比較例1~2,於上述硬化條件未引起硬化。As shown in Table 2, Examples 1 to 4 using the radical-curable composition of the present invention were cured at low temperature and in a short time, and had high transparency. On the other hand, in the comparative examples 1-2 which used the composition which does not have a (meth)acryloyl group, hardening did not generate|occur|produce in the said hardening conditions.
又,本發明並非限定於上述實施形態。上述實施形態為例示,凡具有與本發明申請專利範圍中記載之技術思想實質相同構成,而發揮相同作用效果者,均包含於本發明之技術範圍。In addition, this invention is not limited to the said embodiment. The above-mentioned embodiments are examples, and all those having substantially the same structure as the technical idea described in the scope of the patent application of the present invention and exhibiting the same functions and effects are included in the technical scope of the present invention.
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