JP2020160445A - 表示装置およびその製造方法 - Google Patents
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Abstract
Description
すなわち、携帯端末の正面の面積に対する表示画面の面積の比率(スクリーン対ボディ比;screen-to-body ratio)について、例えば、75%以上、80%以上、または85%以上、特には90%以上または95%以上とすることが求められている。
貫通孔(ホール)の箇所で、バリアー機能が損なわれないように、コネクタCNは、貫通孔(ホール)を密封するように配置される。
また、必要に応じて、転写前の導電体パターンCPを覆う平坦化膜(オーバーコート層OC)が形成される(図6)。
特に好ましくは、近紫外線(near UV)のレーザ照射により容易に分解されてガスを生成することのできるトリアゼン(triazene)またはこの誘導体から構成されたポリマーを用いることができる。
なお、貫通孔(ホール)及びコネクタCNの径は、表示パネル中に通常用いられているコンタクトホールと同程度、または、これより大きくすることができる。例えば、100nm〜1μmとすることができる。
CN:コネクタ
CS:キャリア基板
CT:導電体
CVL、CVL’:共通電圧線
DA:表示領域
DL、DL’:データ線
DVL、DVL’:駆動電圧線
EC:封止層
EE:電子素子
NA:非表示領域
OC:オーバーコート層
P:パッド
PP:パッド部
PX:画素
RL:剥離層
SB:基板
SL:犠牲層
TCP:転写された導電体パターン
Claims (21)
- 第1基板上に剥離層を積層する段階と、
前記剥離層上に導電体パターンを形成する段階と、
前記導電体パターン上に犠牲層を形成する段階と、
前記犠牲層上にポリマー層を含む第2基板を形成する段階と、
前記第2基板上に導電体を含む電子素子を形成する段階と、
前記導電体パターンに対応する受入パターンを前記犠牲層に形成する段階と、
前記導電体パターンを前記犠牲層の前記受入パターンを通じて前記第2基板の背面に転写する段階と、
前記第1基板、前記剥離層および前記犠牲層を除去する段階とを含む表示装置の製造方法。 - 前記剥離層は、動的剥離層である、請求項1に記載の表示装置の製造方法。
- 前記犠牲層の前記受入パターンは、陰刻パターンであり、
前記陰刻パターンを前記犠牲層に形成する段階は、
前記導電体パターンにレーザを照射して、前記犠牲層における前記導電体パターンと重なる部分を、除去する段階を含む、請求項1に記載の表示装置の製造方法。 - 前記犠牲層における前記導電体パターンと重なる部分を除去する段階は、前記犠牲層における前記導電体パターンと重なる部分を、気化させる段階を含む、請求項3に記載の表示装置の製造方法。
- 前記導電体パターンを前記第2基板の背面に転写する段階は、
前記導電体パターンにレーザを照射して、前記導電体パターンを溶融させることで、前記犠牲層の前記受入パターンに前記溶融した導電体パターンを浸入させる段階を含む、請求項1に記載の表示装置の製造方法。 - 前記導電体パターンを形成した後、前記犠牲層を形成する前に、前記導電体パターンを覆うオーバーコート層を形成する段階をさらに含む、請求項1に記載の表示装置の製造方法。
- 前記導電体パターンと、前記電子素子の導電体とを電気的に連結する段階をさらに含む、請求項1に記載の表示装置の製造方法。
- 前記第1基板、前記剥離層および前記犠牲層を除去する段階は、前記第1基板および前記剥離層を同時に前記犠牲層から分離した後、前記犠牲層を除去する段階を含む、請求項1に記載の表示装置の製造方法。
- 前記電子素子は、トランジスタおよび発光素子をさらに含む、請求項1に記載の表示装置の製造方法。
- 前記導電体は、電源供給線またはデータ線を含む、請求項1に記載の表示装置の製造方法。
- 前記導電体パターンは、パッド、電源供給線、データ線の少なくとも1つを含む、請求項1に記載の表示装置の製造方法。
- 前記犠牲層は、多孔性ポリマーを含む、請求項1に記載の表示装置の製造方法。
- 前記犠牲層の前記受入パターンは、多孔性パターンであり、
前記多孔性パターンを前記犠牲層に形成する段階は、
前記導電体パターンにレーザを照射して、前記犠牲層における前記導電体パターンに対応する部分を、さらに多孔性にする段階を含む、請求項12に記載の表示装置の製造方法。 - 前記導電体パターンを前記第2基板の背面に転写する段階は、
前記導電体パターンにレーザを照射して、前記導電体パターンを溶融させることで、前記犠牲層の前記受入パターンに前記溶融した導電体パターンを浸入させる段階を含む、請求項12に記載の表示装置の製造方法。 - 基板と、
前記基板上に位置し、導電体を含む電子素子と、
前記基板の下に位置する導電体パターンと、
前記基板を貫通し、前記電子素子の導電体と、前記導電体パターンとを電気的に連結するコネクタとを含み、
前記導電体パターンは、パッド、電源供給線およびデータ線の少なくとも1つを含む表示装置。 - 前記導電体パターンは、前記基板のすぐ下に位置し、前記基板の背面と接する、請求項15に記載の表示装置。
- 前記基板は、100マイクロメートル未満の厚さを有するポリマー層である、請求項15に記載の表示装置。
- 前記導電体パターンは、導電物質およびポリマーを含む、請求項15に記載の表示装置。
- 前記導電体パターンは、多孔性ポリマー及び前記多孔性ポリマーの空隙内に位置する導電物質を含む、請求項15に記載の表示装置。
- 前記電子素子は、回路素子および発光素子を含み、
前記回路素子は、前記電子素子の導電体を含み、
前記電子素子の導電体は、電源供給線またはデータ線を含む、請求項15に記載の表示装置。 - 前記基板は、映像を表示する表示領域と、前記表示領域の周辺にある非表示領域とを含み、
前記導電体パターンは、表示領域と重なる部分を含む、請求項15に記載の表示装置。
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EP3716347A3 (en) | 2020-12-16 |
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