JP2020112381A - 厚み計測装置、及び厚み計測装置を備えた加工装置 - Google Patents
厚み計測装置、及び厚み計測装置を備えた加工装置 Download PDFInfo
- Publication number
- JP2020112381A JP2020112381A JP2019001584A JP2019001584A JP2020112381A JP 2020112381 A JP2020112381 A JP 2020112381A JP 2019001584 A JP2019001584 A JP 2019001584A JP 2019001584 A JP2019001584 A JP 2019001584A JP 2020112381 A JP2020112381 A JP 2020112381A
- Authority
- JP
- Japan
- Prior art keywords
- thickness
- light
- plate
- light source
- spectral interference
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012545 processing Methods 0.000 title claims description 40
- 230000003595 spectral effect Effects 0.000 claims abstract description 57
- 230000001678 irradiating effect Effects 0.000 claims abstract description 13
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical class 0.000 claims description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052753 mercury Inorganic materials 0.000 claims description 3
- 229910001507 metal halide Inorganic materials 0.000 claims description 3
- 150000005309 metal halides Chemical class 0.000 claims description 3
- 229910052724 xenon Inorganic materials 0.000 claims description 3
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims description 3
- 238000005259 measurement Methods 0.000 abstract description 4
- 238000001228 spectrum Methods 0.000 description 21
- 230000003287 optical effect Effects 0.000 description 10
- 238000004364 calculation method Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02015—Interferometers characterised by the beam path configuration
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/14—Beam splitting or combining systems operating by reflection only
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
- G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
- G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/22—Telecentric objectives or lens systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
波長 :1064nm
平均出力 :1W
繰り返し周波数 :100kHz
パルス幅 :1ns
スポット径 :φ1μm
加工送り速度 :100mm/秒
6:厚み計測装置
60:厚み計測手段
61:白色光源
62:分光手段
63:集光レンズ
64:ビームスプリッター
65:テレセントリックレンズ
66:コリメーションレンズ
67:2次元イメージセンサー
672:受光領域
10:制御手段
120:記憶部
130:厚み決定部
140:波形テーブル
20:保持手段
24:チャックテーブル
30:移動手段
31:X軸方向移動手段
32:Y軸方向移動手段
40:レーザー光線照射手段
50:アライメント手段
W:ウエーハ(板状物)
L0:白色光
L1:分光
L2:拡大分光
L3、L4:戻り光
Claims (4)
- 板状物の厚みを計測する厚み計測装置であって、
板状物を保持する保持手段と、該保持手段に保持された板状物の厚みを非接触で計測する厚み計測手段と、を少なくとも含み、
該厚み計測手段は、
白色光源と、
該白色光源が発した白色光を波長に対応して時間差を生じさせ分光して照射する分光手段と、
該分光手段により分光された光が導かれ該保持手段に保持された板状物のX軸方向及びY軸方向で規定される2次元領域に該光を照射するビームスプリッターと、
該板状物の2次元領域の上面及び下面から反射した戻り光を、該ビームスプリッターを介して受光する2次元イメージセンサーと、
該2次元イメージセンサーを構成し該板状物の該2次元領域に対応したX軸方向、及びY軸方向に並ぶ複数の画素が時間差によって順次受け取る分光された波長に対応する戻り光の強度を分光干渉波形として記憶する記憶部と、
複数種類の見本分光干渉波形を板状物の厚みに対応して記録した波形テーブルと、
該記憶部に記憶された画素毎の分光干渉波形に基づいて板状物の該2次元領域を規定する座標位置の厚みを決定する厚み決定部と、
を備え、
該厚み決定部は、
該記憶部に記憶された分光干渉波形と、該波形テーブルの各見本分光干渉波形とを比較して該分光干渉波形と波形が一致した見本分光干渉波形に対応する厚みを該板状物の厚みとして決定する厚み計測装置。 - 該厚み計測手段は、
該分光手段と、該ビームスプリッターとの間に配設される集光レンズと、
該ビームスプリッターから拡散した光を平行光として該保持手段に保持された板状物のX軸方向、及びY軸方向で規定される2次元領域に照射するテレセントリックレンズと、
該ビームスプリッターと該2次元イメージセンサーとの間に配設され、該板状物の上面及び下面から反射した戻り光を平行光に生成するコリメーションレンズと、
を備える請求項1に記載の厚み計測装置。 - 該白色光源は、SLD光源、ASE光源、スーパーコンティニウム光源、LED光源、ハロゲン光源、キセノン光源、水銀光源、メタルハライド光源、のいずれかである請求項1、又は2に記載の厚み計測装置。
- 請求項1乃至3のいずれかに記載の厚み計測装置を備えた加工装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019001584A JP7481090B2 (ja) | 2019-01-09 | 2019-01-09 | 厚み計測装置、及び厚み計測装置を備えた加工装置 |
KR1020190176505A KR20200086624A (ko) | 2019-01-09 | 2019-12-27 | 두께 계측 장치 |
TW109100310A TW202035944A (zh) | 2019-01-09 | 2020-01-06 | 厚度測量裝置 |
CN202010013915.1A CN111430254B (zh) | 2019-01-09 | 2020-01-07 | 厚度测量装置 |
DE102020200116.2A DE102020200116B4 (de) | 2019-01-09 | 2020-01-08 | Dickenmessvorrichtung |
US16/738,235 US11054246B2 (en) | 2019-01-09 | 2020-01-09 | Thickness measuring apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019001584A JP7481090B2 (ja) | 2019-01-09 | 2019-01-09 | 厚み計測装置、及び厚み計測装置を備えた加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020112381A true JP2020112381A (ja) | 2020-07-27 |
JP7481090B2 JP7481090B2 (ja) | 2024-05-10 |
Family
ID=71104242
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019001584A Active JP7481090B2 (ja) | 2019-01-09 | 2019-01-09 | 厚み計測装置、及び厚み計測装置を備えた加工装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11054246B2 (ja) |
JP (1) | JP7481090B2 (ja) |
KR (1) | KR20200086624A (ja) |
DE (1) | DE102020200116B4 (ja) |
TW (1) | TW202035944A (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019205847A1 (de) * | 2019-04-24 | 2020-10-29 | Infineon Technologies Ag | Verfahren und Vorrichtung zur Erzeugung mindestens einer Modifikation in einem Festkörper |
CN112059422A (zh) * | 2020-09-12 | 2020-12-11 | 北京航空航天大学 | 用于半导体晶圆研磨的激光加工设备 |
CN114812411B (zh) * | 2022-05-16 | 2022-11-18 | 泰州汇品不锈钢有限公司 | 一种激光测量法兰厚度的设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09133517A (ja) * | 1995-09-06 | 1997-05-20 | Seiko Epson Corp | 分布測定装置 |
JPH1123216A (ja) * | 1997-07-03 | 1999-01-29 | Fuji Photo Optical Co Ltd | 透明薄板測定用干渉計 |
JP2000097648A (ja) * | 1998-09-25 | 2000-04-07 | Toshiba Corp | 段差測定装置および段差測定方法 |
JP2018004442A (ja) * | 2016-07-01 | 2018-01-11 | 株式会社溝尻光学工業所 | 透明板の形状測定方法および形状測定装置 |
JP2018036212A (ja) * | 2016-09-02 | 2018-03-08 | 株式会社ディスコ | 厚み計測装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60109390U (ja) | 1983-12-28 | 1985-07-25 | 富士通株式会社 | シ−ルド板の取付構造 |
US5291269A (en) | 1991-12-06 | 1994-03-01 | Hughes Aircraft Company | Apparatus and method for performing thin film layer thickness metrology on a thin film layer having shape deformations and local slope variations |
US5365340A (en) | 1992-12-10 | 1994-11-15 | Hughes Aircraft Company | Apparatus and method for measuring the thickness of thin films |
US6137575A (en) * | 1997-10-24 | 2000-10-24 | Canon Kabushiki Kaisha | Film thickness measuring method and apparatus |
US6236459B1 (en) * | 1998-11-05 | 2001-05-22 | University Of Miami | Thin film measuring device and method |
US6824813B1 (en) * | 2000-04-06 | 2004-11-30 | Applied Materials Inc | Substrate monitoring method and apparatus |
EP1430270A4 (en) * | 2001-09-21 | 2006-10-25 | Kmac | METHOD AND DEVICE FOR MEASURING THE THICK PROFILE AND THE DISTRIBUTION OF THIN FILM MULTI-LAYER REFRACTIVE INDICES BY TWO-DIMENSIONAL REFLECTOMETRY |
US7324214B2 (en) * | 2003-03-06 | 2008-01-29 | Zygo Corporation | Interferometer and method for measuring characteristics of optically unresolved surface features |
US8670128B2 (en) * | 2009-02-02 | 2014-03-11 | Kobe Steel, Ltd. | Profile measuring apparatus |
JP2011122894A (ja) | 2009-12-09 | 2011-06-23 | Disco Abrasive Syst Ltd | チャックテーブルに保持された被加工物の計測装置およびレーザー加工機 |
JP2012021916A (ja) | 2010-07-15 | 2012-02-02 | Disco Abrasive Syst Ltd | 厚み検出装置および研削機 |
US20180252518A1 (en) * | 2013-01-16 | 2018-09-06 | Scott A. Chalmers | Optical profilometer |
US10274307B2 (en) * | 2015-03-17 | 2019-04-30 | Toray Engineering Co., Ltd. | Film thickness measurement device using interference of light and film thickness measurement method using interference of light |
JP7235500B2 (ja) | 2018-12-27 | 2023-03-08 | 株式会社ディスコ | 厚み計測装置、及び厚み計測装置を備えた加工装置 |
-
2019
- 2019-01-09 JP JP2019001584A patent/JP7481090B2/ja active Active
- 2019-12-27 KR KR1020190176505A patent/KR20200086624A/ko active Search and Examination
-
2020
- 2020-01-06 TW TW109100310A patent/TW202035944A/zh unknown
- 2020-01-08 DE DE102020200116.2A patent/DE102020200116B4/de active Active
- 2020-01-09 US US16/738,235 patent/US11054246B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09133517A (ja) * | 1995-09-06 | 1997-05-20 | Seiko Epson Corp | 分布測定装置 |
JPH1123216A (ja) * | 1997-07-03 | 1999-01-29 | Fuji Photo Optical Co Ltd | 透明薄板測定用干渉計 |
JP2000097648A (ja) * | 1998-09-25 | 2000-04-07 | Toshiba Corp | 段差測定装置および段差測定方法 |
JP2018004442A (ja) * | 2016-07-01 | 2018-01-11 | 株式会社溝尻光学工業所 | 透明板の形状測定方法および形状測定装置 |
JP2018036212A (ja) * | 2016-09-02 | 2018-03-08 | 株式会社ディスコ | 厚み計測装置 |
Also Published As
Publication number | Publication date |
---|---|
CN111430254A (zh) | 2020-07-17 |
JP7481090B2 (ja) | 2024-05-10 |
KR20200086624A (ko) | 2020-07-17 |
DE102020200116A1 (de) | 2020-07-09 |
DE102020200116B4 (de) | 2023-07-27 |
TW202035944A (zh) | 2020-10-01 |
US11054246B2 (en) | 2021-07-06 |
US20200217641A1 (en) | 2020-07-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7235500B2 (ja) | 厚み計測装置、及び厚み計測装置を備えた加工装置 | |
US9791411B2 (en) | Processing apparatus including a three-dimensional interferometric imager | |
JP7481090B2 (ja) | 厚み計測装置、及び厚み計測装置を備えた加工装置 | |
JP7210367B2 (ja) | 厚み計測装置、及び厚み計測装置を備えた加工装置 | |
CN111380471B (zh) | 厚度测量装置 | |
KR20160026715A (ko) | 레이저 가공 장치 | |
JP2018063148A (ja) | 計測装置 | |
TW201816358A (zh) | 厚度測量裝置 | |
US11938570B2 (en) | Laser processing apparatus | |
JP7235514B2 (ja) | 厚み計測装置、及び厚み計測装置を備えた加工装置 | |
CN111430254B (zh) | 厚度测量装置 | |
JP2018021761A (ja) | 計測装置 | |
JP6821259B2 (ja) | 被加工物の加工方法 | |
JP7358185B2 (ja) | 厚み計測装置、及び厚み計測装置を備えた加工装置 | |
JP2023100410A (ja) | 計測装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20211111 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20220913 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220927 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20221124 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20230221 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240425 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7481090 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |