JP2020506535A - 直視型ディスプレイのための一体型反射体を備える発光ダイオード、および、その製造方法 - Google Patents
直視型ディスプレイのための一体型反射体を備える発光ダイオード、および、その製造方法 Download PDFInfo
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- JP2020506535A JP2020506535A JP2019537128A JP2019537128A JP2020506535A JP 2020506535 A JP2020506535 A JP 2020506535A JP 2019537128 A JP2019537128 A JP 2019537128A JP 2019537128 A JP2019537128 A JP 2019537128A JP 2020506535 A JP2020506535 A JP 2020506535A
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Abstract
Description
Claims (26)
- ドープされた化合物半導体層を含む基板と、
前記ドープされた化合物半導体層の上面から垂直に延在するナノワイヤのアレイであって、前記アレイ内の各ナノワイヤが第1の導電型のドーピングを有するナノワイヤコアおよび活性発光層を含む活性シェルを含むナノワイヤのアレイと、
前記ナノワイヤのアレイ内の各ナノワイヤの側壁に接触する第2の導電型の半導体材料層と、
前記ナノワイヤのアレイの上にある横方向に延在する部分および前記ナノワイヤのアレイを横方向に取り囲む側壁部分を含む反射層と、
はんだ材料を含み前記反射層の上にある導電性ボンディング構造と、を含むことを特徴とする発光デバイス。 - 前記第2の導電型の半導体材料層の上にあり、前記ナノワイヤのアレイを横方向に取り囲む誘電体材料層をさらに含み、
前記反射層は、導電性反射層であり、
前記反射層の前記横方向に延在する部分は、前記第2の導電型の半導体材料層および前記導電性ボンディング構造に電気的に接続され、
前記反射層の前記横方向に延在する部分の周辺部分は、前記誘電体材料層の第1の部分の下にあり、
前記反射層の前記側壁部分は、前記誘電体材料層の前記第1の部分および第2の部分の上にあり、
前記誘電体材料層は、前記反射層の前記側壁部分を前記反射層の前記横方向に延在する部分から分離し、
前記反射層の前記側壁部分は、前記反射層の横方向に延在する部分と電気的または物理的に接触しないことを特徴とする請求項1に記載の発光デバイス。 - 前記反射層と前記導電性ボンディング構造との間に配置されるバリア層と、
前記第2の導電型の半導体材料層の上にあり、前記ナノワイヤのアレイを横方向に取り囲み、前記反射層の下にある誘電体材料層であって、前記反射層が導電性反射層であり、前記反射層が、前記第2の導電型の半導体材料層と、前記バリア層を介して前記導電性ボンディング構造と、に電気的に接続されている誘電体材料層と、をさらに含むことを特徴とする請求項1に記載の発光デバイス。 - 前記反射層の側壁が、前記誘電体材料層の側壁部分によって前記ナノワイヤのアレイから横方向に間隔を置いて配置され、
前記誘電体材料層が、前記ナノワイヤのアレイを含むメサ構造の領域の外側に配置され、前記誘電体材料層の前記側壁部分に隣接する水平部分を含み、
前記反射層が、前記誘電体材料層の前記側壁部分に隣接し、前記誘電体材料層の前記水平部分の上にある水平周辺領域を含むことを特徴とする請求項3に記載の発光デバイス。 - 前記第2の導電型の半導体材料層の前記水平方向に延在する部分の上に配置される透明導電性酸化物層をさらに含むことを特徴とする請求項3に記載の発光デバイス。
- 前記透明導電性酸化物層が、前記第2の導電型の半導体材料層の上部周辺から内側に横方向に窪み、
前記第2の導電型の半導体材料層の前記水平方向に延在する部分のエッジ部分が、前記透明導電性酸化物層の下に露出され、
前記誘電体材料層が、前記第2の導電型の半導体材料層の前記水平方向に延在する部分の前記露出したエッジ部分と接触することを特徴とする請求項5に記載の発光デバイス。 - 前記反射層の下向きに突出した部分が、前記誘電体材料層の開口部を通って延在し、前記透明導電性酸化物層に接触することを特徴とする請求項5に記載の発光デバイス。
- 前記反射層が絶縁反射層であり、前記第2の導電型の半導体材料層の上にあり、前記ナノワイヤのアレイを横方向に取り囲むことを特徴とする請求項1に記載の発光デバイス。
- 前記第2の導電型の半導体材料層の上面に配置され、前記第2の導電型の半導体材料層の上部周辺から内側に横方向に窪んだ金属電極をさらに含み、前記絶縁反射層が、前記金属電極の上を通る開口部を含み、前記導電性ボンディング構造が、前記絶縁反射層の前記開口部を通って延在する少なくとも1つの導電材料によって前記第2の導電型の半導体材料層に電気的に接続されることを特徴とする請求項8に記載の発光デバイス。
- 前記絶縁反射層の側壁が、前記ナノワイヤのアレイの側壁と接触し、
前記金属電極が、本質的に銀からなることを特徴とする請求項8に記載の発光デバイス。 - 前記導電性ボンディング構造が、合金または層スタックとして貴金属およびスズを含むはんだ材料を含み、前記はんだ材料は、その厚さの5から20%を圧縮可能であることを特徴とする請求項1に記載の発光デバイス。
- 前記反射層および前記基板の側壁を横方向に取り囲み、接触する誘電体マトリクスと、
前記導電性ボンディング構造に電気的に接続されたバックプレーンと、
前記バックプレーンに電気的に接続され、前記誘電体マトリクスに埋め込まれた、異なる色の光を発する複数の追加の発光ダイオードと、
前記マトリクス層の上および前記化合物半導体材料層の上に配置され、前記複数の追加の発光ダイオードのコンタクトノードに電気的に接続された共通の透明導電性酸化物層と、
をさらに含むことを特徴とする請求項1に記載の発光デバイス。 - 前記基板の上面に配置されるパターニングされた誘電体マスク層をさらに含み、各ナノワイヤコアは、前記パターニングされた誘電体マスク層を通るそれぞれの開口部を通って垂直に延在し、前記パターニングされた誘電体マスク層は、前記ナノワイヤのアレイの領域の外側に配置される追加の開口部をさらに含み、前記誘電体材料層は、前記追加の開口部を通って前記ドープされた化合物半導体層に接触することを特徴とする請求項1に記載の発光デバイス。
- ドープされた化合物半導体層を含む基板と、
活性発光層と、
第2の導電型の半導体材料層と、
反射層と、
前記反射層の上にあり、はんだ材料を含む導電性ボンディング構造であって、前記はんだ材料が合金または層スタックとして貴金属およびスズを含み、前記はんだ材料が、その厚さの5から20%を圧縮可能である導電性ボンディング構造と、を含むことを特徴とする発光デバイス。 - 前記ドープされた化合物半導体層の上面から垂直に延在するナノワイヤのアレイをさらに含み、前記アレイ内の各ナノワイヤが、第1の導電型のドーピングを有するナノワイヤコアおよび前記活性発光層を含む活性シェルを含み、前記反射層が、前記ナノワイヤのアレイの上にある横方向に延在する部分を含むことを特徴とする請求項14に記載の発光デバイス。
- 前記はんだ材料に、5%から20%の範囲の体積分率のボイドが含まれていることを特徴とする請求項14に記載の発光デバイス。
- 前記はんだ材料が、スズ層と、Au、AgおよびCuの少なくとも1つを含む貴金属層と、の層スタックを含み、前記はんだ材料の原子の総数に対する前記貴金属層の原子の総数の割合が、0.5%から2.0%の範囲であることを特徴とする請求項14に記載の発光デバイス。
- 前記はんだ材料が、スズと、Au、AgおよびCuから選択される少なくとも1つの貴金属と、の合金を含み、前記合金の前記少なくとも1つの貴金属の全原子濃度が、0.5%から2.0%の範囲であることを特徴とする請求項14に記載の発光デバイス。
- ドープされた化合物半導体層を含む基板を覆うナノワイヤのアレイであって、前記アレイ内の各ナノワイヤは、前記ドープされた化合物半導体層の上面から垂直に延在し、前記アレイ内の各ナノワイヤは、第1の導電型のドーピングを有するナノワイヤコアと活性発光層を含む活性シェルとを含むナノワイヤのアレイを形成する工程と、
前記ナノワイヤの側壁に第2の導電型の半導体材料層を形成する工程と、
前記第2の導電型の半導体材料層を覆う反射層であって、前記ナノワイヤのアレイの上にある横方向に延在する部分と、前記ナノワイヤのアレイを横方向に取り囲む側壁部分と、を含む反射層を形成する工程と、
前記反射層を覆う導電性ボンディング構造を形成する工程と、を含むことを特徴とする発光デバイスの形成の方法。 - 前記第2の導電型の半導体材料層を覆う第1のリフトオフマスクを形成する工程と、
前記第1のリフトオフマスクを覆いおよび前記第2の導電型の半導体材料層を覆う第1の反射導電層を形成する工程と、
前記反射層の横方向に延在する部分を形成するために、前記第1のリフトオフマスクをリフトオフする工程と、
メサ構造を形成するために、前記反射層の前記横方向に延在する部分をエッチングマスクとして使用して、前記第2の導電型の半導体材料層、前記ナノワイヤのアレイ、および、前記ドープされた化合物半導体層をエッチングする工程と、
前記反射層の前記横方向に延在する部分を覆いおよび前記メサ構造の周りに誘電体材料層を形成する工程と、
前記反射層の前記横方向に延在する部分の中央部分を覆うように配置される前記誘電体材料層の中央部分を覆う第2のリフトオフマスクを形成する工程と、
前記第2のリフトオフマスクを覆いおよび前記誘電体材料層の露出した側壁部分を覆う第2の反射導電層を形成する工程と、
前記誘電体材料層の側壁部分を覆うように配置される前記反射層の前記側壁部分を形成するために、前記第2のリフトオフマスクをリフトオフする工程と、
前記誘電体材料層に前記反射層の前記横方向に延在する部分を露出させる開口部を形成するために、前記反射層の前記側壁部分をマスクとして使用し、前記誘電体材料層をエッチングする工程であって、前記導電性ボンディング構造が、前記反射層の前記横方向に延在する部分に電気的に接触するように前記開口部に形成される工程と、
をさらに含むことを特徴とする請求項19に記載の方法。 - 前記第2の導電型の半導体材料層を覆いおよび前記ナノワイヤのアレイの周りにある誘電体材料層を形成する工程をさらに含むことを特徴とする請求項19に記載の方法。
- 前記反射層は、導電性反射層であり、前記第2の導電型の半導体材料層に電気的に接続され、前記導電性ボンディング構造に電気的に接続され、
前記反射層は、前記誘電体材料層の前記側壁部分によって前記ナノワイヤのアレイから横方向に間隔を置いて配置され、
前記第2の導電型の半導体材料層を覆うように透明導電性酸化物層を形成する工程と、
前記透明導電性酸化物層を覆うようにフォトレジスト層を形成し、パターニングする工程と、
メサ構造を形成するために、前記パターニングされたフォトレジスト層の領域の外側から前記透明導電性酸化物層、前記第2の導電型の半導体材料層、および、前記ナノワイヤをエッチングする工程と、
前記パターニングされたフォトレジスト層を収縮させる工程と、
前記第2の導電型の半導体材料層の水平方向に延在する部分のエッジ部分を露出させるために、前記収縮したパターニングされたフォトレジスト層をマスクとして使用して、前記透明導電性酸化物層を選択的にエッチングする工程と、
をさらに含み、
前記誘電体材料層は、前記第2の導電型の半導体材料層の前記水平方向に延在する部分の露出した前記エッジ部分に接触することを特徴とする請求項21に記載の方法。 - 前記反射層が、絶縁反射層であり、前記第2の導電型の半導体材料層の上にあり、前記ナノワイヤのアレイを横方向に取り囲むことを特徴とする請求項21に記載の方法。
- 反射層の上にバリア層を形成する工程であって、前記導電性ボンディング構造が前記バリア層の上に形成される工程と、
前記基板の前記上面にパターニングされた誘電体マスク層を形成する工程と、
少なくとも1つの選択的エピタキシープロセスを使用して、前記パターニングされた誘電体マスク層の開口部を通して前記ナノワイヤおよび追加のナノワイヤのアレイを成長させる工程と、
前記ナノワイヤのアレイをマスキングしている間に、エッチングプロセスによって前記追加のナノワイヤを除去する工程と、をさらに含むことを特徴とする請求項21に記載の方法。 - 前記導電性ボンディング構造をバックプレーンに取り付ける工程と、
異なる色の光を発光する複数の追加の発光ダイオードを前記バックプレーンに取り付ける工程と、
レーザリフトオフを使用して、前記ドープされた化合物半導体層から支持基板を除去する工程と、
前記複数の追加の発光ダイオードの間に誘電体マトリクスを形成する工程と、
前記マトリクス層上および前記化合物半導体材料層上に、前記複数の追加の発光ダイオードのコンタクトノードに電気的に接続する共通の透明導電性酸化物層を形成する工程と、をさらに含むことを特徴とする請求項21に記載の方法。 - バックプレーンと、
各画素が赤色発光ダイオード、緑色発光ダイオードおよび青色発光ダイオードを含む前記バックプレーン上の画素のアレイと、
前記画素のアレイ内の前記赤色発光ダイオード、前記緑色発光ダイオードおよび前記青色発光ダイオードのそれぞれを横方向に取り囲む誘電体マトリクスと、
前記誘電体マトリクス上に配置され、各画素の前記赤色発光ダイオード、前記緑色発光ダイオードおよび前記青色発光ダイオードのコンタクトノードに電気的に接続された共通の透明導電酸化物層と、を含むことを特徴とする直視型ディスプレイデバイス。
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