JP2017527780A5 - - Google Patents
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- JP2017527780A5 JP2017527780A5 JP2016575210A JP2016575210A JP2017527780A5 JP 2017527780 A5 JP2017527780 A5 JP 2017527780A5 JP 2016575210 A JP2016575210 A JP 2016575210A JP 2016575210 A JP2016575210 A JP 2016575210A JP 2017527780 A5 JP2017527780 A5 JP 2017527780A5
- Authority
- JP
- Japan
- Prior art keywords
- different
- aperture
- collection
- images
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462017264P | 2014-06-26 | 2014-06-26 | |
| US62/017,264 | 2014-06-26 | ||
| US201562111402P | 2015-02-03 | 2015-02-03 | |
| US62/111,402 | 2015-02-03 | ||
| US14/749,564 | 2015-06-24 | ||
| US14/749,564 US9709510B2 (en) | 2014-06-26 | 2015-06-24 | Determining a configuration for an optical element positioned in a collection aperture during wafer inspection |
| PCT/US2015/038115 WO2015200856A1 (en) | 2014-06-26 | 2015-06-26 | Determining a configuration for an optical element positioned in a collection aperture during wafer inspection |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017527780A JP2017527780A (ja) | 2017-09-21 |
| JP2017527780A5 true JP2017527780A5 (enExample) | 2018-07-26 |
| JP6652511B2 JP6652511B2 (ja) | 2020-02-26 |
Family
ID=54930191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016575210A Active JP6652511B2 (ja) | 2014-06-26 | 2015-06-26 | ウェハ検査中に集光アパーチャ内に位置付けられる光学要素の構成の決定 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9709510B2 (enExample) |
| JP (1) | JP6652511B2 (enExample) |
| KR (1) | KR102269512B1 (enExample) |
| CN (2) | CN108508028B (enExample) |
| IL (1) | IL248647B (enExample) |
| WO (1) | WO2015200856A1 (enExample) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10062156B2 (en) * | 2016-02-25 | 2018-08-28 | Kla-Tencor Corporation | Method and system for detecting defects on a substrate |
| KR102637273B1 (ko) * | 2016-11-23 | 2024-02-15 | 노바 엘티디. | 마이크로전자 디바이스 내의 패턴화된 구조물의 파라미터를 측정하기 위한 광학 시스템 및 방법 |
| US10429315B2 (en) * | 2017-07-18 | 2019-10-01 | Samsung Electronics Co., Ltd. | Imaging apparatus and imaging method |
| JP7115826B2 (ja) * | 2017-07-18 | 2022-08-09 | 三星電子株式会社 | 撮像装置および撮像方法 |
| CN109425619B (zh) * | 2017-08-31 | 2021-12-28 | 深圳中科飞测科技股份有限公司 | 光学测量系统及方法 |
| CN109425618B (zh) * | 2017-08-31 | 2021-12-28 | 深圳中科飞测科技股份有限公司 | 光学测量系统及方法 |
| US10607119B2 (en) * | 2017-09-06 | 2020-03-31 | Kla-Tencor Corp. | Unified neural network for defect detection and classification |
| KR102633672B1 (ko) * | 2017-11-15 | 2024-02-05 | 코닝 인코포레이티드 | 유리 시트들 상의 표면 결함들을 검출하기 위한 방법들 및 장치 |
| US11067389B2 (en) | 2018-03-13 | 2021-07-20 | Kla Corporation | Overlay metrology system and method |
| NL2023884A (en) | 2018-10-12 | 2020-05-07 | Asml Netherlands Bv | Detection system for an alignment sensor |
| US11815470B2 (en) | 2019-01-17 | 2023-11-14 | Applied Materials Israel, Ltd. | Multi-perspective wafer analysis |
| US10902582B2 (en) * | 2019-01-17 | 2021-01-26 | Applied Materials Israel, Ltd. | Computerized system and method for obtaining information about a region of an object |
| CN110006684A (zh) * | 2019-03-13 | 2019-07-12 | 广州金域医学检验中心有限公司 | 数字病理切片的生成系统和方法 |
| US11933735B2 (en) * | 2019-03-29 | 2024-03-19 | Osaka University | Optical detection device, optical detection method, method for designing optical detection device, sample classification method, and defect detection method |
| CN113795792B (zh) * | 2019-05-06 | 2024-12-06 | Asml荷兰有限公司 | 暗场显微镜 |
| US10921261B2 (en) | 2019-05-09 | 2021-02-16 | Kla Corporation | Strontium tetraborate as optical coating material |
| US11011366B2 (en) | 2019-06-06 | 2021-05-18 | Kla Corporation | Broadband ultraviolet illumination sources |
| US11255797B2 (en) | 2019-07-09 | 2022-02-22 | Kla Corporation | Strontium tetraborate as optical glass material |
| US11703459B2 (en) | 2019-11-04 | 2023-07-18 | Tokyo Electron Limited | System and method to calibrate a plurality of wafer inspection system (WIS) modules |
| US11168978B2 (en) | 2020-01-06 | 2021-11-09 | Tokyo Electron Limited | Hardware improvements and methods for the analysis of a spinning reflective substrates |
| KR102874193B1 (ko) | 2020-03-10 | 2025-10-20 | 도쿄엘렉트론가부시키가이샤 | 트랙 시스템 내로의 통합을 위한 장파 적외선 열 센서 |
| US11738363B2 (en) | 2021-06-07 | 2023-08-29 | Tokyo Electron Limited | Bath systems and methods thereof |
| US12488452B2 (en) | 2021-06-16 | 2025-12-02 | Tokyo Electron Limited | Wafer bath imaging |
| US12072606B2 (en) | 2021-07-30 | 2024-08-27 | Kla Corporation | Protective coating for nonlinear optical crystal |
| KR102695451B1 (ko) * | 2021-12-03 | 2024-08-23 | 참엔지니어링(주) | 하전입자를 이용한 시료 처리 장치 |
| US11899338B2 (en) | 2021-12-11 | 2024-02-13 | Kla Corporation | Deep ultraviolet laser using strontium tetraborate for frequency conversion |
| EP4339703A1 (en) * | 2022-09-13 | 2024-03-20 | ASML Netherlands B.V. | Metrology method and associated metrology device |
| KR20250068557A (ko) * | 2022-09-13 | 2025-05-16 | 에이에스엠엘 네델란즈 비.브이. | 계측 방법 및 연관된 계측 디바이스 |
| US20250383294A1 (en) * | 2024-06-18 | 2025-12-18 | Kla Corporation | Speckle noise reduction using pupil masks |
| WO2026087041A1 (en) * | 2024-10-23 | 2026-04-30 | Carl Zeiss Smt Gmbh | Apparatus and method for checking a component, and lithography system |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7957066B2 (en) * | 2003-02-21 | 2011-06-07 | Kla-Tencor Corporation | Split field inspection system using small catadioptric objectives |
| US7041998B2 (en) | 2003-03-24 | 2006-05-09 | Photon Dynamics, Inc. | Method and apparatus for high-throughput inspection of large flat patterned media using dynamically programmable optical spatial filtering |
| US20060012781A1 (en) | 2004-07-14 | 2006-01-19 | Negevtech Ltd. | Programmable spatial filter for wafer inspection |
| US20060285110A1 (en) * | 2005-02-25 | 2006-12-21 | Accent Optical Technologies, Inc. | Apparatus and method for enhanced critical dimension scatterometry |
| JP4625716B2 (ja) * | 2005-05-23 | 2011-02-02 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置及び欠陥検査方法 |
| US7345825B2 (en) * | 2005-06-30 | 2008-03-18 | Kla-Tencor Technologies Corporation | Beam delivery system for laser dark-field illumination in a catadioptric optical system |
| US7345754B1 (en) | 2005-09-16 | 2008-03-18 | Kla-Tencor Technologies Corp. | Fourier filters and wafer inspection systems |
| KR101422256B1 (ko) * | 2009-06-19 | 2014-07-22 | 케이엘에이-텐코어 코오포레이션 | 극자외선 마스크 블랭크들상의 결함들을 검출하기 위한 검사 시스템들 및 방법들 |
| KR20110055787A (ko) | 2009-11-20 | 2011-05-26 | 재단법인 서울테크노파크 | 레이저를 이용한 접합웨이퍼 검사장치 |
| WO2012062858A1 (en) * | 2010-11-12 | 2012-05-18 | Asml Netherlands B.V. | Metrology method and apparatus, lithographic system and device manufacturing method |
| NL2008197A (en) * | 2011-02-11 | 2012-08-14 | Asml Netherlands Bv | Inspection apparatus and method, lithographic apparatus, lithographic processing cell and device manufacturing method. |
| WO2012126684A1 (en) * | 2011-03-24 | 2012-09-27 | Asml Netherlands B.V. | Substrate and patterning device for use in metrology, metrology method and device manufacturing method |
| JP5898322B2 (ja) * | 2011-10-12 | 2016-04-06 | ベンタナ メディカル システムズ， インコーポレイテッド | 多焦点干渉計画像取得 |
| US8614790B2 (en) * | 2011-12-12 | 2013-12-24 | Applied Materials Israel, Ltd. | Optical system and method for inspection of patterned samples |
| KR102117133B1 (ko) * | 2012-03-07 | 2020-05-29 | 케이엘에이 코포레이션 | 조명 동공 구성을 선택하기 위한 웨이퍼 및 레티클 검사 시스템 및 방법 |
| KR101761735B1 (ko) * | 2012-03-27 | 2017-07-26 | 에이에스엠엘 네델란즈 비.브이. | 메트롤로지 방법 및 장치, 리소그래피 시스템 및 디바이스 제조 방법 |
| US8896827B2 (en) | 2012-06-26 | 2014-11-25 | Kla-Tencor Corporation | Diode laser based broad band light sources for wafer inspection tools |
| KR101442792B1 (ko) | 2012-08-31 | 2014-09-23 | (주)유텍시스템 | 사파이어 웨이퍼의 검사 방법 |
| US9075027B2 (en) * | 2012-11-21 | 2015-07-07 | Kla-Tencor Corporation | Apparatus and methods for detecting defects in vertical memory |
| US9091650B2 (en) * | 2012-11-27 | 2015-07-28 | Kla-Tencor Corporation | Apodization for pupil imaging scatterometry |
| US9726617B2 (en) * | 2013-06-04 | 2017-08-08 | Kla-Tencor Corporation | Apparatus and methods for finding a best aperture and mode to enhance defect detection |
-
2015
- 2015-06-24 US US14/749,564 patent/US9709510B2/en active Active
- 2015-06-26 KR KR1020177000065A patent/KR102269512B1/ko active Active
- 2015-06-26 JP JP2016575210A patent/JP6652511B2/ja active Active
- 2015-06-26 CN CN201810473396.XA patent/CN108508028B/zh active Active
- 2015-06-26 CN CN201580029498.7A patent/CN106415249B/zh active Active
- 2015-06-26 WO PCT/US2015/038115 patent/WO2015200856A1/en not_active Ceased
-
2016
- 2016-10-31 IL IL248647A patent/IL248647B/en active IP Right Grant
-
2017
- 2017-06-18 US US15/626,123 patent/US10215713B2/en active Active
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