JP7073413B2 - リピータ欠陥検出 - Google Patents

リピータ欠陥検出 Download PDF

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Publication number
JP7073413B2
JP7073413B2 JP2019568762A JP2019568762A JP7073413B2 JP 7073413 B2 JP7073413 B2 JP 7073413B2 JP 2019568762 A JP2019568762 A JP 2019568762A JP 2019568762 A JP2019568762 A JP 2019568762A JP 7073413 B2 JP7073413 B2 JP 7073413B2
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Japan
Prior art keywords
die
image
inspection channel
images
inspection
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JP2019568762A
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Japanese (ja)
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JP2020526911A (ja
JP2020526911A5 (enExample
Inventor
プレムチャンドラ エム シャンカー
アショク バラダラジャン
ジュウワン ラー
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KLA Corp
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KLA Corp
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Publication of JP2020526911A5 publication Critical patent/JP2020526911A5/ja
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00—Image enhancement or restoration
    • G06T5/50—Image enhancement or restoration using two or more images, e.g. averaging or subtraction
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20212—Image combination
    • G06T2207/20221—Image fusion; Image merging
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20212—Image combination
    • G06T2207/20224—Image subtraction
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Processing (AREA)
JP2019568762A 2017-07-10 2018-07-08 リピータ欠陥検出 Active JP7073413B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762530699P 2017-07-10 2017-07-10
US62/530,699 2017-07-10
US15/704,900 2017-09-14
US15/704,900 US10957033B2 (en) 2017-07-10 2017-09-14 Repeater defect detection
PCT/US2018/041178 WO2019014077A1 (en) 2017-07-10 2018-07-08 DETECTION OF REPEATER DEFECTS

Publications (3)

Publication Number Publication Date
JP2020526911A JP2020526911A (ja) 2020-08-31
JP2020526911A5 JP2020526911A5 (enExample) 2021-08-19
JP7073413B2 true JP7073413B2 (ja) 2022-05-23

Family

ID=64903357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019568762A Active JP7073413B2 (ja) 2017-07-10 2018-07-08 リピータ欠陥検出

Country Status (7)

Country Link
US (1) US10957033B2 (enExample)
EP (1) EP3635772B1 (enExample)
JP (1) JP7073413B2 (enExample)
KR (1) KR102356945B1 (enExample)
CN (1) CN110870053B (enExample)
TW (1) TWI760523B (enExample)
WO (1) WO2019014077A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110208284B (zh) * 2019-05-27 2021-09-17 武汉中导光电设备有限公司 一种多通道缺陷合并分析的方法及系统
US11710227B2 (en) * 2020-06-19 2023-07-25 Kla Corporation Design-to-wafer image correlation by combining information from multiple collection channels
US11810284B2 (en) * 2020-08-21 2023-11-07 Kla Corporation Unsupervised learning for repeater-defect detection

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005277395A (ja) 2004-02-23 2005-10-06 Nano Geometry Kenkyusho:Kk パターン検査装置および方法
JP2007149055A (ja) 2005-05-19 2007-06-14 Nano Geometry Kenkyusho:Kk パターン検査装置および方法
JP2015096866A (ja) 2009-01-26 2015-05-21 ケーエルエー−テンカー・コーポレーションＫｌａ−Ｔｅｎｃｏｒ Ｃｏｒｐｏｒａｔｉｏｎ ウエハ上の欠陥を検出するためのシステムおよび方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1630862B1 (en) * 2003-05-30 2016-01-13 Ebara Corporation Sample inspection device and method, and device manufacturing method using the sample inspection device and method
US20050105791A1 (en) * 2003-10-29 2005-05-19 Lee Ken K. Surface inspection method
KR100598381B1 (ko) 2004-06-18 2006-07-07 삼성전자주식회사 인-라인 타입의 자동 웨이퍼결함 분류장치 및 그 제어방법
WO2006006148A2 (en) * 2004-07-12 2006-01-19 Negevtech Ltd. Multi mode inspection method and apparatus
US7729529B2 (en) * 2004-12-07 2010-06-01 Kla-Tencor Technologies Corp. Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle
US7711177B2 (en) * 2006-06-08 2010-05-04 Kla-Tencor Technologies Corp. Methods and systems for detecting defects on a specimen using a combination of bright field channel data and dark field channel data
US7796804B2 (en) * 2007-07-20 2010-09-14 Kla-Tencor Corp. Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
US8126255B2 (en) 2007-09-20 2012-02-28 Kla-Tencor Corp. Systems and methods for creating persistent data for a wafer and for using persistent data for inspection-related functions
US8605275B2 (en) * 2009-01-26 2013-12-10 Kla-Tencor Corp. Detecting defects on a wafer
WO2012019219A1 (en) * 2010-08-09 2012-02-16 Bt Imaging Pty Ltd Persistent feature detection
US9279774B2 (en) * 2011-07-12 2016-03-08 Kla-Tencor Corp. Wafer inspection
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
US9766186B2 (en) * 2014-08-27 2017-09-19 Kla-Tencor Corp. Array mode repeater detection
US9766187B2 (en) 2014-08-27 2017-09-19 Kla-Tencor Corp. Repeater detection
US9816940B2 (en) 2015-01-21 2017-11-14 Kla-Tencor Corporation Wafer inspection with focus volumetric method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005277395A (ja) 2004-02-23 2005-10-06 Nano Geometry Kenkyusho:Kk パターン検査装置および方法
JP2007149055A (ja) 2005-05-19 2007-06-14 Nano Geometry Kenkyusho:Kk パターン検査装置および方法
JP2015096866A (ja) 2009-01-26 2015-05-21 ケーエルエー−テンカー・コーポレーションＫｌａ−Ｔｅｎｃｏｒ Ｃｏｒｐｏｒａｔｉｏｎ ウエハ上の欠陥を検出するためのシステムおよび方法

Also Published As

Publication number Publication date
KR102356945B1 (ko) 2022-02-08
US20190012778A1 (en) 2019-01-10
TW201909115A (zh) 2019-03-01
EP3635772A4 (en) 2021-03-10
EP3635772A1 (en) 2020-04-15
WO2019014077A1 (en) 2019-01-17
CN110870053B (zh) 2023-09-15
KR20200018703A (ko) 2020-02-19
US10957033B2 (en) 2021-03-23
JP2020526911A (ja) 2020-08-31
TWI760523B (zh) 2022-04-11
CN110870053A (zh) 2020-03-06
EP3635772B1 (en) 2025-09-03

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