JP6652511B2 - ウェハ検査中に集光アパーチャ内に位置付けられる光学要素の構成の決定 - Google Patents

ウェハ検査中に集光アパーチャ内に位置付けられる光学要素の構成の決定 Download PDF

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JP6652511B2
JP6652511B2 JP2016575210A JP2016575210A JP6652511B2 JP 6652511 B2 JP6652511 B2 JP 6652511B2 JP 2016575210 A JP2016575210 A JP 2016575210A JP 2016575210 A JP2016575210 A JP 2016575210A JP 6652511 B2 JP6652511 B2 JP 6652511B2
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collection
aperture
wafer
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JP2017527780A (ja
JP2017527780A5 (enExample
Inventor
パヴェル コルチン
パヴェル コルチン
ミハイル ハウリラウ
ミハイル ハウリラウ
ジュンウェイ ウェイ
ジュンウェイ ウェイ
ダニエル カップ
ダニエル カップ
グレース チェン
グレース チェン
ロバート ダネン
ロバート ダネン
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KLA Corp
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KLA Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95623—Inspecting patterns on the surface of objects using a spatial filtering method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/066—Modifiable path; multiple paths in one sample
    • G01N2201/0668—Multiple paths; optimisable path length

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  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2016575210A 2014-06-26 2015-06-26 ウェハ検査中に集光アパーチャ内に位置付けられる光学要素の構成の決定 Active JP6652511B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201462017264P 2014-06-26 2014-06-26
US62/017,264 2014-06-26
US201562111402P 2015-02-03 2015-02-03
US62/111,402 2015-02-03
US14/749,564 US9709510B2 (en) 2014-06-26 2015-06-24 Determining a configuration for an optical element positioned in a collection aperture during wafer inspection
US14/749,564 2015-06-24
PCT/US2015/038115 WO2015200856A1 (en) 2014-06-26 2015-06-26 Determining a configuration for an optical element positioned in a collection aperture during wafer inspection

Publications (3)

Publication Number Publication Date
JP2017527780A JP2017527780A (ja) 2017-09-21
JP2017527780A5 JP2017527780A5 (enExample) 2018-07-26
JP6652511B2 true JP6652511B2 (ja) 2020-02-26

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JP2016575210A Active JP6652511B2 (ja) 2014-06-26 2015-06-26 ウェハ検査中に集光アパーチャ内に位置付けられる光学要素の構成の決定

Country Status (6)

Country Link
US (2) US9709510B2 (enExample)
JP (1) JP6652511B2 (enExample)
KR (1) KR102269512B1 (enExample)
CN (2) CN108508028B (enExample)
IL (1) IL248647B (enExample)
WO (1) WO2015200856A1 (enExample)

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CN109425619B (zh) * 2017-08-31 2021-12-28 深圳中科飞测科技股份有限公司 光学测量系统及方法
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US10607119B2 (en) * 2017-09-06 2020-03-31 Kla-Tencor Corp. Unified neural network for defect detection and classification
JP7208233B2 (ja) * 2017-11-15 2023-01-18 コーニング インコーポレイテッド ガラスシートの表面欠陥の検出方法および装置
US11067389B2 (en) 2018-03-13 2021-07-20 Kla Corporation Overlay metrology system and method
US11556068B2 (en) 2018-10-12 2023-01-17 Asml Netherlands B.V. Detection system for an alignment sensor
US10902582B2 (en) * 2019-01-17 2021-01-26 Applied Materials Israel, Ltd. Computerized system and method for obtaining information about a region of an object
US11815470B2 (en) 2019-01-17 2023-11-14 Applied Materials Israel, Ltd. Multi-perspective wafer analysis
CN110006684A (zh) * 2019-03-13 2019-07-12 广州金域医学检验中心有限公司 数字病理切片的生成系统和方法
US11933735B2 (en) * 2019-03-29 2024-03-19 Osaka University Optical detection device, optical detection method, method for designing optical detection device, sample classification method, and defect detection method
US11940608B2 (en) * 2019-05-06 2024-03-26 Asml Netherlands B.V. Dark field microscope
US10921261B2 (en) 2019-05-09 2021-02-16 Kla Corporation Strontium tetraborate as optical coating material
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US11255797B2 (en) 2019-07-09 2022-02-22 Kla Corporation Strontium tetraborate as optical glass material
JP2023502872A (ja) 2019-11-04 2023-01-26 東京エレクトロン株式会社 複数のウェハー検査システム（ｗｉｓ）モジュールを較正するためのシステム及び方法
US11168978B2 (en) 2020-01-06 2021-11-09 Tokyo Electron Limited Hardware improvements and methods for the analysis of a spinning reflective substrates
CN115315794A (zh) 2020-03-10 2022-11-08 东京毅力科创株式会社 用于集成到跟踪系统的长波红外热传感器
US11738363B2 (en) 2021-06-07 2023-08-29 Tokyo Electron Limited Bath systems and methods thereof
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Also Published As

Publication number Publication date
IL248647B (en) 2020-05-31
US10215713B2 (en) 2019-02-26
KR102269512B1 (ko) 2021-06-24
CN108508028B (zh) 2021-03-09
JP2017527780A (ja) 2017-09-21
US20170292918A1 (en) 2017-10-12
CN106415249B (zh) 2018-06-12
US9709510B2 (en) 2017-07-18
CN106415249A (zh) 2017-02-15
CN108508028A (zh) 2018-09-07
WO2015200856A1 (en) 2015-12-30
KR20170021830A (ko) 2017-02-28
US20150377797A1 (en) 2015-12-31
IL248647A0 (en) 2017-01-31

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