JP2020526911A5 - - Google Patents

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Publication number
JP2020526911A5
JP2020526911A5 JP2019568762A JP2019568762A JP2020526911A5 JP 2020526911 A5 JP2020526911 A5 JP 2020526911A5 JP 2019568762 A JP2019568762 A JP 2019568762A JP 2019568762 A JP2019568762 A JP 2019568762A JP 2020526911 A5 JP2020526911 A5 JP 2020526911A5
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JP
Japan
Prior art keywords
die
image
channel
images
inspection channel
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Application number
JP2019568762A
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English (en)
Japanese (ja)
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JP2020526911A (ja
JP7073413B2 (ja
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Priority claimed from US15/704,900 external-priority patent/US10957033B2/en
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Publication of JP2020526911A publication Critical patent/JP2020526911A/ja
Publication of JP2020526911A5 publication Critical patent/JP2020526911A5/ja
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Publication of JP7073413B2 publication Critical patent/JP7073413B2/ja
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JP2019568762A 2017-07-10 2018-07-08 リピータ欠陥検出 Active JP7073413B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762530699P 2017-07-10 2017-07-10
US62/530,699 2017-07-10
US15/704,900 2017-09-14
US15/704,900 US10957033B2 (en) 2017-07-10 2017-09-14 Repeater defect detection
PCT/US2018/041178 WO2019014077A1 (en) 2017-07-10 2018-07-08 DETECTION OF REPEATER DEFECTS

Publications (3)

Publication Number Publication Date
JP2020526911A JP2020526911A (ja) 2020-08-31
JP2020526911A5 true JP2020526911A5 (enExample) 2021-08-19
JP7073413B2 JP7073413B2 (ja) 2022-05-23

Family

ID=64903357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019568762A Active JP7073413B2 (ja) 2017-07-10 2018-07-08 リピータ欠陥検出

Country Status (7)

Country Link
US (1) US10957033B2 (enExample)
EP (1) EP3635772B1 (enExample)
JP (1) JP7073413B2 (enExample)
KR (1) KR102356945B1 (enExample)
CN (1) CN110870053B (enExample)
TW (1) TWI760523B (enExample)
WO (1) WO2019014077A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110208284B (zh) * 2019-05-27 2021-09-17 武汉中导光电设备有限公司 一种多通道缺陷合并分析的方法及系统
US11710227B2 (en) * 2020-06-19 2023-07-25 Kla Corporation Design-to-wafer image correlation by combining information from multiple collection channels
US11810284B2 (en) * 2020-08-21 2023-11-07 Kla Corporation Unsupervised learning for repeater-defect detection

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI345054B (en) * 2003-05-30 2011-07-11 Ebara Corp Specimen inspection device and method, and method for making a semiconductor device using such specimen inspection device and method
US20050105791A1 (en) * 2003-10-29 2005-05-19 Lee Ken K. Surface inspection method
JP4771714B2 (ja) * 2004-02-23 2011-09-14 株式会社Ｎｇｒ パターン検査装置および方法
KR100598381B1 (ko) 2004-06-18 2006-07-07 삼성전자주식회사 인-라인 타입의 자동 웨이퍼결함 분류장치 및 그 제어방법
WO2006006148A2 (en) * 2004-07-12 2006-01-19 Negevtech Ltd. Multi mode inspection method and apparatus
US7729529B2 (en) * 2004-12-07 2010-06-01 Kla-Tencor Technologies Corp. Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle
JP4787673B2 (ja) * 2005-05-19 2011-10-05 株式会社Ｎｇｒ パターン検査装置および方法
US7711177B2 (en) * 2006-06-08 2010-05-04 Kla-Tencor Technologies Corp. Methods and systems for detecting defects on a specimen using a combination of bright field channel data and dark field channel data
US7796804B2 (en) * 2007-07-20 2010-09-14 Kla-Tencor Corp. Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
US8126255B2 (en) 2007-09-20 2012-02-28 Kla-Tencor Corp. Systems and methods for creating persistent data for a wafer and for using persistent data for inspection-related functions
US8605275B2 (en) * 2009-01-26 2013-12-10 Kla-Tencor Corp. Detecting defects on a wafer
US8223327B2 (en) * 2009-01-26 2012-07-17 Kla-Tencor Corp. Systems and methods for detecting defects on a wafer
WO2012019219A1 (en) * 2010-08-09 2012-02-16 Bt Imaging Pty Ltd Persistent feature detection
US9279774B2 (en) * 2011-07-12 2016-03-08 Kla-Tencor Corp. Wafer inspection
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
US9766186B2 (en) * 2014-08-27 2017-09-19 Kla-Tencor Corp. Array mode repeater detection
US9766187B2 (en) * 2014-08-27 2017-09-19 Kla-Tencor Corp. Repeater detection
US9816940B2 (en) 2015-01-21 2017-11-14 Kla-Tencor Corporation Wafer inspection with focus volumetric method

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