JP2020107761A - Laminated substrate manufacturing apparatus, laminated substrate manufacturing line, and laminated substrate manufacturing method - Google Patents

Abstract

To provide a laminated substrate manufacturing apparatus capable of efficiently feeding and removing workpieces and laminating workpieces while suppressing variations in quality.SOLUTION: A laminated substrate manufacturing apparatus includes a pallet transfer unit 100 that intermittently transfers a pallet P on which a workpiece W is placed, and the pallet transfer unit 100 is arranged such that a laminating area R1 in which a heating head 320 is arranged and an area R2 in which the pallet transfer unit 100 is arranged overlap each other. A lower edge portion 312 of a lamination unit 300 descends toward the positioned pallet P, and the lower edge portion 312 contacts the pallet P to form a temporary chamber CH. The workpiece W is laminated by pressing the heating surface 326 toward the workpiece W while the chamber CH is evacuated while the workpiece W is mounted on the pallet P.SELECTED DRAWING: Figure 2

Description

The present invention relates to a laminated substrate manufacturing apparatus, a laminated substrate manufacturing line, and a laminated substrate manufacturing method.

Conventionally, there is known a laminated component in which a plurality of individual pieces (sticking members) are stuck to a substrate (sticking member) via an adhesive.
In this laminated component, a plurality of pieces are temporarily press-bonded to a substrate (including the case where the substrate is another piece as in the case of Patent Document 1), and the work is heated. However, it can be obtained by applying pressure (pressurizing) in the stacking direction.
In the present specification, such heating and pressurizing of the work is referred to as “laminating (main pressure bonding)”, and the laminated component thus obtained is referred to as “laminating substrate”, and thus laminating is performed. A device for obtaining a substrate is referred to as a "laminated substrate manufacturing device".

By the way, it is known that when the adhesive is heated, air bubbles are generated in the adhesive and/or in the vicinity of the adhesive (such as a portion where the adhesive contacts the member to be attached or the member to be attached) depending on conditions. If air bubbles remain in the adhesive and in the vicinity of the adhesive after laminating, the adhesive state may vary, and not only the adhesive but also the adhered member, the adhered member, etc. may be oxidized. No (bubble problem).

(1) In order to solve such a bubble problem, a member to be attached and a member to be attached (a plurality of members) are placed in a chamber, and air is evacuated from the chamber to perform lamination so that bubbles do not remain at a problematic portion. The technology to make is widely known.
As a member sticking device to which such a technique is applied, for example, a metal-clad laminate manufacturing device for a multilayer printed wiring board described in Patent Document 1 (hereinafter, referred to as “device 700 described in Patent Document 1” for convenience) is available. Are known.
FIG. 12 is a diagram for explaining the devices described in Patent Documents 1 and 3. FIG. 12A shows the device 700 described in Patent Document 1, and FIG. 12B shows the substrate bonding device 900 described in Patent Document 3.

As shown in FIG. 12A, in the device 700 described in Patent Document 1, a plurality of laminated multilayer printed wiring laminate members 713 (laminates) are elastically packed 715 and a tray plate prior to the attaching process. 711 and heating plates 716a and 716b inside a chamber (no reference numeral), and the heating plate 716a on the upper layer side of the laminated body is brought into contact with the elastic packing 715 to form a closed space. The inside of the chamber is exhausted from the exhaust port 718. After that, the upper layer side heat plate 716a and the lower layer side heat plate 716b are heated and pressed to integrate the laminated body (laminating process). Reference numeral 714 indicates a cushion material, and reference numeral 719 indicates a mirror surface plate.
According to the apparatus 700 described in Patent Document 1, a plurality of multilayer printed wiring laminate members 713 can be collectively attached while removing air bubbles (multi-stage press).
It is also possible to consider constructing a “laminated substrate manufacturing apparatus” by applying the apparatus 700 described in Patent Document 1 as described above. For example, a device is prepared in which a plurality of "workpieces" in which a plurality of individual pieces are temporarily pressure-bonded to a substrate are prepared, these plurality of workpieces are put in a chamber so as to be stacked, and a plurality of work pieces are collectively laminated. You can also

Japanese Utility Model Publication No. 5-88920 JP, 2000-325773, A JP, 2007-5335, A

However, the apparatus 700 described in Patent Document 1 stores a certain number of multilayer printed wiring laminate members 713 (workpieces), and then collectively puts these works into a chamber for batch processing. Therefore, if the device 700 described in Patent Document 1 is applied to a “laminated substrate manufacturing device”, the following problems occur.

That is, the following can be said according to the “laminated substrate manufacturing apparatus” to which the apparatus 700 described in Patent Document 1 is applied. (A) Looking at a plurality of works stacked in the chamber, the time from the temporary pressure bonding to the actual laminating process (waiting time) is different for each stacked work. In other words, various works are stacked, from a work that has passed a considerable time after the provisional pressure bonding to a work that has just been temporarily bonded, and the state of the provisional pressure bonding cannot be said to be uniform for each work. Therefore, when these plural works are collectively laminated, there is a possibility that quality variations may occur in the pressure-bonded state. (B) When performing pressure bonding, it is necessary to individually take out the temporarily pressure-bonded workpieces and load (stack) them into the chamber, and the position of the temporarily pressure-bonded individual pieces relative to the substrate may be increased or decreased by this transfer operation. There is a possibility of deviation. That is, there is a possibility that quality variation may occur at the crimping position. (C) A plurality of works are collectively heated and pressed by the upper-side heat plate 716a and the lower-side heat plate 716b. Therefore, in the work of a layer relatively close to the heat plates 716a and 716b and the work of a layer (intermediate layer) relatively far from the heat plates 716a and 716b, the amount of heat that can be received and the force to be applied are different. The sizes are not the same. Since the work of the intermediate layer does not receive sufficient heat and pressure, the adhesive force may be insufficient. Therefore, when comparing a plurality of works, there is a possibility that quality variations may occur in the crimped state.
As described above, according to the “laminating substrate manufacturing apparatus” to which the apparatus 700 described in Patent Document 1 is applied, quality variation occurs depending on individual products when viewed as an entire production lot (quality variation problem).

(2) In order to solve the quality variation problem, it is possible to laminate the works one by one (for example, refer to the heating press chamber described in Patent Document 2). In this case, if the works coming from the upstream process are subjected to the laminating process under the same processing conditions one after another, it is possible to suppress the quality variation due to individual products.
However, when the heating press chamber (not shown) described in Patent Document 2 is applied, a work is prepared, incorporated into the chamber (feeding), laminated, and processed products in the chamber are processed. It is necessary to perform the work of taking out (removal of material) one by one, and the efficiency of the material supply/removal of work is low and the productivity cannot be increased (the problem of material removal/removal efficiency of the work).

(3) In order to solve the problem of material feeding/removal efficiency of the work, the material feeding/removing material can be automated by using a robot or the like (for example, refer to the substrate bonding apparatus 900 described in Patent Document 3).
As shown in FIG. 12B, the substrate bonding apparatus 900 described in Patent Document 3 has a substrate mounting mechanism 909 for mounting the first substrate 991 on the second substrate 992, a reduced pressure environment or an inert gas. A bonding mechanism 903 that bonds the first substrate 991 and the second substrate 992 under the environment, and a transport mechanism 904 that transports the first substrate 991 and the second substrate 992 from the substrate mounting mechanism 909 to the bonding mechanism 903. The transport mechanism 904 is composed of, for example, a robot having an arm 941 (for details of other reference numerals, see Patent Document 3).
If a robot (conveyance mechanism 904) having such an arm 941 is introduced into the “laminated substrate manufacturing apparatus”, it may be possible to improve the efficiency of the material feeding/removing material.
However, the transfer target assumed by the arm 941 of the robot or the like described in Patent Document 3 is two semiconductor substrates (first substrate and second substrate) having substantially the same shape, and has a relatively large size. It is the work 9W, and the work 9W alone has relatively rigidity, and the shape of the upper surface side of the work 9W is substantially flat.
On the other hand, the work handled by the "laminated substrate manufacturing apparatus" may be a flexible substrate or a sheet-shaped film as the substrate, and the individual pieces are not limited to the same shape as the substrate, and are smaller than the substrate (when viewed in plan. A small member (having a small area) can also be applied. For this reason, even if the arm 941 such as the robot described in Patent Document 3 is introduced into the “laminated substrate manufacturing apparatus”, such a work cannot be placed/grasped on the arm 941 and the work cannot be transported. .. Even if such a work can be placed on the arm 941, there is a possibility that small pieces may drop during the transportation or the position of the pieces may shift. In addition, there is a possibility that the work will be wrinkled during the transportation, resulting in a defective product (in the case of a substrate made of a film, a substrate made of a flexible substrate, or the like).
Therefore, in some cases, the arm 941 of the robot or the like described in Patent Document 3 may not be able to carry (feed) a work handled by the “laminated substrate manufacturing apparatus” in the first place. It may also cause quality problems.

Further, the joining mechanism 903 described in Patent Document 3 is configured to join the workpieces (first substrate and second substrate) whose top surface has a substantially flat shape, and which has an uneven top surface ( When a plurality of pieces having different heights are placed on the substrate), it may not be possible to satisfactorily laminate them.

Therefore, the present invention has been made in view of the above circumstances, and it is possible to perform the feeding and removing material of the work more efficiently than before, and to laminate the work while suppressing the variation in quality. An object of the present invention is to provide a laminated substrate manufacturing apparatus and a laminated substrate manufacturing method which can be performed.

[1] A laminated board manufacturing apparatus of the present invention is a laminated board manufacturing apparatus for laminating a work in a state in which a plurality of pieces are temporarily press-bonded on a substrate, and laminating the work, on which the work is placed. A pallet transport unit for intermittently transporting the pallet, and a pallet positioning unit that stops the movement of the pallet that has been transported, separates the pallet from the transport force transmission unit of the pallet transport unit, and determines the position of the pallet. A laminating unit having a work accommodating portion capable of accommodating the work from the lower edge portion to the inner side, and having a heating head for heating and pressurizing the work accommodated inside the work accommodating portion. When the laminated substrate manufacturing apparatus is viewed in a plan view, the pallet transport unit is arranged so that the laminating region where the heating head is disposed and the region where the pallet transport unit is disposed overlap each other. The heating head has a heating surface having a shape conforming to the shape of the upper surface side of the work, and the laminating unit lowers the lower edge portion toward the positioned pallet, The work chamber and the pallet are configured to form a temporary chamber by contacting an edge portion with the pallet, and the laminated substrate manufacturing apparatus is configured such that the work is placed on the pallet. It is configured to laminate the work by pressing the heating surface toward the work while the chamber is evacuated.

In the laminated substrate manufacturing apparatus of the present invention, the pallet conveying unit is arranged so that the laminating area where the heating head is arranged and the area where the pallet conveying unit is arranged overlap, and the work is placed on the pallet. It is configured to press the heating surface toward the work and laminate the work while the inside of the chamber is evacuated while being placed. In other words, the work is taken into the laminating area together with the pallet (material supply), the work is laminated on the work while it is placed on the pallet, and the finished product is placed on the pallet and the whole pallet is placed downstream. It can be transported (fluidized) (removal material) to the process.
Therefore, as in the past, the workpieces that have been temporarily pressure-bonded are individually taken out and loaded into the chamber, or the workpieces are prepared one by one and incorporated into the chamber (feeding). Without performing work such as taking out (removing material), while the work is still placed on the pallet (in the same state as when being transported) on the pallet transport path, A laminating process can be performed.
Therefore, according to the laminated substrate manufacturing apparatus of the present invention, it is possible to perform the work feeding/removing material more efficiently than in the past.

Further, the laminated substrate manufacturing apparatus of the present invention includes a pallet transfer unit for intermittently transferring the pallet on which the work is placed, and the work surface is placed on the pallet and the heating surface is evacuated from the chamber. Is pressed toward the work to laminate the work. That is, the work provisionally pressure-bonded in the upstream process is directly taken into the laminated substrate manufacturing apparatus by the pallet transport unit, and a temporary chamber is formed for each pallet as it is for lamination.
Therefore, as long as the transfer by the pallet transfer device outside the laminated substrate manufacturing apparatus is performed at substantially the same throughput, the standby time from the temporary pressure bonding to the laminating process is substantially constant. Therefore, unlike the conventional case, the waiting time until the laminating process is not largely varied.
Further, according to the laminated substrate manufacturing apparatus of the present invention, since the heating surface is brought into contact with each of the works and laminated, the amount of heat applied to each work and the magnitude of the pressing force are the same. You can meet the conditions. Therefore, the amount of heat that can be received by the work and the magnitude of the force to be applied do not vary depending on the positions of the stacked layers as in the conventional case.
In addition, since it is not necessary to reload the works for performing the lamination as in the conventional case, the position shift of the individual pieces due to the reloading does not occur.
Further, since the laminated substrate manufacturing apparatus of the present invention performs lamination with the heating head having the heating surface having a shape conforming to the shape of the upper surface side of the work, the upper surface side of the work is uneven depending on the height of the individual pieces placed on the substrate. Even in the case of the shape, desired lamination can be performed without causing positional deviation or positional deviation of the individual pieces.
As described above, according to the laminated substrate manufacturing apparatus of the present invention, it is possible to suppress variations in various elements such as the standby time, the amount of heat, the magnitude of the pressure to be applied, and the positional deviation, and as a result, Since it is possible to suppress the variation in the pressure-bonded state, it is possible to laminate the work while suppressing the variation in quality as compared with the conventional case.

[2] In the laminated substrate manufacturing apparatus of the present invention, it is preferable that a sealing member that comes into contact with the upper surface of the pallet is attached to the lower edge portion of the laminating unit.

By attaching the seal member to the lower edge portion in this way, when the lower edge portion comes into contact with the pallet to form a temporary chamber, the airtightness of the chamber can be enhanced. As a result, the exhaust efficiency in the chamber can be improved and the cycle time can be shortened.
Further, even if the surface condition of the pallet varies to some extent, the sealing can be ensured by sandwiching the seal member between the pallet and the lower edge portion.
Further, due to the friction of the seal member, the pallet is less likely to be displaced with respect to the heating head, and the variation in the quality of the laminated substrate due to the displacement can be further suppressed.

[3] In the laminated substrate manufacturing apparatus of the present invention, when the vertical direction is +z direction, the direction in which the pallet is transported is +x direction, and the direction perpendicular to +z direction and +x direction is +y direction, the pallet is The positioning unit is provided with a pallet obstacle portion, and by pushing the pallet obstacle portion from a direction perpendicular to the +x direction to a pallet passing area, the movement of the conveyed pallet is stopped and the position of the pallet in the +x direction is changed. The laminated substrate manufacturing apparatus has a pallet stopper that determines the pallet and a pallet transport unit elevating/lowering drive unit that drives the pallet transport unit up and down, and the laminated substrate manufacturing apparatus is positioned directly below the pallet whose movement is stopped by the pallet stopper. Further comprising a pallet mounting table disposed on the pallet mounting table, the pallet transport unit lifting drive unit lowers the pallet transport unit together with the pallet, and the pallet is placed on the pallet mount table. Is preferred.

With such a pallet stopper, the movement of the pallet being conveyed can be stopped and the position of the pallet in the +x direction can be temporarily fixed, and the position of the pallet in the +x direction can be positioned.
Further, such a pallet transport unit lifting/lowering drive unit can separate the pallet from the transport force transmission unit of the pallet transport unit (release the mutual contact), and the pallet can be placed on the pallet placement table. it can. As a result, the pallet can be positioned in the +z direction.
Further, since the pallet and the work are mounted on the pallet mounting table which is firmly fixed, the pallet and the work can stably resist the pressing of the heating head. Therefore, it is possible to further suppress the variation in quality of the laminated substrate.

[4] In the laminated substrate manufacturing apparatus of the present invention, it is preferable that the pallet mounting table is provided with a table exhaust port.

With such a configuration, the air existing between the upper surface of the pallet mounting table and the lower surface of the pallet can be exhausted from the table exhaust port by the exhaust device. As a result, the lower surface of the pallet can be brought into close contact with the pallet mounting table, and the positioning of the pallet and the work can be ensured.

[5] In the laminated substrate manufacturing apparatus of the present invention, when the work placed on the pallet is viewed in a plan view from a direction perpendicular to the main surface of the pallet, the work has an area of the individual piece of the substrate. It is preferable that the area is small.

According to the laminated substrate manufacturing apparatus of the present invention, it is possible to suitably laminate even a work whose individual area is smaller than the area of the substrate, that is, a work on which fine members are placed.

[6] In the laminated substrate manufacturing apparatus of the present invention, the substrate is a flexible substrate,
Preferably.

According to the laminated substrate manufacturing apparatus of the present invention, it is possible to suitably laminate a work including a flexible substrate having a relatively flexible structure.

[7] In the laminated substrate manufacturing line of the present invention, one of a temporary pressure bonding device for temporarily pressure bonding a plurality of the individual pieces onto the substrate and a plurality of pallet transport devices for transferring the pallets removed from the temporary pressure bonding device. A pallet distributor that distributes one, and a plurality of the pallet conveyors that each have one end connected to the pallet distributor and that conveys the pallets distributed from the pallet distributor. A plurality of the laminated substrate manufacturing apparatuses connected to the other end of each of the pallet conveying apparatuses, wherein the laminated substrate manufacturing apparatus is the laminated substrate manufacturing apparatus according to any one of [1] to [6] above. There is a feature.

[8] A method for manufacturing a laminated substrate according to the present invention is a method for manufacturing a laminated substrate, in which a work, in which a plurality of pieces are temporarily pressure-bonded onto a substrate, is laminated as an object to be laminated. Pallet stopping step of stopping the movement of the pallet conveyed while the work is placed on the pallet while contacting the pallet, and pallet positioning for separating the stopped pallet from the conveying force transmitting section and determining the position of the pallet. A material supplying step having steps, a work accommodating portion capable of accommodating the work from the lower edge portion to the inner side, and a heating head for heating/pressurizing the work accommodated in the work accommodating portion are provided. A chamber forming step of forming a temporary chamber in the work accommodating portion and the pallet by lowering the lower edge of the laminating unit toward the pallet, and contacting the lower edge with the pallet; A vacuuming step of exhausting the inside of the chamber; and a laminating step having a heating/pressurizing step of pressing the heating surface of the laminating unit toward the work to heat/pressurize the work. And

Since the laminated substrate manufacturing method of the present invention has such a configuration, the same effects as the effects obtained by the laminated substrate manufacturing apparatus described in [1] to [6] above can be obtained.

It is a figure shown in order to demonstrate the work W and the pallet P. 1 is a perspective view of a laminated substrate manufacturing apparatus 1 according to Embodiment 1. FIG. FIG. 3 is a front view of relevant parts when the laminated substrate manufacturing apparatus 1 according to the first embodiment is viewed from the direction of arrow A in FIG. 2. FIG. 3 is a diagram for explaining the laminated substrate manufacturing apparatus 1 according to the first embodiment. FIG. 3 is a diagram shown for explaining a main part of the laminating unit 300 according to the first embodiment. 5 is a flow chart shown for explaining the method for manufacturing the laminated substrate according to the first embodiment. FIG. 3 is a schematic diagram shown for explaining the operation of the laminated substrate manufacturing apparatus 1 according to the first embodiment. FIG. 3 is a schematic diagram shown for explaining the operation of the laminated substrate manufacturing apparatus 1 according to the first embodiment. FIG. 5 is a schematic diagram shown for explaining a laminated substrate manufacturing line 10 according to Embodiment 2. FIG. FIG. 11 is a diagram shown for explaining a laminated substrate manufacturing apparatus 2 according to Modification 2 and a laminated substrate manufacturing apparatus 3 according to Modification 3. FIG. 11 is a diagram shown for explaining a laminated substrate manufacturing apparatus 4 according to Modification 4. FIG. 6 is a diagram shown for explaining the devices described in Patent Document 1 and Patent Document 3.

Hereinafter, a laminated substrate manufacturing apparatus, a laminated substrate manufacturing line, and a laminated substrate manufacturing method of the present invention will be described based on the embodiments shown in the drawings. It should be noted that each drawing is a schematic diagram and does not necessarily reflect the actual dimensions strictly.

[Embodiment 1]
1. Work W and pallet P
Prior to the description of the laminated substrate manufacturing apparatus 1, the work W and the pallet P to be handled by the laminated substrate manufacturing apparatus 1 will be described.
FIG. 1 is a diagram shown for explaining the work W and the pallet P. FIG. 1A is a plan view when the work W and the pallet P are directly placed on a horizontal plane, and FIG. 1B is a sectional view taken along the line aa in FIG. 1A. The double-dashed line symbol SL indicates a seal line described later, and the symbol WSF indicates the upper surface of the work W.

(1) Work W
In the present specification, the “workpiece W” refers to a “collection of the board BD and the plurality of individual pieces PC” in which the plurality of individual pieces PC are temporarily pressure-bonded onto the board BD (see FIG. 1 ).
It is assumed that a plurality of individual pieces PC are placed on the board BD in a state of being temporarily pressure-bonded. A plurality of pieces of the same type may be placed on the substrate BD, or a plurality of pieces of different types such as sizes and heights may be placed as illustrated in FIG. .. In this case, as shown in FIG. 1B, the upper surface WSF side of the work W has an uneven shape due to the height of the individual piece PC mounted on the substrate BD.

Further, in the laminated substrate manufacturing apparatus 1 according to the first embodiment, it is possible to suitably apply the work W in which the area of the individual PC is smaller than the area of the substrate BD. That is, it is possible to suitably laminate a work on which small members are placed.

The “temporarily pressure-bonded state” means a state in which the individual piece PC is temporarily fixed to the board BD by a slight pressure applied from the individual piece PC to the board BD. In the first embodiment, since the adhesive is typically interposed between the individual piece PC and the substrate BD, the adhesive force of the adhesive also contributes to the fixing and is temporarily fixed. However, the present invention is not limited to this, and, for example, a case where the material is temporarily placed without a positional deviation or a positional deviation without an adhesive material is included in the “temporarily crimped state”.

The laminated substrate manufacturing apparatus 1 is an apparatus for laminating by applying pressure (pressurizing) in the stacking direction of the individual pieces PC and the substrate BD while heating the work W. In this respect, the work W is the “object to be laminated”.
For reference, since the individual piece PC is usually pressure-bonded to the board BD, the individual piece PC is a “sticking member” and the board BD is a “sticking member”. In the present specification, "laminate" may be referred to as "main pressure bonding" or simply "pressure bonding".

As the “substrate BD”, various types of substrates such as a sheet-like film, a resin-impregnated substrate, a ceramics substrate, and a metal substrate can be applied. Further, the “substrate BD” can be arbitrarily applied from a flexible substrate having a relatively flexible structure to a rigid substrate having a relatively strong structure. In particular, the laminated substrate manufacturing apparatus 1 of the first embodiment can suitably apply a flexible substrate as the substrate.
Note that a circuit may be formed or may not be formed on the “substrate BD”.
As the "individual PC", various kinds of films such as a film for protection, a metal plate for reinforcement, and individual electronic parts can be applied.

(2) Pallet P
In the present specification, the “pallet P” refers to a member as a jig that carries the work W and conveys the work W. The pallet P not only contributes to the work transfer, but also constitutes a part of a chamber in which a vacuum is drawn as described later.
The pallet P may have a plate shape, for example. For example, an aluminum plate having a given thickness can be used.
The pallet P preferably has an appropriate work fixing mechanism (not shown) so that the position/posture of the work W does not shift with respect to the pallet P. The pallet P has outer dimensions, a structure of a pallet lower surface with which a conveying force transmitting unit (conveyor belt or the like) described later comes into contact, a structure near a portion (seal line SL) with which a lower edge of a laminating unit comes into contact when forming a chamber described below, and the like. As long as a certain condition is satisfied, it is possible to flexibly deal with the specification change by changing the specification of the work W, the holding structure of the work W, or the like according to the change in the number of the work W or the like. ..

A work W is placed on the pallet P (see FIG. 1). As in the example of FIG. 1, two workpieces W may be placed on the pallet P. By placing a plurality of works W on the pallet P and then simultaneously laminating the plurality of works W by a laminating unit described later, the production cycle time per work can be shortened.
The number of works W placed on one pallet P is not limited to this, and may be a single piece or three or more pieces.
The work W is placed on the pallet P, is transported together with the pallet P from an upstream process, is taken into the laminated substrate manufacturing apparatus 1, is subjected to a laminating process, and is then transported to a downstream process.
In this specification, the conveyance of the pallet may be referred to as “flowing”. Further, the work W′ that has undergone the laminating process by the laminated substrate manufacturing apparatus 1 may be referred to as a “product”.

2. Configuration of Laminated Substrate Manufacturing Apparatus 1 According to First Embodiment FIG. 2 is a perspective view of the laminated substrate manufacturing apparatus 1 according to the first embodiment. FIG. 3 is a front view of relevant parts when the laminated substrate manufacturing apparatus 1 is viewed from the direction of arrow A in FIG. FIG. 4 is a diagram for explaining the laminated substrate manufacturing apparatus 1 according to the first embodiment. FIG. 4A is a plan view of the laminated substrate manufacturing apparatus 1 as viewed from above (the display of a laminating unit 300 described later is omitted). FIG. 4E is a diagram corresponding to FIG. 4A and shows a laminating region R1 and a region R2 in which the pallet transport unit is arranged.
The vertical direction is the +z direction, the direction in which the pallet P is transported by the pallet transport unit 100 (described later) is the +x direction, and the direction perpendicular to the +z direction and the +x direction is the +y direction. Further, a direction opposite to the +x direction is defined as a −x direction, a direction opposite to the +y direction is defined as a −y direction, and a direction opposite to the +z direction is defined as a −z direction. Further, the +z direction may be referred to as “down” and the −z direction may be referred to as “up”.

(1) Outline The laminated substrate manufacturing apparatus 1 is an apparatus for laminating a work piece in a state in which a plurality of individual pieces are temporarily pressure-bonded onto the substrate, as an object to be laminated.
As shown in FIGS. 2 and 3, the laminated substrate manufacturing apparatus 1 includes a pallet transport unit 100, a pallet positioning unit 200, and a laminate unit 300.
Reference numeral 500 indicates a base. Although not shown in the drawing, each main body (not shown) of the pallet transport unit 100, the pallet positioning unit 200, and the laminating unit 300 is fixed to the base 500.

(2) Pallet transport unit 100
The pallet transfer unit 100 intermittently transfers the pallet P on which the work W is placed.
As shown in FIG. 3, the pallet transfer unit frame 105 is fixed to the base 500. A transportation power source 115 is fixed to the pallet transportation unit frame 105. The shaft of the transport power source 115 (motor or the like) is connected to a pulley by a pulley belt or the like, and power can be transmitted to the transport force transmission unit 110 via the pulley.
The conveyance force transmission unit 110 transmits the conveyance force to the pallet P. Specifically, the transport force transmission unit 110 is configured to contact the lower surface of the pallet P and transport the pallet P in the +x direction by the frictional force generated by both. As the carrying force transmitting unit 110, for example, a carrying belt called a conveyor belt, a carrying chain, or the like can be applied. Further, in the case of realizing non-contact pallet conveyance utilizing a linear motor in the pallet conveyance unit 100, a linear driving device arranged on the fixed side (for example, the pallet conveyance unit frame 105 side) is also included in the conveyance force transmission section 110. Will be done.

The pallet transport unit 100 takes in the pallet P on which the work W that has been subjected to the temporary pressure bonding in the upstream process is placed from the left side of the paper surface of FIGS. 2 and 3. The bottom surface of the taken-in pallet P comes into contact with the carrying force transmission unit 110 and is carried in the +x direction.
In the pallet transfer unit 100, when the laminated substrate manufacturing apparatus 1 is viewed in a plan view, the pallet transfer unit and the “laminating area R1 (hatched area in FIG. 4E)” in which the heating head 320 described later is arranged are arranged. The region R2 (the shaded region in FIG. 4(e)) is arranged so as to overlap the region R2 (see FIG. 4(e)). Further, the transport force transmission unit 110 extends along the +x direction, and the flow path of the pallet P overlaps the laminating region R1.
The pallet P is once transported to the laminating area R1 along this flow path. When the desired laminating process is completed, the pallet transfer unit 100 transfers the pallet P toward the downstream process. Reference numeral 120 indicates a side wall rail.

The definition of "transporting the pallet P intermittently" means that the transporting device of the first embodiment does not transport a continuous transporting target such as a tape or a hoop but a transporting target of a predetermined unit. It means that the device is supposed to send "in a predetermined unit" and "intermittently". Specifically, a free-flow type transport device is assumed in which individual pallets P are sequentially flowed from upstream to downstream in units of pallets P.

(3) Pallet positioning unit 200
The pallet positioning unit 200 stops the movement of the pallet P that has been conveyed, separates the pallet P from the conveyance force transmission unit 110 of the pallet conveyance unit 100, and determines the position of the pallet P.

(3-1) Pallet stopper 210
FIG. 4C is an enlarged plan view of an essential part in which the region surrounded by the broken line E in FIG. FIG. 4D is a right side cross-sectional view of a main part when the laminated substrate manufacturing apparatus 1 is cut along the dashed-dotted line indicated by bb in FIG. 4A and seen from the direction of arrow F (arrow B in FIG. 2 ). It is a figure. In addition, in FIG.4(d), each component is deformed and is drawn typically.

The pallet positioning unit 200 has a pallet stopper 210 that stops the movement of the pallet P and determines the position of the pallet P in the +x direction.
As shown in FIGS. 2 to 4(a), the pallet stopper 210 sandwiches a pallet passage region R3 (see reference numeral R3 in FIG. 4(d)), which is a region through which the pallet P passes, to sandwich the pallet passage region. They are arranged on the −y direction side and the +y direction side of R3, respectively.
The pallet stopper 210 is provided with a pallet obstacle portion 212. The pallet obstruction portion 212 prevents the flow of the pallet P, and may be an appropriate member such as an L-angle member or a bar member.
The pallet positioning unit 200 detects the pallet P transported to the vicinity of the pallet stopper 210 by a pallet passing sensor (not shown), and moves the pallet obstacle portion 212 in a direction perpendicular to the +x direction (-y direction or +y direction in the illustrated example). The pallet passage region R3 is configured to be projected by an air cylinder or the like. As a result, the flowing pallet P and the pallet obstacle portion 212 are interfered with each other so that the pallet P does not flow any more and the movement of the pallet P is stopped (see FIGS. 4(c) and 4(d)). ..

(3-2) Separation of Pallet P and Conveyance Force Transmission Unit 110 The pallet positioning unit 200 has a pallet conveyance unit elevation drive unit 130 that drives the pallet conveyance unit 100 up and down (as will be described below, pallet conveyance unit elevation drive). Since the section 130 has a function of separating the pallet and a function of positioning in the +z direction, it also constitutes a part of the pallet positioning unit 200).
The pallet transport unit lifting/lowering drive unit 130 (not shown) is configured so that the entire pallet transport unit 100 can be moved up and down in the +z direction/−z direction <<arrow 130a in FIG. See the arrow l in d) and the arrow q in FIG. Along with this, the conveyance force transmission unit 110 also moves up and down.
The pallet transport unit lifting/lowering drive unit 130 can be configured by, for example, a motor and a ball screw (not shown) connected to the entire pallet transport unit 100, or can be configured by a solenoid, an air cylinder, or the like.

On the other hand, the pallet mounting table 230 is firmly fixed to the base 500 (see FIGS. 2, 3 and 4D). The pallet mounting table 230 is arranged at a position immediately below (when viewed from the pallet) the pallet P whose movement is stopped by the pallet stopper 210.
The level of the upper surface of the pallet mounting table 230 and the level of the upper surface of the conveying force transmitting unit 110 are, in a normal operating state, the lower end of the pallet passing region R3 (in other words, the lower surface of the pallet P) and the upper surface of the pallet mounting table 230. The relationship between them is set so that a gap SP1 (see FIG. 4(d)) can be formed between the and (in order to secure the clearance of the interval SP1). Therefore, in the normal operation state, the pallet P and the pallet mounting table 230 do not interfere with each other, and the pallet P flows smoothly.

On the other hand, when the pallet transport unit lifting/lowering drive unit 130 lowers the pallet transport unit 100, the pallet transport unit is lifted/lowered so that the level of the upper surface of the transport force transmission unit 110 is lower than that of the pallet mounting table 230. The amount of descent in the drive unit 130 is set.
Therefore, after the movement of the pallet P is stopped by the pallet stopper 210, the pallet transport unit lifting drive unit 130 causes the pallet transport unit 100 to move together with the pallet P (in a state where the pallet P is placed on the transport force transmission unit 110). When the descent is started, the lower surface of the pallet P placed on the upper surface of the conveying force transmitting unit 110 eventually contacts the upper surface of the pallet mounting table 230, and the lower surface of the pallet P is separated from the upper surface of the conveying force transmitting unit 110. (Relatively, the pallet P floats from the transfer force transmission unit 110). That is, the contact between the lower surface of the pallet P and the upper surface of the transport force transmission unit 110 is released. Then, the pallet P is placed only on the pallet loading table 230. In this way, the pallet transport unit lifting drive unit 130 lowers the pallet transport unit 100 together with the pallet P, and the pallet P is moved to the pallet load table 230. Configured to rest on,

(3-3) Positioning of Pallet P The pallet positioning unit 200 is configured to determine the position of the pallet P after separating the pallet P and the transfer force transmission unit 110.

The pallet positioning unit 200 realizes the positioning of the pallet P by, for example, the pallet stopper 210, the pallet transport unit lifting drive unit 130, the pallet mounting table 230, and the cam follower 220.
Specifically, the position of the pallet P in each direction is determined by configuring the pallet positioning unit 200 as follows.
(A) The pallet obstacle portion 212 is configured to project from the direction perpendicular to the +x direction to the pallet passage area R3. As a result, the movement of the conveyed pallet P stops, and the position of the pallet P in the +x direction is temporarily fixed. In this way, the position of the pallet P in the +x direction can be determined.
(B) After the position of the pallet P in the +x direction is fixed, the pallet transport unit lifting drive unit 130 lowers the pallet transport unit 100 together with the pallet P so that the pallet P is placed on the pallet loading table 230. Constitute. Accordingly, the position of the pallet P in the +z direction can be temporarily fixed, and the position of the pallet P in the +z direction can be determined.
(C) The cam followers 220 are arranged on the +y direction side and the −y direction side of the upper surface of the conveying force transmission unit 110, respectively, so as to sandwich the pallet passing region R3 (see FIGS. 2 to 4).
In this cam follower 220, when the pallet P is in an open state in which the fluid does not flow, the relationship between the roller surface (reference numeral omitted) of the cam follower 220 and the pallet passage region R3 is such that the clearance between them is zero (0), or Is set to be positive (with a slight gap) within the range of tolerance that is considered good.
If the pallet P is conveyed to the laminating area R1 with a slight deviation in the +y direction/−y direction, the end surface of the pallet P (+y direction side/−y direction side surface) is the roller surface of the cam follower 220. The pallet P is pushed in the +y direction/−y direction, which should be the original position, and is corrected to the target position in the +y direction/−y direction (FIGS. 4B and 4). See (d)>>. In this way, when the pallet P is conveyed to the laminating area R1, the position of the pallet P in the +y direction/−y direction can be automatically determined.
Note that FIG. 4B is a diagram shown for explaining the cam follower 220, and is a front view of the main part as viewed from the direction of arrow D in FIG. 4A.
(D) The pallet stoppers 210 are arranged on the −y direction side and the +y direction side (both sides) of the pallet passage region R3 so as to sandwich the pallet passage region R3.
Therefore, even if the attitude of the conveyed pallet P is incorrect (even if there is a deviation in the θ direction), the pallet stoppers 210 are provided on both sides of the pallet passage region R3 on the −y direction side and the +y direction side. The pallet P is pushed in the +x direction by the two conveyance force transmission units 110 (on the −y direction side and the +y direction side), so that the end surface of the pallet P has pallet stoppers 210 on both sides (particularly on the pallet side). It will be pressed against the obstacle 212). Accordingly, the attitude of the pallet P in the θ direction can be fixed and the attitude of the pallet P in the θ direction can be determined.
The pallet P whose position (and posture) is determined as described above is configured to be aligned with the heating head 320 during the laminating process described later.

(4) Laminating unit 300
The laminating unit 300 heats and pressurizes the work W placed on the pallet P to laminate it. In other words, the laminating unit 300 performs the "laminating process" in which the individual pieces PC are permanently pressure-bonded to the substrate BD.

(4-1) Head mechanism body 380
As shown in FIG. 3, the laminating unit 300 has a laminating unit main body 305, an outer peripheral edge portion 307 including a lower edge portion 312 at the lower end, and the like. The laminating unit 300 has a work accommodating portion 310 capable of accommodating the work W from the lower edge portion 312 to the inside. A heating head 320 (not shown in FIG. 3) is arranged inside the work storage portion 310.
The laminating unit main body 305, the outer peripheral edge portion 307, the heating head 320 and the like are collectively referred to as a “head mechanism 380”.

(4-2) Head mechanism lifting drive unit 350
As shown in FIGS. 2 and 3, the laminating unit 300 has a head mechanism elevating/lowering drive unit 350. The head mechanism lifting/lowering drive unit 350 is composed of a motor 352, a ball screw 354, a guide 356, etc., and drives the head mechanism 380 up and down.

(4-3) Details of Head Mechanism Body 380 FIG. 5 is a diagram shown for explaining a main part (head mechanism body 380) of the laminating unit 300 of the first embodiment. 5(a) to 5(c) are enlarged cross-sectional views of an essential part in which the cross section of the region surrounded by the broken line C in FIG. 3 is enlarged.

The details of the head mechanism 380 will be described with reference to FIG.
FIG. 5A shows the state of the head mechanism 380 alone (the state of the head mechanism alone).
The laminating unit main body 305 is connected to the head mechanism lifting/lowering drive unit 350 and directly receives the driving force from the head mechanism lifting/lowering drive unit 350 (see also FIG. 3).

An outer peripheral edge portion 307 is provided near the lower peripheral edge of the laminating unit body 305. The outer peripheral edge portion 307 is vertically movable with respect to the laminating unit main body 305.
The outer peripheral edge portion 307 is pressed downward by the return spring 322 with respect to the laminating unit main body 305. Therefore, when it is not in contact with the pallet P, it is at the lower position (origin position) as shown in FIG.
A second seal member 324 is inserted in a portion where the outer peripheral edge portion 307 slides with respect to the laminate unit main body 305 (between the outer peripheral edge portion 307 and the laminate unit main body 305), and the sliding portion is sealed to prevent air leakage. It is designed to block traffic to and from.

The lower edge portion 312, which is the lower side of the outer peripheral edge portion 307, is set in a positional relationship so as to come into contact with the peripheral edge portion of the positioned pallet P.
When the lower edge portion 312 contacts the pallet P, the work chamber 310 and the upper surfaces of the pallet P can form a temporary chamber CH (see FIG. 5B).
Further, a seal member (first seal member 314) that comes into contact with the upper surface of the pallet P is attached to the lower edge portion 312. By attaching the seal member (first seal member 314) to the lower edge portion 312, when the lower edge portion 312 contacts the pallet P and a temporary chamber CH is formed, the airtightness of the chamber CH is improved. It can be increased.
A member such as rubber can be adopted as the seal member. The hardness of the seal member is preferably not too hard so as to fit the contact surface of the pallet P, while it is not too soft from the viewpoint of durability. Further, it is preferable that the surface of the pallet P that contacts the lower edge portion 312 is smooth.

(4-4) Heating head 320
As shown in FIG. 5A, a heating head 320 for heating/pressurizing the work W is disposed inside the laminating unit main body 305. The heating head 320 heats/pressurizes the work W housed inside the work housing unit 310.
The heating head 320 has a heating surface 326 having a shape corresponding to the shape of the upper surface WSF side of the work W on the side in the direction in which the work W abuts. In other words, the heating surface 326 has an uneven shape so as to match the cross-sectional shape of the work W.
The heating head 320 has a built-in heater 330 for supplying heat.

(4-5) State Transition of Head Mechanism Body 380 FIG. 5B shows a state when the lower edge portion 312 is in contact with the pallet P to form the chamber CH (chamber forming state), and FIG. FIG. 3C shows a state in which the work W is pressed against the heating surface 326 of the heating head 320 and heated/pressurized (a laminating execution state).
(A) When the head mechanism 380 is in the state of only a single body, the outer peripheral edge portion 307 is in the lower position (origin position) by the return spring 322 (head mechanism single body state) <<Fig. 5(a) reference".
(B) When the head mechanism 380 is lowered by the head mechanism raising/lowering drive unit 350, the lower edge portion 312 (more specifically, the first seal member 314) contacts the peripheral portion of the pallet. At this time, the outer peripheral edge portion 307 is pushed downward by the return spring 322, the lower edge portion 312 and the upper surface of the pallet P are sealed, and the work chamber 310 and the pallet P form a temporary chamber CH ( Chamber formation state) <<See Fig. 5(b)>>.
In this state, the gas in the chamber CH can be exhausted (evacuated) from the exhaust port 340 by using the exhaust device 400 not shown in FIG. 5 (see FIG. 7E). >>.
(C) When the head mechanism 380 further descends, the heating surface 326 of the heating head 320 contacts the work W. When the heating head 320 further attempts to move downward in this state, pressure is applied to the work W from the heating head 320 (heating surface 326), and the work W can be heated and pressed (lamination execution state) << See FIG. 5(c)>>
Further, at this time, since the pallet P is mounted on the pallet mounting table 230 which is firmly fixed, it is possible to stably resist the pressing of the heating head 320 against the work W.
Further, even in this state, the formation of the chamber CH is maintained, and the gas in the chamber CH can be continuously exhausted (evacuated).
After (d), by raising the head mechanism 380 by the head mechanism raising/lowering drive unit 350, the state of FIG. 5C, the state of FIG. 5B, and the state of FIG. The state can be changed in the opposite direction.

As described above, the laminated substrate manufacturing apparatus 1 is configured to laminate the work W by pressing the heating surface 326 toward the work W while exhausting the inside of the chamber CH with the work W placed on the pallet P. ing.

3. Method for Manufacturing Laminated Substrate According to Embodiment 1 (Operation of Laminated Substrate Manufacturing Apparatus 1)
Next, a method of manufacturing a laminated board (operation of the laminated board manufacturing apparatus 1) will be described with reference to FIGS. 6 to 8.
FIG. 6 is a flow chart shown for explaining the method for manufacturing the laminated substrate according to the first embodiment. 7 and 8 are schematic diagrams shown for explaining the operation of the laminated substrate manufacturing apparatus 1 according to the first embodiment. 7A to 7E show a state of a part of the steps of the material supplying step S10 and the laminating step S20 (chamber forming step S22), and FIGS. 8A to 8E show laminating. The remaining steps of the step S20, the head mechanism retracting step S30, and the material removing step S40 are shown. Only FIG. 7C is a plan view, and the remaining figures are front views.

The method for manufacturing a laminated substrate according to the first embodiment is a method for manufacturing a laminated substrate in which a plurality of individual pieces PC are temporarily bonded to a substrate BD and a work W is laminated as an object to be laminated. As shown in FIG. 5, at least the material supplying step S10 including the pallet stopping step S12 and the pallet positioning step S14, and the laminating step S20 including the chamber forming step S22, the evacuation step S24, and the heating/pressurizing step S26 are included.
Further, following the laminating step S20, a vacuum mechanism releasing step S32, a head mechanism retracting step S30 having a heating head separating step S34 and a chamber eliminating step S36, and a material removing step S40 having a pallet positioning eliminating step S42 may be included. ..

(1) Palette stop step S12
First, the pallet P on which the work W that has been subjected to temporary pressure bonding in the upstream process is placed is taken in. At this time, the pallet P is conveyed in the direction of the arrow j along the +x direction while the work W is placed while making contact with the conveyance force transmission unit 110 (see FIG. 7A).
Next, when the pallet P conveyed to the vicinity of the pallet stopper 210 is detected by a pallet passage sensor (not shown), the pallet obstacle portion 212 is moved from the direction perpendicular to the +x direction to the pallet passage region R3 (not shown in FIG. 7). The pallet P projected in the direction of the arrow k is stopped to stop the movement of the conveyed pallet P (see FIGS. 7B and 7C).

(2) Pallet positioning step S14
By carrying out the pallet stopping step S12, the pallet P is simultaneously positioned in the +x direction. At the same time, even if the position of the pallet P in the +y direction/-y direction is displaced, the cam follower 220 is configured to push the end face of the pallet P in the originally +y direction/-y direction. , The pallet P is automatically positioned in the +y direction/−y direction. Further, the attitude of the pallet P in the θ direction is also determined by these.
7(b) and 7(c), the pallet transfer unit raising/lowering drive unit 130 lowers the pallet transfer unit 100 together with the pallet P in the direction of arrow l. As a result, the pallet P is placed on the pallet placement table 230, so that the position of the pallet P in the +z direction is temporarily fixed, and the pallet P is positioned in the +z direction (see FIG. 7D). ..
In this way, the stopped pallet P is separated from the transfer force transmission unit 110, and the position of the pallet P is determined.

By performing the above, the material supplying step S10 can be performed, and the work W and the pallet P can be attached to the subsequent laminating step S20.

(3) Chamber forming step S22
Next, the head mechanism lifting/lowering drive unit 350 (not shown in FIG. 7, the same applies hereinafter) is operated to lower the head mechanism 380 in the direction of the arrow m, whereby the laminating unit 300 (head mechanism 380). The lower edge portion 312 is lowered toward the pallet P. Then, the lower edge portion 312 (more specifically, the first seal member 314) is brought into contact with the pallet P, the lower edge portion 312 and the upper surface of the pallet P are sealed, and the work storage portion 310 and the pallet P temporarily. Forming a different chamber CH (see FIG. 7E).
At this time, the laminating unit 300 (more specifically, the head mechanism body 380) has a work accommodating portion 310 capable of accommodating the work W from the lower edge portion 312 to the inner side, and the work W is provided inside the work accommodating portion 310. It is assumed that a heating head 320 for heating/pressurizing is installed.

(4) Vacuuming step S24
Next, the gas in the chamber CH is exhausted (evacuated) from the exhaust port 340 by using the exhaust device 400 such as a vacuum pump (see FIG. 7E).
At this time, the inside of the chamber CH is preferably set to about −40 kPa to −120 kPa. Furthermore, it is more preferable to set the pressure to about −70 kPa to −80 kPa.

(5) Heating/pressurizing step S26
Next, the head mechanism lifting/lowering drive unit 350 is operated to further lower the head mechanism 380 in the direction of arrow n, and the heating surface 326 of the laminating unit 300 (more specifically, the heating head 320) is directed toward the work W. The work W is pressed and heated/pressurized (see FIG. 8A). At this time, the gas in the chamber CH is continuously exhausted.
The conditions for performing the heating/pressurizing step S26 differ depending on the specifications of the workpiece W, but for example, while heating/pressurizing while setting the temperature of the heater 330 to a predetermined temperature within the range of 150 to 200° C. The time may be set to a predetermined time within the range of 1 to 2 minutes.

By performing the above, the laminating step S20 can be performed, and the laminated substrate can be obtained.

(6) Vacuum release step S32
Next, the path between the exhaust device 400 and the exhaust port 340 is cut off, and the inside of the chamber CH is opened to the same level as the atmosphere through the exhaust port 340 to release the vacuum (see FIG. 8B).

(7) Heating head separation step S34
Next, the head mechanism lifting/lowering drive unit 350 is operated to raise the head mechanism 380 in the direction of the arrow o, and the heating head 320 (heating surface 326) is separated from the work W (see FIG. 8B). The figure shows the state just before separation. >>.

(8) Chamber elimination step S36
Next, the head mechanism lifting/lowering drive unit 350 is operated to further raise the head mechanism 380 in the direction of the arrow p, and the lower edge portion 312 and the pallet P which are in contact with each other are separated and temporarily formed. Then, the chamber CH is removed, and the work storage portion 310, the pallet P, and the work W are opened to the atmosphere (see FIG. 8C).

(9) Pallet positioning cancellation step S42
Next, the pallet transport unit lifting/lowering drive unit 130 raises the pallet transport unit 100 in the direction of arrow q to separate the pallet P mounted on the pallet mounting table 230 from the pallet mounting table 230, and the transport force transmitting unit 110. Place it again on the upper surface of the plate (see FIG. 8D).
After that, by retracting the pallet obstacle portion 212 of the pallet stopper 210 from the pallet passage region R3, the pallet P is allowed to freely flow and discharged in the direction of the arrow r downstream (see FIG. 8(e)).

By performing the above, the laminated substrate (product W') that has undergone the laminating process can be removed and passed to the next step.

4. Effects of Laminated Substrate Manufacturing Apparatus 1 and Laminated Substrate Manufacturing Method According to First Embodiment (1) In the laminated substrate manufacturing apparatus 1 according to the first embodiment, the laminating area R1 in which the heating head 320 is disposed and the pallet transport unit 100 are provided. The pallet transport unit 100 is arranged so as to overlap the provided region R2, and the heating surface 326 is placed on the heating surface 326 while the inside of the chamber CH is exhausted while the work W is placed on the pallet P. The work W is laminated by pressing the work W toward.
That is, the work W together with the pallet P is taken into the laminating area R1 (material supply), the work W is laminated on the pallet P, and the work W is laminated. The pallet P can be conveyed (fluidized) (removed) to the downstream process while being placed on the pallet.
Therefore, as in the past, the workpieces that have been temporarily pressure-bonded are individually taken out and loaded into the chamber, or the workpieces are prepared one by one and incorporated into the chamber (feeding). Without performing work such as taking out (removing material), while the work is still placed on the pallet (in the same state as when being transported) on the pallet transport path, A laminating process can be performed.
Therefore, according to the laminated substrate manufacturing apparatus 1, it is possible to perform the work feeding/removing material more efficiently than in the past.

In addition, the laminated substrate manufacturing apparatus 1 according to the first embodiment includes the pallet transport unit 100 that intermittently transports the pallet P on which the work W is placed, and the work W is placed on the pallet P in the chamber. While evacuating the inside of CH, the heating surface 326 is pressed against the work W to laminate the work W. That is, the work W that has been temporarily press-bonded in the upstream process is taken into the laminated substrate manufacturing apparatus 1 by the pallet transport unit 100 as it is, and the temporary chamber CH is formed in the pallet unit and laminated.
Therefore, as long as the transfer by the pallet transfer device (not shown) outside the laminated substrate manufacturing apparatus 1 is performed at substantially the same throughput, the waiting time from the temporary pressure bonding to the laminating process is substantially constant. Becomes Therefore, unlike the conventional case, the waiting time until the laminating process is not largely varied.
Further, according to the laminated substrate manufacturing apparatus 1, since the heating surface 326 is brought into contact with each of the works and laminated, the amount of heat applied to each work W, the magnitude of the pressing force, and the like are the same. You can meet the conditions. Therefore, the amount of heat that can be received by the work and the magnitude of the force to be applied do not vary depending on the positions of the stacked layers as in the conventional case.
In addition, since it is not necessary to reload the works for performing the lamination as in the conventional case, the position shift of the individual pieces due to the reloading does not occur.
Further, since the laminated substrate manufacturing apparatus 1 performs the lamination with the heating head 320 having the heating surface 326 having a shape conforming to the shape of the upper surface WSF of the work W, the work may be changed depending on the height of the individual PC placed on the board BD. Even when the upper surface WSF side of W has an uneven shape, desired lamination can be performed without causing the positional deviation and the attitude deviation of the individual PC.
As described above, according to the laminated substrate manufacturing apparatus 1 according to the first embodiment, it is possible to suppress variations in various elements such as the standby time, the amount of heat, the magnitude of the pressure to be applied, and the positional deviation. As a result, it is possible to suppress variations in the pressure-bonded state, so that it is possible to laminate the works W while suppressing variations in quality as compared with the conventional case.

(2) At the lower edge portion 312 of the laminating unit 300, a seal member (first seal member 314) that comes into contact with the upper surface of the pallet P is attached.
Therefore, when the lower edge portion 312 contacts the pallet P to form the temporary chamber CH, the airtightness of the chamber CH can be enhanced. As a result, the exhaust efficiency in the chamber CH can be improved and the cycle time can be shortened. Further, even if the surface state of the pallet P is somewhat uneven, it is possible to ensure the sealing by sandwiching the seal member (first seal member 314) between the pallet P and the lower edge portion 312. it can. Further, due to the friction of the seal member (first seal member 314), the pallet is less likely to be displaced with respect to the heating head, and the variation in the quality of the laminated substrate due to the displacement can be further suppressed.

(3) Since the basic constituent elements of the method for manufacturing a laminated board according to the first embodiment have the same configurations as the constituent elements of the laminated board manufacturing apparatus 1 according to the first embodiment, According to such a laminated substrate manufacturing method, the same effects as the effects obtained by the laminated substrate manufacturing apparatus 1 can be obtained.

[Embodiment 2]
Next, the configuration of the laminated substrate manufacturing line 10 according to the second embodiment will be described with reference to FIG. FIG. 9 is a schematic diagram shown for explaining the laminated substrate manufacturing line 10 according to the second embodiment.

The laminated board manufacturing line 10 according to the second embodiment is a laminated board manufacturing line for manufacturing a laminated board by temporarily press-bonding a plurality of individual PCs onto the board BD and further by final press-bonding.
The laminated substrate manufacturing line 10 according to the second embodiment includes a temporary pressure bonding device 7 for temporarily pressure bonding a plurality of individual PCs onto the substrate BD, and a plurality of pallet transport devices 9 for the pallets P removed from the temporary pressure bonding device 7. A plurality of pallet distributors 8 for distributing to any one, and a plurality of pallet carrier devices 9 each having one end connected to the pallet distributor 8 for carrying the pallets P distributed from the pallet distributor 8 are provided. And a plurality of laminated substrate manufacturing apparatuses 1 connected to the other ends of the pallet transfer apparatuses 9 (see FIG. 9).
Note that reference numeral 5 indicates a pallet merging device, and reference numeral 6 indicates a next process device for performing the next process. The laminated substrate manufacturing apparatus 1 here is the same as the laminated substrate manufacturing apparatus 1 according to the first embodiment.

Since the laminated substrate manufacturing line 10 according to the second embodiment includes the laminated substrate manufacturing apparatus 1 according to the first embodiment, the laminated substrate manufacturing apparatus 1 according to the first embodiment also has the same effects.

Further, the cycle time (for example, about 1 to 2 minutes) of the main pressure bonding step by the laminated substrate manufacturing apparatus 1 is different from the cycle time of the temporary pressure bonding step by the temporary pressure bonding apparatus 7 (for example, about 30 to 40 seconds). In the case of a relatively long length, by arranging the laminated substrate manufacturing apparatus 1 in parallel with one temporary pressure bonding apparatus 7, the takt time of the entire line can be matched.
Further, by arranging the laminated substrate manufacturing apparatuses 1 in parallel, the work W temporarily pressure-bonded in the upstream temporary pressure bonding step can be immediately put into the laminated substrate manufacturing apparatus 1 in a space. Therefore, the waiting time from the temporary pressure bonding to the laminating process can be made substantially constant. Therefore, it is possible to suppress a large variation in the waiting time until the laminating process is performed as in the conventional case.

[Modification]
Although the present invention has been described based on the above embodiment, the present invention is not limited to the above embodiment. The present invention can be implemented in various modes without departing from the spirit thereof, and the following modifications are possible, for example.

(1) The numbers, materials, shapes, positions, sizes, etc. of the constituent elements described in the above embodiments are mere examples, and can be changed within a range that does not impair the effects of the present invention.
For example, in the first embodiment, the work W of the laminated substrate manufacturing apparatus 1 has been described on the assumption that a plurality of individual pieces PC are provisionally mounted on each substrate BD, but the present invention is not limited to this. Absent. A tentatively mounted piece may be laminated on each board BD (Modification 1).
As long as a plurality of pieces can be laminated, it is naturally possible to laminate a single piece, and the same effect can be obtained. Therefore, such a laminated board manufacturing apparatus is also the laminated board manufacturing apparatus 1 of the present invention. Is equal to

(2) As shown in FIG. 10A, a seal member (third seal member 234) made of resin or the like may be attached to the upper surface of the pallet mounting table 230.
When the pallet P is placed on the upper surface of the pallet placing table 230, the third seal member 234 can absorb the impact, and the pallet P can be placed so as to fit the pallet placing table 230. The positioning can be made more reliable. The seal member (third seal member 234) made of resin or the like may be attached to the lower surface of the pallet P.
Further, the pallet mounting table 230 may be provided with a table exhaust port 235 <<refer also to FIG. 2, FIG. 4(a) and FIG. 4(d)>>.
When the pallet P is placed on the pallet mounting table 230, it is present between the upper surface of the pallet mounting table 230 and the lower surface of the pallet P by an exhaust device (not shown) connected to the table exhaust port 235. The air used may be exhausted. As a result, the pallet P is drawn closer to the pallet mounting table 230 more closely, so that the positioning of the pallet P can be further ensured (laminated substrate manufacturing apparatus 2 of Modification 2).
10 is a diagram shown for explaining the laminated substrate manufacturing apparatus 2 according to the modified example 2 and the laminated substrate manufacturing apparatus 3 according to the modified example 3.

(3) Further, as shown in FIG. 10B, the pallet itself may be provided with a through hole Ph penetrating between the upper surface and the lower surface. The through hole Ph of the pallet P′ is arranged so as to be at a position corresponding to the table exhaust port 235 when the pallet P′ is positioned.
That is, a table exhaust port 235, a suction path (no reference numeral), etc. may be provided on the pallet mounting table 230 side to exhaust the inside of the chamber CH through the through hole Ph in the thickness direction of the pallet P′ (modified example). 3. Laminated board manufacturing equipment 3).
With such a configuration, when the exhaust device 400 such as a relatively heavy vacuum pump is installed under the base 500, the suction path between the exhaust device 400 and the chamber CH has a pallet mounting table. Since the suction path is provided on the 230 side, the total length of the suction path is shorter than when the suction path is provided on the laminating unit 300 side, so that exhaust loss can be reduced. Further, since the suction path is provided not at the movable part of the head mechanism 380 but at the fixed part of the pallet mounting table 230, the laminated substrate manufacturing apparatus has a simple structure.

(4) In the first embodiment, as the pallet transport unit 100, a free-flow type in which individual pallets P are sequentially flowed from upstream to downstream by utilizing a conveyor belt or the like is exemplified. explained. However, the present invention is not limited to this.
For example, instead of the conveyor belt or the like, as shown in FIG. 11, it may be a table-conveying type that conveys the pallet P while rotating intex in the R direction about the rotation axis AX1 (a laminated substrate manufacturing apparatus of Modification 4). 4).
11: is a figure shown in order to demonstrate the laminated substrate manufacturing apparatus 4 which concerns on the modification 4. FIG. FIG. 11A shows a plan view, and FIG. 11B is a cross-sectional view taken along line u-u of FIG. 11A. In the figure, reference numerals TBa, TBb, TBc indicate index tables, reference numeral ST1 indicates a feeding/removing material station for feeding/removing the pallet P, and reference numeral ST2 indicates a work W (substrate and individual pieces) placed on the pallet P. Indicates a temporary pressure bonding station for temporarily pressure bonding, and reference numeral ST3 indicates a main pressure bonding station for performing a main pressure bonding (laminating) of the work W placed on the pallet P.
In the modified example 4, the laminating unit 300 of the first embodiment is arranged at the position of the main pressure bonding station ST3, and the laminating unit 300 (head mechanism 380) is lowered in the directions of arrows V and W, so that the work at the position of ST3. The laminating process can be performed with W placed on the pallet P (see FIG. 11B).

(5) In positioning the pallet P in the first embodiment, the pallet transfer unit lifting drive unit 130 moves the pallet transfer unit 100 side to separate the pallet P from the transfer force transmission unit 110 and position the pallet P. It was However, the present invention is not limited to this. For example, a guide hole and a guide pin (not shown) are provided between the pallet P and the pallet mounting table 230, and the pallet mounting table 230 is moved to position the guide hole and the guide pin together. You may go (Modification 5).

(6) In the first embodiment, as the heating surface 326 of the heating head 320, one having irregularities formed in advance is applied. However, the present invention is not limited to this. For example, as the heating head 320, a tube (not shown) may be inflated to conform the shape of the heating head to the uneven shape of the work (Modification 6).

1, 2, 3, 4... Laminated substrate manufacturing device, 5... Pallet joining device, 6... Next process device, 7... Temporary pressure bonding device, 8... Pallet distribution device, 9... Pallet transfer device, 10... Laminated substrate manufacturing line, 100... Pallet transport unit, 105... Pallet transport unit frame, 110... Transport power transmission unit, 115... Transport power source, 130... Pallet transport unit lifting drive unit, 200... Pallet positioning unit, 210... Pallet stopper, 212... Pallet obstacle 220, cam follower, 230, pallet mounting table, 234... third seal member, 235... table exhaust port, 300... laminating unit, 305... laminating unit body, 307... outer peripheral edge part, 310... work accommodating section, 312 ... Lower edge part, 314... First seal member, 320... Heating head, 322... Return spring, 324... Second seal member, 326... Heating surface, 330... Heater, 340... Exhaust port, 350... Head mechanism lifting drive 352... Motor, 354... Ball screw, 356... Guide, 380... Head mechanism, 400... Exhaust device, 500... Base, 700... Device described in Patent Document 1, 711... Tray plate, 713... Multilayer Laminated member for printed wiring, 715... Elastic packing, 716a, 716b... Heat plate, 718... Exhaust port, 900... Substrate joining device, 902... Substrate placing mechanism, 903... Joining mechanism, 904... Transfer mechanism, 941... Arm

Claims (8)

A laminate substrate manufacturing apparatus for laminating a work piece in a state in which a plurality of pieces are temporarily pressure-bonded on a substrate,
A pallet transfer unit for intermittently transferring the pallet on which the work is placed,
A pallet positioning unit that stops the movement of the pallet that has been transported, separates the pallet from the transport force transmission unit of the pallet transport unit, and determines the position of the pallet;
A laminating unit having a work accommodating portion capable of accommodating the work from the lower edge portion to the inner side, and a heating head for heating/pressurizing the work accommodated inside the work accommodating portion,
Equipped with
In a plan view of the laminated substrate manufacturing apparatus, the pallet transfer unit is arranged so that the laminating area where the heating head is arranged and the area where the pallet transfer unit is arranged overlap each other. ,
The heating head has a heating surface having a shape conforming to the shape of the upper surface side of the work,
In the laminating unit, the lower edge portion descends toward the positioned pallet, and the lower edge portion abuts the pallet, so that a temporary chamber is formed by the work accommodating portion and the pallet. Composed,
The laminated substrate manufacturing apparatus is configured to laminate the work by pressing the heating surface toward the work in a state where the chamber is evacuated with the work placed on the pallet.
A laminated substrate manufacturing device characterized by the above. The laminated substrate manufacturing apparatus according to claim 1,
At the lower edge of the laminating unit, a sealing member that comes into contact with the upper surface of the pallet is attached.
A laminated substrate manufacturing device characterized by the above. The laminated substrate manufacturing apparatus according to claim 1 or 2,
When the vertical direction is +z direction, the direction in which the pallet is conveyed is +x direction, and the direction perpendicular to +z direction and +x direction is +y direction,
The pallet positioning unit is
A pallet stopper provided with a pallet obstruction portion and stopping the movement of the pallet conveyed by protruding the pallet obstruction portion from a direction perpendicular to the +x direction to a pallet passage area to determine the position of the pallet in the +x direction. ,
A pallet transport unit lifting drive unit for driving the pallet transport unit up and down,
The laminated substrate manufacturing apparatus,
The pallet stopper further comprises a pallet mounting table arranged at a position immediately below the pallet, the movement of which is stopped by the pallet stopper.
The pallet transport unit elevating and lowering drive unit lowers the pallet transport unit together with the pallet, and the pallet is placed on the pallet placing table.
A laminated substrate manufacturing device characterized by the above. The laminated substrate manufacturing apparatus according to any one of claims 1 to 3,
The pallet mounting table is provided with a table exhaust port,
A laminated substrate manufacturing device characterized by the above. The laminated substrate manufacturing apparatus according to any one of claims 1 to 4,
When the work placed on the pallet is viewed in a plan view from a direction perpendicular to the main surface of the pallet, the work has an area of the individual piece smaller than the area of the substrate,
A laminated substrate manufacturing device characterized by the above. The laminated substrate manufacturing apparatus according to any one of claims 1 to 5,
The substrate is a flexible substrate,
A laminated substrate manufacturing device characterized by the above. A temporary pressure bonding device for temporarily pressure bonding the plurality of pieces onto the substrate;
A pallet distributor that distributes the pallet removed from the temporary pressure bonding device to any one of a plurality of pallet conveyors;
One end of each is connected to the pallet distributor, and a plurality of pallet conveyors for conveying the pallets distributed from the pallet distributor,
Each of the plurality of laminated substrate manufacturing apparatus is connected to the other end of each of the plurality of pallet conveyors,
The laminated substrate manufacturing apparatus is the laminated substrate manufacturing apparatus according to any one of claims 1 to 6,
Laminated substrate manufacturing line. A method for manufacturing a laminated substrate, in which a plurality of individual pieces are laminated on a work piece in a state of being temporarily pressure-bonded onto the board,
A pallet stopping step of stopping the movement of the pallet conveyed while the work is placed while being in contact with the conveying force transmitting unit, and separating the stopped pallet from the conveying force transmitting unit and positioning the pallet. A material supply process having a pallet positioning step for determining
The lower edge portion of the laminating unit having a work accommodating portion capable of accommodating the work from the lower edge portion to the inner side and having a heating head for heating/pressurizing the work accommodated inside the workpiece accommodating portion. A chamber forming step of forming a temporary chamber in the work accommodating portion and the pallet by lowering the pallet toward the pallet, and the lower edge portion of the pallet contacting the pallet, and a vacuuming step of evacuating the chamber. And a laminating step having a heating/pressurizing step of pressing the heating surface of the laminating unit toward the work to heat/press the work.
A method of manufacturing a laminated substrate, comprising: