JP2020515019A5 - - Google Patents

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Publication number
JP2020515019A5
JP2020515019A5 JP2019554476A JP2019554476A JP2020515019A5 JP 2020515019 A5 JP2020515019 A5 JP 2020515019A5 JP 2019554476 A JP2019554476 A JP 2019554476A JP 2019554476 A JP2019554476 A JP 2019554476A JP 2020515019 A5 JP2020515019 A5 JP 2020515019A5
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JP
Japan
Prior art keywords
cap layer
protective cap
silicon emitter
less
diameter
Prior art date
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Application number
JP2019554476A
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English (en)
Japanese (ja)
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JP6860691B2 (ja
JP2020515019A (ja
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Priority claimed from US15/588,006 external-priority patent/US10141155B2/en
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Publication of JP2020515019A publication Critical patent/JP2020515019A/ja
Publication of JP2020515019A5 publication Critical patent/JP2020515019A5/ja
Application granted granted Critical
Publication of JP6860691B2 publication Critical patent/JP6860691B2/ja
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JP2019554476A 2016-12-20 2017-12-18 ルテニウム被覆を有する電子ビーム放出器 Active JP6860691B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662436925P 2016-12-20 2016-12-20
US62/436,925 2016-12-20
US15/588,006 2017-05-05
US15/588,006 US10141155B2 (en) 2016-12-20 2017-05-05 Electron beam emitters with ruthenium coating
PCT/US2017/066969 WO2018118757A1 (en) 2016-12-20 2017-12-18 Electron beam emitters with ruthenium coating

Publications (3)

Publication Number Publication Date
JP2020515019A JP2020515019A (ja) 2020-05-21
JP2020515019A5 true JP2020515019A5 (enExample) 2021-02-04
JP6860691B2 JP6860691B2 (ja) 2021-04-21

Family

ID=62562596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019554476A Active JP6860691B2 (ja) 2016-12-20 2017-12-18 ルテニウム被覆を有する電子ビーム放出器

Country Status (7)

Country Link
US (1) US10141155B2 (enExample)
JP (1) JP6860691B2 (enExample)
KR (1) KR102301555B1 (enExample)
CN (1) CN110291609B (enExample)
IL (1) IL267375B (enExample)
TW (1) TWI731202B (enExample)
WO (1) WO2018118757A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10607806B2 (en) 2017-10-10 2020-03-31 Kla-Tencor Corporation Silicon electron emitter designs
US10395884B2 (en) 2017-10-10 2019-08-27 Kla-Tencor Corporation Ruthenium encapsulated photocathode electron emitter
US10714294B2 (en) 2018-05-25 2020-07-14 Kla-Tencor Corporation Metal protective layer for electron emitters with a diffusion barrier
US10714295B2 (en) 2018-09-18 2020-07-14 Kla-Tencor Corporation Metal encapsulated photocathode electron emitter
US11495428B2 (en) * 2019-02-17 2022-11-08 Kla Corporation Plasmonic photocathode emitters at ultraviolet and visible wavelengths
US11217416B2 (en) * 2019-09-27 2022-01-04 Kla Corporation Plasmonic photocathode emitters
US11719652B2 (en) * 2020-02-04 2023-08-08 Kla Corporation Semiconductor metrology and inspection based on an x-ray source with an electron emitter array
US11335529B2 (en) * 2020-06-19 2022-05-17 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Thermally enhanced compound field emitter
US11699564B2 (en) * 2020-10-23 2023-07-11 Nuflare Technology, Inc. Schottky thermal field emitter with integrated beam splitter

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5363021A (en) 1993-07-12 1994-11-08 Cornell Research Foundation, Inc. Massively parallel array cathode
EP0637050B1 (en) * 1993-07-16 1999-12-22 Matsushita Electric Industrial Co., Ltd. A method of fabricating a field emitter
JP3239038B2 (ja) * 1995-04-03 2001-12-17 シャープ株式会社 電界放出型電子源の製造方法
PL324090A1 (en) * 1995-06-09 1998-05-11 Toshiba Kk Impregnated-type cathode asembly, cathode substrate used in that assembly, electron gun incorporating that cathode assembly and electron and electron valve incorporating that cathode assembly
JP3627836B2 (ja) * 1997-06-20 2005-03-09 ソニー株式会社 冷陰極の製造方法
JP3084272B2 (ja) * 1998-12-22 2000-09-04 松下電工株式会社 電界放射型電子源
US6911768B2 (en) * 2001-04-30 2005-06-28 Hewlett-Packard Development Company, L.P. Tunneling emitter with nanohole openings
JP2003288834A (ja) * 2002-03-27 2003-10-10 National Institute Of Advanced Industrial & Technology 電界放出型冷陰極
US7279686B2 (en) 2003-07-08 2007-10-09 Biomed Solutions, Llc Integrated sub-nanometer-scale electron beam systems
US7074719B2 (en) * 2003-11-28 2006-07-11 International Business Machines Corporation ALD deposition of ruthenium
US7465210B2 (en) 2004-02-25 2008-12-16 The Regents Of The University Of California Method of fabricating carbide and nitride nano electron emitters
US7735147B2 (en) 2005-10-13 2010-06-08 The Regents Of The University Of California Probe system comprising an electric-field-aligned probe tip and method for fabricating the same
KR101159074B1 (ko) * 2006-01-14 2012-06-25 삼성전자주식회사 도전성 탄소나노튜브 팁, 이를 구비한 스캐닝 프로브마이크로스코프의 탐침 및 상기 도전성 탄소나노튜브 팁의제조 방법
CN101105488B (zh) * 2006-07-14 2011-01-26 鸿富锦精密工业(深圳)有限公司 逸出功的测量方法
GB0722120D0 (en) * 2007-11-10 2007-12-19 Quantum Filament Technologies Improved field emission backplate
WO2012114521A1 (ja) 2011-02-25 2012-08-30 株式会社Param 電子銃および電子ビーム装置
CN103367134B (zh) * 2013-08-08 2015-11-11 电子科技大学 一种基于金属钌修饰的多孔硅表面金属电极制备方法
KR101674972B1 (ko) * 2013-12-26 2016-11-10 한국과학기술원 나노 스케일 패터닝 방법 및 이로부터 제조된 전자기기용 집적소자
US9984846B2 (en) 2016-06-30 2018-05-29 Kla-Tencor Corporation High brightness boron-containing electron beam emitters for use in a vacuum environment

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