JP2020149029A - Ledディスプレイ装置及びその製造方法 - Google Patents
Ledディスプレイ装置及びその製造方法 Download PDFInfo
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- JP2020149029A JP2020149029A JP2019083263A JP2019083263A JP2020149029A JP 2020149029 A JP2020149029 A JP 2020149029A JP 2019083263 A JP2019083263 A JP 2019083263A JP 2019083263 A JP2019083263 A JP 2019083263A JP 2020149029 A JP2020149029 A JP 2020149029A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 58
- 230000008878 coupling Effects 0.000 claims abstract description 27
- 238000010168 coupling process Methods 0.000 claims abstract description 27
- 238000005859 coupling reaction Methods 0.000 claims abstract description 27
- 239000011521 glass Substances 0.000 claims abstract description 27
- 239000012790 adhesive layer Substances 0.000 claims description 55
- 239000010410 layer Substances 0.000 claims description 33
- 239000005357 flat glass Substances 0.000 claims description 10
- 238000002360 preparation method Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000002313 adhesive film Substances 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 3
- 230000004397 blinking Effects 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
200 LEDチップ 300 ベース板
310 ベース層 320 第1接着層
330 第2接着層 340 結合孔
W ガラス
Claims (8)
- 建築物の外壁または窓のガラスに取り付けられるLEDディスプレイ装置において、
上面に複数の電極配線が相互離隔された状態で実装されるフィルムタイプの基板と、
前記電極配線に実装される複数のLEDチップと、
前記基板の上面を覆うように形成され、前記電極配線と対向する位置に前記LEDチップが外部に露出するように結合孔が形成されるベース板と、を含み、
前記電極配線に実装された前記LEDチップが前記結合孔により外部に露出するように前記ベース板の一面が前記基板に貼り合わされた状態で前記ベース板の他面が外壁または窓のガラスに貼り合わされることを特徴とするLEDディスプレイ装置。 - 前記ベース板は、
ベース層と、
一面は前記基板の上面に貼り合わされ、他面は前記ベース層の下面に貼り合わされる第1接着層と、
一面は建築物の外壁または窓のガラスに貼り合わされ、他面は前記ベース層の上面に貼り合わされる第2接着層と、を含み、
複数の前記結合孔は、前記ベース層、前記第1接着層及び前記第2接着層に一体に貫通して形成され、
複数の前記LEDチップは、複数の前記結合孔に挿入して収容されることを特徴とする請求項1に記載のLEDディスプレイ装置。 - 前記ベース層の厚さは、前記LEDチップの高さよりも厚く形成され、複数の前記LEDチップは、前記結合孔の内部に位置することを特徴とする請求項1に記載のLEDディスプレイ装置。
- 前記基板及び前記ベース板は、透明に構成されることを特徴とする請求項1に記載のLEDディスプレイ装置。
- 建築物の外壁または窓のガラスに取り付けられるLEDディスプレイ装置の製造方法において、
上面に複数の電極配線が相互離隔された状態で実装されるフィルムタイプの基板を準備する基板準備工程と、
複数の電極配線に複数のLEDチップをそれぞれ実装する実装工程と、
前記LEDチップと対向する位置に前記LEDチップが外部に露出するように結 合孔が形成されるベース板を準備するベース板準備工程と、
前記ベース板の一面が前記基板の上面を覆うように貼り合わされ、複数の前記LEDチップが複数の結合孔により外部に露出する第1貼り合わせ工程と、
前記ベース板の他面が建築物の外壁または窓のガラスに貼り合わされる第2貼り合わせ工程と、を含むことを特徴とするLEDディスプレイ装置の製造方法。 - 前記ベース板準備工程は、
ベース層の下面と上面に第1接着層と第2接着層がそれぞれ貼り合わされるステップと、
複数の前記LEDチップが挿入されるように前記ベース層、前記第1接着層及び前記第2接着層に複数の結合孔が一体に貫通して形成されるステップと、を含むことを特徴とする請求項5に記載のLEDディスプレイ装置の製造方法。 - 複数の前記LEDチップは、前記結合孔の内部に位置することを特徴とする請求項5に記載のLEDディスプレイ装置の製造方法。
- 前記基板及び前記ベース板は、透明に構成されることを特徴とする請求項5に記載のLEDディスプレイ装置の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2019-0028695 | 2019-03-13 | ||
KR1020190028695A KR102050840B1 (ko) | 2019-03-13 | 2019-03-13 | Led 디스플레이 장치의 제조 방법 |
Publications (2)
Publication Number | Publication Date |
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JP2020149029A true JP2020149029A (ja) | 2020-09-17 |
JP6830678B2 JP6830678B2 (ja) | 2021-02-17 |
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JP2019083263A Active JP6830678B2 (ja) | 2019-03-13 | 2019-04-24 | Ledディスプレイ装置及びその製造方法 |
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JP (1) | JP6830678B2 (ja) |
KR (1) | KR102050840B1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114302638A (zh) * | 2021-12-01 | 2022-04-08 | 蚌埠晶显科技有限公司 | 一种用于加工led发光玻璃的网板及使用方法 |
WO2023204015A1 (ja) * | 2022-04-21 | 2023-10-26 | Agc株式会社 | 車両用窓ガラスシステム |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000293125A (ja) * | 1999-04-02 | 2000-10-20 | Matsushita Electric Ind Co Ltd | 表示装置 |
JP2001347886A (ja) * | 2000-06-08 | 2001-12-18 | Taiwa Denki:Kk | 車両用led一体型リアランプ |
KR20070070600A (ko) * | 2005-12-29 | 2007-07-04 | 남 영 김 | 칩led 유리 |
CN201191485Y (zh) * | 2007-09-26 | 2009-02-04 | 长春希达电子技术有限公司 | 全彩色led集成三合一显示模组 |
WO2009019816A1 (ja) * | 2007-08-06 | 2009-02-12 | Shinya Ishida | フレキシブルledモジュールによる表示システム |
KR20100001517U (ko) * | 2008-08-01 | 2010-02-10 | (주)트로스 아이엔디 | 건축물 외장재와 결합된 엘이디 판넬 |
KR20110078482A (ko) * | 2009-12-31 | 2011-07-07 | 서울반도체 주식회사 | 멀티 칩 엘이디 패키지 및 그 제조방법 |
JP2012518265A (ja) * | 2009-02-18 | 2012-08-09 | ジエー ヨン ホー | 吸着板が取り付けられたled |
JP2013506953A (ja) * | 2009-09-30 | 2013-02-28 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 光出力ステッカ |
WO2016121591A1 (ja) * | 2015-01-26 | 2016-08-04 | 旭硝子株式会社 | 表示装置付き建材ガラス板及び建材ガラス構造 |
JP2017068134A (ja) * | 2015-09-30 | 2017-04-06 | 大日本印刷株式会社 | 複合情報表示装置 |
JP2017199627A (ja) * | 2016-04-28 | 2017-11-02 | 株式会社ラパンクリエイト | 発光装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20180134032A (ko) | 2017-06-08 | 2018-12-18 | 김원호 | 조명장식이 설치된 창호 |
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2019
- 2019-03-13 KR KR1020190028695A patent/KR102050840B1/ko active IP Right Grant
- 2019-04-24 JP JP2019083263A patent/JP6830678B2/ja active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000293125A (ja) * | 1999-04-02 | 2000-10-20 | Matsushita Electric Ind Co Ltd | 表示装置 |
JP2001347886A (ja) * | 2000-06-08 | 2001-12-18 | Taiwa Denki:Kk | 車両用led一体型リアランプ |
KR20070070600A (ko) * | 2005-12-29 | 2007-07-04 | 남 영 김 | 칩led 유리 |
WO2009019816A1 (ja) * | 2007-08-06 | 2009-02-12 | Shinya Ishida | フレキシブルledモジュールによる表示システム |
CN201191485Y (zh) * | 2007-09-26 | 2009-02-04 | 长春希达电子技术有限公司 | 全彩色led集成三合一显示模组 |
KR20100001517U (ko) * | 2008-08-01 | 2010-02-10 | (주)트로스 아이엔디 | 건축물 외장재와 결합된 엘이디 판넬 |
JP2012518265A (ja) * | 2009-02-18 | 2012-08-09 | ジエー ヨン ホー | 吸着板が取り付けられたled |
JP2013506953A (ja) * | 2009-09-30 | 2013-02-28 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 光出力ステッカ |
KR20110078482A (ko) * | 2009-12-31 | 2011-07-07 | 서울반도체 주식회사 | 멀티 칩 엘이디 패키지 및 그 제조방법 |
WO2016121591A1 (ja) * | 2015-01-26 | 2016-08-04 | 旭硝子株式会社 | 表示装置付き建材ガラス板及び建材ガラス構造 |
JP2017068134A (ja) * | 2015-09-30 | 2017-04-06 | 大日本印刷株式会社 | 複合情報表示装置 |
JP2017199627A (ja) * | 2016-04-28 | 2017-11-02 | 株式会社ラパンクリエイト | 発光装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114302638A (zh) * | 2021-12-01 | 2022-04-08 | 蚌埠晶显科技有限公司 | 一种用于加工led发光玻璃的网板及使用方法 |
CN114302638B (zh) * | 2021-12-01 | 2023-05-26 | 蚌埠晶显科技有限公司 | 一种用于加工led发光玻璃的网板及使用方法 |
WO2023204015A1 (ja) * | 2022-04-21 | 2023-10-26 | Agc株式会社 | 車両用窓ガラスシステム |
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KR102050840B1 (ko) | 2019-12-03 |
JP6830678B2 (ja) | 2021-02-17 |
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