JP2021011020A - Thermal print head and method for manufacturing the same - Google Patents

Abstract

To provide a thermal print head in which a thermal storage part installed in a lower tier of a heat generating part can be readily formed.SOLUTION: A thermal print head includes: a substrate 1 having a principal surface 11; a thermal storage layer 15 formed at the principal surface 11 of the substrate 1; and multiple heat generating parts 41 arranged in an upper layer of the thermal storage layer 15 in a main scanning direction. The thermal storage layer 15 is formed while a plate-like thermal storage member 150 is bonded to the principal surface 11 of the substrate 1.SELECTED DRAWING: Figure 6

Description

The present invention relates to a thermal print head and a method for manufacturing the same.

Patent Document 1 discloses an example of a thermal print head. Thermal print heads generally have a large number of heat generating parts arranged in the main scanning direction on the head substrate. Each heat generating portion is laminated on the resistor layer formed on the head substrate via the heat storage portion so that a part thereof is exposed and the upstream electrode layer and the downstream electrode layer are laminated with their ends facing each other. It is formed by doing. By energizing between the upstream electrode layer and the downstream electrode layer, the exposed portion (heating portion) of the resistor layer generates heat due to Joule heat. The heat storage unit is provided to prevent wasteful heat generated by the heat generation unit from leaking to the head substrate or the like to enable high-speed printing.

The thermal printhead disclosed in the same document also uses Si as a substrate, and forms each component including a resistor layer by a semiconductor process. In this case, the heat storage portion is formed by sputtering using SiO ₂ or a CVD method, but it takes a considerable amount of time to form the heat storage portion having a sufficient thickness, which causes a problem that the manufacturing efficiency of the thermal print head deteriorates. There is.

Japanese Unexamined Patent Publication No. 2017-7203

The present invention has been devised under the above circumstances, and an object of the present invention is to provide a thermal print head capable of easily forming a heat storage portion provided below the heat generating portion.

In order to solve the above problems, the following technical means are adopted in the present invention.

The thermal printhead provided by the first aspect of the present invention is arranged in the main scanning direction on a substrate having a main surface, a heat storage layer formed on the main surface of the substrate, and an upper layer of the heat storage layer. The heat storage layer includes a plurality of heat generating portions, and is characterized in that a plate-shaped heat storage member is attached to the main surface of the substrate.

In a preferred embodiment, each of the plurality of heat generating portions is laminated on the resistor layer and the resistor layer so as to expose a part of the resistor layer, and the upstream side capable of energizing each other. It is formed to include a conductive layer and a downstream conductive layer.

In a preferred embodiment, the substrate is made of Si.

In a preferred embodiment, the plate-shaped heat storage member is made of SiO ₂ .

In a preferred embodiment, the plate-shaped heat storage member has a thickness of 30 to 50 μm.

In a preferred embodiment, the plate-shaped heat storage member is attached to the entire surface or substantially the entire surface of the main surface of the substrate.

The thermal printhead provided by the first aspect of the present invention is also formed so as to cover a substrate having a recess extending in the main scanning direction on the main surface and the recess on the main surface of the substrate. The heat storage layer includes a plurality of heat storage layers which are upper layers of the heat storage layer and are located above the recessed portions and are arranged in the main scanning direction, and the heat storage layer is formed on the main surface of the substrate. It is characterized in that a plate-shaped heat storage member is attached and formed.

In a preferred embodiment, each of the plurality of heat generating portions is laminated on the resistor layer and the resistor layer so as to expose a part of the resistor layer, and the upstream side capable of energizing each other. It is formed to include a conductive layer and a downstream conductive layer.

In a preferred embodiment, the substrate is made of Si.

In a preferred embodiment, the plate-shaped heat storage member is made of SiO ₂ .

In a preferred embodiment, the plate-shaped heat storage member has a thickness of 30 to 50 μm.

In a preferred embodiment, the depth of the recess is 10 to 100 μm.

In a preferred embodiment, the plate-shaped heat storage member is attached to the entire surface or substantially the entire surface of the main surface of the substrate.

The method for manufacturing a thermal printhead provided by the second aspect of the present invention is to cover a substrate having a main surface, a heat storage layer formed on the main surface of the substrate, and an upper layer of the heat storage layer in the main scanning direction. The heat storage layer is a method for manufacturing a thermal print head, which includes a plurality of arranged heat generating portions and is formed by attaching a plate-shaped heat storage member to the main surface of the substrate, and is a method for manufacturing a thermal print head. The layer is characterized in that it is formed by attaching a plate-shaped heat storage member to the main surface of the material substrate.

In a preferred embodiment, the material substrate is made of Si.

In a preferred embodiment, the plate-shaped heat storage member is made of SiO ₂ .

In a preferred embodiment, the plate-shaped heat storage member is attached to the entire surface or substantially the entire surface of the main surface of the substrate material by anodic bonding.

The method for manufacturing a thermal printhead provided by the second aspect of the present invention also covers a substrate having a recess extending in the main scanning direction on the main surface and covering the recess on the main surface of the substrate. The heat storage layer formed includes a plurality of heat storage layers which are upper layers of the heat storage layer and are located above the recessed portions and are arranged in the main scanning direction. The heat storage layer is the above-mentioned substrate. A method for manufacturing a thermal print head, in which a plate-shaped heat storage member is attached to a main surface, and the heat storage layer is formed by attaching a plate-shaped heat storage member to the main surface of a material substrate. It is characterized by that.

In a preferred embodiment, the substrate is made of Si.

The plate-shaped heat storage member is made of SiO ₂ .

In a preferred embodiment, the plate-shaped heat storage member is attached to the entire surface or substantially the entire surface of the main surface of the substrate material by anodic bonding.

Other features and advantages of the present invention will become more apparent with the detailed description given below with reference to the accompanying drawings.

It is a top view which shows the thermal print head which concerns on 1st Embodiment of this invention. It is a main part plan view which shows the thermal print head which concerns on 1st Embodiment of this invention. It is an enlarged plan view of the main part which shows the thermal print head which concerns on 1st Embodiment of this invention. It is sectional drawing which follows the IV-IV line of FIG. It is sectional drawing of the main part which shows the thermal print head which concerns on 1st Embodiment of this invention. It is an enlarged sectional view of the main part which shows the thermal print head which concerns on 1st Embodiment of this invention. It is sectional drawing of the main part which shows an example of the manufacturing method of the thermal printhead which concerns on 1st Embodiment of this invention. It is sectional drawing of the main part which shows an example of the manufacturing method of the thermal printhead which concerns on 1st Embodiment of this invention. It is sectional drawing of the main part which shows an example of the manufacturing method of the thermal print head which concerns on 1st Embodiment of this invention. It is sectional drawing of the main part which shows an example of the manufacturing method of the thermal printhead which concerns on 1st Embodiment of this invention. It is sectional drawing of the main part which shows an example of the manufacturing method of the thermal printhead which concerns on 1st Embodiment of this invention. It is sectional drawing of the main part which shows an example of the manufacturing method of the thermal printhead which concerns on 1st Embodiment of this invention. It is sectional drawing of the main part which shows an example of the manufacturing method of the thermal printhead which concerns on 1st Embodiment of this invention. It is sectional drawing of the main part which shows the thermal print head which concerns on 2nd Embodiment of this invention. It is an enlarged sectional view of the main part which shows the thermal print head which concerns on 2nd Embodiment of this invention. It is sectional drawing of the main part which shows an example of the manufacturing method of the thermal printhead which concerns on 2nd Embodiment of this invention. It is sectional drawing of the main part which shows an example of the manufacturing method of the thermal printhead which concerns on 2nd Embodiment of this invention. It is sectional drawing of the main part which shows an example of the manufacturing method of the thermal printhead which concerns on 2nd Embodiment of this invention. It is sectional drawing of the main part which shows an example of the manufacturing method of the thermal printhead which concerns on 2nd Embodiment of this invention. It is sectional drawing of the main part which shows an example of the manufacturing method of the thermal printhead which concerns on 2nd Embodiment of this invention. It is sectional drawing of the main part which shows an example of the manufacturing method of the thermal printhead which concerns on 2nd Embodiment of this invention. It is sectional drawing of the main part which shows an example of the manufacturing method of the thermal printhead which concerns on 2nd Embodiment of this invention. It is sectional drawing of the main part which shows an example of the manufacturing method of the thermal printhead which concerns on 2nd Embodiment of this invention.

Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

1 to 6 show a thermal print head according to a first embodiment of the present invention. The thermal printed head A1 has a head substrate 1, a connecting substrate 5, and a heat radiating member 8. The head substrate 1 and the connection substrate 5 are mounted on the heat radiating member 8 so as to be adjacent to each other in the sub-scanning direction y. A plurality of heat generating portions 41 arranged in the main scanning direction x are formed on the head substrate 1 according to the configuration described in detail later. The heat generating portion 41 is selectively heat-driven by the driver IC 7 mounted on the connection board 5, and is pressed against the heat generating portion 41 by the platen roller 91 according to a print signal transmitted from the outside via the connector 59. Print on a printing medium such as thermal paper.

The head substrate 1 has an elongated rectangular planar shape with the main scanning direction x as the longitudinal direction and the sub-scanning direction y as the lateral direction. The size of the head substrate 1 is not limited, but for example, the dimension of the main scanning direction x is, for example, 50 to 150 mm, the dimension of the sub scanning direction y is, for example, 2.0 to 5.0 mm, and the thickness direction z. The size of is, for example, 725 μm. In the following description, the side of the head substrate 1 in the sub-scanning direction y near the driver IC 7 is referred to as an upstream side, and the side far from the driver IC 7 is referred to as a downstream side.

The head substrate 1 of the present embodiment is made of, for example, a single crystal semiconductor. Si is suitable as the single crystal semiconductor.

As shown in FIGS. 5 and 6, a heat storage layer 15 is formed on the main surface 11 of the head substrate 1. The heat storage layer 15 is formed by, for example, attaching a plate-shaped heat storage member 150 made of SiO ₂ to the main surface 11. According to the manufacturing method described later, the heat storage layer 15 is formed by attaching a SiO ₂ wafer to a Si wafer by, for example, anodic bonding, and polishing to obtain a required thickness. The thickness of the heat storage layer 15 thus formed can be a sufficient thickness of, for example, 30 to 50 μm. Further, in the present embodiment, the heat storage layer 15 is formed over the entire surface of the main surface 11 of the head substrate 1.

At least the resistor layer 4, the electrode layer 3, and the protective layer 2 are formed in this order on the upper layer of the heat storage layer 15.

The resistor layer 4 is formed on the upper layer of the heat storage layer 15. The portion of the resistor layer 4 that is exposed without being covered by the electrode layer 3, which will be described later, forms the heat generating portion 41. Many of the heat generating portions 41 are arranged in the main scanning direction x. The resistor layer 4 is made of, for example, TaN, and its thickness is not particularly limited, and is, for example, 0.02 μm to 0.1 μm. The resistor layer 4 has a predetermined width in the sub-scanning direction y, and is formed separately in the main scanning direction x in order to make each heat generating portion 41 independent in the main scanning direction x.

The electrode layer 3 includes a plurality of individual electrode layers 31 formed on the upstream side of the head substrate 1 and a common electrode layer 32 formed on the downstream side of the head substrate 1. Each individual electrode layer 31 has a strip shape extending substantially in the sub-scanning direction y, and its downstream tip extends to a position overlapping the upstream end of the resistor layer 15. An individual pad portion 311 is formed at the upstream end of each individual electrode layer 31. The individual pad portion 311 is a portion connected to the drive IC 7 mounted on the connection board 5 by a wire 61. The common electrode layer 32 has a plurality of comb tooth portions 324 and a common portion 323 that connects the plurality of comb tooth portions 324 in common. The common portion 323 is formed in the main scanning direction x along the upstream edge of the head substrate 1, and each comb tooth portion 324 has a strip shape that is separated from the common portion 323 and extends in the sub scanning direction y. It is opposed to the tip of the electrode layer 31 at a predetermined interval. The common portion 323 has an extension portion 325 that is bent in the sub-scanning direction y from both ends of the main scanning direction x and extends to the downstream side of the head substrate 1. The electrode layer 3 is made of, for example, Cu, and its thickness is, for example, 0.3 to 2.0 μm. As described above, the portion of the resistor layer 4 that is not covered with the individual electrode layer 31 and the comb tooth portion 324 of the common electrode layer 32 whose tip portions face each other forms each heat generating portion 41. To do.

The resistor layer 4 and the electrode layer 3 are further covered with a protective layer 2. The protective layer 2 is made of an insulating material, for example, SiO ₂ , SiC, SiC, AlN, or the like. The thickness of the protective layer 2 is, for example, 1.0 to 10 μm.

As shown in FIGS. 2 and 5, the protective layer 2 has a pad opening 21. The pad opening 21 exposes the individual pad portions 311 provided in the plurality of individual electrode layers 31.

The connection board 5 is arranged adjacent to the head board 1 on the upstream side in the sub-scanning direction y. The connection board 5 is, for example, a PCB board on which a driver IC 7 and a connector 59 are mounted. The connection board 5 has a rectangular shape in a plan view with the main scanning direction x as the longitudinal direction.

The driver IC 7 is mounted on the connection board 5 and is provided to individually energize a plurality of heat generating portions 41. The driver IC 7 and each individual pad portion 311 of each of the individual electrode layers 31 are connected by a plurality of wires 61. The driver IC 7 is also connected by a wire 62 to the wiring pattern formed on the connection board 5. A print signal transmitted from the outside is input to the driver IC 7 via the connector 59. The plurality of heat generating units 41 are selectively energized according to the print signal to selectively generate heat.

The driver IC 7 and the wires 61 and 62 are covered with the protective resin 78 so as to straddle the head substrate 1 and the connection substrate 5. As the protective resin 78, a black insulating resin such as an epoxy resin is used.

The heat radiating member 8 supports the head substrate 1 and the connecting substrate 5, and is provided to dissipate a part of the heat generated by the heat generating portion 41 to the outside. The heat radiating member 8 is made of metal such as aluminum.

Next, an example of a method for manufacturing the thermal print head A1 will be described with reference to FIGS. 7 to 13.

First, as shown in FIG. 7, the material substrate 1A is prepared. The material substrate 1A is made of a single crystal semiconductor, for example, a Si wafer. The material substrate 1A preferably has a flat main surface 11A, and the main surface 11A is preferably a (100) surface.

Next, as shown in FIG. 8, the SiO ₂ wafer 150A as the plate-shaped heat storage member 150 is attached over the entire surface of the main surface 11A of the material substrate 1A. Anode bonding is suitable as the method of this attachment.

Then, as shown in FIG. 9, the surface of the plate-shaped heat storage member 150 is polished to set the thickness to a desired thickness, for example, 30 to 50 μm.

Next, as shown in FIG. 10, a resistor film 4A is formed. The resistor film 4A is formed, for example, by forming a thin film of TaN by sputtering.

Next, as shown in FIG. 11, by etching the resistor film 4A, a resistor layer 4 having a predetermined width in the sub-scanning direction y and extending in the main scanning direction x is formed.

Then, as shown in FIG. 12, the conductive film 3A is formed. The conductive film 3A is formed by, for example, forming a layer made of Cu by plating or sputtering.

Next, as shown in FIG. 13, the conductive film 3A and the resistor film 4A are selectively etched to separate the resistor layer 4 in the main scanning direction x, and the resistor layer 4 is subjected to the heat generating portion 41. The individual electrode layer 31 to be left and covered, and the comb tooth portion 324 of the common electrode layer 32 are formed.

Next, the protective layer 2 for forming the protective layer 2 is formed by depositing SiC and SiC on the electrode layer 3 and the resistor layer 4 using, for example, CVD. Further, the pad opening 21 is formed by partially removing the protective layer 2 by etching or the like. After that, the head substrate 1 and the connection substrate 5 are assembled on the heat radiating member 8, the driver IC7 connection is mounted on the connection substrate 5, the wires 61 and 62 are bonded, the protective resin 78 is formed, and the like. The thermal print head A1 shown in FIGS. 1 to 6 can be obtained.

Next, the operation of the thermal print head A1 according to the first embodiment will be described.

The Si wafer, which is the material of the head substrate 1, has relatively good thermal conductivity, and if no treatment is performed, the heat generated by the heat generating portion 41 is wasted and leaks toward the heat radiating member 8, which makes it unsuitable for high-speed printing. However, in this thermal print head A1, since a heat storage layer 15 having a sufficient thickness is formed below the heat generating portion 41, wasteful leakage of heat generated by the heat generating portion 41 is prevented, and high-speed printing is also possible. Become suitable.

Moreover, since the heat storage layer 15 is formed by attaching the SiO ₂ wafer to the Si wafer, the heat storage layer 15 has an overwhelming thickness and is overwhelmingly thicker than, for example, formed by adhering SiO ₂ by sputtering. It can be formed in an overwhelmingly short time, which greatly contributes to the improvement of manufacturing efficiency and cost reduction of the thermal print head A1.

14 to 15 show a thermal print head according to a second embodiment of the present invention. The first point of the thermal print head A2 is that a recessed portion 115 extending in the main scanning direction x with a predetermined width in the sub scanning direction y is formed in a region located below the heat generating portion 41 on the main surface 11 of the head substrate 1. It is different from A1 of the thermal print head according to the embodiment. In FIGS. 14 to 15, members or parts that are the same as or equivalent to the thermal printhead A1 according to the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted below.

On the main surface 11 of the head substrate 1, a recessed portion 115 extending in the main scanning direction x is formed at a position corresponding to the sub-scanning direction y position of the heat generating portion 41. The depth of the recessed portion 115 is, for example, 10 to 100 μm.

The heat storage layer 15 is formed by sticking over the entire surface of the main surface 11 so as to cover the recessed 115 portion. As a result, a gap 115A due to the recessed portion 115 is formed directly below the heat storage layer 15 corresponding to the position y in the sub-scanning direction of the heat generating portion 41. Similar to the first embodiment, at least the resistor layer 4, the electrode layer 3, and the protective layer 2 are formed on the upper layer of the heat storage layer 15 in this order.

Next, an example of a method for manufacturing the thermal print head A2 will be described with reference to FIGS. 16 to 23.

First, as shown in FIG. 16, the material substrate 1A is prepared. The material substrate 1A is made of a single crystal semiconductor, for example, a Si wafer. The material substrate 1A preferably has a flat main surface 11A, and the main surface 11A is preferably a (100) surface.

Next, as shown in FIG. 17, a recessed portion 115 is formed on the main surface 11A of the material substrate 1A. The recessed portion 115 can be formed, for example, by anisotropic etching. As described above, the depth of the recessed portion 115A is, for example, 10 to 100 μm.

Next, as shown in FIG. 18, the SiO ₂ wafer 150A as the plate-shaped heat storage member 150 is attached over the entire surface of the main surface 11A of the material substrate 1A. Anode bonding is suitable as the method of this attachment.

Next, as shown in FIG. 19, the thickness of the plate-shaped heat storage member 150 is set to a desired thickness, for example, 30 to 50 μm, by polishing the surface of the plate-shaped heat storage member 150.

Next, as shown in FIG. 20, a resistor film 4A is formed. The resistor film 4A is formed, for example, by forming a thin film of TaN by sputtering.

Next, as shown in FIG. 21, the resistor film 4A is etched to form a resistor layer 4 having a predetermined width in the sub-scanning direction and extending in the main scanning direction x.

Then, as shown in FIG. 22, the conductive film 3A is formed. The conductive film 3A is formed by, for example, forming a layer made of Cu by plating or sputtering.

Next, as shown in FIG. 23, the conductive film 3A and the resistor film 4A are selectively etched to separate the resistor layer 4 in the main scanning direction x, and the resistor layer 4 is subjected to the heat generating portion 41. The individual electrode layer 31 to be left and covered, and the comb tooth portion 324 of the common electrode layer 32 are formed.

Next, the protective layer 2 for forming the protective layer 2 is formed by depositing SiC and SiC on the electrode layer 3 and the resistor layer 4 using, for example, CVD. Further, the pad opening 21 is formed by partially removing the protective layer 2 by etching or the like. After that, the head substrate 1 and the connection substrate 5 are assembled on the heat radiating member 8, the driver IC7 connection is mounted on the connection substrate 5, the wires 61 and 62 are bonded, the protective resin 78 is formed, and the like. The thermal print head A2 shown in FIGS. 14 to 15 can be obtained.

The thermal print head A2 according to the second embodiment has basically the same operation as described above for the thermal print head A1 according to the first embodiment.

In addition, since the thermal print head A2 according to the second embodiment has a void 115A due to the recessed portion 115 below the heat storage layer 15, the heat storage performance can be further improved.

Further, in the thermal print head A2 according to the second embodiment, since the heat storage layer 15 is formed by attaching the plate-shaped heat storage member 150 to the main surface 11 of the head substrate 1, the heat storage layer 15 is directly below the heat storage layer 15. A gap 115A can be formed in the recessed portion 115, whereby the heat storage performance can be improved.

Of course, the scope of the present invention is not limited to the above-described embodiment, and any modification within the scope of the matters described in each claim is included in the scope of the present invention.

For example, with respect to the plurality of heat generating portions 41, it is of course possible to adopt any form of heat generating portions that selectively energizes the exposed portions of the resistor layers independently arranged in the main scanning direction x to generate heat.

A1, A2: Thermal printed head 1: Head substrate 1A: Material substrate 2: Protective layer 3: Electrode layer 3A: Conductive film 4: Resistor layer 4A: Resistor film 5: Connection substrate 7: Driver IC
8: Heat dissipation member 11: Main surface 11A: Main surface 15: Heat storage layer 21: Pad opening 31: Individual electrode layer 32: Common electrode layer 41: Heat generating part 59: Connector 61: Wire 62: Wire 78: Protective resin 91: Platen roller 115: Recessed portion 115A: Void 150: Plate-shaped heat storage member 150A; SiO ₂ wafer 151: Resist 311; Electrode pad portion 323: Common portion 324: Comb tooth portion 325: Extension portion x: Main scanning direction y: Sub-scanning direction

Claims (21)

A substrate with a main surface and
The heat storage layer formed on the main surface of the substrate and
The upper layer of the heat storage layer includes a plurality of heat generating portions arranged in the main scanning direction.
The thermal print head is characterized in that the heat storage layer is formed by attaching a plate-shaped heat storage member to the main surface of the substrate. Each of the plurality of heat generating portions is laminated on the resistor layer and the resistor layer so as to expose a part of the resistor layer, and an upstream conductive layer and a downstream conductive layer capable of energizing each other. The thermal printhead according to claim 1, which is formed to include a layer. The thermal print head according to claim 1 or 2, wherein the substrate is made of Si. The thermal print head according to claim 3, wherein the plate-shaped heat storage member is made of SiO ₂ . The thermal print head according to claim 4, wherein the plate-shaped heat storage member has a thickness of 30 to 50 μm. The thermal print head according to any one of claims 1 to 5, wherein the plate-shaped heat storage member is attached to the entire surface or substantially the entire surface of the main surface of the substrate. A substrate having a recess extending in the main scanning direction on the main surface,
A heat storage layer formed on the main surface of the substrate so as to cover the recessed portion,
A plurality of heat generating portions, which are upper layers of the heat storage layer and are located above the recessed portions and are arranged in the main scanning direction, are included.
The thermal print head is characterized in that the heat storage layer is formed by attaching a plate-shaped heat storage member to the main surface of the substrate. Each of the plurality of heat generating portions is laminated on the resistor layer and the resistor layer so as to expose a part of the resistor layer, and an upstream conductive layer and a downstream conductive layer capable of energizing each other. The thermal printhead according to claim 7, which is formed by including a layer. The thermal print head according to claim 7 or 8, wherein the substrate is made of Si. The thermal print head according to claim 9, wherein the plate-shaped heat storage member is made of SiO ₂ . The thermal print head according to claim 10, wherein the plate-shaped heat storage member has a thickness of 30 to 50 μm. The thermal print head according to any one of claims 7 to 11, wherein the depth of the recessed portion is 10 to 100 μm. The thermal print head according to any one of claims 7 to 12, wherein the plate-shaped heat storage member is attached to the entire surface or substantially the entire surface of the main surface of the substrate. A substrate having a main surface, a heat storage layer formed on the main surface of the substrate, and a plurality of heat generating portions arranged in the main scanning direction on the upper layer of the heat storage layer are included, and the heat storage layer is the substrate. A method for manufacturing a thermal print head, which is formed by attaching a plate-shaped heat storage member to the main surface of the above.
A method for manufacturing a thermal print head, wherein the heat storage layer is formed by attaching a plate-shaped heat storage member to a main surface of a material substrate. The method for manufacturing a thermal print head according to claim 14, wherein the material substrate is made of Si. The method for manufacturing a thermal print head according to claim 15, wherein the plate-shaped heat storage member is made of SiO ₂ . The method for manufacturing a thermal print head according to claim 15, wherein the plate-shaped heat storage member is attached to the entire surface or substantially the entire surface of the main surface of the substrate material by anode bonding. A substrate having a concave portion extending in the main scanning direction on the main surface, a heat storage layer formed on the main surface of the substrate so as to cover the concave portion, and an upper layer of the heat storage layer above the concave portion. A thermal print head including a plurality of heat generating portions arranged in the main scanning direction, and the heat storage layer is formed by attaching a plate-shaped heat storage member to the main surface of the substrate. It is a manufacturing method of
A method for manufacturing a thermal print head, wherein the heat storage layer is formed by attaching a plate-shaped heat storage member to a main surface of a material substrate. The method for manufacturing a thermal printhead according to claim 18, wherein the substrate is made of Si. The method for manufacturing a thermal print head according to claim 19, wherein the plate-shaped heat storage member is made of SiO ₂ . The method for manufacturing a thermal print head according to claim 20, wherein the plate-shaped heat storage member is attached to the entire surface or substantially the entire surface of the main surface of the substrate material by anode bonding.

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