JP2020501358A5 - - Google Patents
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- JP2020501358A5 JP2020501358A5 JP2019528902A JP2019528902A JP2020501358A5 JP 2020501358 A5 JP2020501358 A5 JP 2020501358A5 JP 2019528902 A JP2019528902 A JP 2019528902A JP 2019528902 A JP2019528902 A JP 2019528902A JP 2020501358 A5 JP2020501358 A5 JP 2020501358A5
- Authority
- JP
- Japan
- Prior art keywords
- optical modes
- defect
- defects
- focal planes
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000007547 defect Effects 0.000 claims 58
- 230000003287 optical effect Effects 0.000 claims 48
- 239000004065 semiconductor Substances 0.000 claims 16
- 238000000034 method Methods 0.000 claims 15
- 238000004626 scanning electron microscopy Methods 0.000 claims 9
- 238000012549 training Methods 0.000 claims 9
- 238000005286 illumination Methods 0.000 claims 6
- 238000005259 measurement Methods 0.000 claims 6
- 238000001514 detection method Methods 0.000 claims 4
- 238000012795 verification Methods 0.000 claims 4
- 238000003384 imaging method Methods 0.000 claims 1
- 238000007689 inspection Methods 0.000 claims 1
- 238000010801 machine learning Methods 0.000 claims 1
- 238000012545 processing Methods 0.000 claims 1
- 230000004044 response Effects 0.000 claims 1
- 238000012360 testing method Methods 0.000 claims 1
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662427973P | 2016-11-30 | 2016-11-30 | |
| US201662427917P | 2016-11-30 | 2016-11-30 | |
| US62/427,973 | 2016-11-30 | ||
| US62/427,917 | 2016-11-30 | ||
| US15/826,019 US11047806B2 (en) | 2016-11-30 | 2017-11-29 | Defect discovery and recipe optimization for inspection of three-dimensional semiconductor structures |
| US15/826,019 | 2017-11-29 | ||
| PCT/US2017/064040 WO2018102596A2 (en) | 2016-11-30 | 2017-11-30 | Defect discovery and recipe optimization for inspection of three-dimensional semiconductor structures |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020501358A JP2020501358A (ja) | 2020-01-16 |
| JP2020501358A5 true JP2020501358A5 (enExample) | 2021-01-14 |
| JP7080884B2 JP7080884B2 (ja) | 2022-06-06 |
Family
ID=62190747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019528902A Active JP7080884B2 (ja) | 2016-11-30 | 2017-11-30 | 三次元半導体構造の検査用の欠陥発見およびレシピ最適化 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11047806B2 (enExample) |
| JP (1) | JP7080884B2 (enExample) |
| KR (1) | KR102438824B1 (enExample) |
| CN (1) | CN109964116B (enExample) |
| TW (1) | TWI774708B (enExample) |
| WO (1) | WO2018102596A2 (enExample) |
Families Citing this family (56)
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| KR20180128647A (ko) * | 2017-05-24 | 2018-12-04 | 삼성전자주식회사 | 광학 측정 방법 및 장치, 및 이를 이용한 반도체 장치의 제조 방법 |
| KR102037748B1 (ko) * | 2017-12-06 | 2019-11-29 | 에스케이실트론 주식회사 | 웨이퍼의 결함 영역을 평가하는 방법 |
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| US11054250B2 (en) * | 2018-04-11 | 2021-07-06 | International Business Machines Corporation | Multi-channel overlay metrology |
| DE102018114005A1 (de) * | 2018-06-12 | 2019-12-12 | Carl Zeiss Jena Gmbh | Materialprüfung von optischen Prüflingen |
| TWI787296B (zh) * | 2018-06-29 | 2022-12-21 | 由田新技股份有限公司 | 光學檢測方法、光學檢測裝置及光學檢測系統 |
| IL310722B2 (en) * | 2018-07-13 | 2025-07-01 | Asml Netherlands Bv | SEM image enhancement systems and methods |
| US10801968B2 (en) * | 2018-10-26 | 2020-10-13 | Kla-Tencor Corporation | Algorithm selector based on image frames |
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| US10545099B1 (en) * | 2018-11-07 | 2020-01-28 | Kla-Tencor Corporation | Ultra-high sensitivity hybrid inspection with full wafer coverage capability |
| IL263106B2 (en) * | 2018-11-19 | 2023-02-01 | Nova Ltd | Integrated measurement system |
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| CN109712136B (zh) * | 2018-12-29 | 2023-07-28 | 上海华力微电子有限公司 | 一种分析半导体晶圆的方法及装置 |
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| CN111665259A (zh) * | 2019-03-08 | 2020-09-15 | 深圳中科飞测科技有限公司 | 检测设备及检测方法 |
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| CN118777345A (zh) | 2019-03-28 | 2024-10-15 | 株式会社理学 | 透射式小角度散射装置 |
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| FR3105861B1 (fr) * | 2019-12-31 | 2022-09-02 | Vit | Système et procédé pour réduire les altérations dans des données de capteurs |
| JP7376369B2 (ja) * | 2020-01-15 | 2023-11-08 | 一般財団法人電力中央研究所 | 半導体素子の検査装置 |
| US11360030B2 (en) | 2020-02-04 | 2022-06-14 | Applied Materials Isreal Ltd | Selecting a coreset of potential defects for estimating expected defects of interest |
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| DE102020205540A1 (de) * | 2020-04-30 | 2021-11-04 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren und Vorrichtung zum Prüfen eines technischen Systems |
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| FR3111703B1 (fr) * | 2020-06-18 | 2022-05-20 | Skf Svenska Kullagerfab Ab | Procédé de détection d’un défaut critique pour élément roulant en matériau céramique |
| CN116057546A (zh) * | 2020-09-17 | 2023-05-02 | 株式会社日立高新技术 | 错误原因的推断装置和推断方法 |
| TWI759902B (zh) * | 2020-10-13 | 2022-04-01 | 豪勉科技股份有限公司 | 點測裝置 |
| US12019032B2 (en) * | 2020-12-07 | 2024-06-25 | Nanya Technology Corporation | Electronic system and method of specimen qualification |
| US12057336B2 (en) * | 2020-12-16 | 2024-08-06 | Samsung Electronics Co., Ltd. | Estimating heights of defects in a wafer by scaling a 3D model using an artificial neural network |
| CN113241310B (zh) * | 2021-05-28 | 2022-07-15 | 长江存储科技有限责任公司 | 晶圆缺陷的检测方法、检测装置、检测设备及可读存储介质 |
| US11624775B2 (en) * | 2021-06-07 | 2023-04-11 | Kla Corporation | Systems and methods for semiconductor defect-guided burn-in and system level tests |
| CN113781434B (zh) * | 2021-09-10 | 2025-02-18 | 深圳市高川自动化技术有限公司 | 一种缺陷检测方法、装置、智能终端及计算机可读存储介质 |
| US11961221B2 (en) * | 2021-10-07 | 2024-04-16 | Applied Materials Israel Ltd. | Defect examination on a semiconductor specimen |
| CN114040069B (zh) * | 2021-11-05 | 2023-03-24 | 东方晶源微电子科技(北京)有限公司 | 基于探测器通道的自动对焦方法和装置、设备及存储介质 |
| KR102794689B1 (ko) * | 2021-12-09 | 2025-04-15 | 주식회사 탑 엔지니어링 | 검사장치 및 이를 이용한 검사방법 |
| CN116413272A (zh) * | 2021-12-31 | 2023-07-11 | 上海微电子装备(集团)股份有限公司 | 基片检测系统及基片检测方法 |
| CN114613705B (zh) * | 2022-05-10 | 2022-09-06 | 深圳市众望丽华微电子材料有限公司 | 一种半导体元器件加工的控制方法、系统及介质 |
| US20230402328A1 (en) * | 2022-06-09 | 2023-12-14 | Onto Innovation Inc. | Optical metrology with nuisance feature mitigation |
| KR102547617B1 (ko) * | 2022-06-23 | 2023-06-26 | 큐알티 주식회사 | 가속환경 제공 반도체 소자 테스트 장치 및 이를 이용한 가속환경에서 반도체 소자 테스트 방법 |
| CN115222730B (zh) * | 2022-08-31 | 2025-10-31 | 武汉君赢融合信息技术有限公司 | 一种基于线扫光谱共聚焦相机的缺陷检测算法 |
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| CN117269735B (zh) * | 2023-11-21 | 2024-01-23 | 甘肃送变电工程有限公司 | 基于电磁微波手段的电力工器具智能电子芯片检测方法 |
| KR102758058B1 (ko) | 2024-03-12 | 2025-02-04 | 주식회사 인터엑스 | 공정 환경 요인을 고려한 생산 레시피 최적화 방법 |
| HUP2400260A1 (hu) * | 2024-05-08 | 2025-11-28 | Semilab Semiconductor Physics Laboratory Co Ltd | Roncsolásmentes eljárás és eszköz tömbi hibák detektálására és mélységi eloszlásának meghatározására félvezetõ szeletekben |
| CN119246690A (zh) * | 2024-09-20 | 2025-01-03 | 鸿星科技(集团)股份有限公司 | 一种超声成像的石英晶片快速筛选方法及系统 |
| CN119915735A (zh) * | 2025-03-28 | 2025-05-02 | 杭州光研科技有限公司 | 一种晶圆定位和缺陷检测方法、设备及介质 |
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| US5608526A (en) | 1995-01-19 | 1997-03-04 | Tencor Instruments | Focused beam spectroscopic ellipsometry method and system |
| US5859424A (en) | 1997-04-08 | 1999-01-12 | Kla-Tencor Corporation | Apodizing filter system useful for reducing spot size in optical measurements and other applications |
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| KR102084535B1 (ko) * | 2016-03-30 | 2020-03-05 | 가부시키가이샤 히다치 하이테크놀로지즈 | 결함 검사 장치, 결함 검사 방법 |
| CN106092891A (zh) * | 2016-08-11 | 2016-11-09 | 广东工业大学 | 一种共焦三维光谱显微成像方法及装置 |
| US10887580B2 (en) * | 2016-10-07 | 2021-01-05 | Kla-Tencor Corporation | Three-dimensional imaging for semiconductor wafer inspection |
-
2017
- 2017-11-29 US US15/826,019 patent/US11047806B2/en active Active
- 2017-11-30 WO PCT/US2017/064040 patent/WO2018102596A2/en not_active Ceased
- 2017-11-30 TW TW106141985A patent/TWI774708B/zh active
- 2017-11-30 KR KR1020197017165A patent/KR102438824B1/ko active Active
- 2017-11-30 CN CN201780071387.1A patent/CN109964116B/zh active Active
- 2017-11-30 JP JP2019528902A patent/JP7080884B2/ja active Active
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