JP2017527780A5 - - Google Patents

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Publication number
JP2017527780A5
JP2017527780A5 JP2016575210A JP2016575210A JP2017527780A5 JP 2017527780 A5 JP2017527780 A5 JP 2017527780A5 JP 2016575210 A JP2016575210 A JP 2016575210A JP 2016575210 A JP2016575210 A JP 2016575210A JP 2017527780 A5 JP2017527780 A5 JP 2017527780A5
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JP
Japan
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different
aperture
collection
images
wafer
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JP2016575210A
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English (en)
Japanese (ja)
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JP6652511B2 (ja
JP2017527780A (ja
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Priority claimed from US14/749,564 external-priority patent/US9709510B2/en
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JP2016575210A 2014-06-26 2015-06-26 ウェハ検査中に集光アパーチャ内に位置付けられる光学要素の構成の決定 Active JP6652511B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201462017264P 2014-06-26 2014-06-26
US62/017,264 2014-06-26
US201562111402P 2015-02-03 2015-02-03
US62/111,402 2015-02-03
US14/749,564 2015-06-24
US14/749,564 US9709510B2 (en) 2014-06-26 2015-06-24 Determining a configuration for an optical element positioned in a collection aperture during wafer inspection
PCT/US2015/038115 WO2015200856A1 (en) 2014-06-26 2015-06-26 Determining a configuration for an optical element positioned in a collection aperture during wafer inspection

Publications (3)

Publication Number Publication Date
JP2017527780A JP2017527780A (ja) 2017-09-21
JP2017527780A5 true JP2017527780A5 (enExample) 2018-07-26
JP6652511B2 JP6652511B2 (ja) 2020-02-26

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JP2016575210A Active JP6652511B2 (ja) 2014-06-26 2015-06-26 ウェハ検査中に集光アパーチャ内に位置付けられる光学要素の構成の決定

Country Status (6)

Country Link
US (2) US9709510B2 (enExample)
JP (1) JP6652511B2 (enExample)
KR (1) KR102269512B1 (enExample)
CN (2) CN106415249B (enExample)
IL (1) IL248647B (enExample)
WO (1) WO2015200856A1 (enExample)

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CN109425618B (zh) * 2017-08-31 2021-12-28 深圳中科飞测科技股份有限公司 光学测量系统及方法
US10607119B2 (en) * 2017-09-06 2020-03-31 Kla-Tencor Corp. Unified neural network for defect detection and classification
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WO2020074250A1 (en) 2018-10-12 2020-04-16 Asml Netherlands B.V. Detection system for an alignment sensor
US10902582B2 (en) * 2019-01-17 2021-01-26 Applied Materials Israel, Ltd. Computerized system and method for obtaining information about a region of an object
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WO2020203592A1 (ja) * 2019-03-29 2020-10-08 国立大学法人大阪大学 光検出装置、光検出方法、光検出装置の設計方法、試料分類方法、及び、不良検出方法
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US10921261B2 (en) 2019-05-09 2021-02-16 Kla Corporation Strontium tetraborate as optical coating material
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US11255797B2 (en) 2019-07-09 2022-02-22 Kla Corporation Strontium tetraborate as optical glass material
WO2021091634A1 (en) 2019-11-04 2021-05-14 Tokyo Electron Limited System and method to calibrate a plurality of wafer inspection system (wis) modules
US11624607B2 (en) 2020-01-06 2023-04-11 Tokyo Electron Limited Hardware improvements and methods for the analysis of a spinning reflective substrates
JP7671558B2 (ja) 2020-03-10 2025-05-02 東京エレクトロン株式会社 トラックシステムに統合するための長波赤外線熱センサ
US11738363B2 (en) 2021-06-07 2023-08-29 Tokyo Electron Limited Bath systems and methods thereof
US12488452B2 (en) 2021-06-16 2025-12-02 Tokyo Electron Limited Wafer bath imaging
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US11899338B2 (en) 2021-12-11 2024-02-13 Kla Corporation Deep ultraviolet laser using strontium tetraborate for frequency conversion
WO2024056296A1 (en) * 2022-09-13 2024-03-21 Asml Netherlands B.V. Metrology method and associated metrology device
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US7041998B2 (en) 2003-03-24 2006-05-09 Photon Dynamics, Inc. Method and apparatus for high-throughput inspection of large flat patterned media using dynamically programmable optical spatial filtering
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