CN108987298A - 旋转涂胶装置和方法 - Google Patents

旋转涂胶装置和方法 Download PDF

Info

Publication number
CN108987298A
CN108987298A CN201710399778.8A CN201710399778A CN108987298A CN 108987298 A CN108987298 A CN 108987298A CN 201710399778 A CN201710399778 A CN 201710399778A CN 108987298 A CN108987298 A CN 108987298A
Authority
CN
China
Prior art keywords
sucker
spin coating
coil
electromagnetic induction
coating device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201710399778.8A
Other languages
English (en)
Other versions
CN108987298B (zh
Inventor
卢士良
冉航
李义辉
晏小平
赵俊
陈珊珊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Micro Electronics Equipment Co Ltd
Original Assignee
Shanghai Micro Electronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment Co Ltd filed Critical Shanghai Micro Electronics Equipment Co Ltd
Priority to CN201710399778.8A priority Critical patent/CN108987298B/zh
Priority to US16/618,309 priority patent/US11469121B2/en
Priority to JP2019566160A priority patent/JP6931091B2/ja
Priority to PCT/CN2018/088498 priority patent/WO2018219232A1/zh
Priority to KR1020197038430A priority patent/KR102333626B1/ko
Priority to TW107118814A priority patent/TWI655510B/zh
Publication of CN108987298A publication Critical patent/CN108987298A/zh
Application granted granted Critical
Publication of CN108987298B publication Critical patent/CN108987298B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本发明提供一种旋转涂胶装置和方法,旋转涂胶装置包括一自身可旋转的转轴和一固定在所述转轴端部的吸盘,吸盘下方设置有电磁感应装置,这样吸盘在旋转时若由于离心力导致吸盘上受力不均匀时,吸盘的盘面与水平面相交时,吸盘与下方电磁感应装置发生变化,则电磁感应装置的电磁力发生变化,对吸盘不同部分排斥力和吸引力也发生变化,从而对不平衡的离心力造成了力学补偿,维持了吸盘的平衡。本发明提供的旋转涂胶装置和方法,仅需设置电磁感应装置,无需人力对其进行操控,该装置和方法会自动调控排斥力和吸引力,因此具有使吸盘更加平稳、减少振动对设备损伤、提高旋涂光刻胶效果的同时且省时省力的优点。

Description

旋转涂胶装置和方法
技术领域
本发明涉及半导体光刻机领域,特别涉及一种旋转涂胶装置和方法。
背景技术
目前在芯片制造业,包括LED芯片领域普遍采用高速旋转涂胶方式在样品表面涂敷一层光刻胶,然后利用光刻和显影技术形成特定的微小图形,用于后续加工工艺的保护层。
芯片及LED芯片制造,在直径小于200mm的样品中普遍采用“Flat”形式用于对准。“Flat”形式是指圆形物料沿着小于直径的弦切削下一小块,在切口处形成一个平边。物料的几何中心和重心分离。
涂胶显影工艺需要以几何中心为旋转中心进行高速旋转,由于重心的偏移,导致以几何中心为旋转中心的物料在不同方向上产生不同的离心力。不平衡的离心力将传递到提供转动的系统上,一般是电机的轴。不平衡的离心力将引起旋转系统不稳定,引起振动。涂胶过程中,振动对涂敷的膜厚有负面影响,尤其当基片的质量较大,特别是6寸蓝宝石片,蓝宝石重心偏移过大,所以在旋转时会产生强烈的振动,可能会导致物料破碎或者旋转系统损坏。
发明内容
为解决上述问题,本发明提出了一种旋转涂胶装置和方法,在装置中设置电磁感应装置,对倾斜的吸盘产生可变化的电磁力,使其维持平衡。
为达到上述目的,本发明提供一种旋转涂胶装置,包括一自身可旋转的转轴和一固定在所述转轴端部的吸盘,所述转轴旋转时带动所述吸盘转动,所述吸盘下方设置有跟随所述吸盘转动的电磁感应装置,使得所述吸盘在旋转时产生的离心力与所述电磁感应装置产生的磁力产生力学平衡。
作为优选,所述电磁感应装置包括一固定在所述吸盘底面的环形磁铁、一固定在转轴处的条形磁铁和位于所述环形磁铁和所述条形磁铁之间的线圈组。
作为优选,所述线圈组设置有至少两组,所有的线圈组围绕所述转轴均匀分布。
作为优选,所述线圈组从上至下包括与所述环形磁铁产生电磁感应的第一线圈和与所述条形磁铁产生电磁感应的第二线圈,第一线圈与所述第二线圈之间通过电线电性连接。
作为优选,所述基底上具有切口,所述切口处对应的第一线圈和对应的环形磁铁极性相反,所述切口对应的第二线圈与所述条形磁铁上与该第二线圈对应的端部极性相反。
作为优选,所述线圈组固定在支架上。
作为优选,所述线圈组设置有八组,所有的线圈组围绕所述转轴均匀分布。
本发明还提供一种使用如上所述的旋转涂胶装置的旋转涂胶方法,提供一待涂胶的基底放置在所述吸盘上,当转轴带动所述吸盘旋转时,若离心力使得吸盘上的点高度不相同时,所述电磁感应装置与吸盘上高度较低的部分产生斥力,与吸盘上高度较高的部分产生引力。
与现有技术相比,本发明的有益效果是:本发明提供一种旋转涂胶装置和方法,旋转涂胶装置包括一自身可旋转的转轴和一固定在所述转轴端部的吸盘,吸盘下方设置有电磁感应装置,这样吸盘在旋转时若由于离心力导致吸盘上受力不均匀时,吸盘的盘面与水平面相交时,吸盘与下方电磁感应装置发生变化,则电磁感应装置的电磁力发生变化,对吸盘不同部分排斥力和吸引力也发生变化,从而对不平衡的离心力造成了力学补偿,维持了吸盘的平衡。本发明提供的旋转涂胶装置和方法,仅需设置电磁感应装置,无需人力对其进行操控,该装置和方法会自动调控排斥力和吸引力,因此具有使吸盘更加平稳、减少振动对设备损伤、提高旋涂光刻胶效果的同时且省时省力的优点。
附图说明
图1为本发明提供的旋转涂胶装置结构示意图;
图2为图1的俯视图;
图3为本发明提供的线圈组的结构示意图。
图中:1-基底,2-吸盘,3-转轴,4-环形磁铁,5-第一线圈,6-第二线圈,7-条形磁铁。
具体实施方式
为使本发明的上述目的、特征和优点能够更加明显易懂,下面结合附图对本发明的具体实施方式做详细的说明。
请参照图1,本发明提供一种旋转涂胶装置,包括一自身可旋转的转轴3和一固定在所述转轴3端部的吸盘2,转轴3一般与电机等驱动装置连接,驱动装置驱动转轴3围绕自身的轴旋转,转轴3旋转时带动吸盘2旋转。
吸盘2上放置有基底1,若该基底1的重心与圆心并不重合,例如为用于制作LED的蓝宝石片,一般为平片缺口设计,但安装至吸盘2时,需将基底1的圆心与吸盘2的圆心重合放置,这样该基底1放置在吸盘2上旋转时,吸盘2与基底1共同的重心则偏离转轴3的轴心,那么旋转时必然产生不平衡的离心力,吸盘2上重量大的一处产生较强的离心力,重量小的一处产生较弱的离心力,使得吸盘2产生晃动,重量大的一处向下沉,重量小的一处往上翘曲。
在本发明提供的旋转装置中,设置了电磁感应装置,分别包括一个或多个磁生电装置和一个或多个电生磁装置,所述磁生电装置利用磁铁与线圈相对运动产生电动势,所述电生磁装置通过电流后产生相应磁场;
该电磁感应装置从上至下具体为:
固定在吸盘2下方的环形磁铁4,环形磁铁4沿吸盘2圆周方向分布;
线圈组,从上至下分别为第一线圈5和与第一线圈5电性连接的第二线圈6;
固定在转轴3处的条形磁铁7,该条形磁铁7可固定在转轴3的圆周面,或者可横向贯穿转轴3。
其中由上述条形磁铁7与第二线圈6构成磁生电装置,由环形磁铁4与第一线圈5构成电生磁装置。
请参照图2,在上述电磁感应装置中,可设置多组线圈组,并且围绕转轴3均匀分布。
在吸盘2上重力小的一处,也即切口对应之处,环形磁铁4的极性与该处下方第一线圈5的极性相反,该第一线圈5对应的第二线圈6与其所在的条形磁铁7的端部的极性也相反。
在吸盘2上重力大的一处,环形磁铁4的极性与该处下方第一线圈5的极性相同,该第一线圈5对应的第二线圈6与其所在的条形磁铁7的端部的极性也相同。
上述线圈组中线圈的极性可通过线圈绕组的方向来设置,线圈组可固定在四周支架上,与转轴3和吸盘2并不发生物理接触。
本发明还提供一种使用上述旋转涂胶装置的旋转涂胶方法,具体为
在吸盘2上放置具有切口的待涂胶的基底1,该基底1具有切口(未图示),在转轴3带动吸盘2旋转时,吸盘2上重力大之处高度下降,使得此处与对应的第一线圈5的距离减小,而随着吸盘2的上述形变,转轴3必然也发生形变,使得转轴3向吸盘2上重力大之处倾斜,那么该处条形磁铁7与第二线圈6之间的距离减小,此时第二线圈6的电动势增大,则内部电流增大,而该处第一线圈5和第二线圈6电性连接,则第一线圈5的电流也增大,第一线圈5与该处环形磁铁4之间的磁场也增大,导致第一线圈5与该处环形磁铁4之间的磁力增大,由于第一线圈5和此处的环形磁铁4极性相同,则第一线圈5对此处环形磁铁4的排斥力增大,对吸盘2此处产生向上托举的力。
相应地,在吸盘2上重力小之处,则此处的第一线圈5和其对应的环形磁铁4之间极性相反,则产生相互吸引的磁力,若该处吸盘2向上翘起,则吸引力会将该处吸盘2向下吸附。
综上所示,本发明提供的电磁感应装置在吸盘2上重力大之处产生向上托举的力,在重力小之处产生向下吸附的力,使得吸盘2在旋转过程中,保持力学平衡,减少了吸盘2振动的可能性,更加降低了吸盘2的振动对设备造成的损伤风险。
请参照图3,由于线圈的感性阻抗,磁场会发生一个时间延误,可以减小第二线圈6与第一线圈5的距离或减小第二线圈6与条形磁铁7的距离,消除迟滞效应。
本发明提供一种旋转涂胶装置和方法,旋转涂胶装置包括一自身可旋转的转轴3和一固定在所述转轴3端部的吸盘2,吸盘2下方设置有电磁感应装置,这样吸盘2在旋转时若由于离心力导致吸盘2上受力不均匀,导致吸盘2的盘面与水平面相交时,吸盘2与下方电磁感应装置发生变化,则电磁感应装置的电磁力发生变化,对吸盘2不同部分排斥力和吸引力也发生变化,从而对不平衡的离心力实现了力学补偿,维持了吸盘2的平衡。本发明提供的旋转涂胶装置和方法,仅需设置电磁感应装置,无需人力对其进行操控,该装置和方法会自动调控排斥力和吸引力,因此具有使吸盘2更加平稳、减少振动对设备损伤、提高旋涂光刻胶效果的同时且省时省力的优点。
本发明对上述实施例进行了描述,但本发明不仅限于上述实施例。显然本领域的技术人员可以对发明进行各种改动和变型而不脱离本发明的精神和范围。这样,倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内,则本发明也意图包括这些改动和变型在内。

Claims (10)

1.一种旋转涂胶装置,包括一自身可旋转的转轴和一固定在所述转轴端部的吸盘,所述转轴旋转时带动所述吸盘转动,其特征在于,所述吸盘下方设有电磁感应装置,使得所述吸盘在旋转时产生的离心力与所述电磁感应装置产生的磁力产生力学平衡。
2.如权利要求1所述的旋转涂胶装置,其特征在于,所述电磁感应装置包括一个或多个电生磁装置和一个或多个磁生电装置。
3.如权利要求2所述的旋转涂胶装置,其特征在于,所述电生磁装置由一固定在所述吸盘底面的环形磁铁与一线圈组组成,和/或所述磁生电装置一固定在所述吸盘底面的环形磁铁与一线圈组组成。
4.如权利要求1所述的旋转涂胶装置,其特征在于,所述电磁感应装置包括一固定在所述吸盘底面的环形磁铁、一固定在转轴处的条形磁铁和位于所述环形磁铁和所述条形磁铁之间的线圈组。
5.如权利要求4所述的旋转涂胶装置,其特征在于,所述线圈组设置有至少两组,所有的线圈组围绕所述转轴均匀分布。
6.如权利要求4所述的旋转涂胶装置,其特征在于,所述线圈组包括与所述环形磁铁产生电磁感应的第一线圈和与所述条形磁铁产生电磁感应的第二线圈,第一线圈与所述第二线圈之间通过电线电性连接。
7.如权利要求4所述的旋转涂胶装置,其特征在于,吸盘上放置待涂胶的基底,所述基底上具有切口,所述切口处对应的第一线圈和对应的环形磁铁极性相反,所述切口对应的第二线圈与所述条形磁铁上与该第二线圈对应的端部极性相反。
8.如权利要求2所述的旋转涂胶装置,其特征在于,所述线圈组固定在支架上。
9.如权利要求2所述的旋转涂胶装置,其特征在于,所述线圈组设置有八组,八组线圈组围绕所述转轴均匀分布。
10.一种使用如权利要求1~7中任意一项所述的旋转涂胶装置的旋转涂胶方法,其特征在于,提供一待涂胶的基底放置在所述吸盘上,当转轴带动所述吸盘旋转时,若离心力使得吸盘上的点高度不相同时,所述电磁感应装置与吸盘上高度较低的部分产生斥力,与吸盘上高度较高的部分产生引力。
CN201710399778.8A 2017-05-31 2017-05-31 旋转涂胶装置和方法 Active CN108987298B (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN201710399778.8A CN108987298B (zh) 2017-05-31 2017-05-31 旋转涂胶装置和方法
US16/618,309 US11469121B2 (en) 2017-05-31 2018-05-25 Spin coating device and method
JP2019566160A JP6931091B2 (ja) 2017-05-31 2018-05-25 スピンコーティング装置及び方法
PCT/CN2018/088498 WO2018219232A1 (zh) 2017-05-31 2018-05-25 旋转涂胶装置和方法
KR1020197038430A KR102333626B1 (ko) 2017-05-31 2018-05-25 스핀 코팅 장치 및 방법
TW107118814A TWI655510B (zh) 2017-05-31 2018-05-31 旋轉塗膠裝置和方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710399778.8A CN108987298B (zh) 2017-05-31 2017-05-31 旋转涂胶装置和方法

Publications (2)

Publication Number Publication Date
CN108987298A true CN108987298A (zh) 2018-12-11
CN108987298B CN108987298B (zh) 2020-10-16

Family

ID=64454395

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710399778.8A Active CN108987298B (zh) 2017-05-31 2017-05-31 旋转涂胶装置和方法

Country Status (6)

Country Link
US (1) US11469121B2 (zh)
JP (1) JP6931091B2 (zh)
KR (1) KR102333626B1 (zh)
CN (1) CN108987298B (zh)
TW (1) TWI655510B (zh)
WO (1) WO2018219232A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114643180B (zh) * 2022-02-28 2023-04-07 长电集成电路(绍兴)有限公司 一种光刻胶固化装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6269548B1 (en) * 1997-06-27 2001-08-07 Ebara Corporation Spin processing apparatus
CN101681867A (zh) * 2007-06-05 2010-03-24 东京毅力科创株式会社 处理装置
CN101901776A (zh) * 2008-11-26 2010-12-01 细美事有限公司 旋转头、用于处理基片的设备以及用于处理基片的方法
CN104576495A (zh) * 2015-01-08 2015-04-29 北京七星华创电子股份有限公司 一种晶片夹持装置
CN105436056A (zh) * 2014-09-29 2016-03-30 盛美半导体设备(上海)有限公司 半导体晶片的旋转涂胶方法
CN106024692A (zh) * 2015-03-30 2016-10-12 芝浦机械电子株式会社 自旋处理装置
CN106030987A (zh) * 2013-11-25 2016-10-12 株式会社M&G日本 磁力旋转装置和采用它的带有磁力辅助的电动机
CN106168526A (zh) * 2016-08-15 2016-11-30 上海交通大学 一种转子系统在线动平衡系统及方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5916368A (en) * 1997-02-27 1999-06-29 The Fairchild Corporation Method and apparatus for temperature controlled spin-coating systems
JPH11354617A (ja) 1998-06-10 1999-12-24 Sumiere Sez Kk 基板処理装置および基板処理方法
JP2000208591A (ja) 1999-01-08 2000-07-28 Sony Corp 回転式基板処理装置
JP4075527B2 (ja) * 2002-08-28 2008-04-16 日本電気株式会社 レジスト塗布方法およびレジスト塗布装置
EP1678747A1 (en) 2003-10-31 2006-07-12 Ebara Corporation A processing liquid coating apparatus and a processing liquid coating method
JP2006283894A (ja) 2005-04-01 2006-10-19 Sony Corp 自動平衡装置、回転装置及びディスク駆動装置
KR100675018B1 (ko) 2005-06-22 2007-01-29 도시바삼성스토리지테크놀러지코리아 주식회사 디스크 클램핑 장치
JP5013400B2 (ja) 2006-09-29 2012-08-29 国立大学法人東北大学 塗布膜コーティング装置
JP5012651B2 (ja) * 2008-05-14 2012-08-29 東京エレクトロン株式会社 塗布装置、塗布方法、塗布、現像装置及び記憶媒体
US9385020B2 (en) 2011-12-19 2016-07-05 SCREEN Holdings Co., Ltd. Substrate holding and rotating device, substrate treatment apparatus including the device, and substrate treatment method
US10571433B2 (en) * 2016-11-04 2020-02-25 Sonix, Inc. Adjustable fixture for scanning acoustic microscopy

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6269548B1 (en) * 1997-06-27 2001-08-07 Ebara Corporation Spin processing apparatus
CN101681867A (zh) * 2007-06-05 2010-03-24 东京毅力科创株式会社 处理装置
CN101901776A (zh) * 2008-11-26 2010-12-01 细美事有限公司 旋转头、用于处理基片的设备以及用于处理基片的方法
CN106030987A (zh) * 2013-11-25 2016-10-12 株式会社M&G日本 磁力旋转装置和采用它的带有磁力辅助的电动机
CN105436056A (zh) * 2014-09-29 2016-03-30 盛美半导体设备(上海)有限公司 半导体晶片的旋转涂胶方法
CN104576495A (zh) * 2015-01-08 2015-04-29 北京七星华创电子股份有限公司 一种晶片夹持装置
CN106024692A (zh) * 2015-03-30 2016-10-12 芝浦机械电子株式会社 自旋处理装置
CN106168526A (zh) * 2016-08-15 2016-11-30 上海交通大学 一种转子系统在线动平衡系统及方法

Also Published As

Publication number Publication date
US11469121B2 (en) 2022-10-11
KR102333626B1 (ko) 2021-12-01
CN108987298B (zh) 2020-10-16
WO2018219232A1 (zh) 2018-12-06
KR20200011493A (ko) 2020-02-03
JP2020522889A (ja) 2020-07-30
TW201903530A (zh) 2019-01-16
US20200350182A1 (en) 2020-11-05
JP6931091B2 (ja) 2021-09-01
TWI655510B (zh) 2019-04-01

Similar Documents

Publication Publication Date Title
US20070284956A1 (en) Assembly for generating energy by magnetic polar repulsion
CN1171605A (zh) 旋转稳定磁悬浮体的电磁驱动方法与装置
CN101282070A (zh) 一种三自由度Halbach阵列永磁球形同步电动机
CN107422472A (zh) 微机械的构件和同时围绕两个彼此倾斜的转动轴线调节能够调节的部件的方法
CN106235796A (zh) 一种磁悬浮展示装置
CN105762099B (zh) 一种芯片供送机构及粘片机
TWI676338B (zh) 節能發電裝置
CN108987298A (zh) 旋转涂胶装置和方法
CN103047283B (zh) 一种大气隙五自由度微型磁轴承及工作方法
CN209692652U (zh) 可控制旋转的磁悬浮装置
CN204935271U (zh) 一种磁流变抛光设备的磁场发生装置
JP2020182285A (ja) 発電装置
CN105107704B (zh) 一种无接触式永磁振动装置
JP4644811B2 (ja) 物体面移動装置及び該壁面移動装置に用いられる吸着移動ユニット
CN204935273U (zh) 磁流变抛光设备的磁场发生装置
CN105789101A (zh) 一种芯片供送机构及粘片机
CN209233689U (zh) 一种磁通量变换式发电机
TWI652883B (zh) Magnetic power generator
TWM599501U (zh) 防震磁浮節能式發電裝置
CN104999344A (zh) 一种磁流变抛光设备的磁场发生装置
CN206481143U (zh) 一种立式磁性电机
TWI776753B (zh) 垂直式磁能發電機
CN215498766U (zh) 上拉式可控旋转的悬浮装置和磁悬浮机构
JP2020162302A (ja) 発電装置
CN209692650U (zh) 可控制旋转的磁吸式悬浮装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant