JP2021094594A - 機械振動加工装置及び機械振動加工方法 - Google Patents
機械振動加工装置及び機械振動加工方法 Download PDFInfo
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- JP2021094594A JP2021094594A JP2019229190A JP2019229190A JP2021094594A JP 2021094594 A JP2021094594 A JP 2021094594A JP 2019229190 A JP2019229190 A JP 2019229190A JP 2019229190 A JP2019229190 A JP 2019229190A JP 2021094594 A JP2021094594 A JP 2021094594A
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- 238000003672 processing method Methods 0.000 title claims abstract description 12
- 230000010355 oscillation Effects 0.000 abstract description 15
- 230000008602 contraction Effects 0.000 abstract description 11
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
Description
Claims (4)
- ホーン部を機械振動させて加工を行う機械振動加工装置における機械振動加工方法であって、
前記ホーン部は、加工対象物に接触部で接触し、
前記機械振動加工装置は、
前記ホーン部を支持する支持部と、
前記ホーン部を機械振動させる複数の発振部を備え、
前記複数の発振部は、
第1位置で前記ホーン部を機械振動させる第1発振部と、
前記第1位置とは異なる第2位置で前記ホーン部を機械振動させる第2発振部を含み、
前記支持部は、前記接触部と前記第1位置との間、及び、前記接触部と前記第2位置との間で、前記ホーン部を支持し、
前記第2発振部が、前記第1発振部と同期して前記ホーン部を機械振動させる振動ステップを含む機械振動加工方法。 - 前記振動ステップにおいて、前記第2発振部は、前記第1発振部と逆位相で前記ホーン部を機械振動させる、請求項1記載の機械振動加工方法。
- 前記支持部は、少なくとも、前記接触部と前記第1位置との間における第1ノーダルポイント、及び、前記接触部と前記第2位置との間における第2ノーダルポイントで、前記ホーン部を支持し、
前記振動ステップにおいて、前記第1発振部及び前記第2発振部は、
前記第1ノーダルポイントが縮んだ状態のときに前記第2ノーダルポイントが伸びた状態とし、
前記第1ノーダルポイントが伸びた状態のときに前記第2ノーダルポイントが縮んだ状態とする、請求項2記載の機械振動加工方法。 - ホーン部を機械振動させて加工を行う機械振動加工装置であって、
前記ホーン部を支持する支持部と、
前記ホーン部を機械振動させる複数の発振部を備え、
前記ホーン部は、加工対象物に接触部で接触し、
前記複数の発振部は、
第1位置で前記ホーン部を機械振動させる第1発振部と、
前記第1位置とは異なる第2位置で前記ホーン部を機械振動させる第2発振部を含み、
前記支持部は、前記接触部と前記第1位置との間、及び、前記接触部と前記第2位置との間で、前記ホーン部を支持し、
前記第2発振部は、前記第1発振部と同期して前記ホーン部を機械振動させる、機械振動加工装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019229190A JP7347797B2 (ja) | 2019-12-19 | 2019-12-19 | 機械振動加工装置及び機械振動加工方法 |
US16/950,602 US11590604B2 (en) | 2019-12-19 | 2020-11-17 | Mechanical vibration bonding apparatus and mechanical vibration bonding method |
Applications Claiming Priority (1)
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JP2019229190A JP7347797B2 (ja) | 2019-12-19 | 2019-12-19 | 機械振動加工装置及び機械振動加工方法 |
Publications (3)
Publication Number | Publication Date |
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JP2021094594A true JP2021094594A (ja) | 2021-06-24 |
JP2021094594A5 JP2021094594A5 (ja) | 2022-08-03 |
JP7347797B2 JP7347797B2 (ja) | 2023-09-20 |
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JP2019229190A Active JP7347797B2 (ja) | 2019-12-19 | 2019-12-19 | 機械振動加工装置及び機械振動加工方法 |
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US (1) | US11590604B2 (ja) |
JP (1) | JP7347797B2 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002210409A (ja) * | 2000-11-20 | 2002-07-30 | Sony Corp | 超音波振動方法および超音波振動装置 |
JP2006239749A (ja) * | 2005-03-04 | 2006-09-14 | Toray Eng Co Ltd | 超音波接合方法および超音波接合装置 |
JP2009279657A (ja) * | 2004-10-25 | 2009-12-03 | Adwelds:Kk | 超音波接合装置 |
US20180104764A1 (en) * | 2016-10-14 | 2018-04-19 | John Massa | Ultrasonic Welding Device With Dual Converters |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6078125A (en) * | 1997-07-22 | 2000-06-20 | Branson Ultrasonics Corp. | Ultrasonic apparatus |
US7757926B2 (en) * | 2006-02-28 | 2010-07-20 | Asm Assembly Automation Ltd | Transducer assembly for a bonding apparatus |
US8950458B2 (en) * | 2012-04-27 | 2015-02-10 | Sonics & Materials Inc. | System and method for mounting ultrasonic tools |
JP2016117100A (ja) | 2014-12-20 | 2016-06-30 | 株式会社アルテクス | 接合装置 |
US9346120B1 (en) * | 2015-12-28 | 2016-05-24 | Edison Welding Institute, Inc. | Sonotrode apparatus for use in ultrasonic additive manufacturing |
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2019
- 2019-12-19 JP JP2019229190A patent/JP7347797B2/ja active Active
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2020
- 2020-11-17 US US16/950,602 patent/US11590604B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002210409A (ja) * | 2000-11-20 | 2002-07-30 | Sony Corp | 超音波振動方法および超音波振動装置 |
JP2009279657A (ja) * | 2004-10-25 | 2009-12-03 | Adwelds:Kk | 超音波接合装置 |
JP2006239749A (ja) * | 2005-03-04 | 2006-09-14 | Toray Eng Co Ltd | 超音波接合方法および超音波接合装置 |
US20180104764A1 (en) * | 2016-10-14 | 2018-04-19 | John Massa | Ultrasonic Welding Device With Dual Converters |
Also Published As
Publication number | Publication date |
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US20210187655A1 (en) | 2021-06-24 |
US11590604B2 (en) | 2023-02-28 |
JP7347797B2 (ja) | 2023-09-20 |
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