JP2021103710A5 - - Google Patents
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- Publication number
- JP2021103710A5 JP2021103710A5 JP2019233668A JP2019233668A JP2021103710A5 JP 2021103710 A5 JP2021103710 A5 JP 2021103710A5 JP 2019233668 A JP2019233668 A JP 2019233668A JP 2019233668 A JP2019233668 A JP 2019233668A JP 2021103710 A5 JP2021103710 A5 JP 2021103710A5
- Authority
- JP
- Japan
- Prior art keywords
- mask
- film
- etched
- processing method
- substrate processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000758 substrate Substances 0.000 claims 24
- 238000003672 processing method Methods 0.000 claims 17
- 239000007789 gas Substances 0.000 claims 13
- 230000001681 protective effect Effects 0.000 claims 11
- 238000005530 etching Methods 0.000 claims 7
- 239000004215 Carbon black (E152) Substances 0.000 claims 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 2
- 239000011737 fluorine Substances 0.000 claims 2
- 229910052731 fluorine Inorganic materials 0.000 claims 2
- 229930195733 hydrocarbon Natural products 0.000 claims 2
- 150000002430 hydrocarbons Chemical class 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019233668A JP7333752B2 (ja) | 2019-12-25 | 2019-12-25 | 基板処理方法及び基板処理装置 |
| TW109143749A TWI894187B (zh) | 2019-12-25 | 2020-12-11 | 基板處理方法及基板處理裝置 |
| CN202011472515.3A CN113035708B (zh) | 2019-12-25 | 2020-12-15 | 基片处理方法和基片处理装置 |
| KR1020200183198A KR20210082384A (ko) | 2019-12-25 | 2020-12-24 | 기판 처리 방법 및 기판 처리 장치 |
| US17/133,974 US11501975B2 (en) | 2019-12-25 | 2020-12-24 | Substrate processing method and substrate processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019233668A JP7333752B2 (ja) | 2019-12-25 | 2019-12-25 | 基板処理方法及び基板処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021103710A JP2021103710A (ja) | 2021-07-15 |
| JP2021103710A5 true JP2021103710A5 (https=) | 2022-10-21 |
| JP7333752B2 JP7333752B2 (ja) | 2023-08-25 |
Family
ID=76459255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019233668A Active JP7333752B2 (ja) | 2019-12-25 | 2019-12-25 | 基板処理方法及び基板処理装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11501975B2 (https=) |
| JP (1) | JP7333752B2 (https=) |
| KR (1) | KR20210082384A (https=) |
| CN (1) | CN113035708B (https=) |
| TW (1) | TWI894187B (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102898977B1 (ko) | 2021-12-13 | 2025-12-11 | 삼성전자주식회사 | 플라즈마 식각 장치, 이를 이용한 플라즈마 식각 방법 및 이를 이용한 반도체 소자 제조 방법 |
| KR20250044885A (ko) * | 2022-07-29 | 2025-04-01 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 방법 및 기판 처리 시스템 |
| KR20240128194A (ko) * | 2023-02-17 | 2024-08-26 | 피에스케이 주식회사 | 기판 처리 방법 및 장치 |
| WO2025018161A1 (ja) * | 2023-07-18 | 2025-01-23 | 東京エレクトロン株式会社 | エッチング方法及びエッチング装置 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01194325A (ja) * | 1988-01-29 | 1989-08-04 | Toshiba Corp | ドライエッチング方法 |
| US6569774B1 (en) * | 2000-08-31 | 2003-05-27 | Micron Technology, Inc. | Method to eliminate striations and surface roughness caused by dry etch |
| JP3962339B2 (ja) * | 2002-03-27 | 2007-08-22 | 松下電器産業株式会社 | 電子デバイスの製造方法 |
| JP4722550B2 (ja) * | 2004-06-16 | 2011-07-13 | 東京エレクトロン株式会社 | 半導体装置の製造方法 |
| JP2006060044A (ja) * | 2004-08-20 | 2006-03-02 | Canon Anelva Corp | 磁気抵抗効果素子の製造方法 |
| KR100606540B1 (ko) * | 2004-12-22 | 2006-08-01 | 동부일렉트로닉스 주식회사 | 반도체 소자의 구리 배선 형성 방법 |
| JP4652140B2 (ja) * | 2005-06-21 | 2011-03-16 | 東京エレクトロン株式会社 | プラズマエッチング方法、制御プログラム、コンピュータ記憶媒体 |
| US7902078B2 (en) * | 2006-02-17 | 2011-03-08 | Tokyo Electron Limited | Processing method and plasma etching method |
| US7786019B2 (en) * | 2006-12-18 | 2010-08-31 | Applied Materials, Inc. | Multi-step photomask etching with chlorine for uniformity control |
| CN101295643B (zh) * | 2007-04-24 | 2010-05-19 | 中芯国际集成电路制造(上海)有限公司 | 通孔刻蚀方法及通孔掩膜 |
| JP2009044090A (ja) * | 2007-08-10 | 2009-02-26 | Tokyo Electron Ltd | 半導体装置の製造方法及び記憶媒体 |
| JP5067068B2 (ja) * | 2007-08-17 | 2012-11-07 | 東京エレクトロン株式会社 | 半導体装置の製造方法及び記憶媒体 |
| KR20110028506A (ko) * | 2008-06-17 | 2011-03-18 | 가부시키가이샤 알박 | 다단형 기판의 제조 방법 |
| JP2010135624A (ja) * | 2008-12-05 | 2010-06-17 | Tokyo Electron Ltd | 半導体装置の製造方法 |
| CN101800174A (zh) * | 2010-02-11 | 2010-08-11 | 中微半导体设备(上海)有限公司 | 一种含碳层的等离子刻蚀方法 |
| US8476168B2 (en) * | 2011-01-26 | 2013-07-02 | International Business Machines Corporation | Non-conformal hardmask deposition for through silicon etch |
| JP5981106B2 (ja) * | 2011-07-12 | 2016-08-31 | 東京エレクトロン株式会社 | プラズマエッチング方法 |
| JP2013077594A (ja) * | 2011-09-29 | 2013-04-25 | Tokyo Electron Ltd | プラズマエッチング方法及び半導体装置の製造方法 |
| US9666414B2 (en) * | 2011-10-27 | 2017-05-30 | Applied Materials, Inc. | Process chamber for etching low k and other dielectric films |
| JP2013258244A (ja) * | 2012-06-12 | 2013-12-26 | Tokyo Electron Ltd | エッチング方法及びプラズマ処理装置 |
| US20150079760A1 (en) * | 2013-09-19 | 2015-03-19 | Wei-Sheng Lei | Alternating masking and laser scribing approach for wafer dicing using laser scribing and plasma etch |
| JP2015170763A (ja) * | 2014-03-07 | 2015-09-28 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP6486092B2 (ja) * | 2014-12-11 | 2019-03-20 | 東京エレクトロン株式会社 | プラズマエッチング方法 |
| JP6584339B2 (ja) * | 2016-02-10 | 2019-10-02 | Ｓｐｐテクノロジーズ株式会社 | 半導体素子の製造方法 |
| WO2018026867A1 (en) * | 2016-08-01 | 2018-02-08 | Lam Research Corporation | Technique to deposit sidewall passivation for high aspect ratio cylinder etch |
| JP6836953B2 (ja) | 2016-12-13 | 2021-03-03 | 東京エレクトロン株式会社 | 窒化シリコンから形成された第１領域を酸化シリコンから形成された第２領域に対して選択的にエッチングする方法 |
| KR102904323B1 (ko) * | 2019-02-27 | 2025-12-24 | 램 리써치 코포레이션 | 희생 층을 사용한 반도체 마스크 재성형 |
| CN112151608B (zh) * | 2019-06-28 | 2023-12-15 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及其形成方法 |
-
2019
- 2019-12-25 JP JP2019233668A patent/JP7333752B2/ja active Active
-
2020
- 2020-12-11 TW TW109143749A patent/TWI894187B/zh active
- 2020-12-15 CN CN202011472515.3A patent/CN113035708B/zh active Active
- 2020-12-24 KR KR1020200183198A patent/KR20210082384A/ko active Pending
- 2020-12-24 US US17/133,974 patent/US11501975B2/en active Active
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