JP2020505587A5 - - Google Patents
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- JP2020505587A5 JP2020505587A5 JP2019537247A JP2019537247A JP2020505587A5 JP 2020505587 A5 JP2020505587 A5 JP 2020505587A5 JP 2019537247 A JP2019537247 A JP 2019537247A JP 2019537247 A JP2019537247 A JP 2019537247A JP 2020505587 A5 JP2020505587 A5 JP 2020505587A5
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- infrared detector
- infrared
- lead wire
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762444847P | 2017-01-11 | 2017-01-11 | |
| US62/444,847 | 2017-01-11 | ||
| US201762511485P | 2017-05-26 | 2017-05-26 | |
| US62/511,485 | 2017-05-26 | ||
| PCT/EP2018/050101 WO2018130436A1 (en) | 2017-01-11 | 2018-01-03 | Integrated temperature sensor on lead selenide plate detector assembly |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020505587A JP2020505587A (ja) | 2020-02-20 |
| JP2020505587A5 true JP2020505587A5 (https=) | 2020-12-10 |
| JP6849811B2 JP6849811B2 (ja) | 2021-03-31 |
Family
ID=61054340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019537247A Active JP6849811B2 (ja) | 2017-01-11 | 2018-01-03 | セレン化鉛プレート検出器アセンブリ上に一体化された温度センサ |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10935430B2 (https=) |
| EP (1) | EP3568679B1 (https=) |
| JP (1) | JP6849811B2 (https=) |
| CN (1) | CN110178007B (https=) |
| WO (1) | WO2018130436A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113013283B (zh) * | 2019-12-20 | 2023-07-04 | 中国电子科技集团公司第四十八研究所 | PbSe光敏薄膜红外光电探测芯片及其制备方法、红外光电探测器 |
| CN113013282B (zh) * | 2019-12-20 | 2023-03-21 | 中国电子科技集团公司第四十八研究所 | 高响应PbSe/C60异质结光敏薄膜红外探测芯片及其制备方法、红外探测器 |
| CN112651498B (zh) * | 2020-09-22 | 2021-08-31 | 杭州杭越传感科技有限公司 | 一种自学习式电流传感器的温度稳定性提高方法和装置 |
| CN113140652A (zh) * | 2021-04-14 | 2021-07-20 | 中国科学院长春光学精密机械与物理研究所 | 一种探测芯片及其制备方法 |
| CN113206184B (zh) * | 2021-04-30 | 2023-04-07 | 河北大学 | 一种基于硒化铅薄膜的自驱动紫外光探测器 |
| WO2024201074A1 (en) * | 2023-03-31 | 2024-10-03 | Servomex Group Limited | Method and apparatus for use in optical gas absorption measurements |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4142198A (en) * | 1976-07-06 | 1979-02-27 | Hughes Aircraft Company | Monolithic extrinsic silicon infrared detectors with an improved charge collection structure |
| US5612536A (en) * | 1994-02-07 | 1997-03-18 | Matsushita Electric Industrial Co., Ltd. | Thin film sensor element and method of manufacturing the same |
| US5464982A (en) | 1994-03-21 | 1995-11-07 | Andros Incorporated | Respiratory gas analyzer |
| JPH09329499A (ja) * | 1996-06-12 | 1997-12-22 | Ishizuka Denshi Kk | 赤外線センサ及び赤外線検出器 |
| DE19942214A1 (de) * | 1999-09-03 | 2001-03-08 | Braun Gmbh | Beheizbarer Infrarot-Sensor und Infrarot-Thermometer mit einem derartigen Sensor |
| US6960769B2 (en) | 2002-10-03 | 2005-11-01 | Abb Inc. | Infrared measuring apparatus and method for on-line application in manufacturing processes |
| DE102004007316A1 (de) * | 2004-02-14 | 2005-08-25 | Robert Bosch Gmbh | Infrarot-Ortungsgerät mit Merhfachsensorik |
| JP2006105651A (ja) * | 2004-10-01 | 2006-04-20 | Ishizuka Electronics Corp | サーモパイル素子及びそれを用いた赤外線センサ |
| FR2879819B1 (fr) * | 2004-12-21 | 2007-02-23 | Ulis Soc Par Actions Simplifie | Composant de detection de rayonnements electromagnetiques notamment infrarouges |
| ES2318491T3 (es) | 2005-04-29 | 2009-05-01 | Ministerio De Defensa | Procedimiento para tratamiento de detectores de infrarrojo de seleniuro de plomo no refrigerados y espectralmente selectivos. |
| US8320728B2 (en) * | 2005-09-08 | 2012-11-27 | Georgia Tech Research Corporation | Film thin waveguides, methods of fabrication thereof, and detection systems |
| WO2010033142A1 (en) * | 2008-05-30 | 2010-03-25 | Regents Of The University Of Minnesota | Detection beyond the standard radiation noise limit using spectrally selective absorption |
| JP2010043930A (ja) * | 2008-08-12 | 2010-02-25 | Tateyama Kagaku Kogyo Kk | 非接触温度センサ |
| US20110175145A1 (en) * | 2008-09-25 | 2011-07-21 | Koji Tsuji | Infrared Sensor |
| JP5316959B2 (ja) * | 2010-03-17 | 2013-10-16 | 三菱マテリアル株式会社 | 薄膜サーミスタセンサ |
| JP5440343B2 (ja) * | 2010-04-14 | 2014-03-12 | 株式会社村田製作所 | 熱センサ |
| CN103458783B (zh) * | 2011-01-25 | 2015-11-25 | 皇家飞利浦有限公司 | 用于执行无加热器的基于硒化铅的二氧化碳测定和/或二氧化碳描记的系统和方法 |
| US9097578B2 (en) * | 2011-05-13 | 2015-08-04 | The Regents Of The University Of Michigan | Infrared sensing using pyro/piezo-electric resonators |
| DE102011056610A1 (de) * | 2011-12-19 | 2013-06-20 | Pyreos Ltd. | Infrarotlichtsensorchip mit hoher Messgenauigkeit und Verfahren zum Herstellen des Infrarotlichtsensorchips |
| EP3064913B1 (en) * | 2013-10-31 | 2021-07-14 | Hamamatsu Photonics K.K. | Light-detecting device |
| JP6248211B2 (ja) | 2014-04-14 | 2017-12-13 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | ガスセンサの温度補償 |
| CN104828771B (zh) * | 2015-03-16 | 2016-05-11 | 中国科学院电子学研究所 | 一种集成过滤结构的微型热导检测器及制备方法 |
-
2018
- 2018-01-03 JP JP2019537247A patent/JP6849811B2/ja active Active
- 2018-01-03 CN CN201880006611.3A patent/CN110178007B/zh active Active
- 2018-01-03 EP EP18701668.8A patent/EP3568679B1/en active Active
- 2018-01-03 US US16/475,768 patent/US10935430B2/en active Active
- 2018-01-03 WO PCT/EP2018/050101 patent/WO2018130436A1/en not_active Ceased
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