TWI774708B - 用於半導體結構之檢驗之方法及系統 - Google Patents

用於半導體結構之檢驗之方法及系統 Download PDF

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TWI774708B
TWI774708B TW106141985A TW106141985A TWI774708B TW I774708 B TWI774708 B TW I774708B TW 106141985 A TW106141985 A TW 106141985A TW 106141985 A TW106141985 A TW 106141985A TW I774708 B TWI774708 B TW I774708B
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defect
optical modes
defects
wafer
optical
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TW106141985A
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TW201833539A (zh
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桑透許 巴哈特阿恰亞
迪發希 夏瑪
克里斯多夫 馬希爾
華波
菲利普 米梭爾
羅伯特 M 達納
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美商克萊譚克公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9505—Wafer internal defects, e.g. microcracks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G01N2021/0106—General arrangement of respective parts
    • G01N2021/0118—Apparatus with remote processing
    • G01N2021/0137—Apparatus with remote processing with PC or the like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8883—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges involving the calculation of gauges, generating models
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/646—Specific applications or type of materials flaws, defects
    • G01N2223/6462—Specific applications or type of materials flaws, defects microdefects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20084—Artificial neural networks [ANN]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
TW106141985A 2016-11-30 2017-11-30 用於半導體結構之檢驗之方法及系統 TWI774708B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201662427973P 2016-11-30 2016-11-30
US201662427917P 2016-11-30 2016-11-30
US62/427,973 2016-11-30
US62/427,917 2016-11-30
US15/826,019 US11047806B2 (en) 2016-11-30 2017-11-29 Defect discovery and recipe optimization for inspection of three-dimensional semiconductor structures
US15/826,019 2017-11-29

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TW201833539A TW201833539A (zh) 2018-09-16
TWI774708B true TWI774708B (zh) 2022-08-21

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US (1) US11047806B2 (enExample)
JP (1) JP7080884B2 (enExample)
KR (1) KR102438824B1 (enExample)
CN (1) CN109964116B (enExample)
TW (1) TWI774708B (enExample)
WO (1) WO2018102596A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI801973B (zh) * 2020-09-17 2023-05-11 日商日立全球先端科技股份有限公司 錯誤因素之推定裝置及推定方法

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180128647A (ko) * 2017-05-24 2018-12-04 삼성전자주식회사 광학 측정 방법 및 장치, 및 이를 이용한 반도체 장치의 제조 방법
KR102037748B1 (ko) * 2017-12-06 2019-11-29 에스케이실트론 주식회사 웨이퍼의 결함 영역을 평가하는 방법
US11087451B2 (en) * 2017-12-19 2021-08-10 Texas Instruments Incorporated Generating multi-focal defect maps using optical tools
US11054250B2 (en) * 2018-04-11 2021-07-06 International Business Machines Corporation Multi-channel overlay metrology
DE102018114005A1 (de) * 2018-06-12 2019-12-12 Carl Zeiss Jena Gmbh Materialprüfung von optischen Prüflingen
TWI787296B (zh) * 2018-06-29 2022-12-21 由田新技股份有限公司 光學檢測方法、光學檢測裝置及光學檢測系統
IL310722B2 (en) * 2018-07-13 2025-07-01 Asml Netherlands Bv SEM image enhancement systems and methods
US10801968B2 (en) * 2018-10-26 2020-10-13 Kla-Tencor Corporation Algorithm selector based on image frames
US11468553B2 (en) * 2018-11-02 2022-10-11 Kla Corporation System and method for determining type and size of defects on blank reticles
US10545099B1 (en) * 2018-11-07 2020-01-28 Kla-Tencor Corporation Ultra-high sensitivity hybrid inspection with full wafer coverage capability
IL263106B2 (en) * 2018-11-19 2023-02-01 Nova Ltd Integrated measurement system
JP7351849B2 (ja) * 2018-11-29 2023-09-27 富士フイルム株式会社 構造物の損傷原因推定システム、損傷原因推定方法、及び損傷原因推定サーバ
US11010885B2 (en) * 2018-12-18 2021-05-18 Kla Corporation Optical-mode selection for multi-mode semiconductor inspection
CN109712136B (zh) * 2018-12-29 2023-07-28 上海华力微电子有限公司 一种分析半导体晶圆的方法及装置
US11550309B2 (en) * 2019-01-08 2023-01-10 Kla Corporation Unsupervised defect segmentation
CN111665259A (zh) * 2019-03-08 2020-09-15 深圳中科飞测科技有限公司 检测设备及检测方法
US11047807B2 (en) * 2019-03-25 2021-06-29 Camtek Ltd. Defect detection
CN118777345A (zh) 2019-03-28 2024-10-15 株式会社理学 透射式小角度散射装置
US11600497B2 (en) * 2019-04-06 2023-03-07 Kla Corporation Using absolute Z-height values for synergy between tools
US12061733B2 (en) * 2019-06-28 2024-08-13 Microscopic Image Recognition Algorithms Inc. Optical acquisition system and probing method for object matching
US11676264B2 (en) * 2019-07-26 2023-06-13 Kla Corporation System and method for determining defects using physics-based image perturbations
US11055840B2 (en) * 2019-08-07 2021-07-06 Kla Corporation Semiconductor hot-spot and process-window discovery combining optical and electron-beam inspection
CN114245933B (zh) 2019-09-06 2025-11-18 株式会社日立高新技术 制程信息提示系统、制程错误推定系统
CN112649444A (zh) * 2019-10-10 2021-04-13 超能高新材料股份有限公司 半导体元件内部影像信息检测方法
WO2021083581A1 (en) 2019-10-31 2021-05-06 Carl Zeiss Smt Gmbh Fib-sem 3d tomography for measuring shape deviations of high aspect ratio structures
US11615993B2 (en) * 2019-11-21 2023-03-28 Kla Corporation Clustering sub-care areas based on noise characteristics
JP7422458B2 (ja) * 2019-12-05 2024-01-26 キヤノン株式会社 異物検査装置、異物検査方法、処理装置および物品製造方法
FR3105861B1 (fr) * 2019-12-31 2022-09-02 Vit Système et procédé pour réduire les altérations dans des données de capteurs
JP7376369B2 (ja) * 2020-01-15 2023-11-08 一般財団法人電力中央研究所 半導体素子の検査装置
US11360030B2 (en) 2020-02-04 2022-06-14 Applied Materials Isreal Ltd Selecting a coreset of potential defects for estimating expected defects of interest
US11513085B2 (en) * 2020-02-20 2022-11-29 Kla Corporation Measurement and control of wafer tilt for x-ray based metrology
DE102020205540A1 (de) * 2020-04-30 2021-11-04 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren und Vorrichtung zum Prüfen eines technischen Systems
DE102020205539A1 (de) * 2020-04-30 2021-11-04 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren und Vorrichtung zum Prüfen eines technischen Systems
FR3111703B1 (fr) * 2020-06-18 2022-05-20 Skf Svenska Kullagerfab Ab Procédé de détection d’un défaut critique pour élément roulant en matériau céramique
TWI759902B (zh) * 2020-10-13 2022-04-01 豪勉科技股份有限公司 點測裝置
US12019032B2 (en) * 2020-12-07 2024-06-25 Nanya Technology Corporation Electronic system and method of specimen qualification
US12057336B2 (en) * 2020-12-16 2024-08-06 Samsung Electronics Co., Ltd. Estimating heights of defects in a wafer by scaling a 3D model using an artificial neural network
CN113241310B (zh) * 2021-05-28 2022-07-15 长江存储科技有限责任公司 晶圆缺陷的检测方法、检测装置、检测设备及可读存储介质
US11624775B2 (en) * 2021-06-07 2023-04-11 Kla Corporation Systems and methods for semiconductor defect-guided burn-in and system level tests
CN113781434B (zh) * 2021-09-10 2025-02-18 深圳市高川自动化技术有限公司 一种缺陷检测方法、装置、智能终端及计算机可读存储介质
US11961221B2 (en) * 2021-10-07 2024-04-16 Applied Materials Israel Ltd. Defect examination on a semiconductor specimen
CN114040069B (zh) * 2021-11-05 2023-03-24 东方晶源微电子科技（北京）有限公司 基于探测器通道的自动对焦方法和装置、设备及存储介质
KR102794689B1 (ko) * 2021-12-09 2025-04-15 주식회사 탑 엔지니어링 검사장치 및 이를 이용한 검사방법
CN116413272A (zh) * 2021-12-31 2023-07-11 上海微电子装备（集团）股份有限公司 基片检测系统及基片检测方法
CN114613705B (zh) * 2022-05-10 2022-09-06 深圳市众望丽华微电子材料有限公司 一种半导体元器件加工的控制方法、系统及介质
US20230402328A1 (en) * 2022-06-09 2023-12-14 Onto Innovation Inc. Optical metrology with nuisance feature mitigation
KR102547617B1 (ko) * 2022-06-23 2023-06-26 큐알티 주식회사 가속환경 제공 반도체 소자 테스트 장치 및 이를 이용한 가속환경에서 반도체 소자 테스트 방법
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US12394655B2 (en) * 2022-11-23 2025-08-19 Applied Materials, Inc. Subsurface alignment metrology system for packaging applications
US20250142211A1 (en) * 2023-10-30 2025-05-01 Orbotech Ltd. Non-destructive multiple layers cross-section fib-like visualization
CN117269735B (zh) * 2023-11-21 2024-01-23 甘肃送变电工程有限公司 基于电磁微波手段的电力工器具智能电子芯片检测方法
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HUP2400260A1 (hu) * 2024-05-08 2025-11-28 Semilab Semiconductor Physics Laboratory Co Ltd Roncsolásmentes eljárás és eszköz tömbi hibák detektálására és mélységi eloszlásának meghatározására félvezetõ szeletekben
CN119246690A (zh) * 2024-09-20 2025-01-03 鸿星科技(集团)股份有限公司 一种超声成像的石英晶片快速筛选方法及系统
CN119915735A (zh) * 2025-03-28 2025-05-02 杭州光研科技有限公司 一种晶圆定位和缺陷检测方法、设备及介质

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140307052A1 (en) * 2013-04-10 2014-10-16 Samsung Electronics Co., Ltd. Apparatuses and methods for extracting defect depth information and methods of improving semiconductor device manufacturing processes using defect depth information
TW201448079A (zh) * 2013-03-12 2014-12-16 Kla Tencor Corp 偵測在晶圓上之缺陷
US20150233840A1 (en) * 2009-01-13 2015-08-20 Semiconductor Technologies & Instruments Pte Ltd System and method for inspecting a wafer
US20160025648A1 (en) * 2014-07-22 2016-01-28 Kla-Tencor Corporation Virtual Inspection Systems with Multiple Modes
US20160123894A1 (en) * 2014-10-31 2016-05-05 Kla-Tencor Corporation Measurement Systems Having Linked Field And Pupil Signal Detection

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6271916B1 (en) 1994-03-24 2001-08-07 Kla-Tencor Corporation Process and assembly for non-destructive surface inspections
US5608526A (en) 1995-01-19 1997-03-04 Tencor Instruments Focused beam spectroscopic ellipsometry method and system
US5859424A (en) 1997-04-08 1999-01-12 Kla-Tencor Corporation Apodizing filter system useful for reducing spot size in optical measurements and other applications
US6201601B1 (en) 1997-09-19 2001-03-13 Kla-Tencor Corporation Sample inspection system
US6208411B1 (en) 1998-09-28 2001-03-27 Kla-Tencor Corporation Massively parallel inspection and imaging system
US6429943B1 (en) 2000-03-29 2002-08-06 Therma-Wave, Inc. Critical dimension analysis with simultaneous multiple angle of incidence measurements
GB0107618D0 (en) * 2001-03-27 2001-05-16 Aoti Operating Co Inc Detection and classification of micro-defects in semi-conductors
US7130039B2 (en) 2002-04-18 2006-10-31 Kla-Tencor Technologies Corporation Simultaneous multi-spot inspection and imaging
US7359045B2 (en) * 2002-05-06 2008-04-15 Applied Materials, Israel, Ltd. High speed laser scanning inspection system
AU2003302049A1 (en) 2002-11-20 2004-06-15 Mehrdad Nikoohahad System and method for characterizing three-dimensional structures
CN1318839C (zh) * 2002-11-28 2007-05-30 威光机械工程股份有限公司 印刷电路板上瑕疵组件的自动光学检测方法
US6842021B1 (en) * 2003-11-07 2005-01-11 National Semiconductor Corporation System and method for detecting location of a defective electrical connection within an integrated circuit
US7295303B1 (en) 2004-03-25 2007-11-13 Kla-Tencor Technologies Corporation Methods and apparatus for inspecting a sample
JP2006079000A (ja) * 2004-09-13 2006-03-23 Olympus Corp 光走査型観察装置
US7142992B1 (en) * 2004-09-30 2006-11-28 Kla-Tencor Technologies Corp. Flexible hybrid defect classification for semiconductor manufacturing
US7478019B2 (en) 2005-01-26 2009-01-13 Kla-Tencor Corporation Multiple tool and structure analysis
US7570797B1 (en) * 2005-05-10 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for generating an inspection process for an inspection system
KR101565071B1 (ko) * 2005-11-18 2015-11-03 케이엘에이-텐코 코포레이션 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
US7570796B2 (en) * 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
JP4723362B2 (ja) * 2005-11-29 2011-07-13 株式会社日立ハイテクノロジーズ 光学式検査装置及びその方法
US7567351B2 (en) 2006-02-02 2009-07-28 Kla-Tencor Corporation High resolution monitoring of CD variations
JP2009014510A (ja) 2007-07-04 2009-01-22 Hitachi High-Technologies Corp 検査方法及び検査装置
US7715997B2 (en) * 2007-09-11 2010-05-11 Kla-Tencor Technologies Corporation Intelligent inspection based on test chip probe failure maps
JP2013122393A (ja) * 2011-12-09 2013-06-20 Toshiba Corp 欠陥検査装置および欠陥検査方法
DE102012009836A1 (de) * 2012-05-16 2013-11-21 Carl Zeiss Microscopy Gmbh Lichtmikroskop und Verfahren zur Bildaufnahme mit einem Lichtmikroskop
CN102788752B (zh) * 2012-08-08 2015-02-04 江苏大学 基于光谱技术的农作物内部信息无损检测装置及方法
US9189844B2 (en) * 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US9581430B2 (en) 2012-10-19 2017-02-28 Kla-Tencor Corporation Phase characterization of targets
US8948494B2 (en) * 2012-11-12 2015-02-03 Kla-Tencor Corp. Unbiased wafer defect samples
US8912495B2 (en) 2012-11-21 2014-12-16 Kla-Tencor Corp. Multi-spectral defect inspection for 3D wafers
US9075027B2 (en) 2012-11-21 2015-07-07 Kla-Tencor Corporation Apparatus and methods for detecting defects in vertical memory
US10769320B2 (en) 2012-12-18 2020-09-08 Kla-Tencor Corporation Integrated use of model-based metrology and a process model
US9291554B2 (en) 2013-02-05 2016-03-22 Kla-Tencor Corporation Method of electromagnetic modeling of finite structures and finite illumination for metrology and inspection
US9389349B2 (en) 2013-03-15 2016-07-12 Kla-Tencor Corporation System and method to determine depth for optical wafer inspection
US9696264B2 (en) 2013-04-03 2017-07-04 Kla-Tencor Corporation Apparatus and methods for determining defect depths in vertical stack memory
US9772297B2 (en) 2014-02-12 2017-09-26 Kla-Tencor Corporation Apparatus and methods for combined brightfield, darkfield, and photothermal inspection
US9518934B2 (en) * 2014-11-04 2016-12-13 Kla-Tencor Corp. Wafer defect discovery
US9599573B2 (en) * 2014-12-02 2017-03-21 Kla-Tencor Corporation Inspection systems and techniques with enhanced detection
US9816940B2 (en) 2015-01-21 2017-11-14 Kla-Tencor Corporation Wafer inspection with focus volumetric method
US9797846B2 (en) * 2015-04-17 2017-10-24 Nuflare Technology, Inc. Inspection method and template
KR102084535B1 (ko) * 2016-03-30 2020-03-05 가부시키가이샤 히다치 하이테크놀로지즈 결함 검사 장치, 결함 검사 방법
CN106092891A (zh) * 2016-08-11 2016-11-09 广东工业大学 一种共焦三维光谱显微成像方法及装置
US10887580B2 (en) * 2016-10-07 2021-01-05 Kla-Tencor Corporation Three-dimensional imaging for semiconductor wafer inspection

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150233840A1 (en) * 2009-01-13 2015-08-20 Semiconductor Technologies & Instruments Pte Ltd System and method for inspecting a wafer
TW201448079A (zh) * 2013-03-12 2014-12-16 Kla Tencor Corp 偵測在晶圓上之缺陷
US20140307052A1 (en) * 2013-04-10 2014-10-16 Samsung Electronics Co., Ltd. Apparatuses and methods for extracting defect depth information and methods of improving semiconductor device manufacturing processes using defect depth information
US20160025648A1 (en) * 2014-07-22 2016-01-28 Kla-Tencor Corporation Virtual Inspection Systems with Multiple Modes
US20160123894A1 (en) * 2014-10-31 2016-05-05 Kla-Tencor Corporation Measurement Systems Having Linked Field And Pupil Signal Detection

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI801973B (zh) * 2020-09-17 2023-05-11 日商日立全球先端科技股份有限公司 錯誤因素之推定裝置及推定方法
US12141173B2 (en) 2020-09-17 2024-11-12 Hitachi High-Tech Corporation Error factor estimation device and error factor estimation method

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