JP2021028652A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2021028652A5 JP2021028652A5 JP2019147243A JP2019147243A JP2021028652A5 JP 2021028652 A5 JP2021028652 A5 JP 2021028652A5 JP 2019147243 A JP2019147243 A JP 2019147243A JP 2019147243 A JP2019147243 A JP 2019147243A JP 2021028652 A5 JP2021028652 A5 JP 2021028652A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- feature
- parameter set
- substrate
- exposure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 27
- 238000005070 sampling Methods 0.000 claims 17
- 239000004065 semiconductor Substances 0.000 claims 16
- 238000000034 method Methods 0.000 claims 9
- 238000004886 process control Methods 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 5
- 229920002120 photoresistant polymer Polymers 0.000 claims 5
- 239000011248 coating agent Substances 0.000 claims 3
- 238000000576 coating method Methods 0.000 claims 3
- 238000005259 measurement Methods 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019147243A JP7329386B2 (ja) | 2019-08-09 | 2019-08-09 | リソグラフィ処理される半導体デバイスのためのプロセス制御方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019147243A JP7329386B2 (ja) | 2019-08-09 | 2019-08-09 | リソグラフィ処理される半導体デバイスのためのプロセス制御方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021028652A JP2021028652A (ja) | 2021-02-25 |
| JP2021028652A5 true JP2021028652A5 (enExample) | 2022-08-15 |
| JP7329386B2 JP7329386B2 (ja) | 2023-08-18 |
Family
ID=74666948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019147243A Active JP7329386B2 (ja) | 2019-08-09 | 2019-08-09 | リソグラフィ処理される半導体デバイスのためのプロセス制御方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7329386B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112346296B (zh) * | 2019-08-06 | 2025-07-22 | 科尼亚克有限公司 | 用于经光刻加工的半导体器件的工艺控制方法 |
| US12094691B2 (en) * | 2020-09-30 | 2024-09-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Etch apparatus for compensating shifted overlayers |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007027573A (ja) * | 2005-07-20 | 2007-02-01 | Canon Inc | 露光装置および露光方法ならびにこれらの露光装置または露光方法を用いたデバイス製造方法 |
| KR101555709B1 (ko) * | 2005-11-04 | 2015-09-25 | 가부시키가이샤 니콘 | 해석 장치, 처리 장치, 측정 장치, 노광 장치, 기판 처리시스템, 해석 방법 및 프로그램 |
| US8175831B2 (en) * | 2007-04-23 | 2012-05-08 | Kla-Tencor Corp. | Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers |
| JP5237690B2 (ja) * | 2008-05-16 | 2013-07-17 | ルネサスエレクトロニクス株式会社 | 半導体デバイスの製造方法 |
| NL2005997A (en) * | 2010-02-19 | 2011-08-22 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
| JP2014229675A (ja) * | 2013-05-21 | 2014-12-08 | ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． | 重ね合わせ補正システム |
| US10739685B2 (en) * | 2018-02-14 | 2020-08-11 | Qoniac Gmbh | Process control method for lithographically processed semiconductor devices |
-
2019
- 2019-08-09 JP JP2019147243A patent/JP7329386B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI703659B (zh) | 判定程序之校正 | |
| TWI591342B (zh) | 計量工具、用於校準計量工具之方法、用於使比例因數與目標缺陷相關聯之方法、用於偵測目標缺陷類型之方法及相關非暫時性電腦可讀媒體 | |
| TWI721092B (zh) | 用於評估半導體製程的方法和裝置 | |
| US8007968B2 (en) | Substrate processing method, program, computer-readable storage medium and substrate processing system | |
| TWI685726B (zh) | 用於控制基板之定位之方法及用於判定參照基板之特徵之位置的方法 | |
| US20080142508A1 (en) | Temperature setting method of thermal processing plate, computer-readable recording medium recording program thereon, and temperature setting apparatus for thermal processing plate | |
| TWI842959B (zh) | 使用晶圓模型及晶圓製造組件之晶圓曝光方法 | |
| CN110573966A (zh) | 用于优化光刻工艺的方法和装置 | |
| JP2021028652A5 (enExample) | ||
| TW202119135A (zh) | 用於控制微影設備之方法 | |
| US11366397B2 (en) | Method and apparatus for simulation of lithography overlay | |
| US20070105244A1 (en) | Analytical apparatus, processing apparatus, measuring and/or inspecting apparatus, exposure apparatus, substrate processing system, analytical method, and program | |
| JP7329386B2 (ja) | リソグラフィ処理される半導体デバイスのためのプロセス制御方法 | |
| KR102770697B1 (ko) | 리소그래피로 처리된 반도체 장치에 대한 프로세스 제어 방법 | |
| TWI781335B (zh) | 先進工藝控制方法及晶片製造元件 | |
| US10379447B2 (en) | Method and apparatus for simulation of lithography overlay | |
| JP4535242B2 (ja) | 熱処理評価方法 | |
| TWI456627B (zh) | 於導軌式微影工具中控制關鍵尺寸的方法及系統 | |
| CN112346296B (zh) | 用于经光刻加工的半导体器件的工艺控制方法 | |
| JP2021128284A5 (ja) | 計測方法、露光方法、物品の製造方法、プログラム及び露光装置 | |
| TW202040280A (zh) | 用於估計基板形狀之方法及裝置 | |
| US7643126B2 (en) | Method of setting focus condition at time of exposure, apparatus for setting focus condition at time of exposure, program, and computer readable recording medium | |
| JP2009278071A (ja) | 半導体装置の製造方法 | |
| CN118843380A (zh) | 提高磁性存储器均一性的方法 | |
| TW202232268A (zh) | 製造半導體裝置之方法及用於半導體製造總成之製程控制系統 |