JP2021100071A5 - - Google Patents
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- JP2021100071A5 JP2021100071A5 JP2019231786A JP2019231786A JP2021100071A5 JP 2021100071 A5 JP2021100071 A5 JP 2021100071A5 JP 2019231786 A JP2019231786 A JP 2019231786A JP 2019231786 A JP2019231786 A JP 2019231786A JP 2021100071 A5 JP2021100071 A5 JP 2021100071A5
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- peripheral edge
- substrate processing
- processing method
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- 239000000758 substrate Substances 0.000 claims description 88
- 230000002093 peripheral effect Effects 0.000 claims description 33
- 238000003672 processing method Methods 0.000 claims 12
- 238000002407 reforming Methods 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- 230000001678 irradiating effect Effects 0.000 claims 2
- 238000012986 modification Methods 0.000 claims 1
- 230000004048 modification Effects 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- 238000007781 pre-processing Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019231786A JP7412161B2 (ja) | 2019-12-23 | 2019-12-23 | 基板処理装置及び基板処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019231786A JP7412161B2 (ja) | 2019-12-23 | 2019-12-23 | 基板処理装置及び基板処理方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021100071A JP2021100071A (ja) | 2021-07-01 |
| JP2021100071A5 true JP2021100071A5 (https=) | 2022-09-30 |
| JP7412161B2 JP7412161B2 (ja) | 2024-01-12 |
Family
ID=76541384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019231786A Active JP7412161B2 (ja) | 2019-12-23 | 2019-12-23 | 基板処理装置及び基板処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7412161B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240073916A (ko) * | 2021-09-30 | 2024-05-27 | 도쿄엘렉트론가부시키가이샤 | 처리 방법 및 처리 시스템 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6385727B2 (ja) | 2014-06-13 | 2018-09-05 | 株式会社ディスコ | 貼り合わせウェーハ形成方法 |
| JP6410152B2 (ja) | 2015-09-11 | 2018-10-24 | 東芝メモリ株式会社 | 半導体装置の製造方法 |
| KR102903523B1 (ko) | 2018-04-27 | 2025-12-23 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 시스템 및 기판 처리 방법 |
-
2019
- 2019-12-23 JP JP2019231786A patent/JP7412161B2/ja active Active
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