CN110870053B - 重复缺陷检查 - Google Patents

重复缺陷检查 Download PDF

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Publication number
CN110870053B
CN110870053B CN201880044655.5A CN201880044655A CN110870053B CN 110870053 B CN110870053 B CN 110870053B CN 201880044655 A CN201880044655 A CN 201880044655A CN 110870053 B CN110870053 B CN 110870053B
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CN
China
Prior art keywords
die
images
inspection channel
image
inspection
Prior art date
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CN201880044655.5A
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English (en)
Chinese (zh)
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CN110870053A (zh
Inventor
P·M·桑卡
A·巴拉达拉真
罗柱桓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
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KLA Tencor Corp
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Publication of CN110870053A publication Critical patent/CN110870053A/zh
Application granted granted Critical
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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00—Image enhancement or restoration
    • G06T5/50—Image enhancement or restoration using two or more images, e.g. averaging or subtraction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20212—Image combination
    • G06T2207/20221—Image fusion; Image merging
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20212—Image combination
    • G06T2207/20224—Image subtraction
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
CN201880044655.5A 2017-07-10 2018-07-08 重复缺陷检查 Active CN110870053B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762530699P 2017-07-10 2017-07-10
US62/530,699 2017-07-10
US15/704,900 US10957033B2 (en) 2017-07-10 2017-09-14 Repeater defect detection
US15/704,900 2017-09-14
PCT/US2018/041178 WO2019014077A1 (en) 2017-07-10 2018-07-08 DETECTION OF REPEATER DEFECTS

Publications (2)

Publication Number Publication Date
CN110870053A CN110870053A (zh) 2020-03-06
CN110870053B true CN110870053B (zh) 2023-09-15

Family

ID=64903357

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880044655.5A Active CN110870053B (zh) 2017-07-10 2018-07-08 重复缺陷检查

Country Status (7)

Country Link
US (1) US10957033B2 (enExample)
EP (1) EP3635772B1 (enExample)
JP (1) JP7073413B2 (enExample)
KR (1) KR102356945B1 (enExample)
CN (1) CN110870053B (enExample)
TW (1) TWI760523B (enExample)
WO (1) WO2019014077A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110208284B (zh) * 2019-05-27 2021-09-17 武汉中导光电设备有限公司 一种多通道缺陷合并分析的方法及系统
US11710227B2 (en) * 2020-06-19 2023-07-25 Kla Corporation Design-to-wafer image correlation by combining information from multiple collection channels
US11810284B2 (en) * 2020-08-21 2023-11-07 Kla Corporation Unsupervised learning for repeater-defect detection

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106662538A (zh) * 2014-08-27 2017-05-10 科磊股份有限公司 重复缺陷检测

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7248353B2 (en) * 2003-05-30 2007-07-24 Ebara Corporation Method and apparatus for inspecting samples, and method for manufacturing devices using method and apparatus for inspecting samples
US20050105791A1 (en) * 2003-10-29 2005-05-19 Lee Ken K. Surface inspection method
JP4771714B2 (ja) 2004-02-23 2011-09-14 株式会社Ｎｇｒ パターン検査装置および方法
KR100598381B1 (ko) 2004-06-18 2006-07-07 삼성전자주식회사 인-라인 타입의 자동 웨이퍼결함 분류장치 및 그 제어방법
EP1766363A2 (en) * 2004-07-12 2007-03-28 Negevtech Ltd. Multi mode inspection method and apparatus
US7729529B2 (en) * 2004-12-07 2010-06-01 Kla-Tencor Technologies Corp. Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle
JP4787673B2 (ja) 2005-05-19 2011-10-05 株式会社Ｎｇｒ パターン検査装置および方法
US7711177B2 (en) * 2006-06-08 2010-05-04 Kla-Tencor Technologies Corp. Methods and systems for detecting defects on a specimen using a combination of bright field channel data and dark field channel data
US7796804B2 (en) * 2007-07-20 2010-09-14 Kla-Tencor Corp. Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
US8126255B2 (en) 2007-09-20 2012-02-28 Kla-Tencor Corp. Systems and methods for creating persistent data for a wafer and for using persistent data for inspection-related functions
US8223327B2 (en) 2009-01-26 2012-07-17 Kla-Tencor Corp. Systems and methods for detecting defects on a wafer
US8605275B2 (en) * 2009-01-26 2013-12-10 Kla-Tencor Corp. Detecting defects on a wafer
WO2012019219A1 (en) * 2010-08-09 2012-02-16 Bt Imaging Pty Ltd Persistent feature detection
US9279774B2 (en) * 2011-07-12 2016-03-08 Kla-Tencor Corp. Wafer inspection
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
US9766187B2 (en) 2014-08-27 2017-09-19 Kla-Tencor Corp. Repeater detection
US9816940B2 (en) 2015-01-21 2017-11-14 Kla-Tencor Corporation Wafer inspection with focus volumetric method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106662538A (zh) * 2014-08-27 2017-05-10 科磊股份有限公司 重复缺陷检测

Also Published As

Publication number Publication date
CN110870053A (zh) 2020-03-06
US20190012778A1 (en) 2019-01-10
EP3635772B1 (en) 2025-09-03
JP7073413B2 (ja) 2022-05-23
TWI760523B (zh) 2022-04-11
EP3635772A1 (en) 2020-04-15
KR102356945B1 (ko) 2022-02-08
US10957033B2 (en) 2021-03-23
EP3635772A4 (en) 2021-03-10
KR20200018703A (ko) 2020-02-19
JP2020526911A (ja) 2020-08-31
WO2019014077A1 (en) 2019-01-17
TW201909115A (zh) 2019-03-01

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