JP6864738B2 - デフォーカス検出方法 - Google Patents
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- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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Description
本願は、2016年9月23日付米国仮特許出願第62/399251号に基づく優先権主張を伴うので、この参照を以てその開示内容を本願に繰り入れることにする。
Claims (19)
- コントローラを用いウェハのダイにセグメントマスクを適用することでそのダイ上にセグメントを形成するステップと、
前記コントローラを用い、前記セグメントの平均強度を、明視野モードを用い赤色、緑色及び青色にて、並びに暗視野モードを用い赤色、緑色及び青色にて計算するステップと、
前記コントローラを用いデフォーカス値をそれら平均強度と比較するステップと、
前記コントローラを用い、デフォーカス感度が最適になる色組合せを特定するステップと、
前記コントローラを用い、デフォーカスに対する感度を前記セグメント内の画素毎に求めるステップと、
前記コントローラを用い、感度に対するしきい値を前記画素毎に適用するステップと、
前記しきい値を上回る諸画素に基づき、前記コントローラを用い、前記ダイ上に第2セグメントマスクを生成するステップと、
を有する方法。 - 請求項1に記載の方法であって、前記ウェハが焦点変調を伴う訓練ウェハである方法。
- 請求項1に記載の方法であって、前記ウェハが前記ダイを複数個有し、前記生成及び前記計算がそのウェハ上のダイ毎に反復される方法。
- 請求項1に記載の方法であって、前記ダイの一部を覆うよう前記セグメントマスクが構成される方法。
- 請求項1に記載の方法であって、前記比較が、前記平均強度に対するデフォーカス値の散布図の生成を含む方法。
- 請求項1に記載の方法であって、更に、前記コントローラを用い前記しきい値を調整するステップを有する方法。
- 請求項1の方法であって、前記しきい値を前記画素毎に適用する際にダイ内全画素平均強度を用いる方法。
- プログラムが格納される非一時的コンピュータ可読媒体であり、そのプログラムが、プロセッサに指令することにより、
ダイにセグメントマスクを適用することでそのダイ上にセグメントを形成し、
明視野モード使用時の赤色、緑色及び青色を含むデータで以て、並びに暗視野モード使用時の赤色、緑色及び青色を含むデータで以て、前記セグメントの平均強度を計算し、
デフォーカス値をそれら平均強度と比較し、
デフォーカス感度が最適になる色組合せを特定し、
デフォーカスに対する感度を前記セグメント内の画素毎に求め、
感度に対するしきい値を前記画素毎に適用し、且つ
前記しきい値を上回る諸画素に基づき、前記ダイ上に第2セグメントマスクを生成するよう、
構成されている非一時的コンピュータ可読媒体。 - 請求項8に記載の非一時的コンピュータ可読媒体であって、ウェハが前記ダイを複数個有し、前記生成及び前記計算がそのウェハ上のダイ毎に反復される非一時的コンピュータ可読媒体。
- 請求項8に記載の非一時的コンピュータ可読媒体であって、前記ダイの一部を覆うよう前記セグメントマスクが構成される非一時的コンピュータ可読媒体。
- 請求項8に記載の非一時的コンピュータ可読媒体であって、前記デフォーカス値の比較が、前記平均強度に対する前記デフォーカス値の散布図の生成を含む非一時的コンピュータ可読媒体。
- 請求項8に記載の非一時的コンピュータ可読媒体であって、前記プログラムが、更に、前記しきい値を調整するよう構成されている非一時的コンピュータ可読媒体。
- 請求項8に記載の非一時的コンピュータ可読媒体であって、前記しきい値を前記画素毎に適用する際にダイ内全画素平均強度が用いられる非一時的コンピュータ可読媒体。
- ウェハを保持するよう構成されたチャックと、
前記ウェハの表面を計測するよう構成された計測システムであり、明視野モード及び暗視野モードを用いそのウェハの像をもたらす計測システムと、
前記計測システムと電子通信するコントローラであり、プロセッサ、そのプロセッサと電子通信する電子データ格納ユニット、並びにそのプロセッサと電子通信する通信ポートを有するコントローラと、
を備え、前記コントローラが、
前記ウェハのダイにセグメントマスクを適用することでそのダイ上にセグメントを形成し、
前記明視野モード使用時の赤色、緑色及び青色を含むデータで以て、並びに前記暗視野モード使用時の赤色、緑色及び青色を含むデータで以て、前記セグメントの平均強度を計算し、
デフォーカス値をそれら平均強度と比較し、
デフォーカス感度が最適になる色組合せを特定し、
デフォーカスに対する感度を前記セグメント内の画素毎に求め、
感度に対するしきい値を前記画素毎に適用し、且つ
前記しきい値を上回る諸画素に基づき、前記ダイ上に第2セグメントマスクを生成するよう、
構成されているシステム。 - 請求項14に記載のシステムであって、前記ウェハが複数個のダイを有するシステム。
- 請求項14に記載のシステムであって、前記コントローラにより適用される前記セグメントマスクが、前記ダイの一部を覆うよう構成されているシステム。
- 請求項14に記載のシステムであって、前記デフォーカス値の比較が、前記平均強度に対する前記デフォーカス値の散布図の生成を含むシステム。
- 請求項14に記載のシステムであって、前記コントローラが、更に、前記しきい値を調整するよう構成されているシステム。
- 請求項14に記載のシステムであって、前記しきい値を前記画素毎に適用する際にダイ内全画素平均強度を用いるシステム。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662399251P | 2016-09-23 | 2016-09-23 | |
US62/399,251 | 2016-09-23 | ||
US15/669,030 | 2017-08-04 | ||
US15/669,030 US10372113B2 (en) | 2016-09-23 | 2017-08-04 | Method for defocus detection |
PCT/US2017/051901 WO2018057433A1 (en) | 2016-09-23 | 2017-09-15 | Method for defocus detection |
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JP2019532339A JP2019532339A (ja) | 2019-11-07 |
JP6864738B2 true JP6864738B2 (ja) | 2021-04-28 |
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US (1) | US10372113B2 (ja) |
EP (1) | EP3516683B1 (ja) |
JP (1) | JP6864738B2 (ja) |
KR (1) | KR102287796B1 (ja) |
CN (1) | CN109690750B (ja) |
SG (1) | SG11201901331YA (ja) |
WO (1) | WO2018057433A1 (ja) |
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KR20220077080A (ko) | 2020-12-01 | 2022-06-08 | 주식회사 익센트릭게임그루 | 곡면 프로젝션에서의 몰입형 콘텐츠 제공 시스템 및 디포커스 제어 방법 |
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KR101419663B1 (ko) * | 2003-06-19 | 2014-07-15 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조방법 |
US6985220B1 (en) | 2003-08-20 | 2006-01-10 | Kla-Tencor Technologies Corporation | Interactive threshold tuning |
DE60333688D1 (de) * | 2003-12-19 | 2010-09-16 | Ibm | Differentielle metrologie für kritische abmessung und überlagerung |
CN101286010B (zh) * | 2008-04-25 | 2010-10-20 | 上海微电子装备有限公司 | 用于光刻设备的对准系统及其对准方法和光刻设备 |
JP2009277903A (ja) * | 2008-05-15 | 2009-11-26 | Panasonic Corp | 電子部品形成装置および電子部品 |
JPWO2011016420A1 (ja) | 2009-08-03 | 2013-01-10 | 株式会社エヌ・ピー・シー | 太陽電池の欠陥検査装置、欠陥検査方法、およびプログラム |
WO2011044218A1 (en) * | 2009-10-08 | 2011-04-14 | Massachusetts Institute Of Technology | Phase from defocused color images |
JP5526014B2 (ja) | 2010-12-21 | 2014-06-18 | 株式会社日立製作所 | 撮像装置 |
US20130016895A1 (en) | 2011-07-15 | 2013-01-17 | International Business Machines Corporation | Method and system for defect-bitmap-fail patterns matching analysis including peripheral defects |
US9311700B2 (en) * | 2012-09-24 | 2016-04-12 | Kla-Tencor Corporation | Model-based registration and critical dimension metrology |
US9546862B2 (en) | 2012-10-19 | 2017-01-17 | Kla-Tencor Corporation | Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry tool |
US10192303B2 (en) * | 2012-11-12 | 2019-01-29 | Kla Tencor Corporation | Method and system for mixed mode wafer inspection |
CN103488060B (zh) * | 2013-09-30 | 2015-09-09 | 上海华力微电子有限公司 | 确定光刻曝光离焦量的方法 |
US9710728B2 (en) * | 2014-10-28 | 2017-07-18 | Kla-Tencor Corporation | Image based signal response metrology |
US9569834B2 (en) * | 2015-06-22 | 2017-02-14 | Kla-Tencor Corporation | Automated image-based process monitoring and control |
JP6600162B2 (ja) * | 2015-05-19 | 2019-10-30 | キヤノン株式会社 | 撮像装置およびその制御方法 |
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EP3516683B1 (en) | 2022-06-22 |
JP2019532339A (ja) | 2019-11-07 |
SG11201901331YA (en) | 2019-04-29 |
US20180088560A1 (en) | 2018-03-29 |
EP3516683A1 (en) | 2019-07-31 |
US10372113B2 (en) | 2019-08-06 |
CN109690750B (zh) | 2020-12-01 |
WO2018057433A1 (en) | 2018-03-29 |
CN109690750A (zh) | 2019-04-26 |
KR20190045942A (ko) | 2019-05-03 |
KR102287796B1 (ko) | 2021-08-06 |
EP3516683A4 (en) | 2020-03-18 |
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