JP2020522889A - スピンコーティング装置及び方法 - Google Patents
スピンコーティング装置及び方法 Download PDFInfo
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- JP2020522889A JP2020522889A JP2019566160A JP2019566160A JP2020522889A JP 2020522889 A JP2020522889 A JP 2020522889A JP 2019566160 A JP2019566160 A JP 2019566160A JP 2019566160 A JP2019566160 A JP 2019566160A JP 2020522889 A JP2020522889 A JP 2020522889A
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- 238000004528 spin coating Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 230000005674 electromagnetic induction Effects 0.000 claims abstract description 28
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract 1
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 12
- 230000005484 gravity Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000009987 spinning Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
チャック2の下に固定された環状磁石4;
環状磁石4は、チャック2の周囲に沿って連続的又は非連続的に配置することができる。すなわち、環状磁石4は、チャック2の周囲に沿って均一に分布することが好ましいいくつかのリングセグメントを含むことができる。
上から下に、第1コイル5と、第1コイル5に電気的に結合された第2コイル6とを含む。
磁性バー7は、シャフト3の円周面に固定されていても、シャフト3を横断して延びていてもよい。磁性バー7がシャフト3の円周面に固定される場合、磁性バー7の2つの端部を結合して、シャフト3を囲む環を形成することができる。磁性バー7がシャフト3を横断して延びる場合(その両端部がシャフト3の円周面から突出する場合)、シャフト3を横断して延びる複数の磁性バー7は、同じ高さでシャフト3に配置され、複数の磁性バー7の端部はシャフト3の円周面に沿って同じ高さで均一に分布する。
Claims (10)
- 回転可能なシャフトと、前記シャフトの端部に固定されたチャックとを備えるスピンコーティング装置であって、
前記シャフトは、回転すると、前記チャックを回転駆動し、
電磁誘導装置が前記チャックの下に配置され、
前記チャックの回転によって生成される遠心力が前記電磁誘導装置によって生成される磁力とバランスを取り、前記チャックの表面の水平度が調整される、
スピンコーティング装置。 - 前記電磁誘導装置は、1つ以上の電磁素子と、1つ以上の前記電磁素子に結合された1つ以上の磁電素子とを含む、請求項1に記載のスピンコーティング装置。
- 前記電磁素子は、前記チャックの下面に固定された環状磁石に対応して配置された1つ以上の第1コイルを備え、
前記磁電素子は、前記シャフトに固定された1つ以上の磁性バーと、1つ以上の前記磁性バーに対応して設けられた1つ以上の第2コイルを含む。
請求項2に記載のスピンコーティング装置。 - 前記電磁誘導装置は、前記チャックの下面に固定された環状磁石と、前記シャフトに固定された1つ以上の磁性バーと、前記環状磁石と1つ以上の磁性バーとの間に配置された1つ以上のコイル群を含む、
請求項1に記載のスピンコーティング装置。 - 前記シャフトの周りに均一に分布する少なくとも2つのコイル群が設けられる、
請求項4に記載のスピンコーティング装置。 - 前記コイル群の各々は、電力が供給されると、前記環状磁石と相互作用する磁力を生成することができる第1コイルと、1つ以上の前記磁性バーと電磁誘導を生成するように構成された第2コイルとを含み、各コイル群内の前記第1コイルと前記第2コイルは電気的に結合されている、
請求項4に記載のスピンコーティング装置。 - 前記コイル群の少なくとも1つは、前記チャックに支持された基板のノッチに位置的に対応して配置され、前記ノッチと位置的に対応して配置された前記コイル群の前記第1コイルは、前記環状磁石の一部とは反対の極性を有しており、前記ノッチと位置的に対応して配置された前記コイル群の前記第2コイルは、前記磁性バーの対応するものと反対の極性を有している、
請求項6に記載のスピンコーティング装置。 - 1つ以上の前記コイル群はホルダーに固定されている、
請求項4に記載のスピンコーティング装置。 - 8つの前記コイル群が設けられ、8つの前記コイル群が前記シャフトの周りに均一に分布している、
請求項4に記載のスピンコーティング装置。 - 請求項1〜9のいずれか一項に記載のスピンコーティング装置を用いたスピンコーティング法であって、
前記チャック上にコーティングされる基板を用意し、
前記シャフトによって駆動される前記チャックの回転時及びそれに対応して生成される遠心力により、前記チャックの異なる部分が異なる高さを有し、
前記チャックの表面の水平度を調整するために、前記電磁誘導装置によって、前記チャックのより低い高さを有する部分に反発力を、より高い高さを有する前記チャックの別の部分に引力を加える、
スピンコーティング方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710399778.8 | 2017-05-31 | ||
CN201710399778.8A CN108987298B (zh) | 2017-05-31 | 2017-05-31 | 旋转涂胶装置和方法 |
PCT/CN2018/088498 WO2018219232A1 (zh) | 2017-05-31 | 2018-05-25 | 旋转涂胶装置和方法 |
Publications (2)
Publication Number | Publication Date |
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JP2020522889A true JP2020522889A (ja) | 2020-07-30 |
JP6931091B2 JP6931091B2 (ja) | 2021-09-01 |
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JP2019566160A Active JP6931091B2 (ja) | 2017-05-31 | 2018-05-25 | スピンコーティング装置及び方法 |
Country Status (6)
Country | Link |
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US (1) | US11469121B2 (ja) |
JP (1) | JP6931091B2 (ja) |
KR (1) | KR102333626B1 (ja) |
CN (1) | CN108987298B (ja) |
TW (1) | TWI655510B (ja) |
WO (1) | WO2018219232A1 (ja) |
Families Citing this family (1)
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CN114643180B (zh) * | 2022-02-28 | 2023-04-07 | 长电集成电路(绍兴)有限公司 | 一种光刻胶固化装置 |
Citations (4)
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JPH11354617A (ja) * | 1998-06-10 | 1999-12-24 | Sumiere Sez Kk | 基板処理装置および基板処理方法 |
JP2000208591A (ja) * | 1999-01-08 | 2000-07-28 | Sony Corp | 回転式基板処理装置 |
JP2004087934A (ja) * | 2002-08-28 | 2004-03-18 | Nec Corp | レジスト塗布方法およびレジスト塗布装置 |
JP2013229552A (ja) * | 2011-12-19 | 2013-11-07 | Dainippon Screen Mfg Co Ltd | 基板保持回転装置およびそれを備えた基板処理装置、ならびに基板処理方法 |
Family Cites Families (15)
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JP3672416B2 (ja) * | 1997-06-27 | 2005-07-20 | 株式会社荏原製作所 | スピン処理装置 |
KR20060113684A (ko) | 2003-10-31 | 2006-11-02 | 가부시키가이샤 에바라 세이사꾸쇼 | 처리액코팅장치 및 처리액코팅방법 |
JP2006283894A (ja) | 2005-04-01 | 2006-10-19 | Sony Corp | 自動平衡装置、回転装置及びディスク駆動装置 |
KR100675018B1 (ko) | 2005-06-22 | 2007-01-29 | 도시바삼성스토리지테크놀러지코리아 주식회사 | 디스크 클램핑 장치 |
JP5013400B2 (ja) | 2006-09-29 | 2012-08-29 | 国立大学法人東北大学 | 塗布膜コーティング装置 |
JP4979472B2 (ja) * | 2007-06-05 | 2012-07-18 | 東京エレクトロン株式会社 | 処理装置 |
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-
2017
- 2017-05-31 CN CN201710399778.8A patent/CN108987298B/zh active Active
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2018
- 2018-05-25 JP JP2019566160A patent/JP6931091B2/ja active Active
- 2018-05-25 KR KR1020197038430A patent/KR102333626B1/ko active IP Right Grant
- 2018-05-25 WO PCT/CN2018/088498 patent/WO2018219232A1/zh active Application Filing
- 2018-05-25 US US16/618,309 patent/US11469121B2/en active Active
- 2018-05-31 TW TW107118814A patent/TWI655510B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11354617A (ja) * | 1998-06-10 | 1999-12-24 | Sumiere Sez Kk | 基板処理装置および基板処理方法 |
JP2000208591A (ja) * | 1999-01-08 | 2000-07-28 | Sony Corp | 回転式基板処理装置 |
JP2004087934A (ja) * | 2002-08-28 | 2004-03-18 | Nec Corp | レジスト塗布方法およびレジスト塗布装置 |
JP2013229552A (ja) * | 2011-12-19 | 2013-11-07 | Dainippon Screen Mfg Co Ltd | 基板保持回転装置およびそれを備えた基板処理装置、ならびに基板処理方法 |
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Publication number | Publication date |
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TW201903530A (zh) | 2019-01-16 |
CN108987298B (zh) | 2020-10-16 |
KR20200011493A (ko) | 2020-02-03 |
WO2018219232A1 (zh) | 2018-12-06 |
JP6931091B2 (ja) | 2021-09-01 |
KR102333626B1 (ko) | 2021-12-01 |
TWI655510B (zh) | 2019-04-01 |
US11469121B2 (en) | 2022-10-11 |
US20200350182A1 (en) | 2020-11-05 |
CN108987298A (zh) | 2018-12-11 |
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