JP2020112766A - 半導体基板 - Google Patents
半導体基板 Download PDFInfo
- Publication number
- JP2020112766A JP2020112766A JP2019005779A JP2019005779A JP2020112766A JP 2020112766 A JP2020112766 A JP 2020112766A JP 2019005779 A JP2019005779 A JP 2019005779A JP 2019005779 A JP2019005779 A JP 2019005779A JP 2020112766 A JP2020112766 A JP 2020112766A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- alignment mark
- trench
- oxide film
- convex portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 86
- 239000004065 semiconductor Substances 0.000 title claims abstract description 81
- 230000001681 protective effect Effects 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 10
- 230000007423 decrease Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 238000001459 lithography Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Abstract
Description
10a 表面
10b 裏面
11 アライメントマーク
12 トレンチ
13 凸状部
14 傾斜面
15 平坦部
20 マスク
21 パターン
22 ペリクル
30 光源
31 レンズ
32 赤外線カメラ
1 酸化膜
2 レジスト
Claims (1)
- デバイスを構成するデバイス用トレンチとアライメントマークとを備える半導体基板であって、
前記アライメントマークは、
前記半導体基板に形成されたアライメントマーク用トレンチと、
前記半導体基板の表面から突出する凸状部とを含み、
前記凸状部の側面は、前記半導体基板の表面に対して傾斜する傾斜面である、
半導体基板。
Priority Applications (1)
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JP2019005779A JP7225815B2 (ja) | 2019-01-17 | 2019-01-17 | 半導体基板 |
Applications Claiming Priority (1)
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JP2019005779A JP7225815B2 (ja) | 2019-01-17 | 2019-01-17 | 半導体基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020112766A true JP2020112766A (ja) | 2020-07-27 |
JP7225815B2 JP7225815B2 (ja) | 2023-02-21 |
Family
ID=71667001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2019005779A Active JP7225815B2 (ja) | 2019-01-17 | 2019-01-17 | 半導体基板 |
Country Status (1)
Country | Link |
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JP (1) | JP7225815B2 (ja) |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02266512A (ja) * | 1989-04-07 | 1990-10-31 | Oki Electric Ind Co Ltd | 半導体素子の製造方法 |
JPH10186682A (ja) * | 1996-12-24 | 1998-07-14 | Sanee Giken Kk | 露光装置およびその露光装置を用いた露光方法 |
JP2001135695A (ja) * | 1999-11-10 | 2001-05-18 | Asahi Kasei Microsystems Kk | 重ね合わせ精度測定方法とこの方法で使用されるマーク |
JP2002208545A (ja) * | 2000-11-07 | 2002-07-26 | Nikon Corp | 光学特性検出方法及び露光方法 |
US20040043310A1 (en) * | 2002-05-14 | 2004-03-04 | Tomoyuki Takeishi | Processing method, manufacturing method of semiconductor device, and processing apparatus |
JP2008010548A (ja) * | 2006-06-28 | 2008-01-17 | Toppan Printing Co Ltd | アライメントマークおよび位置計測方法 |
US20100092599A1 (en) * | 2008-10-10 | 2010-04-15 | Molecular Imprints, Inc. | Complementary Alignment Marks for Imprint Lithography |
JP2015090421A (ja) * | 2013-11-06 | 2015-05-11 | Hoya株式会社 | 薄膜付き基板及び転写用マスクの製造方法 |
CN106483777A (zh) * | 2015-08-31 | 2017-03-08 | 上海微电子装备有限公司 | 一种具有调焦功能的对准系统及对准方法 |
-
2019
- 2019-01-17 JP JP2019005779A patent/JP7225815B2/ja active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02266512A (ja) * | 1989-04-07 | 1990-10-31 | Oki Electric Ind Co Ltd | 半導体素子の製造方法 |
JPH10186682A (ja) * | 1996-12-24 | 1998-07-14 | Sanee Giken Kk | 露光装置およびその露光装置を用いた露光方法 |
JP2001135695A (ja) * | 1999-11-10 | 2001-05-18 | Asahi Kasei Microsystems Kk | 重ね合わせ精度測定方法とこの方法で使用されるマーク |
JP2002208545A (ja) * | 2000-11-07 | 2002-07-26 | Nikon Corp | 光学特性検出方法及び露光方法 |
US20040043310A1 (en) * | 2002-05-14 | 2004-03-04 | Tomoyuki Takeishi | Processing method, manufacturing method of semiconductor device, and processing apparatus |
JP2008010548A (ja) * | 2006-06-28 | 2008-01-17 | Toppan Printing Co Ltd | アライメントマークおよび位置計測方法 |
US20100092599A1 (en) * | 2008-10-10 | 2010-04-15 | Molecular Imprints, Inc. | Complementary Alignment Marks for Imprint Lithography |
JP2015090421A (ja) * | 2013-11-06 | 2015-05-11 | Hoya株式会社 | 薄膜付き基板及び転写用マスクの製造方法 |
CN106483777A (zh) * | 2015-08-31 | 2017-03-08 | 上海微电子装备有限公司 | 一种具有调焦功能的对准系统及对准方法 |
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JP7225815B2 (ja) | 2023-02-21 |
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