JP2021001398A5 - - Google Patents
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- Publication number
- JP2021001398A5 JP2021001398A5 JP2020101588A JP2020101588A JP2021001398A5 JP 2021001398 A5 JP2021001398 A5 JP 2021001398A5 JP 2020101588 A JP2020101588 A JP 2020101588A JP 2020101588 A JP2020101588 A JP 2020101588A JP 2021001398 A5 JP2021001398 A5 JP 2021001398A5
- Authority
- JP
- Japan
- Prior art keywords
- copper
- nodules
- micro
- nodule
- clad laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 101
- 229910052802 copper Inorganic materials 0.000 claims description 90
- 239000010949 copper Substances 0.000 claims description 90
- 239000011889 copper foil Substances 0.000 claims description 11
- 230000037431 insertion Effects 0.000 claims 4
- 238000003780 insertion Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021177752A JP7317924B2 (ja) | 2019-06-19 | 2021-10-29 | ミクロ粗面化電着銅箔及び銅張積層板 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962863819P | 2019-06-19 | 2019-06-19 | |
| US62/863,819 | 2019-06-19 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021177752A Division JP7317924B2 (ja) | 2019-06-19 | 2021-10-29 | ミクロ粗面化電着銅箔及び銅張積層板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021001398A JP2021001398A (ja) | 2021-01-07 |
| JP2021001398A5 true JP2021001398A5 (https=) | 2021-12-02 |
| JP7270579B2 JP7270579B2 (ja) | 2023-05-10 |
Family
ID=73799662
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020101588A Active JP7270579B2 (ja) | 2019-06-19 | 2020-06-11 | ミクロ粗面化した電着銅箔及び銅張積層板 |
| JP2021177752A Active JP7317924B2 (ja) | 2019-06-19 | 2021-10-29 | ミクロ粗面化電着銅箔及び銅張積層板 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021177752A Active JP7317924B2 (ja) | 2019-06-19 | 2021-10-29 | ミクロ粗面化電着銅箔及び銅張積層板 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US20200404784A1 (https=) |
| JP (2) | JP7270579B2 (https=) |
| CN (2) | CN112118671B (https=) |
| TW (1) | TWI764170B (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111771015B (zh) * | 2018-02-23 | 2022-03-29 | 古河电气工业株式会社 | 电解铜箔以及使用该电解铜箔的锂离子二次电池用负极、锂离子二次电池、覆铜层叠板和印刷布线板 |
| JP7270579B2 (ja) * | 2019-06-19 | 2023-05-10 | 金居開發股▲分▼有限公司 | ミクロ粗面化した電着銅箔及び銅張積層板 |
| US11839024B2 (en) * | 2020-07-15 | 2023-12-05 | Dupont Electronics, Inc. | Composite and copper clad laminate made therefrom |
| TWI869660B (zh) * | 2021-06-18 | 2025-01-11 | 日商拓自達電線股份有限公司 | 電磁波屏蔽膜 |
| JPWO2023054398A1 (https=) * | 2021-09-30 | 2023-04-06 | ||
| LU501394B1 (en) | 2022-02-07 | 2023-08-07 | Circuit Foil Luxembourg | Surface-treated copper foil for high-frequency circuit and method for producing the same |
| CN114755241A (zh) * | 2022-03-09 | 2022-07-15 | 三门三友科技股份有限公司 | 一种基于激光扫描的阴极铜质量检测系统及方法 |
| TWI818576B (zh) * | 2022-06-08 | 2023-10-11 | 昂筠國際股份有限公司 | 銅箔結構及其製造方法 |
| EP4391734A1 (en) * | 2022-12-21 | 2024-06-26 | JX Metals Corporation | Copper foil, laminate, and flexible printed wiring board |
| TWI876541B (zh) * | 2023-09-19 | 2025-03-11 | 南亞塑膠工業股份有限公司 | 粗化銅箔的製造方法 |
| WO2025203900A1 (ja) * | 2024-03-25 | 2025-10-02 | Ｊｘ金属株式会社 | 表面処理銅箔、銅張積層板、及び回路形成方法 |
| TWI894979B (zh) * | 2024-05-24 | 2025-08-21 | 台燿科技股份有限公司 | 銅箔積層板及其應用 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010110092A1 (ja) | 2009-03-27 | 2010-09-30 | 日鉱金属株式会社 | プリント配線板用銅箔及びその製造方法 |
| TWI405510B (zh) | 2010-11-24 | 2013-08-11 | Co Tech Copper Foil Coporation | 經粗化處理的銅箔及其製造方法 |
| KR101623667B1 (ko) | 2011-11-04 | 2016-05-23 | 제이엑스 킨조쿠 가부시키가이샤 | 인쇄 회로용 동박 |
| JP2015124426A (ja) * | 2013-12-27 | 2015-07-06 | 株式会社Ｓｈカッパープロダクツ | 表面処理銅箔及び積層板 |
| KR102404294B1 (ko) * | 2014-09-30 | 2022-05-31 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 플렉시블 회로 기판 및 전자 기기 |
| JP6682516B2 (ja) * | 2015-04-28 | 2020-04-15 | 三井金属鉱業株式会社 | 粗化処理銅箔及びプリント配線板 |
| JP6193534B2 (ja) * | 2015-07-03 | 2017-09-06 | 三井金属鉱業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
| CN105348732A (zh) * | 2015-09-15 | 2016-02-24 | 广东生益科技股份有限公司 | 电路基板及其制备方法 |
| JP6248231B1 (ja) * | 2016-02-10 | 2017-12-13 | 古河電気工業株式会社 | 表面処理銅箔及びこれを用いて製造される銅張積層板 |
| WO2018110579A1 (ja) * | 2016-12-14 | 2018-06-21 | 古河電気工業株式会社 | 表面処理銅箔および銅張積層板 |
| TWI619851B (zh) * | 2017-02-24 | 2018-04-01 | 南亞塑膠工業股份有限公司 | 具近似絨毛狀銅瘤的電解銅箔與線路板組件的製造方法 |
| KR102353878B1 (ko) * | 2017-03-30 | 2022-01-19 | 후루카와 덴키 고교 가부시키가이샤 | 표면 처리 동박 및 이를 이용한 동 클래드 적층판 |
| KR102340473B1 (ko) * | 2017-04-25 | 2021-12-16 | 후루카와 덴키 고교 가부시키가이샤 | 표면 처리 동박 |
| TWI668333B (zh) | 2018-09-17 | 2019-08-11 | 金居開發股份有限公司 | 微粗糙電解銅箔及銅箔基板 |
| TWI669032B (zh) * | 2018-09-26 | 2019-08-11 | 金居開發股份有限公司 | 微粗糙電解銅箔及銅箔基板 |
| CN111031663B (zh) * | 2018-10-09 | 2023-05-05 | 金居开发股份有限公司 | 铜箔基板 |
| US20200270413A1 (en) * | 2019-02-27 | 2020-08-27 | Rogers Corporation | Low loss dielectric composite comprising a hydrophobized fused silica |
| TWI719698B (zh) | 2019-06-12 | 2021-02-21 | 金居開發股份有限公司 | 進階反轉電解銅箔及其銅箔基板 |
| JP7270579B2 (ja) * | 2019-06-19 | 2023-05-10 | 金居開發股▲分▼有限公司 | ミクロ粗面化した電着銅箔及び銅張積層板 |
-
2020
- 2020-06-11 JP JP2020101588A patent/JP7270579B2/ja active Active
- 2020-06-11 TW TW109119742A patent/TWI764170B/zh active
- 2020-06-12 US US16/899,630 patent/US20200404784A1/en not_active Abandoned
- 2020-06-17 CN CN202010552237.6A patent/CN112118671B/zh active Active
- 2020-06-17 CN CN202110900090.XA patent/CN113438806B/zh active Active
-
2021
- 2021-06-23 US US17/355,515 patent/US12120816B2/en active Active
- 2021-10-29 JP JP2021177752A patent/JP7317924B2/ja active Active
-
2024
- 2024-07-01 US US18/760,054 patent/US12557213B2/en active Active
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