JP7329386B2 - リソグラフィ処理される半導体デバイスのためのプロセス制御方法 - Google Patents
リソグラフィ処理される半導体デバイスのためのプロセス制御方法 Download PDFInfo
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| JP2019147243A JP7329386B2 (ja) | 2019-08-09 | 2019-08-09 | リソグラフィ処理される半導体デバイスのためのプロセス制御方法 |
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| JP2019147243A JP7329386B2 (ja) | 2019-08-09 | 2019-08-09 | リソグラフィ処理される半導体デバイスのためのプロセス制御方法 |
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| JP2021028652A JP2021028652A (ja) | 2021-02-25 |
| JP2021028652A5 JP2021028652A5 (enExample) | 2022-08-15 |
| JP7329386B2 true JP7329386B2 (ja) | 2023-08-18 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220102118A1 (en) * | 2020-09-30 | 2022-03-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Etch apparatus for compensating shifted overlayers |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112346296B (zh) * | 2019-08-06 | 2025-07-22 | 科尼亚克有限公司 | 用于经光刻加工的半导体器件的工艺控制方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007027573A (ja) | 2005-07-20 | 2007-02-01 | Canon Inc | 露光装置および露光方法ならびにこれらの露光装置または露光方法を用いたデバイス製造方法 |
| WO2007052699A1 (ja) | 2005-11-04 | 2007-05-10 | Nikon Corporation | 解析装置、処理装置、測定装置、露光装置、基板処理システム、解析方法及びプログラム |
| JP2009277957A (ja) | 2008-05-16 | 2009-11-26 | Renesas Technology Corp | 半導体デバイスの製造方法および製造システム |
| JP2011176309A (ja) | 2010-02-19 | 2011-09-08 | Asml Netherlands Bv | リソグラフィ装置及びデバイス製造方法 |
| JP2013153167A (ja) | 2007-04-23 | 2013-08-08 | Kla-Tencor Corp | ウエハー上で実施される測定中のプロセスに関するダイナミック・サンプリング・スキームを生成または実施するための方法ならびにシステム |
| JP2014229675A (ja) | 2013-05-21 | 2014-12-08 | ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． | 重ね合わせ補正システム |
| US20190250516A1 (en) | 2018-02-14 | 2019-08-15 | Qoniac Gmbh | Process Control Method For Lithographically Processed Semiconductor Devices |
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2019
- 2019-08-09 JP JP2019147243A patent/JP7329386B2/ja active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007027573A (ja) | 2005-07-20 | 2007-02-01 | Canon Inc | 露光装置および露光方法ならびにこれらの露光装置または露光方法を用いたデバイス製造方法 |
| WO2007052699A1 (ja) | 2005-11-04 | 2007-05-10 | Nikon Corporation | 解析装置、処理装置、測定装置、露光装置、基板処理システム、解析方法及びプログラム |
| JP2013153167A (ja) | 2007-04-23 | 2013-08-08 | Kla-Tencor Corp | ウエハー上で実施される測定中のプロセスに関するダイナミック・サンプリング・スキームを生成または実施するための方法ならびにシステム |
| JP2009277957A (ja) | 2008-05-16 | 2009-11-26 | Renesas Technology Corp | 半導体デバイスの製造方法および製造システム |
| JP2011176309A (ja) | 2010-02-19 | 2011-09-08 | Asml Netherlands Bv | リソグラフィ装置及びデバイス製造方法 |
| JP2014229675A (ja) | 2013-05-21 | 2014-12-08 | ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． | 重ね合わせ補正システム |
| US20190250516A1 (en) | 2018-02-14 | 2019-08-15 | Qoniac Gmbh | Process Control Method For Lithographically Processed Semiconductor Devices |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220102118A1 (en) * | 2020-09-30 | 2022-03-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Etch apparatus for compensating shifted overlayers |
| US12094691B2 (en) * | 2020-09-30 | 2024-09-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Etch apparatus for compensating shifted overlayers |
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| JP2021028652A (ja) | 2021-02-25 |
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