JP2020141264A - 圧電振動デバイス - Google Patents
圧電振動デバイス Download PDFInfo
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- JP2020141264A JP2020141264A JP2019035579A JP2019035579A JP2020141264A JP 2020141264 A JP2020141264 A JP 2020141264A JP 2019035579 A JP2019035579 A JP 2019035579A JP 2019035579 A JP2019035579 A JP 2019035579A JP 2020141264 A JP2020141264 A JP 2020141264A
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- vibration device
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0595—Holders; Supports the holder support and resonator being formed in one body
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1042—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a housing formed by a cavity in a resin
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/022—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the cantilever type
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
2 水晶振動板
3 第1樹脂フィルム
4 第2樹脂フィルム
5 水晶ウェハ
21 振動部
23 外枠部
24 連結部
25 第1励振電極
26 第2励振電極
27 第1実装端子
28 第2実装端子
201 第1封止パターン
202 第2封止パターン
Claims (10)
- 両主面の一方の主面に形成された第1励振電極及び前記両主面の他方の主面に形成された第2励振電極を有すると共に、前記第1,第2励振電極にそれぞれ接続された第1,第2実装端子を有する圧電振動板と、
前記圧電振動板の前記第1,第2励振電極をそれぞれ覆うように、前記圧電振動板の前記両主面にそれぞれ接合される第1,第2封止部材とを備え、
前記第1,第2封止部材の少なくとも一方の封止部材は、樹脂製のフィルムである、
ことを特徴とする圧電振動デバイス。 - 前記第1,第2封止部材の両封止部材は、前記樹脂製のフィルムである、
請求項1に記載の圧電振動デバイス。 - 前記圧電振動板は、前記両主面に前記第1,第2励振電極がそれぞれ形成された振動部と、該振動部に連結部を介して連結されると共に、前記振動部の外周を取り囲む外枠部とを有し、前記外枠部は、前記振動部より厚肉であり、
前記フィルムは、その周端部が前記外枠部の両主面にそれぞれ接合されて、前記振動部を封止する、
請求項2に記載の圧電振動デバイス。 - 前記圧電振動板は、平面視矩形であり、前記平面視矩形の二組の対向辺の内の一方の組の対向辺に沿う方向の一方の端部の前記外枠部に、前記第1実装端子が形成され、他方の端部の前記外枠部に、前記第2実装端子が形成されている、
請求項3に記載の圧電振動デバイス。 - 前記第1,第2実装端子は、前記外枠部の前記両主面にそれぞれ形成され、前記両主面の前記第1実装端子同士が電気的に接続されると共に、前記両主面の前記第2実装端子同士が電気的に接続されている、
請求項4に記載の圧電振動デバイス。 - 前記外枠部の前記両主面の一方の主面には、前記第1励振電極と前記第1実装端子とを接続し、かつ前記振動部を取り囲むと共に、前記フィルムが接合される第1封止パターンが形成され、前記外枠部の前記両主面の他方の主面には、前記第2励振電極と前記第2実装端子とを接続し、かつ前記振動部を取り囲むと共に、前記フィルムが接合される第2封止パターンが形成されている、
請求項4または5に記載の圧電振動デバイス。 - 前記第1封止パターン、及び、前記第2封止パターンは、前記平面視矩形の二組の対向辺の内の前記一方の組の対向辺に沿って延びる延出部をそれぞれ有し、各延出部の幅が、前記一方の組の対向辺に沿って延びる前記外枠部の幅より狭い、
請求項6に記載の圧電振動デバイス。 - 前記フィルムが、耐熱樹脂製のフィルムである、
請求項1ないし7のいずれか一項に記載の圧電振動デバイス。 - 前記フィルムは、少なくとも片面に熱可塑性の接着層を備えている、
請求項1ないし8のいずれか一項に記載の圧電振動デバイス。 - 前記圧電振動板が、水晶振動板である、
請求項1ないし9のいずれか一項に記載の圧電振動デバイス。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019035579A JP6780718B2 (ja) | 2019-02-28 | 2019-02-28 | 圧電振動デバイス |
US17/429,918 US20220131519A1 (en) | 2019-02-28 | 2020-01-16 | Piezoelectric vibrating device |
EP20763265.4A EP3930189A4 (en) | 2019-02-28 | 2020-01-16 | PIEZOELECTRICAL VIBRATION DEVICE |
CN202080006894.9A CN113243082B (zh) | 2019-02-28 | 2020-01-16 | 压电振动器件 |
PCT/JP2020/001233 WO2020174915A1 (ja) | 2019-02-28 | 2020-01-16 | 圧電振動デバイス |
TW109106527A TWI708479B (zh) | 2019-02-28 | 2020-02-27 | 壓電振動元件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019035579A JP6780718B2 (ja) | 2019-02-28 | 2019-02-28 | 圧電振動デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020141264A true JP2020141264A (ja) | 2020-09-03 |
JP6780718B2 JP6780718B2 (ja) | 2020-11-04 |
Family
ID=72239326
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019035579A Active JP6780718B2 (ja) | 2019-02-28 | 2019-02-28 | 圧電振動デバイス |
Country Status (5)
Country | Link |
---|---|
US (1) | US20220131519A1 (ja) |
EP (1) | EP3930189A4 (ja) |
JP (1) | JP6780718B2 (ja) |
TW (1) | TWI708479B (ja) |
WO (1) | WO2020174915A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023048051A1 (ja) * | 2021-09-22 | 2023-03-30 | 株式会社大真空 | 圧電振動デバイス |
Families Citing this family (1)
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---|---|---|---|---|
JPWO2023053836A1 (ja) * | 2021-09-30 | 2023-04-06 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5877920U (ja) * | 1981-11-20 | 1983-05-26 | 日本特殊陶業株式会社 | 圧電共振器 |
JPH06188670A (ja) * | 1992-12-15 | 1994-07-08 | Tdk Corp | 圧電部品及びその製造方法 |
JPH11330903A (ja) * | 1998-05-11 | 1999-11-30 | Murata Mfg Co Ltd | ラダー型圧電フィルタおよびその製造方法 |
JP3303777B2 (ja) * | 1998-06-02 | 2002-07-22 | 株式会社村田製作所 | 圧電共振子 |
JP2001102900A (ja) * | 1999-09-29 | 2001-04-13 | Kyocera Corp | 表面実装型圧電発振子 |
JP2005184325A (ja) | 2003-12-18 | 2005-07-07 | Nippon Dempa Kogyo Co Ltd | 水晶振動子 |
JP2006311015A (ja) * | 2005-04-27 | 2006-11-09 | Seiko Epson Corp | 圧電振動片及び圧電振動子 |
CN101107776B (zh) * | 2005-06-16 | 2010-05-19 | 株式会社村田制作所 | 压电器件及其制作方法 |
WO2007026428A1 (ja) * | 2005-08-31 | 2007-03-08 | Kyocera Corporation | 圧電共振子 |
JP4893296B2 (ja) * | 2006-12-22 | 2012-03-07 | 株式会社大真空 | 圧電振動デバイス |
JPWO2008099570A1 (ja) * | 2007-02-13 | 2010-05-27 | 株式会社大真空 | 圧電振動デバイス |
JP2008205761A (ja) * | 2007-02-20 | 2008-09-04 | Daishinku Corp | 圧電振動デバイス |
JP6158505B2 (ja) * | 2012-12-21 | 2017-07-05 | 京セラ株式会社 | 水晶デバイス |
JP2015128147A (ja) * | 2013-11-28 | 2015-07-09 | 日東電工株式会社 | 中空封止用樹脂シート、及び、中空パッケージの製造方法 |
JP2018117243A (ja) * | 2017-01-18 | 2018-07-26 | 株式会社村田製作所 | 圧電振動子及びその製造方法 |
-
2019
- 2019-02-28 JP JP2019035579A patent/JP6780718B2/ja active Active
-
2020
- 2020-01-16 EP EP20763265.4A patent/EP3930189A4/en active Pending
- 2020-01-16 US US17/429,918 patent/US20220131519A1/en active Pending
- 2020-01-16 WO PCT/JP2020/001233 patent/WO2020174915A1/ja unknown
- 2020-02-27 TW TW109106527A patent/TWI708479B/zh active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023048051A1 (ja) * | 2021-09-22 | 2023-03-30 | 株式会社大真空 | 圧電振動デバイス |
Also Published As
Publication number | Publication date |
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TW202034628A (zh) | 2020-09-16 |
EP3930189A4 (en) | 2022-05-04 |
EP3930189A1 (en) | 2021-12-29 |
CN113243082A (zh) | 2021-08-10 |
JP6780718B2 (ja) | 2020-11-04 |
TWI708479B (zh) | 2020-10-21 |
US20220131519A1 (en) | 2022-04-28 |
WO2020174915A1 (ja) | 2020-09-03 |
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