JP2020120430A - ロータリテーブル装置 - Google Patents
ロータリテーブル装置 Download PDFInfo
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- JP2020120430A JP2020120430A JP2019007183A JP2019007183A JP2020120430A JP 2020120430 A JP2020120430 A JP 2020120430A JP 2019007183 A JP2019007183 A JP 2019007183A JP 2019007183 A JP2019007183 A JP 2019007183A JP 2020120430 A JP2020120430 A JP 2020120430A
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- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 abstract description 7
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
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- 230000007246 mechanism Effects 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
- H02K41/03—Synchronous motors; Motors moving step by step; Reluctance motors
- H02K41/031—Synchronous motors; Motors moving step by step; Reluctance motors of the permanent magnet type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
- H02K11/21—Devices for sensing speed or position, or actuated thereby
- H02K11/22—Optical devices
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
- H02K7/08—Structural association with bearings
- H02K7/086—Structural association with bearings radially supporting the rotor around a fixed spindle; radially supporting the rotor directly
- H02K7/088—Structural association with bearings radially supporting the rotor around a fixed spindle; radially supporting the rotor directly radially supporting the rotor directly
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K21/00—Synchronous motors having permanent magnets; Synchronous generators having permanent magnets
- H02K21/12—Synchronous motors having permanent magnets; Synchronous generators having permanent magnets with stationary armatures and rotating magnets
- H02K21/24—Synchronous motors having permanent magnets; Synchronous generators having permanent magnets with stationary armatures and rotating magnets with magnets axially facing the armatures, e.g. hub-type cycle dynamos
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K2201/00—Specific aspects not provided for in the other groups of this subclass relating to the magnetic circuits
- H02K2201/15—Sectional machines
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Linear Motors (AREA)
- Windings For Motors And Generators (AREA)
Abstract
Description
前記テーブルは,前記下面に前記界磁マグネットが配設され且つ前記ベッドに対向する側に位置する軸部と,該軸部に一体構造であって相手部材を取り付けるための載置部とから構成され,前記テーブルの前記軸部には全周にわたって延びるリング部材が配設され,前記リング部材の外周面の全域にわたってリングスケールが設けられ,前記ベッドには前記リングスケールを読み取るためのセンサが配設されていることを特徴とするロータリテーブル装置に関する。
2 テーブル
3,3’ 電機子組立体
4 界磁マグネット
5 軸受
6 電機子コイル
7 基板
9 マグネット
10 軸部
11 載置部
17 リング部材
18,19 環状凹部
20 リングスケール
21 センサ
30 テーパ面
32 下面
36 絶縁プレート(第1絶縁層)
37 絶縁シート(第2絶縁層)
41,42,43,44 外周面
45 内周面
Claims (6)
- 所定の場所に設置されるベッド,前記ベッドに軸受を介して回転可能に取り付けられた円盤状のテーブル,及び前記テーブルを回転駆動するモータを有し,前記モータの一次側でなる電機子組立体を構成する複数の電機子コイルは,扁平で環状に巻回された三相のコアレスコイルから構成され且つ前記ベッド上の環状凹部に周方向に沿ってそれぞれ配設されており,前記モータの二次側でなる界磁マグネットを構成する複数のマグネットは,板状に形成され且つ前記テーブルの下面の環状凹部に磁極を交互に異にして周方向に沿って前記電機子コイルに対向してそれぞれ配設されていることから成るロータリテーブル装置において,
前記テーブルは,前記下面に前記界磁マグネットが配設され且つ前記ベッドに対向する側に位置する軸部と,該軸部に一体構造であって相手部材を取り付けるための載置部とから構成され,前記テーブルの前記軸部には全周にわたって延びるリング部材が配設され,前記リング部材の外周面の全域にわたってリングスケールが設けられ,前記ベッドには前記リングスケールを読み取るためのセンサが配設されていることを特徴とするロータリテーブル装置。 - 前記テーブルの前記軸部の外周面は前記載置部の外周面よりも内側に位置し,前記軸部の取り付けられた前記リングスケールの外周面が前記載置部の前記外周面よりも内側に位置していることを特徴とする請求項1に記載のロータリテーブル装置。
- 前記リング部材は,前記テーブルの前記軸部の外周面にインロー嵌合によって固定されていることを特徴とする請求項1又は2に記載のロータリテーブル装置。
- 前記テーブルの前記軸部に嵌入された前記リング部材の内周面は,前記テーブルの前記軸部の前記外周面の挿入方向に沿ってテーパ面に形成されていることを特徴とする請求項3に記載のロータリテーブル装置。
- 前記電機子組立体は,多数の前記マグネットの配設方向に沿って形成されたリング状の基板,及び前記マグネットの配設方向に沿って前記基板上に順次に配設された前記電機子コイルから構成され,前記電機子組立体には,前記電機子コイル側に設けられた第1絶縁層と前記基板側に形成された第2絶縁層とが設けられていることを特徴とする請求項1〜4のいずれか1項に記載のロータリテーブル装置。
- 前記第1絶縁層は前記電機子組立体に接着される絶縁プレートであり,前記第2絶縁層は前記基板に接着した絶縁シート又は前記基板に塗布された絶縁膜であることを特徴とする請求項5に記載のロータリテーブル装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019007183A JP2020120430A (ja) | 2019-01-18 | 2019-01-18 | ロータリテーブル装置 |
US16/737,064 US11387726B2 (en) | 2019-01-18 | 2020-01-08 | Rotary table device |
JP2023220895A JP2024023967A (ja) | 2019-01-18 | 2023-12-27 | ロータリテーブル装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019007183A JP2020120430A (ja) | 2019-01-18 | 2019-01-18 | ロータリテーブル装置 |
Related Child Applications (1)
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JP2023220895A Division JP2024023967A (ja) | 2019-01-18 | 2023-12-27 | ロータリテーブル装置 |
Publications (1)
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JP2020120430A true JP2020120430A (ja) | 2020-08-06 |
Family
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Family Applications (2)
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JP2019007183A Pending JP2020120430A (ja) | 2019-01-18 | 2019-01-18 | ロータリテーブル装置 |
JP2023220895A Pending JP2024023967A (ja) | 2019-01-18 | 2023-12-27 | ロータリテーブル装置 |
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JP2023220895A Pending JP2024023967A (ja) | 2019-01-18 | 2023-12-27 | ロータリテーブル装置 |
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US (1) | US11387726B2 (ja) |
JP (2) | JP2020120430A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023047733A1 (ja) * | 2021-09-24 | 2023-03-30 | 日本トムソン株式会社 | 回転テーブル装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04105885A (ja) * | 1990-08-27 | 1992-04-07 | Mitsutoyo Corp | 簡易型微少位置決め機構及び微少位置決め方法 |
JPH09272823A (ja) * | 1996-04-03 | 1997-10-21 | Mitsubishi Electric Corp | 絶縁塗料、該塗料の塗膜を有するプリント配線基板、該塗料を用いる絶縁性低下予防法および絶縁性回復法 |
JP2001352744A (ja) * | 2000-06-02 | 2001-12-21 | Nippon Thompson Co Ltd | 可動マグネット型リニアモータを内蔵したスライド装置 |
JP2005333763A (ja) * | 2004-05-21 | 2005-12-02 | Nippon Thompson Co Ltd | アライメントステージ装置 |
JP2011119320A (ja) * | 2009-12-01 | 2011-06-16 | Yaskawa Electric Corp | θZ駆動装置およびそれを備えたステージ装置、検査装置 |
JP2017090243A (ja) * | 2015-11-10 | 2017-05-25 | 株式会社ニコン | 回転円筒体の計測装置、基板処理装置及びデバイス製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1153004C (zh) * | 1999-06-18 | 2004-06-09 | 株式会社三协精机制作所 | 旋转式缸装置 |
JP4333979B2 (ja) | 2002-08-09 | 2009-09-16 | 日本トムソン株式会社 | リニアモータを内蔵したアライメントステージ装置 |
JP4584626B2 (ja) * | 2004-05-24 | 2010-11-24 | 日本トムソン株式会社 | アライメントステージ装置 |
US10541117B2 (en) * | 2015-10-29 | 2020-01-21 | Lam Research Corporation | Systems and methods for tilting a wafer for achieving deposition uniformity |
-
2019
- 2019-01-18 JP JP2019007183A patent/JP2020120430A/ja active Pending
-
2020
- 2020-01-08 US US16/737,064 patent/US11387726B2/en active Active
-
2023
- 2023-12-27 JP JP2023220895A patent/JP2024023967A/ja active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04105885A (ja) * | 1990-08-27 | 1992-04-07 | Mitsutoyo Corp | 簡易型微少位置決め機構及び微少位置決め方法 |
JPH09272823A (ja) * | 1996-04-03 | 1997-10-21 | Mitsubishi Electric Corp | 絶縁塗料、該塗料の塗膜を有するプリント配線基板、該塗料を用いる絶縁性低下予防法および絶縁性回復法 |
JP2001352744A (ja) * | 2000-06-02 | 2001-12-21 | Nippon Thompson Co Ltd | 可動マグネット型リニアモータを内蔵したスライド装置 |
JP2005333763A (ja) * | 2004-05-21 | 2005-12-02 | Nippon Thompson Co Ltd | アライメントステージ装置 |
JP2011119320A (ja) * | 2009-12-01 | 2011-06-16 | Yaskawa Electric Corp | θZ駆動装置およびそれを備えたステージ装置、検査装置 |
JP2017090243A (ja) * | 2015-11-10 | 2017-05-25 | 株式会社ニコン | 回転円筒体の計測装置、基板処理装置及びデバイス製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023047733A1 (ja) * | 2021-09-24 | 2023-03-30 | 日本トムソン株式会社 | 回転テーブル装置 |
KR20240048544A (ko) | 2021-09-24 | 2024-04-15 | 니혼토무손가부시기가이샤 | 회전 테이블 장치 |
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US11387726B2 (en) | 2022-07-12 |
US20200235650A1 (en) | 2020-07-23 |
JP2024023967A (ja) | 2024-02-21 |
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