JP2012046604A - Curable silicone-based composition containing polycyclic hydrocarbon skeleton component - Google Patents

Curable silicone-based composition containing polycyclic hydrocarbon skeleton component Download PDF

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JP2012046604A
JP2012046604A JP2010189038A JP2010189038A JP2012046604A JP 2012046604 A JP2012046604 A JP 2012046604A JP 2010189038 A JP2010189038 A JP 2010189038A JP 2010189038 A JP2010189038 A JP 2010189038A JP 2012046604 A JP2012046604 A JP 2012046604A
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Eiichi Tabei
栄一 田部井
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Shin Etsu Chemical Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a curable silicone-based composition having a gas barrier property, causing no warpage of a substrate even when the substrate is subjected to sealing, and providing a transparent cured product having a hardness suitable for dicing.SOLUTION: This curable silicone-based composition includes: (A) a reaction product of an addition reaction between (a) a compound represented by General Formula (1): [where R is an unsubstituted or halogen atom or the like-substituted monovalent hydrocarbon group or alkoxy group] which has in the molecule thereof, two SiH bonds and (b) a polycyclic hydrocarbon having in the molecule thereof, two addition-reactable carbon-carbon double bonds, which has in the molecule thereof, two addition-reactable carbon-carbon double bonds; (B) a linear siloxane containing in the molecule thereof, three or more SiH bonds and a phenyl group; (C) a siloxane compound having an alkoxysilyl group and/or an epoxy group and an SiH bond; and (D) a hydrosilylation reaction catalyst.

Description

本発明は、光学機器用部材、電子機器用絶縁材またはコーティング材料として有用な、多環式炭化水素骨格含有成分を含む硬化性シリコーン系組成物に関する。   The present invention relates to a curable silicone-based composition containing a polycyclic hydrocarbon skeleton-containing component that is useful as a member for optical equipment, an insulating material for electronic equipment, or a coating material.

近年、光学機器用部材、特に光エネルギーの大きな青色発光ダイオード(LED)や白色発光ダイオード(LED)の封止材料を初めとして、シリコーン樹脂のLED関連の様々な用途への利用が進んでいる。こうした状況下、封止材に対して種々の耐久性が要求されている。
シリコーン封止材料に着目してみると、耐光性や耐熱変色性に優れる利点がある一方、シリコーンは特性としてガス透過性を有するために、外部からの腐食性ガスの浸入により銀電極が変色し、その結果、LEDの輝度が低下してしまうことがある。
2. Description of the Related Art In recent years, the use of silicone resin for various LED-related applications has progressed, including sealing materials for optical device members, particularly blue light-emitting diodes (LEDs) and white light-emitting diodes (LEDs) with large light energy. Under such circumstances, various durability is required for the sealing material.
Focusing on the silicone sealing material has the advantage of being excellent in light resistance and heat discoloration, but since silicone has gas permeability as a characteristic, the silver electrode discolors due to the ingress of corrosive gas from the outside. As a result, the brightness of the LED may decrease.

一方、LEDの封止工程に着目すると、カップ状のデバイスに封止材をディスペンス方式で行なう方法の他、多数のLEDチップを搭載した基板に対して、封止樹脂を一括塗布し、樹脂を硬化させた後に、ダイシングによって個片化する製造方法も採用されている。このような製造方法において高硬度のシリコーン封止材を用いた場合、硬化収縮によって基板の反りが発生し、精密なダイシングができないことがある。   On the other hand, when focusing on the LED sealing process, in addition to a method of dispensing a sealing material on a cup-shaped device by a dispensing method, a sealing resin is applied collectively to a substrate on which a large number of LED chips are mounted. A manufacturing method is also employed in which after curing, the product is separated into pieces by dicing. When a high-hardness silicone sealing material is used in such a manufacturing method, warping of the substrate may occur due to curing shrinkage, and precise dicing may not be possible.

先に、本発明者は、付加反応性炭素−炭素二重結合を1分子中に2個有する多環式炭化水素骨格含有化合物とケイ素原子に結合した水素原子を1分子中に少なくとも3個以上有する化合物とヒドロシリル化触媒を必須成分として含む硬化性組成物を提案した(特許文献1)。しかしながら、この組成物を加熱硬化させた硬化物はガスバリア性に劣るため、銀電極が変色することがある。また、基板上に塗布し、樹脂を硬化させた場合に基板に反りが発生し、精密なダイシング加工ができない問題点があった。   First, the present inventor has determined that at least three hydrogen atoms bonded to a silicon atom and a polycyclic hydrocarbon skeleton-containing compound having two addition-reactive carbon-carbon double bonds in one molecule are bonded to a silicon atom. The curable composition containing the compound which has and a hydrosilylation catalyst as an essential component was proposed (patent document 1). However, since the cured product obtained by heat-curing this composition is inferior in gas barrier properties, the silver electrode may be discolored. Further, when the resin is applied on the substrate and the resin is cured, the substrate warps, and there is a problem that precise dicing cannot be performed.

特開2005−133073号公報JP 2005-133073 A

上記従来技術の問題点に鑑み、本発明は、ガスバリア性を有し、かつ、多数のLEDチップを搭載した基板に対して封止を施しても基板の反りが発生せず、それでいてダイシングするのに十分な硬度を持つ透明な硬化物を与える硬化性シリコーン系組成物を提供することを目的とする。   In view of the above-mentioned problems of the prior art, the present invention has a gas barrier property, and even if sealing is performed on a substrate on which a large number of LED chips are mounted, the substrate does not warp, and yet it is diced. An object of the present invention is to provide a curable silicone-based composition that gives a transparent cured product having sufficient hardness.

本発明者らは、上記目的を達成するために鋭意検討を行った結果、本発明を完成させるに至った。
即ち、本発明は、
(A)(a)下記一般式(1):
As a result of intensive studies to achieve the above object, the present inventors have completed the present invention.
That is, the present invention
(A) (a) The following general formula (1):

Figure 2012046604
Figure 2012046604

[式中、Rは独立に非置換のまたはハロゲン原子、シアノ基もしくはグリシドキシ基で置
換された炭素原子数1〜12の1価炭化水素基または炭素原子数1〜6アルコキシ基である。]
で表されるケイ素原子に結合した水素原子を1分子中に2個有する化合物と、
(b)付加反応性炭素−炭素二重結合を1分子中に2個有する多環式炭化水素と、
の付加反応生成物であって、かつ、付加反応性炭素−炭素二重結合を1分子中に2個有する付加反応生成物、
(B)ケイ素原子に結合した水素原子を1分子中に3個以上有し、かつ、フェニル基を含有する直鎖状シロキサン、
(C)アルコキシシリル基およびエポキシ基からなる群から選ばれる少なくとも1種の官能基と、ケイ素原子に結合した水素原子と、を有するシロキサン化合物、ならびに、
(D)ヒドロシリル化反応触媒
を含む硬化性シリコーン系組成物を提供するものである。
[Wherein, R is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms or an alkoxy group having 1 to 6 carbon atoms which is unsubstituted or substituted with a halogen atom, a cyano group or a glycidoxy group. ]
A compound having two hydrogen atoms bonded to a silicon atom represented by
(b) a polycyclic hydrocarbon having two addition-reactive carbon-carbon double bonds in one molecule;
An addition reaction product having two addition-reactive carbon-carbon double bonds per molecule,
(B) a linear siloxane having three or more hydrogen atoms bonded to a silicon atom in one molecule and containing a phenyl group;
(C) a siloxane compound having at least one functional group selected from the group consisting of an alkoxysilyl group and an epoxy group, and a hydrogen atom bonded to a silicon atom, and
(D) A curable silicone composition containing a hydrosilylation reaction catalyst is provided.

本発明の硬化性シリコーン系組成物は、電極の変色を防止するガスバリア性を保持し、かつ、多数のLEDチップを搭載した基板に対して封止を施しても基板に反りが生じることがなく、ダイシングするのに十分な硬度を持つ硬化性シリコーン系組成物を与えることができる。従って、種々の製造工程に対応した発光ダイオード素子の保護、封止の用途に好適に使用できる。また、硬化物は透明性に優れるため、レンズ材料、光学機器用封止材、ディスプレイ材料等の各種の光学用材料、電子機器用絶縁材、更にはコーティング材料としても有用である。   The curable silicone composition of the present invention retains gas barrier properties to prevent discoloration of the electrode, and the substrate is not warped even when sealing is performed on the substrate on which a large number of LED chips are mounted. A curable silicone composition having a hardness sufficient for dicing can be provided. Therefore, it can be suitably used for protection and sealing applications of light emitting diode elements corresponding to various manufacturing processes. Further, since the cured product is excellent in transparency, it is useful as various optical materials such as lens materials, sealing materials for optical devices, display materials, insulating materials for electronic devices, and coating materials.

以下、本発明について詳しく説明する。なお、Meはメチル基を示し、Phはフェニル基を示す。
−硬化性シリコーン系組成物−
[(A)成分]
本発明の組成物の(A)成分は、
(a)下記一般式(1):
The present invention will be described in detail below. Me represents a methyl group and Ph represents a phenyl group.
-Curable silicone composition-
[Component (A)]
The component (A) of the composition of the present invention is:
(a) The following general formula (1):

Figure 2012046604
Figure 2012046604

[式中、Rは独立に非置換のまたはハロゲン原子、シアノ基もしくはグリシドキシ基で置
換された炭素原子数1〜12、好ましくは1〜6の1価炭化水素基または炭素原子数1〜6、好ましくは1〜4のアルコキシ基である]
で表されるケイ素原子に結合した水素原子(以下、「SiH」とも云う)を1分子中に2個有する化合物と、
(b)付加反応性炭素−炭素二重結合を1分子中に2個有する多環式炭化水素との付加反応生成物であって、かつ、付加反応性炭素−炭素二重結合を1分子中に2個有する付加反応生成物である。
[Wherein, R is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, preferably 1 to 6 carbon atoms, or 1 to 6 carbon atoms, which is unsubstituted or substituted with a halogen atom, a cyano group or a glycidoxy group, Preferred are 1-4 alkoxy groups]
A compound having two hydrogen atoms (hereinafter also referred to as “SiH”) bonded to a silicon atom represented by
(b) an addition reaction product with a polycyclic hydrocarbon having two addition-reactive carbon-carbon double bonds in one molecule, and the addition-reactive carbon-carbon double bond in one molecule It is an addition reaction product having two.

<(a)成分>
この(A)成分の反応原料である、(a)成分は式(1)で表される化合物である。
<(A) component>
The component (a), which is a reaction raw material of the component (A), is a compound represented by the formula (1).

Figure 2012046604
Figure 2012046604

(式中、Rは、独立に非置換のまたはハロゲン原子、シアノ基もしくはグリシドキシ基で置換された炭素原子数1〜12、好ましくは1〜6の1価炭化水素基または炭素原子数1〜6、好ましくは1〜4のアルコキシ基である。
上記一般式(1)中のRは、アルケニル基およびアルケニルアリール基以外のものであるものが好ましく、特に、その全てがメチル基であることが好ましい。
Wherein R is independently a monovalent hydrocarbon group having 1 to 12, preferably 1 to 6 carbon atoms, or 1 to 6 carbon atoms, which is independently unsubstituted or substituted with a halogen atom, a cyano group or a glycidoxy group. , Preferably 1-4 alkoxy groups.
R in the general formula (1) is preferably other than an alkenyl group and an alkenylaryl group, and it is particularly preferable that all of them are methyl groups.

この上記一般式(1)で表される化合物としては、例えば、
構造式:HMe2Si-p-C64-SiMe2Hで表される1,4-ビス(ジメチルシリル)ベンゼン、
構造式:HMe2Si-m-C64-SiMe2Hで表される1,3-ビス(ジメチルシリル)ベンゼン等のシルフェニレン化合物が挙げられる。
なお、この上記一般式(1)で表される化合物は、1種単独でも2種以上を組み合わせても使用することができる。
As the compound represented by the general formula (1), for example,
Structural formula: 1,4-bis (dimethylsilyl) benzene represented by HMe 2 Si—p—C 6 H 4 —SiMe 2 H;
Examples include silphenylene compounds such as 1,3-bis (dimethylsilyl) benzene represented by the structural formula: HMe 2 Si-m—C 6 H 4 —SiMe 2 H.
The compound represented by the general formula (1) can be used alone or in combination of two or more.

<(b)成分>
この(A)成分の反応原料である(b)付加反応性炭素−炭素二重結合を1分子中に2個有する多環式炭化水素において、前記「付加反応性」とは、ケイ素原子に結合した水素原子と周知のヒドロシリル化反応により付加反応し得る性質を意味する。
<(B) component>
In (b) a polycyclic hydrocarbon having two addition-reactive carbon-carbon double bonds in one molecule, which is a reaction raw material of component (A), the above-mentioned “addition reactivity” means bonding to a silicon atom. It means a property capable of undergoing an addition reaction with a known hydrogen atom by a well-known hydrosilylation reaction.

また、該(b)成分は、(i)多環式炭化水素の骨格を形成している炭素原子のうち、隣接する2つの炭素原子間に付加反応性炭素−炭素二重結合が形成されているもの、(ii)多環式炭化水素の骨格を形成している炭素原子に結合した水素原子が、付加反応性炭素−炭素二重結合含有基によって置換されているもの、または、(iii)多環式炭化水素の骨格を形成している炭素原子のうち、隣接する2つの炭素原子間に付加反応性炭素−炭素二重結合が形成されており、かつ、多環式炭化水素の骨格を形成している炭素原子に結合した水素原子が付加反応性炭素−炭素二重結合含有基によって置換されているもの、の何れであっても差し支えない。ここで、付加反応性炭素−炭素二重結合含有基としては、例えば、ビニル基、アリル基、プロペニル基、ブテニル基、ヘキセニル基、ノルボルニル基等のアルケニル基、特に炭素原子数2〜12のもの等が挙げられる。
この(b)成分としては、例えば、下記構造式(x):
The component (b) includes (i) an addition-reactive carbon-carbon double bond formed between two adjacent carbon atoms among the carbon atoms forming the polycyclic hydrocarbon skeleton. (Ii) a hydrogen atom bonded to a carbon atom forming a polycyclic hydrocarbon skeleton is substituted by an addition-reactive carbon-carbon double bond-containing group, or (iii) Among the carbon atoms forming the polycyclic hydrocarbon skeleton, an addition-reactive carbon-carbon double bond is formed between two adjacent carbon atoms, and the polycyclic hydrocarbon skeleton is Any hydrogen atom bonded to the carbon atom formed may be substituted with an addition-reactive carbon-carbon double bond-containing group. Here, examples of the addition-reactive carbon-carbon double bond-containing group include alkenyl groups such as vinyl group, allyl group, propenyl group, butenyl group, hexenyl group, norbornyl group, particularly those having 2 to 12 carbon atoms. Etc.
Examples of the component (b) include the following structural formula (x):

Figure 2012046604
Figure 2012046604

で表される5-ビニルビシクロ[2.2.1]ヘプト-2-エン、
下記構造式(y):
5-vinylbicyclo [2.2.1] hept-2-ene represented by
The following structural formula (y):

Figure 2012046604
Figure 2012046604

で表される6-ビニルビシクロ[2.2.1]ヘプト-2-エン、前記両者の組み合わせ(以下、これら3者を区別する必要がない場合は、「ビニルノルボルネン」と総称することがある)が挙げられる。
なお、前記ビニルノルボルネンのビニル基の置換位置は、シス配置(エキソ形)またはトランス配置(エンド形)のいずれであってもよく、また、前記配置の相違によって、該成分の反応性等に特段の差異がないことから、前記両配置の異性体の組み合わせであっても差し支えない。
6-vinylbicyclo [2.2.1] hept-2-ene represented by the above-mentioned combination of the two (hereinafter, when there is no need to distinguish between the three, they may be collectively referred to as “vinyl norbornene”) Can be mentioned.
Incidentally, the substitution position of the vinyl group of the vinyl norbornene may be either a cis configuration (exo type) or a trans configuration (end type). Since there is no difference in the above, it may be a combination of the isomers in both configurations.

<(A)成分の調製>
本発明の組成物の(A)成分は、SiHを1分子中に2個有する上記(a)成分の1モルに対して、付加反応性炭素−炭素二重結合を1分子中に2個有する上記(b)成分の1モルを越え10モル以下、好ましくは1モルを越え5モル以下の過剰量を、ヒドロシリル化反応触媒の存在下で付加反応させることにより、SiHを有しない付加反応生成物として得ることができる。
<Preparation of component (A)>
The component (A) of the composition of the present invention has two addition-reactive carbon-carbon double bonds in one molecule with respect to 1 mole of the component (a) having two SiH in one molecule. An addition reaction product containing no SiH is obtained by subjecting an excess of more than 1 mole to 10 moles or less, preferably more than 1 mole and less than 5 moles of the component (b) in the presence of a hydrosilylation reaction catalyst. Can be obtained as

前記ヒドロシリル化反応触媒としては、従来から公知のものが全て使用することができる。例えば、白金を担持したカーボン粉末、白金黒、塩化第2白金、塩化白金酸、塩化白金酸と一価アルコールとの反応生成物、塩化白金酸とオレフィン類との錯体、白金ビスアセトアセテート等の白金系触媒;パラジウム系触媒、ロジウム系触媒等の白金族金属系触媒が挙げられる。また、付加反応条件、溶媒の使用等については、特に限定されず通常のとおりとすればよい。   Any conventionally known hydrosilylation reaction catalyst can be used. For example, carbon powder carrying platinum, platinum black, secondary platinum chloride, chloroplatinic acid, reaction products of chloroplatinic acid and monohydric alcohol, complexes of chloroplatinic acid and olefins, platinum bisacetoacetate, etc. Platinum-based catalyst; platinum group metal-based catalyst such as palladium-based catalyst and rhodium-based catalyst. Moreover, about addition reaction conditions, use of a solvent, etc., it will not be specifically limited, What is necessary is just to be normal.

前記のとおり、(A)成分の調製に際し、上記(a)成分に対して過剰モル量の上記(b)成分を用いることから、該(A)成分は、上記(b)成分の構造に由来する付加反応性炭素−炭素二重結合を1分子中に2個有するものである。更に、上記(a)成分に由来する残基が、上記(b)成分の構造に由来する付加反応性炭素−炭素二重結合を有しない多環式炭化水素の二価の残基によって結合されている構造を含むものであってもよい。   As mentioned above, when preparing the component (A), the component (b) is used in an excess molar amount with respect to the component (a). Therefore, the component (A) is derived from the structure of the component (b). It has two addition-reactive carbon-carbon double bonds in one molecule. Furthermore, the residue derived from the component (a) is bound by a divalent residue of a polycyclic hydrocarbon not having an addition-reactive carbon-carbon double bond derived from the structure of the component (b). It may include a structure.

即ち、(A)成分としては、例えば、下記一般式(6):

Y-X-(Y'-X)p-Y (6)

(式中、Xは上記(a)成分の化合物の二価の残基であり、Yは上記(b)成分の多環式炭化水素の一価の残基であり、Y'は上記(b)成分の二価の残基であり、pは0〜10、好ましくは0〜5の整数である)
で表される化合物が挙げられる。
That is, as the component (A), for example, the following general formula (6):

Y-X- (Y'-X) p-Y (6)

Wherein X is a divalent residue of the compound of the component (a), Y is a monovalent residue of the polycyclic hydrocarbon of the component (b), and Y ′ is the above (b ) Component divalent residue, p is an integer of 0 to 10, preferably 0 to 5)
The compound represented by these is mentioned.

なお、上記(Y'-X)で表される繰り返し単位の数であるpの値については、上記(a)成分1モルに対して反応させる上記(b)成分の過剰モル量を調整することにより設定することが可能である。
上記一般式(6)中のYとしては、具体的には、例えば、下記構造式:
In addition, about the value of p which is the number of the repeating units represented by said (Y'-X), adjusting the excess molar amount of said (b) component made to react with respect to 1 mol of said (a) component. It is possible to set by.
As Y in the general formula (6), specifically, for example, the following structural formula:

Figure 2012046604
Figure 2012046604

Figure 2012046604
Figure 2012046604

で表される一価の残基(以下、前記6者を区別する必要がない場合は、これらを「NB基」と総称し、また、前記6者の構造を区別せずに「NB」と略記することがある。); (Hereinafter, when it is not necessary to distinguish the six members, these are collectively referred to as “NB group”, and “NB” without distinguishing the six-member structure). May be abbreviated.);

上記一般式(6)中のY'としては、具体的には、例えば、下記構造式:   As Y ′ in the general formula (6), specifically, for example, the following structural formula:

Figure 2012046604
Figure 2012046604

で表される二価の残基が挙げられる。
但し、上記構造式で表される非対称な二価の残基は、その左右方向が上記記載のとおりに限定されるものではなく、上記構造式は、実質上、個々の上記構造を紙面上で180度回転させた構造をも含めて示している。
The bivalent residue represented by these is mentioned.
However, the asymmetrical divalent residue represented by the above structural formula is not limited in the left-right direction as described above. It also shows the structure rotated 180 degrees.

上記一般式(6)で表される(A)成分の好適な具体例を、以下に示すが、これに限定されるものではない。(なお、「NB」の意味するところは、上記のとおりである。)
NB-Me2Si-p-C64-SiMe2-NB
NB-Me2Si-m-C64-SiMe2-NB
Preferred specific examples of the component (A) represented by the general formula (6) are shown below, but are not limited thereto. (The meaning of “NB” is as described above.)
NB-Me 2 Si-p-C 6 H 4 -SiMe 2 -NB
NB-Me 2 Si-m- C 6 H 4 -SiMe 2 -NB

Figure 2012046604
Figure 2012046604

(式中、pは1〜10の整数である。)
更に、本発明の(A)成分は、1種単独でも2種以上を組み合わせても使用することができる。
(In the formula, p is an integer of 1 to 10.)
Furthermore, the component (A) of the present invention can be used singly or in combination of two or more.

[(B)成分]
本発明の(B)成分は、ケイ素原子に結合した水素原子を1分子中に3個以上有し、かつ、フェニル基を含有する直鎖状シロキサンである。該(B)成分中のSiHが、上記(A)成分の1分子中に2個有する付加反応性炭素−炭素二重結合とヒドロシリル化反応により付加して、3次元網状構造の硬化物を与える。
[Component (B)]
The component (B) of the present invention is a linear siloxane having 3 or more hydrogen atoms bonded to a silicon atom in one molecule and containing a phenyl group. SiH in the component (B) is added by an addition reactive carbon-carbon double bond and two hydrosilylation reactions in one molecule of the component (A) to give a cured product having a three-dimensional network structure. .

該(B)成分としては、例えば、下記一般式(2):

R’3SiO(R’2SiO)SiR’3 (2)

[式中、R’は、独立に水素原子、非置換のまたはハロゲン原子、シアノ基もしくはグリシドキシ基で置換された炭素原子数1〜12の1価炭化水素基であり、但し、1分子中のR'の少なくとも3個は水素原子で、かつ、1分子中のR'の少なくとも1個はフェニル基であり、nは0〜100の数を示す。]
で表される直鎖状シロキサン系化合物が挙げられる。
Examples of the component (B) include the following general formula (2):

R ' 3 SiO (R' 2 SiO) n SiR ' 3 (2)

[Wherein R ′ is independently a hydrogen atom, an unsubstituted or monovalent hydrocarbon group having 1 to 12 carbon atoms substituted with a halogen atom, a cyano group or a glycidoxy group, provided that At least three of R ′ are hydrogen atoms, and at least one of R ′ in one molecule is a phenyl group, and n is a number from 0 to 100. ]
The linear siloxane type compound represented by these is mentioned.

上記一般式(2)中のR’が非置換またはハロゲン原子、シアノ基もしくはグリシドキシ基で置換された一価炭化水素基である場合、例えば、メチル基、エチル、プロピル基、イソプロピル基、ブチル基、tert-ブチル基、ペンチル基、イソペンチル基、ヘキシル基、sec-ヘキシル基等のアルキル基;シクロペンチル基、シクロヘキシル基等のシクロアルキル基;フェニル基、o-,m-,p-トリル等のアリール基;ベンジル基、2-フェニルエチル基等のアラルキル基;p-ビニルフェニル基等のアルケニルアリール基;およびこれらの基中の炭素原子に結合した1個以上の水素原子が、ハロゲン原子、シアノ基、もしくはグリシドキシ基で置換された、例えば、クロロメチル基、3-クロロプロピル基、3,3,3-トリフルオロプロピル基等のハロゲン化アルキル基;2-シアノエチル基;3-グリシドキシプロピル基等が挙げられる。また、(A)成分と相溶し透明な材料を形成するために、また、得られるガスバリア性の観点から、1分子中の少なくとも1個のR’はフェニル基である。
上記の条件を満たすことを条件として、残るR’はメチル基とフェニル基であることが、工業的に製造することが容易であり、入手しやすいことから好ましい。
When R ′ in the general formula (2) is an unsubstituted or monovalent hydrocarbon group substituted with a halogen atom, a cyano group or a glycidoxy group, for example, a methyl group, ethyl, propyl group, isopropyl group, butyl group Alkyl groups such as tert-butyl group, pentyl group, isopentyl group, hexyl group and sec-hexyl group; cycloalkyl groups such as cyclopentyl group and cyclohexyl group; aryl such as phenyl group, o-, m- and p-tolyl An aralkyl group such as a benzyl group or a 2-phenylethyl group; an alkenylaryl group such as a p-vinylphenyl group; and one or more hydrogen atoms bonded to carbon atoms in these groups are a halogen atom or a cyano group Or an alkyl halide substituted with a glycidoxy group, for example, a chloromethyl group, a 3-chloropropyl group, a 3,3,3-trifluoropropyl group, etc. ; 2-cyanoethyl group; such as 3-glycidoxypropyl group. In addition, in order to form a transparent material that is compatible with the component (A) and from the viewpoint of the obtained gas barrier properties, at least one R ′ in one molecule is a phenyl group.
On the condition that the above conditions are satisfied, it is preferable that the remaining R ′ is a methyl group and a phenyl group because they are easily produced industrially and are easily available.

上記(B)成分の好適な具体例を、以下に示すが、これに限定されるものではない。
Me3SiO(MeHSiO)3(Ph2SiO)2SiMe3
Me3SiO(MeHSiO)4(Ph2SiO)2SiMe3
HMe2SiO(MeHSiO)1(Ph2SiO)2SiMe2H
HMe2SiO(MeHSiO)2(Ph2SiO)2SiMe2H
本発明の(B)成分は、1種単独でも2種以上を組み合わせても使用することができる。
Although the preferable example of the said (B) component is shown below, it is not limited to this.
Me 3 SiO (MeHSiO) 3 (Ph 2 SiO) 2 SiMe 3
Me 3 SiO (MeHSiO) 4 (Ph 2 SiO) 2 SiMe 3
HMe 2 SiO (MeHSiO) 1 (Ph 2 SiO) 2 SiMe 2 H
HMe 2 SiO (MeHSiO) 2 (Ph 2 SiO) 2 SiMe 2 H
The component (B) of the present invention can be used singly or in combination of two or more.

[(C)成分]
本発明の(C)成分は、アルコキシシリル基およびエポキシ基からなる群から選ばれる少なくとも1種の官能基と、ケイ素原子に結合した水素原子と、を有するシロキサン化合物であり、(A)成分の付加反応性炭素−炭素二重結合とヒドロシリル化反応により付加して、3次元網状構造の硬化物を与えるとともに、基板材料との接着性を付与するものである。
[Component (C)]
Component (C) of the present invention is a siloxane compound having at least one functional group selected from the group consisting of an alkoxysilyl group and an epoxy group, and a hydrogen atom bonded to a silicon atom, It is added by an addition-reactive carbon-carbon double bond and a hydrosilylation reaction to give a cured product having a three-dimensional network structure and to provide adhesion to a substrate material.

上記のアルコキシシリル基およびエポキシ基は、通常、2価の有機基を介してケイ素原子に結合しており、2価の有機基としては、エチレン基、トリメチレン基、テトラメチレン基等の炭素原子数2〜6のアルキレン基、および、かかるアルキレン基を構成する複数のメチレン基の一部が酸素原子に置換されたアルキレン基が挙げられる。   The above alkoxysilyl group and epoxy group are usually bonded to a silicon atom via a divalent organic group, and the divalent organic group includes carbon atoms such as an ethylene group, a trimethylene group, and a tetramethylene group. Examples thereof include 2 to 6 alkylene groups and alkylene groups in which some of a plurality of methylene groups constituting the alkylene groups are substituted with oxygen atoms.

この(C)成分としては、例えば、1-(2-トリメトキシシリルエチル)-1,3,5,7-テトラメチルシクロテトラシロキサン、1-(3-グリシドキシプロピル)-1,3,5,7-テトラメチルシクロテトラシロキサン、1-(2-トリメトキシシリルエチル)-3-(3-グリシドキシプロピル)-1,3,5,7-テトラメチルシクロテトラシロキサン、等が挙げられる。これらは1種単独でも2種以上を組み合わせても使用することができる。   Examples of the component (C) include 1- (2-trimethoxysilylethyl) -1,3,5,7-tetramethylcyclotetrasiloxane, 1- (3-glycidoxypropyl) -1,3, 5,7-tetramethylcyclotetrasiloxane, 1- (2-trimethoxysilylethyl) -3- (3-glycidoxypropyl) -1,3,5,7-tetramethylcyclotetrasiloxane, etc. . These can be used singly or in combination of two or more.

[(A)、(B)および(C)成分の配合量]
一般的には、硬度がコーティング材料等の前述した用途において十分な硬度を有する硬化物が得られる点で、本組成物中に含まれる付加反応性炭素−炭素二重結合の合計1モル当り、該組成物中に含まれるSiHの合計の量が、通常、0.5〜3.0モルの範囲、好ましくは0.8〜1.5モルの範囲となるようにするのがよい。即ち、後述する任意配合成分として、上記(A)成分以外の付加反応性炭素−炭素二重結合を有するケイ素系化合物、および/または、(B)成分および(C)成分以外のSiHを有するケイ素系化合物を配合する場合においては、これらの任意配合成分中の付加反応性炭素−炭素二重結合およびSiH基を考慮する必要がある。
[Amounts of components (A), (B) and (C)]
Generally, in terms of obtaining a cured product having a hardness that is sufficient for the above-described uses such as coating materials, the total amount of addition reactive carbon-carbon double bonds contained in the composition is 1 mol. The total amount of SiH contained in the composition is usually in the range of 0.5 to 3.0 mol, preferably in the range of 0.8 to 1.5 mol. That is, as an optional compounding component to be described later, a silicon-based compound having an addition-reactive carbon-carbon double bond other than the component (A) and / or silicon having SiH other than the component (B) and the component (C) When blending a system compound, it is necessary to consider the addition-reactive carbon-carbon double bond and SiH group in these optional blending components.

しかし、(A)成分、(B)成分および(C)成分以外に、付加反応性炭素−炭素二重結合を有するケイ素系化合物もSiH基を有するケイ素化合物も存在しない場合には、(A)、(B)および(C)成分の配合量は、(A)成分中の付加反応性炭素−炭素二重結合の合計1モル当り、(B)成分および(C)成分中のSiHの合計の量が、通常、0.5〜3.0モル、好ましくは0.8〜1.5モルとなる量とすることになる。   However, in addition to the component (A), the component (B), and the component (C), when neither a silicon compound having an addition reactive carbon-carbon double bond nor a silicon compound having a SiH group is present, (A) , (B) and (C) are blended in such amounts that the total amount of SiH in component (B) and component (C) is based on the total mole of addition-reactive carbon-carbon double bonds in component (A). The amount is usually 0.5 to 3.0 mol, preferably 0.8 to 1.5 mol.

なお、(A)成分以外の付加反応性炭素−炭素二重結合を有するケイ素系化合物が含まれる場合、該化合物が有する付加反応性炭素−炭素二重結合が、全組成物中の付加反応性炭素−炭素二重結合の合計量の50モル%以下であることが好ましく、0〜30モル%であることがより好ましい。また、(B)成分および(C)成分以外のSiHを有するケイ素系化合物が含まれる場合、該化合物が有するSiHが、全組成物中のSiHの合計量の50モル%以下であることが好ましく、0〜30モル%であることがより好ましい。   In addition, when a silicon compound having an addition-reactive carbon-carbon double bond other than the component (A) is included, the addition-reactive carbon-carbon double bond of the compound is an addition reactivity in the entire composition. It is preferably 50 mol% or less, more preferably 0 to 30 mol% of the total amount of carbon-carbon double bonds. Further, when a silicon-based compound having SiH other than the component (B) and the component (C) is included, the SiH of the compound is preferably 50 mol% or less of the total amount of SiH in the entire composition. 0 to 30 mol% is more preferable.

[(D)成分]
本発明の(D)成分であるヒドロシリル化反応触媒は、上記「(A)成分の調製」で記載したものと同じである。
[Component (D)]
The hydrosilylation reaction catalyst which is the component (D) of the present invention is the same as that described in the above “Preparation of the component (A)”.

本発明の組成物への(D)成分の配合量は、触媒としての有効量であればよく、特に制限されない。通常、上記(A)成分と(B)成分との合計質量に対して、白金族金属原子として、通常、1〜500ppm、特に2〜100ppm程度となる量を配合することが好ましい。前記範囲内の配合量とすることで、硬化反応に要する時間が適度のものとなり、硬化物が着色する等の問題を生じることがない。   The blending amount of the component (D) in the composition of the present invention is not particularly limited as long as it is an effective amount as a catalyst. Usually, it is preferable to add an amount of usually about 1 to 500 ppm, particularly about 2 to 100 ppm as a platinum group metal atom with respect to the total mass of the component (A) and the component (B). By setting the blending amount within the above range, the time required for the curing reaction becomes appropriate, and problems such as coloring of the cured product do not occur.

[他の配合成分]
本発明の組成物には、上記(A)〜(D)成分に加えて、本発明の目的・効果を損なわない範囲で下記に例示する他の成分を配合することは任意である。
<酸化防止剤>
本発明の硬化性樹脂組成物の硬化物中には、上記(A)成分中の付加反応性炭素−炭素二重結合が未反応のまま残存している場合があり、必要に応じ、酸化防止剤を配合することにより前記着色を未然に防止することができる。
[Other ingredients]
In addition to the above components (A) to (D), it is optional to add other components exemplified below to the composition of the present invention as long as the objects and effects of the present invention are not impaired.
<Antioxidant>
In the cured product of the curable resin composition of the present invention, the addition-reactive carbon-carbon double bond in the component (A) may remain unreacted. The said coloring can be prevented beforehand by mix | blending an agent.

この酸化防止剤としては、従来から公知のものが全て使用することができ、例えば、2,6-ジ-t-ブチル-4-メチルフェノール、2,5-ジ-t-アミルヒドロキノン、2,5-ジ-t-ブチルヒドロキノン、4,4'-ブチリデンビス(3-メチル-6-t-ブチルフェノール)、2,2'-メチレンビス(4-メチル-6-t-ブチルフェノール)、2,2'-メチレンビス(4-エチル-6-t-ブチルフェノール)等が挙げられる。これらは、1種単独でも2種以上を組み合わせても使用することができる。   As the antioxidant, all conventionally known antioxidants can be used. For example, 2,6-di-t-butyl-4-methylphenol, 2,5-di-t-amylhydroquinone, 2, 5-di-t-butylhydroquinone, 4,4'-butylidenebis (3-methyl-6-t-butylphenol), 2,2'-methylenebis (4-methyl-6-t-butylphenol), 2,2'- And methylenebis (4-ethyl-6-t-butylphenol). These can be used singly or in combination of two or more.

なお、この酸化防止剤を使用する場合、その配合量は、酸化防止剤としての有効量であればよく、特に制限されないが、上記(A)成分と(B)成分との合計質量に対して、通常、10〜10,000ppm、特に100〜1,000ppm程度配合することが好ましい。前記範囲内の配合量とすることによって、酸化防止能力が十分発揮され、着色、白濁、酸化劣化等の発生がなく光学的特性に優れた硬化物が得られる。   In addition, when using this antioxidant, the blending amount thereof is not particularly limited as long as it is an effective amount as an antioxidant, but with respect to the total mass of the component (A) and the component (B). Usually, it is preferably 10 to 10,000 ppm, particularly preferably about 100 to 1,000 ppm. By setting the blending amount within the above range, the antioxidant ability is sufficiently exhibited, and a cured product having excellent optical characteristics without coloration, white turbidity, oxidative deterioration and the like is obtained.

<粘度・硬度調整剤>
本発明の組成物の粘度または本発明の組成物から得られる硬化物の硬度等を調整するために、ケイ素原子に結合したアルケニル基またはSiHを有する直鎖状ジオルガノポリシロキサンもしくは網状オルガノポリシロキサン;非反応性の(即ち、ケイ素原子に結合したアルケニル基およびSiHを有しない)直鎖状または環状ジオルガノポリシロキサン、シルフェニレン系化合物等を配合してもよい。
<Viscosity / Hardness modifier>
In order to adjust the viscosity of the composition of the present invention or the hardness of the cured product obtained from the composition of the present invention, a linear diorganopolysiloxane or reticulated organopolysiloxane having an alkenyl group or SiH bonded to a silicon atom A non-reactive (that is, having no alkenyl group and SiH bonded to a silicon atom) linear or cyclic diorganopolysiloxane, silphenylene compound and the like may be blended.

<その他>
また、ポットライフを確保するために、1-エチニルシクロヘキサノール、3,5-ジメチル-1-ヘキシン-3-オール等の付加反応制御剤を配合することができる。更に、透明性に影響を与えない範囲で、強度を向上させるためにヒュームドシリカ等の無機質充填剤を配合してもよいし、必要に応じて、染料、顔料、難燃剤等を配合してもよい。
<Others>
Moreover, in order to ensure pot life, an addition reaction control agent such as 1-ethynylcyclohexanol and 3,5-dimethyl-1-hexyn-3-ol can be blended. Furthermore, an inorganic filler such as fumed silica may be blended in order to improve the strength within a range that does not affect transparency, and if necessary, a dye, pigment, flame retardant, etc. may be blended. Also good.

更に、太陽光線、蛍光灯等の光エネルギーによる光劣化に抵抗性を付与するため光安定剤を用いることも可能である。この光安定剤としては、光酸化劣化で生成するラジカルを補足するヒンダードアミン系安定剤が適しており、酸化防止剤と併用することで、酸化防止効果はより向上する。光安定剤の具体例としては、ビス(2,2,6,6-テトラメチル-4-ピペリジル)セバケート、4-ベンゾイル-2,2,6,6-テトラメチルピペリジン等が挙げられる。   Furthermore, it is also possible to use a light stabilizer in order to impart resistance to light degradation caused by light energy such as sunlight and fluorescent lamps. As this light stabilizer, a hindered amine stabilizer that captures radicals generated by photooxidation degradation is suitable, and the antioxidant effect is further improved by using it together with the antioxidant. Specific examples of the light stabilizer include bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, 4-benzoyl-2,2,6,6-tetramethylpiperidine and the like.

また、本発明の組成物を封止材料として用いる場合には、基材との接着性を向上させるためにシランカップリング剤を配合してもよいし、クラック防止のため可塑剤を添加してもよい。   Moreover, when using the composition of this invention as a sealing material, in order to improve adhesiveness with a base material, you may mix | blend a silane coupling agent and add a plasticizer for crack prevention. Also good.

なお、本発明の組成物の硬化条件については、その量により異なり、特に制限されないが、通常、60〜180℃、1〜5時間の条件とすることが好ましい。   In addition, about the hardening conditions of the composition of this invention, it changes with the quantity, Although it does not restrict | limit in particular, Usually, it is preferable to set it as the conditions of 60-180 degreeC and 1 to 5 hours.

−組成物の硬化物−
上述した本発明の組成物を硬化させることにより得られる硬化物は、ガスバリア性に優れており、厚さ1mmのシート換算で、23℃において酸素ガス透過率が300cm/m2・day以下であり、好ましくは0〜200cm/m2・dayである。したがって、発光ダイオード等の半導体装置に封止材として用いた場合に、外部から腐食性ガスが浸透することが防止され、銀電極の変色、ひいてはLEDの輝度の低下を防ぐことができる。
-Cured product-
The cured product obtained by curing the composition of the present invention described above has excellent gas barrier properties, and has an oxygen gas permeability of 300 cm 3 / m 2 · day or less at 23 ° C. in terms of a sheet having a thickness of 1 mm. Yes, preferably 0 to 200 cm 3 / m 2 · day. Therefore, when used as a sealing material in a semiconductor device such as a light emitting diode, it is possible to prevent the corrosive gas from permeating from the outside, and to prevent discoloration of the silver electrode and thus reduction in luminance of the LED.

また、該硬化物は一般に硬度(ShoreD)が50以上であり、好ましくは60以上、通常60〜70である。該硬化物はこのように高硬度であるにも関わらず、基板上に塗布し硬化させたときに該基板の変形が起り難いので、多数のLEDチップを搭載した基板に組成物を塗布し硬化させた後に、ダイシングによって個片化する製造方法に用いることができる。   The cured product generally has a hardness (Shore D) of 50 or more, preferably 60 or more, and usually 60 to 70. Despite the high hardness of the cured product, since the substrate hardly deforms when applied and cured on the substrate, the composition is applied to the substrate on which many LED chips are mounted and cured. After being made, it can be used in a manufacturing method for separating into pieces by dicing.

上記の硬化物は無色透明であるので、レンズ材料、LED、受光素子等の光学機器用封止材、ディスプレイ材料等の各種の光学用材料、プリプレグ等の電子機器用絶縁材、更にはコーティング材料として好適である。   Since the above cured product is colorless and transparent, lens materials, LED, sealing materials for optical devices such as light receiving elements, various optical materials such as display materials, insulating materials for electronic devices such as prepregs, and coating materials It is suitable as.

以下、実施例および比較例を示し、本発明を具体的に説明するが、本発明は下記の実施例に制限されるものではない。
[合成例1](A)成分の調製
攪拌装置、冷却管、滴下ロートおよび温度計を備えた5Lの4つ口フラスコに、ビニルノルボルネン(商品名:V0062、東京化成社製;5-ビニルビシクロ[2.2.1]ヘプト-2-エンと6-ビニルビシクロ[2.2.1]ヘプト-2-エンとの略等モル量の異性体混合物)1785g(14.88モル)、および、トルエン455gを加え、オイルバスを用いて85℃に加熱した。これに、5質量%の白金を担持したカーボン粉末3.6gを添加し、攪拌しながら1,4-ビス(ジメチルシリル)ベンゼン1698g(8.75モル)を180分間かけて滴下した。滴下終了後、更に110℃で加熱攪拌を24時間行った後、室温まで冷却した。その後、白金担持カーボンをろ過して除去し、トルエンおよび過剰のビニルノルボルネンを減圧留去して、無色透明なオイル状の反応生成物(25℃における粘度:12820mPa・s)3362gを得た。
EXAMPLES Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated concretely, this invention is not restrict | limited to the following Example.
[Synthesis Example 1] Preparation of Component (A) Into a 5 L four-necked flask equipped with a stirrer, a condenser, a dropping funnel and a thermometer, vinyl norbornene (trade name: V0062, manufactured by Tokyo Chemical Industry Co., Ltd .; 5-vinylbicyclo) [2.2.1] isomer mixture of approximately equimolar amounts of hept-2-ene and 6-vinylbicyclo [2.2.1] hept-2-ene) 1785 g (14.88 mol) and 455 g of toluene were added, and oil was added. Heated to 85 ° C. using a bath. To this, 3.6 g of carbon powder carrying 5 mass% platinum was added, and 1698 g (8.75 mol) of 1,4-bis (dimethylsilyl) benzene was added dropwise over 180 minutes while stirring. After completion of dropping, the mixture was further heated and stirred at 110 ° C. for 24 hours, and then cooled to room temperature. Thereafter, the platinum-supporting carbon was removed by filtration, and toluene and excess vinylnorbornene were distilled off under reduced pressure to obtain 3362 g of a colorless and transparent oily reaction product (viscosity at 25 ° C .: 12820 mPa · s).

反応生成物を、FT-IR、NMR、GPC等により分析した結果、このものは、
(1)p-フェニレン基を2個有する化合物(下記に代表的な構造式の一例を示す):約41モル%、
As a result of analyzing the reaction product by FT-IR, NMR, GPC, etc.,
(1) Compound having two p-phenylene groups (an example of a typical structural formula shown below): about 41 mol%,

Figure 2012046604
Figure 2012046604

(2)p-フェニレン基を3個有する化合物(下記に代表的な構造式の一例を示す):約32モル% (2) Compound having three p-phenylene groups (an example of a typical structural formula shown below): about 32 mol%

Figure 2012046604
Figure 2012046604

(3)および、p-フェニレン基を4個以上有する化合物:約27モル%
の混合物であることが判明した。また、前記混合物全体としての付加反応性炭素−炭素二重結合の含有割合は、0.36モル/100gであった。
(3) and a compound having 4 or more p-phenylene groups: about 27 mol%
It was found to be a mixture of Moreover, the content rate of the addition reactive carbon-carbon double bond as the whole mixture was 0.36 mol / 100 g.

[実施例1]
(A)合成例1で得られた反応生成物:40質量部、
(B)Me3SiO(MeHSiO)3(Ph2SiO)2SiMe3:52質量部、
(C)1-(2-トリメトキシシリルエチル)-3-(3-グリシドキシプロピル)-1,3,5,7-テトラメチルシクロテトラシロキサン:8質量部
(なお、上記組成物中のSiH/炭素−炭素二重結合のモル比は1.03である。)
(D)白金-ビニルシロキサン錯体:白金原子として、上記組成物合計質量に対して20ppmとなる量、並びに
1-エチニルシクロヘキサノール:0.03質量部
を均一に混合して組成物を得た。
[Example 1]
(A) Reaction product obtained in Synthesis Example 1: 40 parts by mass
(B) Me 3 SiO (MeHSiO) 3 (Ph 2 SiO) 2 SiMe 3 : 52 parts by mass,
(C) 1- (2-trimethoxysilylethyl) -3- (3-glycidoxypropyl) -1,3,5,7-tetramethylcyclotetrasiloxane: 8 parts by mass (in the above composition (The SiH / carbon-carbon double bond molar ratio is 1.03.)
(D) platinum-vinylsiloxane complex: an amount of 20 ppm with respect to the total mass of the composition as a platinum atom, and
1-Ethynylcyclohexanol: 0.03 part by mass was uniformly mixed to obtain a composition.

[実施例2]
(A)合成例1で得られた反応生成物:56質量部、
(B)Me3SiO(MeHSiO)4(Ph2SiO)2SiMe3:36質量部、
(C)1-(2-トリメトキシシリルエチル)-3-(3-グリシドキシプロピル)-1,3,5,7-テトラメチルシクロテトラシロキサン:8質量部
(なお、上記組成物中のSiH/炭素−炭素二重結合のモル比は1.04である。)
(D)白金-ビニルシロキサン錯体:白金原子として、上記組成物合計質量に対して20ppmとなる量、並びに
1-エチニルシクロヘキサノール:0.03質量部
を均一に混合して組成物を得た。
[Example 2]
(A) Reaction product obtained in Synthesis Example 1: 56 parts by mass
(B) Me 3 SiO (MeHSiO) 4 (Ph 2 SiO) 2 SiMe 3 : 36 parts by mass,
(C) 1- (2-trimethoxysilylethyl) -3- (3-glycidoxypropyl) -1,3,5,7-tetramethylcyclotetrasiloxane: 8 parts by mass (in the above composition (The SiH / carbon-carbon double bond molar ratio is 1.04.)
(D) platinum-vinylsiloxane complex: an amount of 20 ppm with respect to the total mass of the composition as a platinum atom, and
1-Ethynylcyclohexanol: 0.03 part by mass was uniformly mixed to obtain a composition.

[実施例3]
(A)合成例1で得られた反応生成物:56質量部、
(B)HMe2SiO(MeHSiO)1(Ph2SiO)2SiMe2H:36質量部、
(C)1-(2-トリメトキシシリルエチル)-3-(3-グリシドキシプロピル)-1,3,5,7-テトラメチルシクロテトラシロキサン:8質量部
(なお、上記組成物中のSiH/炭素−炭素二重結合のモル比は1.05である。)
(D)白金-ビニルシロキサン錯体:白金原子として、上記組成物合計質量に対して20ppmとなる量、並びに
1-エチニルシクロヘキサノール:0.03質量部
を均一に混合して組成物を得た。
[Example 3]
(A) Reaction product obtained in Synthesis Example 1: 56 parts by mass
(B) HMe 2 SiO (MeHSiO) 1 (Ph 2 SiO) 2 SiMe 2 H: 36 parts by mass,
(C) 1- (2-trimethoxysilylethyl) -3- (3-glycidoxypropyl) -1,3,5,7-tetramethylcyclotetrasiloxane: 8 parts by mass (in the above composition (The SiH / carbon-carbon double bond molar ratio is 1.05.)
(D) platinum-vinylsiloxane complex: an amount of 20 ppm with respect to the total mass of the composition as a platinum atom, and
1-Ethynylcyclohexanol: 0.03 part by mass was uniformly mixed to obtain a composition.

[実施例4]
(A)合成例1で得られた反応生成物:59質量部、
(B)HMe2SiO(MeHSiO)2(Ph2SiO)2SiMe2H:33質量部、
(C)1-(2-トリメトキシシリルエチル)-3-(3-グリシドキシプロピル)-1,3,5,7-テトラメチルシクロテトラシロキサン:8質量部
(なお、上記組成物中のSiH/炭素−炭素二重結合のモル比は1.09である。)
(D)白金-ビニルシロキサン錯体:白金原子として、上記組成物合計質量に対して20ppmとなる量、並びに
1-エチニルシクロヘキサノール:0.03質量部
を均一に混合して組成物を得た。
[Example 4]
(A) Reaction product obtained in Synthesis Example 1: 59 parts by mass
(B) HMe 2 SiO (MeHSiO) 2 (Ph 2 SiO) 2 SiMe 2 H: 33 parts by mass,
(C) 1- (2-trimethoxysilylethyl) -3- (3-glycidoxypropyl) -1,3,5,7-tetramethylcyclotetrasiloxane: 8 parts by mass (in the above composition (The SiH / carbon-carbon double bond molar ratio is 1.09.)
(D) platinum-vinylsiloxane complex: an amount of 20 ppm with respect to the total mass of the composition as a platinum atom, and
1-Ethynylcyclohexanol: 0.03 part by mass was uniformly mixed to obtain a composition.

[比較例1]
上記実施例1に記載の(A)成分を77質量部用いること、並びに、(B)成分として、
(MeHSiO)415質量部を使用した以外は、実施例1と同様にして組成物を得た。(なお、SiH/炭素−炭素二重結合(モル比)=1.01)
[Comparative Example 1]
Using 77 parts by mass of component (A) described in Example 1 above, and as component (B),
A composition was obtained in the same manner as in Example 1, except that 15 parts by mass of (MeHSIO) 4 was used. (SiH / carbon-carbon double bond (molar ratio) = 1.01)

[比較例2]
上記実施例1に記載の(B)成分として下記の1,3,5,7-テトラメチルシクロテロラシロキサンとビニルノルボルネンの付加反応物 33質量部を使用すること以外は、実施例1と同様にして組成物得た。(なお、SiH/炭素−炭素二重結合(モル比)=1.11)
[Comparative Example 2]
As in Example 1, except that 33 parts by mass of the following reaction product of 1,3,5,7-tetramethylcycloterolasiloxane and vinylnorbornene was used as the component (B) described in Example 1 above. To obtain a composition. (SiH / carbon-carbon double bond (molar ratio) = 1.11)

Figure 2012046604
Figure 2012046604

(式中、nは1〜11の整数である。) (In the formula, n is an integer of 1 to 11.)

<性能評価手法>
各実施例および比較例で得られた組成物について、下記の特性について、それぞれ記載の手法に従って硬化物を作成し、性能評価を実施した。硬化の条件は、100℃で1時間加熱し、さらに、150℃で5時間加熱して硬化を行なった。結果を表1および表2に示す。
<Performance evaluation method>
About the composition obtained by each Example and the comparative example, about the following characteristic, the hardened | cured material was created according to the method of description, respectively, and performance evaluation was implemented. The curing was performed by heating at 100 ° C. for 1 hour and further by heating at 150 ° C. for 5 hours. The results are shown in Tables 1 and 2.

(1)外観
2枚のガラス板間に2mm厚のスペーサーを介在させ、15mm×40mm×2mmの空間に組成物を収め、上記の条件で加熱硬化を行った。得られた硬化物の外観を目視で評価した。
(2)硬度
(1)と同様の方法で作成した6mm厚の硬化物を用いて、硬度(Shore D)を測定した。
(3)ガスバリア性の評価
外径100mmφ、厚み1mmの硬化物を作成し、イリノイインスツルメンツ社製酸素ガス透過率測定装置(8001型)を用い、23℃にて測定を実施した。
(1) Appearance A 2 mm thick spacer was interposed between two glass plates, the composition was placed in a space of 15 mm × 40 mm × 2 mm, and heat curing was performed under the above conditions. The appearance of the obtained cured product was visually evaluated.
(2) Hardness Hardness (Shore D) was measured using a cured product having a thickness of 6 mm prepared by the same method as in (1).
(3) Evaluation of gas barrier property A cured product having an outer diameter of 100 mmφ and a thickness of 1 mm was prepared and measured at 23 ° C. using an oxygen gas permeability measuring device (8001 type) manufactured by Illinois Instruments.

(4)基板形状保持性の評価
基板上で組成物を硬化させて硬化物を作成した際の基板の反りの発生を評価した。
アルミニウム基板(50mm×150mm×0.3mm)に組成物を塗布し上記条件で硬化させ、基板上に1mm厚の硬化物を作成した。室温放置後、アルミ基板の反りを測定した。
(5)ダイシング試験
プリント配線板用積層基板(三菱ガス化学製、HL820、50mm×150mm×0.2mm)に組成物を塗布し上記条件で硬化させ、基板上に1mm厚の硬化物を作成した。室温に放置後、粘着フィルムを基板に貼付後、(株)ディスコ製ダイシング装置(DAD341型)を用いて5mm×5mmのサイズに切断した。
(4) Evaluation of substrate shape retention The occurrence of warpage of the substrate when the composition was cured on the substrate to produce a cured product was evaluated.
The composition was applied to an aluminum substrate (50 mm × 150 mm × 0.3 mm) and cured under the above conditions to produce a 1 mm thick cured product on the substrate. After standing at room temperature, the warpage of the aluminum substrate was measured.
(5) Dicing test The composition was applied to a multilayer substrate for printed wiring boards (manufactured by Mitsubishi Gas Chemical Co., Ltd., HL820, 50 mm x 150 mm x 0.2 mm) and cured under the above conditions to produce a 1 mm thick cured product on the substrate. . After leaving at room temperature, the adhesive film was attached to the substrate, and then cut into a size of 5 mm × 5 mm using a disco dicing machine (DAD341 type).

(6)光透過率
(1)で作成した硬化物について分光光度計を用いて、測定波長:800nm、600nm、400nmの3点について光透過率の測定を行った。
(6) Light transmittance The light transmittance of the cured product prepared in (1) was measured using a spectrophotometer at three measurement wavelengths: 800 nm, 600 nm, and 400 nm.

Figure 2012046604
Figure 2012046604

(注)*比較例1,2のダイシングテストでは、基板を粘着フィルムに貼り付けた際、平坦な状態を保持できない現象が起こった。 (Note) * In the dicing test of Comparative Examples 1 and 2, when the substrate was attached to the adhesive film, a phenomenon that the flat state could not be maintained occurred.

Figure 2012046604
Figure 2012046604

[評価]
実施例の硬化物は、いずれも、透明性、ガスバリア性に優れ、かつ、高硬度であるにもかかわらず基板上に硬化物を作成しても基板の反りが起こらない。したがって、ダイシングに適している。一方、比較例の組成物はガスバリア性に劣り、基板上に硬化物を作成した場合、反りが大きいためダイシングを行うことが不可能であった。
[Evaluation]
All of the cured products of the examples are excellent in transparency and gas barrier properties and have high hardness, but even when the cured product is prepared on the substrate, the substrate does not warp. Therefore, it is suitable for dicing. On the other hand, the composition of the comparative example was inferior in gas barrier properties, and when a cured product was prepared on the substrate, it was impossible to perform dicing due to large warpage.

本発明の組成物は、種々の発光ダイオード素子の製造工程において保護、封止に有用である。また、レンズ材料、光学機器用封止材、ディスプレイ材料等の各種の光学用材料、電子機器用絶縁材、コーティング材料としても有用である。   The composition of the present invention is useful for protection and sealing in the production process of various light-emitting diode elements. It is also useful as various optical materials such as lens materials, sealing materials for optical devices, display materials, insulating materials for electronic devices, and coating materials.

Claims (9)

(A)(a)下記一般式(1):
Figure 2012046604
[式中、Rは独立に非置換のまたはハロゲン原子、シアノ基もしくはグリシドキシ基で置
換された炭素原子数1〜12の1価炭化水素基または炭素原子数1〜6アルコキシ基である。]
で表されるケイ素原子に結合した水素原子を1分子中に2個有する化合物と、
(b)付加反応性炭素−炭素二重結合を1分子中に2個有する多環式炭化水素と、
の付加反応生成物であって、かつ、付加反応性炭素−炭素二重結合を1分子中に2個有する付加反応生成物、
(B)ケイ素原子に結合した水素原子を1分子中に3個以上有し、かつ、フェニル基を含有する直鎖状シロキサン、
(C)アルコキシシリル基およびエポキシ基からなる群から選ばれる少なくとも1種の官能基と、ケイ素原子に結合した水素原子と、を有するシロキサン化合物、ならびに、
(D)ヒドロシリル化反応触媒
を含む硬化性シリコーン系組成物。
(A) (a) The following general formula (1):
Figure 2012046604
[Wherein, R is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms or an alkoxy group having 1 to 6 carbon atoms which is unsubstituted or substituted with a halogen atom, a cyano group or a glycidoxy group. ]
A compound having two hydrogen atoms bonded to a silicon atom represented by
(b) a polycyclic hydrocarbon having two addition-reactive carbon-carbon double bonds in one molecule;
An addition reaction product having two addition-reactive carbon-carbon double bonds per molecule,
(B) a linear siloxane having three or more hydrogen atoms bonded to a silicon atom in one molecule and containing a phenyl group;
(C) a siloxane compound having at least one functional group selected from the group consisting of an alkoxysilyl group and an epoxy group, and a hydrogen atom bonded to a silicon atom, and
(D) A curable silicone composition containing a hydrosilylation reaction catalyst.
請求項1に係る組成物であって、前記(b)の多環式炭化水素が、5-ビニルビシクロ[2.2.1]ヘプト-2-エン、6-ビニルビシクロ[2.2.1]ヘプト-2-エンまたは前記両者の組み合わせである、硬化性シリコーン系組成物。   The composition according to claim 1, wherein the polycyclic hydrocarbon of (b) is 5-vinylbicyclo [2.2.1] hept-2-ene, 6-vinylbicyclo [2.2.1] hept-2. -A curable silicone composition which is an ene or a combination of both. 請求項1または2に係る組成物であって、前記(B)成分が、下記一般式(2)で表される直鎖状シロキサンである、硬化性シリコーン系組成物。

R’3SiO(R’2SiO)SiR’3 (2)

[式中、R’は、独立に水素原子、非置換のまたはハロゲン原子、シアノ基もしくはグリシドキシ基で置換された炭素原子数1〜12の1価炭化水素基であり、但し、1分子中のR'の少なくとも3個は水素原子で、かつ、1分子中のR'の少なくとも1個はフェニル基であり、nは0〜100の数を示す。]
The curable silicone composition according to claim 1 or 2, wherein the component (B) is a linear siloxane represented by the following general formula (2).

R ' 3 SiO (R' 2 SiO) n SiR ' 3 (2)

[Wherein R ′ is independently a hydrogen atom, an unsubstituted or monovalent hydrocarbon group having 1 to 12 carbon atoms substituted with a halogen atom, a cyano group or a glycidoxy group, provided that At least three of R ′ are hydrogen atoms, and at least one of R ′ in one molecule is a phenyl group, and n is a number from 0 to 100. ]
前記(A)成分が、前記(a)成分と該、(a)に対して過剰モル量の前記(b)成分とを、白金担持カーボンの存在下で付加反応させ、その後、該白金担持カーボンをろ過により除去することを含む方法により得られた付加反応性生物である請求項1〜3のいずれか1項に係る硬化性シリコーン系組成物。   The component (A) is an addition reaction between the component (a) and the component (b) in an excess molar amount relative to the component (a) in the presence of platinum-supported carbon, and then the platinum-supported carbon. The curable silicone composition according to any one of claims 1 to 3, wherein the curable silicone composition is an addition-reactive organism obtained by a method comprising removing the odor by filtration. 請求項1〜4のいずれか1項に係る組成物であって、その硬化物がガスバリア性を有する前記硬化性シリコーン系組成物。   The curable silicone composition according to any one of claims 1 to 4, wherein the cured product has gas barrier properties. 本組成物を1mm厚のシートに成形硬化させたときに、該シートの23℃における酸素ガス透過率が300cm/m2・day以下である請求項5に係る硬化性シリコーン系組成物 6. The curable silicone composition according to claim 5, wherein when the composition is molded and cured into a 1 mm thick sheet, the oxygen gas permeability at 23 ° C. of the sheet is 300 cm 3 / m 2 · day or less. 請求項1〜4のいずれか1項に係る組成物であって、基板上に塗布後、該組成物を硬化させたときに該基板の変形が起こらす、かつ、得られた硬化物の硬度(ShoreD)が50以上であるダイシング加工が可能な前記硬化性シリコーン系組成物。   The composition according to any one of claims 1 to 4, wherein the substrate is deformed when the composition is cured after being applied on the substrate, and the hardness of the obtained cured product. The curable silicone-based composition capable of dicing with (Shore D) of 50 or more. 光学デバイスまたは光学部品用材料として用いられる請求項1〜7のいずれか1項に係る硬化性シリコーン系組成物。   The curable silicone composition according to any one of claims 1 to 7, which is used as a material for an optical device or an optical component. 請求項1〜4のいずれか1項に記載の組成物を硬化させて得られ、厚さ1mm換算で、23℃において酸素ガス透過率が300cm/m2・day以下である硬化物。 A cured product obtained by curing the composition according to any one of claims 1 to 4, and having an oxygen gas permeability of 300 cm 3 / m 2 · day or less at 23 ° C. in terms of a thickness of 1 mm.
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