KR102050840B1 - Led 디스플레이 장치의 제조 방법 - Google Patents

Led 디스플레이 장치의 제조 방법 Download PDF

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Publication number
KR102050840B1
KR102050840B1 KR1020190028695A KR20190028695A KR102050840B1 KR 102050840 B1 KR102050840 B1 KR 102050840B1 KR 1020190028695 A KR1020190028695 A KR 1020190028695A KR 20190028695 A KR20190028695 A KR 20190028695A KR 102050840 B1 KR102050840 B1 KR 102050840B1
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KR
South Korea
Prior art keywords
base plate
substrate
led
adhesive layer
led chip
Prior art date
Application number
KR1020190028695A
Other languages
English (en)
Korean (ko)
Inventor
김태완
최삼기
정석준
Original Assignee
(주) 액트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주) 액트 filed Critical (주) 액트
Priority to KR1020190028695A priority Critical patent/KR102050840B1/ko
Priority to JP2019083263A priority patent/JP6830678B2/ja
Application granted granted Critical
Publication of KR102050840B1 publication Critical patent/KR102050840B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
KR1020190028695A 2019-03-13 2019-03-13 Led 디스플레이 장치의 제조 방법 KR102050840B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020190028695A KR102050840B1 (ko) 2019-03-13 2019-03-13 Led 디스플레이 장치의 제조 방법
JP2019083263A JP6830678B2 (ja) 2019-03-13 2019-04-24 Ｌｅｄディスプレイ装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020190028695A KR102050840B1 (ko) 2019-03-13 2019-03-13 Led 디스플레이 장치의 제조 방법

Publications (1)

Publication Number Publication Date
KR102050840B1 true KR102050840B1 (ko) 2019-12-03

Family

ID=68838058

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190028695A KR102050840B1 (ko) 2019-03-13 2019-03-13 Led 디스플레이 장치의 제조 방법

Country Status (2)

Country Link
JP (1) JP6830678B2 (ja)
KR (1) KR102050840B1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114302638B (zh) * 2021-12-01 2023-05-26 蚌埠晶显科技有限公司 一种用于加工led发光玻璃的网板及使用方法
WO2023204015A1 (ja) * 2022-04-21 2023-10-26 Ａｇｃ株式会社 車両用窓ガラスシステム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070070600A (ko) * 2005-12-29 2007-07-04 남 영 김 칩led 유리
KR20110078482A (ko) * 2009-12-31 2011-07-07 서울반도체 주식회사 멀티 칩 엘이디 패키지 및 그 제조방법
KR20180134032A (ko) 2017-06-08 2018-12-18 김원호 조명장식이 설치된 창호

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000293125A (ja) * 1999-04-02 2000-10-20 Matsushita Electric Ind Co Ltd 表示装置
JP2001347886A (ja) * 2000-06-08 2001-12-18 Taiwa Denki:Kk 車両用ｌｅｄ一体型リアランプ
JP4932632B2 (ja) * 2007-08-06 2012-05-16 真也 石田 フレキシブルｌｅｄモジュールによる表示システム
CN201191485Y (zh) * 2007-09-26 2009-02-04 长春希达电子技术有限公司 全彩色led集成三合一显示模组
KR20100001517U (ko) * 2008-08-01 2010-02-10 (주)트로스 아이엔디 건축물 외장재와 결합된 엘이디 판넬
KR101096625B1 (ko) * 2009-02-18 2011-12-22 광성기업 주식회사 Ｌｅｄ가 부착된 누드사인
EP2483594A1 (en) * 2009-09-30 2012-08-08 Koninklijke Philips Electronics N.V. Light output sticker
JPWO2016121591A1 (ja) * 2015-01-26 2017-12-21 旭硝子株式会社 表示装置付き建材ガラス板及び建材ガラス構造
JP2017068134A (ja) * 2015-09-30 2017-04-06 大日本印刷株式会社 複合情報表示装置
JP2017199627A (ja) * 2016-04-28 2017-11-02 株式会社ラパンクリエイト 発光装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070070600A (ko) * 2005-12-29 2007-07-04 남 영 김 칩led 유리
KR20110078482A (ko) * 2009-12-31 2011-07-07 서울반도체 주식회사 멀티 칩 엘이디 패키지 및 그 제조방법
KR20180134032A (ko) 2017-06-08 2018-12-18 김원호 조명장식이 설치된 창호

Also Published As

Publication number Publication date
JP6830678B2 (ja) 2021-02-17
JP2020149029A (ja) 2020-09-17

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