JP2020016652A - 積層体を評価する方法、積層体を評価する装置、積層体を製造する方法、及び積層体を製造する装置 - Google Patents
積層体を評価する方法、積層体を評価する装置、積層体を製造する方法、及び積層体を製造する装置 Download PDFInfo
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Abstract
Description
Y=logX+b
という関係が成立し得る。
以下の各実施例では、同じ基布及び同じポリマー層を用い、貼合せ温度及び貼合せ速度(搬送速度)を変更して積層体を複数作製した。そして、各積層体の平面視画像からボイド率(エアポケットの比率)を測定する一方、各積層体の耐圧性(破断時圧)を測定し、各積層体についてボイド率と耐圧性との相関を求めた。
基布CL1(ポリエステル製、経糸及び緯糸の総繊度がそれぞれ470dtex、目付が200g/m2)を準備した。また、フィルムF1(融点170℃のポリマー層と融点125℃のポリマー層とを積層させた多層フィルム)を準備した。そして、図1で説明した積層体の製造装置100と同様の装置を用いて、加熱・加圧により基布CL1とフィルムF1とを、フィルムF1の層のうち融点が低い方の層が基布CL1側となるようにして貼り合せ、積層体を作製した。この際、加熱温度150℃で、また貼合せ速度を3〜10m/minの間で変更して、計4つの積層体を作製した。
フィルムF1に替えてフィルムF2(融点209℃のポリマー層と融点149℃のポリマー層と積層させた多層フィルム)を用いたこと以外は、実施例1−1と同様にして、基布CL1とフィルムF2とを貼り合せ、積層体を作製した。その際、貼合せ温度を170〜180℃の間で、貼合せ速度を3〜10m/minの間で変更して、計3つの積層体を作製した。さらに、実施例1−1と同様にして、各積層体について、ボイド率及び耐圧性(破断時圧)を求め、片対数グラフにプロットした(図7)。
フィルムF1に替えてフィルムF3(融点209℃の層、融点150℃の層、及び融点109℃の層をこの順で積層させた多層フィルム、層はいずれもポリマー層)を用いたこと以外は、実施例1−1と同様にして、積層体を作製した。その際、フィルムF3の層のうち融点が最も低い層が基布CL1側となるようにして、フィルムF3を基布CL1とを貼り合せた。また、貼合せ温度を170〜180℃の間で、貼合せ速度を3〜10m/minの間で変更して、計4つの積層体を作製した。さらに、実施例1−1と同様にして、各積層体について、ボイド率及び耐圧性(破断時圧)を求め、片対数グラフにプロットした(図7)。
基布CL2(ポリエステル製、経糸及び緯糸の総繊度がそれぞれ470dtex、目付が220g/m2)を準備した。また、上述のフィルムF1を準備した。実施例1−1と同様にして、加熱・加圧により基布CL2とフィルムF1とを貼り合せ、積層体を作製した。その際、貼合せ温度を170℃とし、貼合せ速度を3〜10m/minの間で変更して、計4つの積層体を作製した。さらに、実施例1−1と同様にして、各積層体を、ボイド率及び耐圧性(破断時圧)を求め、片対数グラフにプロットした(図8)。
フィルムF1に替えて上述のフィルムF4(融点187℃のポリマー層と融点144℃のポリマー層と積層させた多層フィルム)を用いたこと以外は、実施例2−1と同様にして、計4つの積層体を作製した。さらに、実施例2−1と同様にして、各積層体を、ボイド率及び耐圧性(破断時圧)を求め、片対数グラフにプロットした(図8)。
基布CL3(ポリエステル製、経糸及び緯糸の総繊度がそれぞれ470dtex、目付が210g/m2)を準備した。また、フィルムF2を準備した。実施例1−1と同様にして、加熱・加圧により基布CL3とフィルムF2とを貼り合せ、積層体を作製した。その際、貼合せ温度を170℃とし、貼合せ速度を3〜10m/minの間で変更して、計4つの積層体を作製した。さらに、実施例1−1と同様にして、各積層体を、ボイド率及び耐圧性(破断時圧)を求め、片対数グラフにプロットした(図9)。
フィルムF2に替えて上述のフィルムF3を用いたこと以外は、実施例3−1と同様にして、計4つの積層体を作製した。さらに、実施例3−1と同様にして、各積層体を、ボイド率及び耐圧性(破断時圧)を求め、片対数グラフにプロットした(図9)。
同じ基布及び同じポリマー層を用い、貼合せ速度を変更して積層体を作製した。そして、各積層体の断面画像からボイド率(エアポケットの比率)を測定する一方、各積層体の耐圧性を内圧保持率として求めた。
基布CL1(本例では、袋状に織られたエアバック用ワンピースウーブン)、及びフィルムF3を準備した。基布CL1を平面状に広げ(袋状の基布の2層が重ねられた状態で)、フィルムF3を基布CL1の両面に、フィルムF3の多層のうち融点が低い方の層が基布CL1側となるようにしてそれぞれ配置し、図1における貼合せ装置20による加熱・加圧によって、基布CL1が2つのフィルムF3で挟まれてなる積層体(袋状の基布CL1の外面にフィルムF3が貼られたもの)を作製した。貼り合せ時の温度は175℃、貼り合せ速度は2.4m/minであった。なお、作製された積層体の縁部は、基布CL1が含まれておらず、フィルムF3同士が直接接合した部分を含んでいる。
実施例4−1と同様にして、基布CL1及びフィルムF3からなる袋状の積層体を作成したが、貼り合せ時の速度は1.6mm/minであった。そして、実施例4−1と同様に、シーム部の断面画像を取得し、取得した画像から二値化処理画像をさらに取得した。図12及び図13に、実施例4−1の断面画像及び二値化処理された後の画像をそれぞれ示す。
4 第2層(基布)
5 積層体
10 評価装置
11 入力手段
12 出力手段
13 画像取得手段
14 記憶手段
15 解析手段
15a エアポケット検出手段
15b 特性値取得手段
15c 評価手段
16 制御手段
17 光源
18 撮像手段
18a 像拡大手段
18b 撮像手段本体
19 情報処理装置
20 貼合せ装置(ラミネーター)
22 加熱部
23 加圧部
24 冷却部
100 積層体の製造装置
Claims (11)
- 2以上の層が貼り合されてなる積層体を評価する方法であって、
前記積層体の二次元画像を取得する画像取得ステップと、
前記二次元画像からエアポケット対応領域を検出する検出ステップと、
前記エアポケット対応領域の面積に関連する特性値を求める特性値取得ステップと、
前記特性値に基づき前記積層体の貼合せ強度を評価する評価ステップと
を含む、方法。 - 前記評価ステップは、前記特性値と前記積層体の耐圧性との相関に基づき評価することを含む、請求項1に記載の方法。
- 前記検出ステップは、前記二次元画像の光学的特徴量に基づき検出することを含む、請求項1又は2に記載の方法。
- 前記光学的特徴量は輝度値である、請求項3に記載の方法。
- 前記検出ステップは二値化処理を含む、請求項1から4のいずれか一項に記載の方法。
- 前記2以上の層のうち少なくとも一層が可撓性ポリマー層である、請求項1から5のいずれか一項に記載の方法。
- 前記2以上の層のうち一層が基布であり、別の一層が、前記基布に貼り合された可撓性ポリマー層である、請求項1から6のいずれか一項に記載の方法。
- 2以上の層が貼り合されてなる積層体を評価する装置であって、
前記積層体の二次元画像を取得する画像取得手段と、
前記二次元画像からエアポケット対応領域を検出する検出手段と、
前記エアポケット対応領域の面積に関連する特性値を求める特性値取得手段と、
前記特性値に基づき前記積層体の貼合せ強度を評価する評価手段とを備える、装置。 - 2以上の層が貼り合されてなる積層体を製造する方法であって、
少なくとも一層がポリマー製である2以上の層を貼り合せて積層体を形成し、
請求項1から6のいずれか一項に記載の方法によって、前記積層体の貼合せ強度をインラインで評価する、方法。 - 前記評価をフィードバックして、前記貼合せの条件を変更する、請求項9に記載の方法。
- 2以上の層が貼り合されてなる積層体を製造する装置であって、
少なくとも一層がポリマー製である2以上の層を貼り合せて積層体を形成する貼合せ手段と、
前記貼合せ手段に後置された、請求項8に記載の装置とを備えた、装置。
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