JP2020509942A5 - - Google Patents
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- JP2020509942A5 JP2020509942A5 JP2019543246A JP2019543246A JP2020509942A5 JP 2020509942 A5 JP2020509942 A5 JP 2020509942A5 JP 2019543246 A JP2019543246 A JP 2019543246A JP 2019543246 A JP2019543246 A JP 2019543246A JP 2020509942 A5 JP2020509942 A5 JP 2020509942A5
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- 230000001070 adhesive Effects 0.000 claims 6
- 239000000853 adhesive Substances 0.000 claims 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
Claims (28)
第１の導電性特徴部及び第１の非導電性特徴部を含む第１の界面特徴部を有する第１の素子と、
第２の導電性特徴部及び第２の非導電性特徴部を含む第２の界面特徴部を有する第２の素子であって、前記第１の界面特徴部の前記第１の導電性特徴部が介在する接着剤を用いずに前記第２の界面特徴部の前記第２の導電性特徴部に直接接合されると共に、前記第１の界面特徴部の前記第１の非導電性特徴部が介在する接着剤を用いずに前記第２の界面特徴部の前記第２の非導電性特徴部に直接接合されて、界面構造体を画定する、前記第２の素子と、
前記第２の素子の中又は上に配設された導電トレースと、
前記第１の素子の上面にあり、前記導電トレースと電気通信するボンドパッドと、
前記第１の素子又は前記第２の素子に結合された、若しくは前記第１の素子又は前記第２の素子と共に形成された集積デバイスと、
を備え、
前記第１の導電性特徴部と前記第２の導電性特徴部との間の接合界面が前記接合構造物の内部領域を実質的に包囲する、接合構造物。 It is a joint structure
A first element having a first interface feature including a first conductive feature and a first non-conductive feature,
A second element having a second interface feature including a second conductive feature and a second non-conductive feature, the first conductive feature of the first interface feature. Is directly bonded to the second conductive feature portion of the second interface feature portion without using an adhesive intervening in the first interface feature portion, and the first non-conductive feature portion of the first interface feature portion is formed. The second element, which is directly bonded to the second non-conductive feature portion of the second interface feature portion without using an intervening adhesive to define the interface structure, and the second element.
Conductive traces arranged in or on the second element,
A bond pad located on the upper surface of the first element and communicating with the conductive trace,
With an integrated device coupled to or formed with the first element or the second element, or with the first element or the second element.
With
A bonded structure in which a bonding interface between the first conductive feature and the second conductive feature substantially surrounds an internal region of the bonded structure.
第１の導電性特徴部及び第１の非導電性特徴部を含む第１の界面特徴部を有する第１の素子と、
第２の導電性特徴部及び第２の非導電性特徴部を含む第２の界面特徴部を有する第２の素子であって、前記第１の界面特徴部の前記第１の導電性特徴部が介在する接着剤を用いずに前記第２の界面特徴部の前記第２の導電性特徴部に直接接合されると共に、前記第１の界面特徴部の前記第１の非導電性特徴部が介在する接着剤を用いずに前記第２の界面特徴部の前記第２の非導電性特徴部に直接接合されて、界面構造体を画定する、前記第２の素子と、
前記第１の素子の上面にあるボンドパッドと、
前記第１の素子又は前記第２の素子に結合された、若しくは前記第１の素子又は前記第２の素子と共に形成された集積デバイスと、
前記ボンドパッドから前記第１の素子を通って延び、前記集積デバイスに電気的に接続する電気的相互接続部と、
を備え、
前記第１の導電性特徴部と前記第２の導電性特徴部との間の接合界面が前記接合構造物の内部領域を実質的に包囲する、接合構造物。 It is a joint structure
A first element having a first interface feature including a first conductive feature and a first non-conductive feature,
A second element having a second interface feature including a second conductive feature and a second non-conductive feature, the first conductive feature of the first interface feature. Is directly bonded to the second conductive feature portion of the second interface feature portion without using an adhesive intervening in the first interface feature portion, and the first non-conductive feature portion of the first interface feature portion is formed. The second element, which is directly bonded to the second non-conductive feature portion of the second interface feature portion without using an intervening adhesive to define the interface structure, and the second element.
The bond pad on the upper surface of the first element and
With an integrated device coupled to or formed with the first element or the second element, or with the first element or the second element.
An electrical interconnect that extends from the bond pad through the first element and electrically connects to the integrated device.
With
A bonded structure in which a bonding interface between the first conductive feature and the second conductive feature substantially surrounds an internal region of the bonded structure.
第１の導電性特徴部及び第１の非導電性特徴部を含む第１の界面特徴部を有する第１の素子、及び、第２の導電性特徴部及び第２の非導電性特徴部を含む第２の界面特徴部を有する第２の素子を提供することと、
前記第１の界面特徴部の前記第１の導電性特徴部と前記第２の界面特徴部の前記第２の導電性特徴部とを、介在する接着剤を用いずに直接接合することと、
前記第１の界面特徴部の前記第１の非導電性特徴部と前記第２の界面特徴部の前記第２の非導電性特徴部とを、介在する接着剤を用いずに直接接合することと、
を含み、
導電トレースが前記第２の素子の中又は上に配設され、
ボンドパッドが、前記第１の素子の上面に配設され、前記導電トレースと電気通信し、集積デバイスが、前記第１の素子又は前記第２の素子に結合される、若しくは前記第１の素子又は前記第２の素子と共に形成され、前記第１の導電性特徴部と前記第２の導電性特徴部との間の接合界面が、前記接合構造物の内部領域を実質的に包囲する、方法。 A method of forming a bonded structure
A first element having a first interface feature including a first conductive feature and a first non-conductive feature, and a second conductive feature and a second non-conductive feature. To provide a second element having a second interface feature including the present.
Directly joining the first conductive feature portion of the first interface feature portion and the second conductive feature portion of the second interface feature portion without using an intervening adhesive.
Directly joining the first non-conductive feature portion of the first interface feature portion and the second non-conductive feature portion of the second interface feature portion without using an intervening adhesive. When,
Including
Conductive traces are disposed in or on the second element.
A bond pad is disposed on the upper surface of the first element to telecommunications with the conductive trace, and the integrated device is coupled to or coupled to the first element or the second element, or the first element. Alternatively, a method in which a bonding interface formed together with the second element and between the first conductive feature and the second conductive feature substantially surrounds an internal region of the bonded structure. ..
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762457116P | 2017-02-09 | 2017-02-09 | |
| US62/457,116 | 2017-02-09 | ||
| US201762458441P | 2017-02-13 | 2017-02-13 | |
| US62/458,441 | 2017-02-13 | ||
| PCT/US2017/067742 WO2018147940A1 (en) | 2017-02-09 | 2017-12-20 | Bonded structures |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020509942A JP2020509942A (en) | 2020-04-02 |
| JP2020509942A5 true JP2020509942A5 (en) | 2020-12-10 |
| JP7030825B2 JP7030825B2 (en) | 2022-03-07 |
Family
ID=63037353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019543246A Active JP7030825B2 (en) | 2017-02-09 | 2017-12-20 | Joined structure |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US10522499B2 (en) |
| EP (1) | EP3580166A4 (en) |
| JP (1) | JP7030825B2 (en) |
| TW (1) | TWI738947B (en) |
| WO (1) | WO2018147940A1 (en) |
Cited By (1)
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| JP7388119B2 (en) | 2019-10-17 | 2023-11-29 | 日本電気硝子株式会社 | Optical window material, method for manufacturing optical window material, optical member, and method for manufacturing optical member |
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