JP2021048308A - 被加工物の加工方法 - Google Patents
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Abstract
Description
本発明の実施形態1に係る被加工物の加工方法を図面に基づいて説明する。図1は、実施形態1に係る被加工物の加工方法の加工対象である被加工物100を示す斜視図である。図2は、図1の被加工物100を示す断面図である。被加工物100は、図1に示すように、例えば、シリコン、サファイア、シリコンカーバイド(SiC)、ガリウムヒ素などを母材100−1とする円板状の半導体ウェーハや光デバイスウェーハなどのウェーハである。被加工物100は、表面101の格子状に形成される複数の分割予定ライン102によって区画された領域にデバイス103が形成されている。
本発明の実施形態2に係る被加工物の加工方法を図面に基づいて説明する。図14は、実施形態2に係る被加工物の加工方法を実施するエッチング加工装置1−2を示す断面図である。図14は、実施形態1と同一部分に同一符号を付して説明を省略する。
10 真空チャンバー
11 内部空間
12 搬入出口
13 扉
20 チャックテーブル
21 保持面
22 吸引路
24 電極
30,30−1,30−2 吸引源
40 ガス供給源
50 プラズマ化ユニット
60 搬入出ユニット
70 プラズマ状態ガス供給ユニット
80 制御ユニット
100 被加工物
105 樹脂テープ
106 環状フレーム
107 開口
200 フレームユニット
302 マスク
501 不活性ガス
502 加工用ガス
600 エッチング加工溝
Claims (4)
- 大気から内部を仕切る真空チャンバーを用いて、内部に収容した板状の被加工物をプラズマ状態のガスで加工する被加工物の加工方法であって、
該真空チャンバーの搬入出用の扉から被加工物を搬入し、該真空チャンバー内のチャックテーブルの保持面に被加工物を載置する搬入ステップと、
該搬入ステップ実施後、該チャックテーブルの該保持面に接続する吸引路から負圧を作用させて被加工物を該チャックテーブルで吸引保持するバキューム保持ステップと、
該バキューム保持ステップ実施後、該扉を閉じて該真空チャンバー内の雰囲気を排気し、低圧プラズマを実施可能で該チャックテーブルの吸引保持が可能な50Pa以上5000Pa以下まで該真空チャンバー内の気圧を減圧させる減圧ステップと、
該減圧ステップ実施後、被加工物を該チャックテーブルで吸引しながら、該被加工物にプラズマ状態の不活性ガスを供給し、該チャックテーブルに配置された電極に電圧を印加して被加工物を該チャックテーブルで静電吸着する静電吸着ステップと、
該静電吸着ステップを実施後、該チャックテーブルに保持された被加工物にプラズマ状態の加工用ガスを供給し、被加工物をドライエッチングする加工ステップと、
該加工ステップ実施後、該被加工物にプラズマ状態の不活性ガスを供給しつつ該チャックテーブルの該電極への電圧印加を停止する静電吸着停止ステップと、
該真空チャンバーに不活性ガスを供給し、該真空チャンバーの内部の気圧を大気圧以上に調整後、該扉を開放する扉開放ステップと、
該扉開放ステップ実施後、該吸引路から作用させた負圧を停止して被加工物を該保持面から離脱させ、該真空チャンバーから搬出する被加工物搬出ステップと、
を備える被加工物の加工方法。 - 該静電吸着ステップ、該加工ステップ、又は該静電吸着停止ステップでは、該真空チャンバーの外部でプラズマ状態になったガスが被加工物に供給される請求項1に記載の被加工物の加工方法。
- 該静電吸着ステップ、該加工ステップ、又は該静電吸着停止ステップでは、該真空チャンバーの内部でプラズマ状態にしたガスが被加工物に供給される請求項1に記載の被加工物の加工方法。
- 被加工物は、環状フレームの開口に樹脂テープで支持されたフレームユニットを構成しており、該チャックテーブルの保持面に該樹脂テープを介して保持される請求項1、請求項2又は請求項3に記載の被加工物の加工方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019170578A JP7292163B2 (ja) | 2019-09-19 | 2019-09-19 | 被加工物の加工方法 |
KR1020200108407A KR20210033890A (ko) | 2019-09-19 | 2020-08-27 | 피가공물의 가공 방법 |
SG10202008689SA SG10202008689SA (en) | 2019-09-19 | 2020-09-07 | Processing method of workpiece |
CN202010972662.0A CN112530801A (zh) | 2019-09-19 | 2020-09-16 | 被加工物的加工方法 |
US17/024,153 US11538704B2 (en) | 2019-09-19 | 2020-09-17 | Processing method of workpiece |
TW109132024A TW202113969A (zh) | 2019-09-19 | 2020-09-17 | 被加工物之加工方法 |
DE102020211724.1A DE102020211724A1 (de) | 2019-09-19 | 2020-09-18 | Bearbeitungsverfahren für ein werkstück |
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JP2019170578A JP7292163B2 (ja) | 2019-09-19 | 2019-09-19 | 被加工物の加工方法 |
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JP2021048308A true JP2021048308A (ja) | 2021-03-25 |
JP7292163B2 JP7292163B2 (ja) | 2023-06-16 |
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US (1) | US11538704B2 (ja) |
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KR (1) | KR20210033890A (ja) |
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JP4938352B2 (ja) | 2006-05-17 | 2012-05-23 | 株式会社ディスコ | 静電チャックテーブル機構 |
US20130098873A1 (en) * | 2011-10-20 | 2013-04-25 | Applied Materials, Inc. | Overhead electron beam source for plasma ion generation in a workpiece processing region |
US10069443B2 (en) * | 2011-12-20 | 2018-09-04 | Tokyo Electron Limited | Dechuck control method and plasma processing apparatus |
US20170229554A1 (en) | 2016-02-05 | 2017-08-10 | Applied Materials, Inc. | High-k dielectric materials utilized in display devices |
JP6524554B2 (ja) * | 2016-05-30 | 2019-06-05 | パナソニックIpマネジメント株式会社 | 素子チップの製造方法 |
JP6910227B2 (ja) | 2017-07-14 | 2021-07-28 | 株式会社ディスコ | 静電チャック |
JP2019075477A (ja) | 2017-10-17 | 2019-05-16 | 株式会社ディスコ | チャックテーブル機構 |
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JPH07231034A (ja) * | 1994-02-17 | 1995-08-29 | Hitachi Ltd | 板状物の固定方法および装置ならびにプラズマ処理装置 |
JP2003151957A (ja) * | 2001-08-27 | 2003-05-23 | Matsushita Electric Ind Co Ltd | プラズマ処理装置及びプラズマ処理方法 |
JP2007165743A (ja) * | 2005-12-16 | 2007-06-28 | Disco Abrasive Syst Ltd | 被加工物保持方法およびエッチング方法 |
JP2018195663A (ja) * | 2017-05-16 | 2018-12-06 | 株式会社ディスコ | ウエーハの分割方法 |
JP2019079837A (ja) * | 2017-10-20 | 2019-05-23 | パナソニックIpマネジメント株式会社 | プラズマ処理方法 |
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US11538704B2 (en) | 2022-12-27 |
CN112530801A (zh) | 2021-03-19 |
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KR20210033890A (ko) | 2021-03-29 |
JP7292163B2 (ja) | 2023-06-16 |
DE102020211724A1 (de) | 2021-03-25 |
US20210090926A1 (en) | 2021-03-25 |
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