IL248647B - Configuring for an optical element placed in a collection port when testing a slice - Google Patents
Configuring for an optical element placed in a collection port when testing a sliceInfo
- Publication number
- IL248647B IL248647B IL248647A IL24864716A IL248647B IL 248647 B IL248647 B IL 248647B IL 248647 A IL248647 A IL 248647A IL 24864716 A IL24864716 A IL 24864716A IL 248647 B IL248647 B IL 248647B
- Authority
- IL
- Israel
- Prior art keywords
- determining
- configuration
- optical element
- element positioned
- wafer inspection
- Prior art date
Links
- 238000007689 inspection Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95623—Inspecting patterns on the surface of objects using a spatial filtering method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/066—Modifiable path; multiple paths in one sample
- G01N2201/0668—Multiple paths; optimisable path length
Landscapes
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Immunology (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462017264P | 2014-06-26 | 2014-06-26 | |
| US201562111402P | 2015-02-03 | 2015-02-03 | |
| US14/749,564 US9709510B2 (en) | 2014-06-26 | 2015-06-24 | Determining a configuration for an optical element positioned in a collection aperture during wafer inspection |
| PCT/US2015/038115 WO2015200856A1 (en) | 2014-06-26 | 2015-06-26 | Determining a configuration for an optical element positioned in a collection aperture during wafer inspection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL248647A0 IL248647A0 (en) | 2017-01-31 |
| IL248647B true IL248647B (en) | 2020-05-31 |
Family
ID=54930191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL248647A IL248647B (en) | 2014-06-26 | 2016-10-31 | Configuring for an optical element placed in a collection port when testing a slice |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9709510B2 (enExample) |
| JP (1) | JP6652511B2 (enExample) |
| KR (1) | KR102269512B1 (enExample) |
| CN (2) | CN108508028B (enExample) |
| IL (1) | IL248647B (enExample) |
| WO (1) | WO2015200856A1 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10062156B2 (en) * | 2016-02-25 | 2018-08-28 | Kla-Tencor Corporation | Method and system for detecting defects on a substrate |
| US11512943B2 (en) * | 2016-11-23 | 2022-11-29 | Nova Ltd | Optical system and method for measuring parameters of patterned structures in micro-electronic devices |
| JP7115826B2 (ja) * | 2017-07-18 | 2022-08-09 | 三星電子株式会社 | 撮像装置および撮像方法 |
| US10429315B2 (en) * | 2017-07-18 | 2019-10-01 | Samsung Electronics Co., Ltd. | Imaging apparatus and imaging method |
| CN109425619B (zh) * | 2017-08-31 | 2021-12-28 | 深圳中科飞测科技股份有限公司 | 光学测量系统及方法 |
| CN109425618B (zh) * | 2017-08-31 | 2021-12-28 | 深圳中科飞测科技股份有限公司 | 光学测量系统及方法 |
| US10607119B2 (en) * | 2017-09-06 | 2020-03-31 | Kla-Tencor Corp. | Unified neural network for defect detection and classification |
| JP7208233B2 (ja) * | 2017-11-15 | 2023-01-18 | コーニング インコーポレイテッド | ガラスシートの表面欠陥の検出方法および装置 |
| US11067389B2 (en) | 2018-03-13 | 2021-07-20 | Kla Corporation | Overlay metrology system and method |
| US11556068B2 (en) | 2018-10-12 | 2023-01-17 | Asml Netherlands B.V. | Detection system for an alignment sensor |
| US10902582B2 (en) * | 2019-01-17 | 2021-01-26 | Applied Materials Israel, Ltd. | Computerized system and method for obtaining information about a region of an object |
| US11815470B2 (en) | 2019-01-17 | 2023-11-14 | Applied Materials Israel, Ltd. | Multi-perspective wafer analysis |
| CN110006684A (zh) * | 2019-03-13 | 2019-07-12 | 广州金域医学检验中心有限公司 | 数字病理切片的生成系统和方法 |
| US11933735B2 (en) * | 2019-03-29 | 2024-03-19 | Osaka University | Optical detection device, optical detection method, method for designing optical detection device, sample classification method, and defect detection method |
| US11940608B2 (en) * | 2019-05-06 | 2024-03-26 | Asml Netherlands B.V. | Dark field microscope |
| US10921261B2 (en) | 2019-05-09 | 2021-02-16 | Kla Corporation | Strontium tetraborate as optical coating material |
| US11011366B2 (en) | 2019-06-06 | 2021-05-18 | Kla Corporation | Broadband ultraviolet illumination sources |
| US11255797B2 (en) | 2019-07-09 | 2022-02-22 | Kla Corporation | Strontium tetraborate as optical glass material |
| JP2023502872A (ja) | 2019-11-04 | 2023-01-26 | 東京エレクトロン株式会社 | 複数のウェハー検査システム（ｗｉｓ）モジュールを較正するためのシステム及び方法 |
| US11168978B2 (en) | 2020-01-06 | 2021-11-09 | Tokyo Electron Limited | Hardware improvements and methods for the analysis of a spinning reflective substrates |
| CN115315794A (zh) | 2020-03-10 | 2022-11-08 | 东京毅力科创株式会社 | 用于集成到跟踪系统的长波红外热传感器 |
| US11738363B2 (en) | 2021-06-07 | 2023-08-29 | Tokyo Electron Limited | Bath systems and methods thereof |
| US12488452B2 (en) | 2021-06-16 | 2025-12-02 | Tokyo Electron Limited | Wafer bath imaging |
| US12072606B2 (en) | 2021-07-30 | 2024-08-27 | Kla Corporation | Protective coating for nonlinear optical crystal |
| KR102695451B1 (ko) * | 2021-12-03 | 2024-08-23 | 참엔지니어링(주) | 하전입자를 이용한 시료 처리 장치 |
| US11899338B2 (en) | 2021-12-11 | 2024-02-13 | Kla Corporation | Deep ultraviolet laser using strontium tetraborate for frequency conversion |
| WO2024056296A1 (en) * | 2022-09-13 | 2024-03-21 | Asml Netherlands B.V. | Metrology method and associated metrology device |
| EP4339703A1 (en) * | 2022-09-13 | 2024-03-20 | ASML Netherlands B.V. | Metrology method and associated metrology device |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7957066B2 (en) * | 2003-02-21 | 2011-06-07 | Kla-Tencor Corporation | Split field inspection system using small catadioptric objectives |
| US7041998B2 (en) | 2003-03-24 | 2006-05-09 | Photon Dynamics, Inc. | Method and apparatus for high-throughput inspection of large flat patterned media using dynamically programmable optical spatial filtering |
| US20060012781A1 (en) | 2004-07-14 | 2006-01-19 | Negevtech Ltd. | Programmable spatial filter for wafer inspection |
| WO2006093800A1 (en) * | 2005-02-25 | 2006-09-08 | Nanometrics Incorporated | Apparatus and method for enhanced critical dimension scatterometry |
| JP4625716B2 (ja) * | 2005-05-23 | 2011-02-02 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置及び欠陥検査方法 |
| US7345825B2 (en) * | 2005-06-30 | 2008-03-18 | Kla-Tencor Technologies Corporation | Beam delivery system for laser dark-field illumination in a catadioptric optical system |
| US7345754B1 (en) | 2005-09-16 | 2008-03-18 | Kla-Tencor Technologies Corp. | Fourier filters and wafer inspection systems |
| US8711346B2 (en) * | 2009-06-19 | 2014-04-29 | Kla-Tencor Corporation | Inspection systems and methods for detecting defects on extreme ultraviolet mask blanks |
| KR20110055787A (ko) | 2009-11-20 | 2011-05-26 | 재단법인 서울테크노파크 | 레이저를 이용한 접합웨이퍼 검사장치 |
| WO2012062858A1 (en) | 2010-11-12 | 2012-05-18 | Asml Netherlands B.V. | Metrology method and apparatus, lithographic system and device manufacturing method |
| US9223227B2 (en) * | 2011-02-11 | 2015-12-29 | Asml Netherlands B.V. | Inspection apparatus and method, lithographic apparatus, lithographic processing cell and device manufacturing method |
| NL2008317A (en) * | 2011-03-24 | 2012-09-25 | Asml Netherlands Bv | Substrate and patterning device for use in metrology, metrology method and device manufacturing method. |
| WO2013053822A1 (en) * | 2011-10-12 | 2013-04-18 | Ventana Medical Systems, Inc. | Polyfocal interferometric image acquisition |
| US8614790B2 (en) * | 2011-12-12 | 2013-12-24 | Applied Materials Israel, Ltd. | Optical system and method for inspection of patterned samples |
| WO2013134068A1 (en) * | 2012-03-07 | 2013-09-12 | Kla-Tencor Corporation | Wafer and reticle inspection systems and method for selecting illumination pupil configurations |
| NL2010401A (en) * | 2012-03-27 | 2013-09-30 | Asml Netherlands Bv | Metrology method and apparatus, lithographic system and device manufacturing method. |
| US8896827B2 (en) | 2012-06-26 | 2014-11-25 | Kla-Tencor Corporation | Diode laser based broad band light sources for wafer inspection tools |
| KR101442792B1 (ko) | 2012-08-31 | 2014-09-23 | (주)유텍시스템 | 사파이어 웨이퍼의 검사 방법 |
| US9075027B2 (en) * | 2012-11-21 | 2015-07-07 | Kla-Tencor Corporation | Apparatus and methods for detecting defects in vertical memory |
| US9091650B2 (en) * | 2012-11-27 | 2015-07-28 | Kla-Tencor Corporation | Apodization for pupil imaging scatterometry |
| US9726617B2 (en) * | 2013-06-04 | 2017-08-08 | Kla-Tencor Corporation | Apparatus and methods for finding a best aperture and mode to enhance defect detection |
-
2015
- 2015-06-24 US US14/749,564 patent/US9709510B2/en active Active
- 2015-06-26 CN CN201810473396.XA patent/CN108508028B/zh active Active
- 2015-06-26 CN CN201580029498.7A patent/CN106415249B/zh active Active
- 2015-06-26 KR KR1020177000065A patent/KR102269512B1/ko active Active
- 2015-06-26 JP JP2016575210A patent/JP6652511B2/ja active Active
- 2015-06-26 WO PCT/US2015/038115 patent/WO2015200856A1/en not_active Ceased
-
2016
- 2016-10-31 IL IL248647A patent/IL248647B/en active IP Right Grant
-
2017
- 2017-06-18 US US15/626,123 patent/US10215713B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US10215713B2 (en) | 2019-02-26 |
| KR102269512B1 (ko) | 2021-06-24 |
| CN108508028B (zh) | 2021-03-09 |
| JP2017527780A (ja) | 2017-09-21 |
| US20170292918A1 (en) | 2017-10-12 |
| CN106415249B (zh) | 2018-06-12 |
| US9709510B2 (en) | 2017-07-18 |
| JP6652511B2 (ja) | 2020-02-26 |
| CN106415249A (zh) | 2017-02-15 |
| CN108508028A (zh) | 2018-09-07 |
| WO2015200856A1 (en) | 2015-12-30 |
| KR20170021830A (ko) | 2017-02-28 |
| US20150377797A1 (en) | 2015-12-31 |
| IL248647A0 (en) | 2017-01-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FF | Patent granted | ||
| KB | Patent renewed | ||
| KB | Patent renewed |