JP2019530801A5 - - Google Patents
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- Publication number
- JP2019530801A5 JP2019530801A5 JP2019515490A JP2019515490A JP2019530801A5 JP 2019530801 A5 JP2019530801 A5 JP 2019530801A5 JP 2019515490 A JP2019515490 A JP 2019515490A JP 2019515490 A JP2019515490 A JP 2019515490A JP 2019530801 A5 JP2019530801 A5 JP 2019530801A5
- Authority
- JP
- Japan
- Prior art keywords
- sputtering
- face plate
- deposition chamber
- plate
- backing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004544 sputter deposition Methods 0.000 claims 19
- 238000000151 deposition Methods 0.000 claims 10
- 230000008021 deposition Effects 0.000 claims 9
- 238000000034 method Methods 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- 239000013077 target material Substances 0.000 claims 4
- 229910052721 tungsten Inorganic materials 0.000 claims 4
- 239000010937 tungsten Substances 0.000 claims 4
- 239000012530 fluid Substances 0.000 claims 3
- 150000002739 metals Chemical class 0.000 claims 3
- 239000002243 precursor Substances 0.000 claims 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052804 chromium Inorganic materials 0.000 claims 2
- 239000011651 chromium Substances 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910003468 tantalcarbide Inorganic materials 0.000 claims 2
- 229910052715 tantalum Inorganic materials 0.000 claims 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 2
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- 229910052719 titanium Inorganic materials 0.000 claims 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 2
- -1 tungsten nitride Chemical class 0.000 claims 2
- 238000003475 lamination Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662399030P | 2016-09-23 | 2016-09-23 | |
| US62/399,030 | 2016-09-23 | ||
| PCT/US2017/051614 WO2018057396A1 (en) | 2016-09-23 | 2017-09-14 | Sputtering showerhead |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019530801A JP2019530801A (ja) | 2019-10-24 |
| JP2019530801A5 true JP2019530801A5 (enExample) | 2020-11-12 |
| JP7175266B2 JP7175266B2 (ja) | 2022-11-18 |
Family
ID=61688305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019515490A Active JP7175266B2 (ja) | 2016-09-23 | 2017-09-14 | スパッタリングシャワーヘッド |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10577689B2 (enExample) |
| JP (1) | JP7175266B2 (enExample) |
| KR (1) | KR102195798B1 (enExample) |
| CN (1) | CN109477207A (enExample) |
| TW (1) | TWI691607B (enExample) |
| WO (1) | WO2018057396A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102590931B1 (ko) * | 2018-07-27 | 2023-10-19 | 어플라이드 머티어리얼스, 인코포레이티드 | 열 증착을 위한 가스 분배 판 |
| US11052496B2 (en) * | 2019-09-26 | 2021-07-06 | Worldwide Machinery, Ltd. | Backing material for welding |
| JP2021143399A (ja) * | 2020-03-12 | 2021-09-24 | 東京エレクトロン株式会社 | 成膜装置 |
| US12080522B2 (en) | 2020-04-22 | 2024-09-03 | Applied Materials, Inc. | Preclean chamber upper shield with showerhead |
| USD973609S1 (en) | 2020-04-22 | 2022-12-27 | Applied Materials, Inc. | Upper shield with showerhead for a process chamber |
| US20230332291A1 (en) * | 2020-09-28 | 2023-10-19 | Lam Research Corporation | Remote plasma architecture for true radical processing |
| US20220154325A1 (en) * | 2020-11-18 | 2022-05-19 | Entegris, Inc. | Articles coated with crack-resistant fluoro-annealed films and methods of making |
| US12498076B2 (en) * | 2022-06-23 | 2025-12-16 | Dynaflex Products | Method of plating an automotive exhaust pipe |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05109655A (ja) * | 1991-10-15 | 1993-04-30 | Applied Materials Japan Kk | Ｃｖｄ−スパツタ装置 |
| EP0808915A3 (en) * | 1996-05-23 | 1998-08-05 | Applied Materials, Inc. | Chemical vapor deposition and sputtering method and apparatus |
| JP2954028B2 (ja) * | 1996-08-16 | 1999-09-27 | 山形日本電気株式会社 | スパッタリング装置 |
| US6123775A (en) * | 1999-06-30 | 2000-09-26 | Lam Research Corporation | Reaction chamber component having improved temperature uniformity |
| JP4454781B2 (ja) * | 2000-04-18 | 2010-04-21 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| US6596133B1 (en) | 2001-06-14 | 2003-07-22 | Cvc Products, Inc. | Method and system for physically-assisted chemical-vapor deposition |
| US6830664B2 (en) * | 2002-08-05 | 2004-12-14 | Tegal Corporation | Cluster tool with a hollow cathode array |
| US6983892B2 (en) | 2004-02-05 | 2006-01-10 | Applied Materials, Inc. | Gas distribution showerhead for semiconductor processing |
| JP4698251B2 (ja) | 2004-02-24 | 2011-06-08 | アプライド マテリアルズ インコーポレイテッド | 可動又は柔軟なシャワーヘッド取り付け |
| US7601246B2 (en) | 2004-09-29 | 2009-10-13 | Lam Research Corporation | Methods of sputtering a protective coating on a semiconductor substrate |
| CN100523293C (zh) | 2004-11-30 | 2009-08-05 | 东京毅力科创株式会社 | 成膜方法及成膜装置 |
| US8075952B2 (en) * | 2006-06-29 | 2011-12-13 | Applied Materials, Inc. | Power loading substrates to reduce particle contamination |
| CN102737949B (zh) | 2007-07-20 | 2016-09-07 | 应用材料公司 | 等离子体工艺设备中用于至射频驱动电极的气体传递的射频扼流器 |
| WO2009135050A2 (en) | 2008-05-02 | 2009-11-05 | Applied Materials, Inc. | Process kit for rf physical vapor deposition |
| KR20120004502A (ko) | 2009-04-03 | 2012-01-12 | 어플라이드 머티어리얼스, 인코포레이티드 | 고압 ｒｆ-ｄｃ 스퍼터링과 이 프로세스의 단차 도포성 및 막 균일성을 개선하기 위한 방법 |
| KR20110105308A (ko) * | 2010-03-18 | 2011-09-26 | 최대규 | 스퍼터링 챔버 |
| WO2011139775A2 (en) | 2010-04-28 | 2011-11-10 | Applied Materials, Inc. | Process chamber lid design with built-in plasma source for short lifetime species |
| TW201216331A (en) | 2010-10-05 | 2012-04-16 | Applied Materials Inc | Ultra high selectivity doped amorphous carbon strippable hardmask development and integration |
| KR101179453B1 (ko) * | 2010-12-15 | 2012-09-07 | 엘아이지에이디피 주식회사 | 화학기상 증착장치 |
| US11183375B2 (en) | 2014-03-31 | 2021-11-23 | Applied Materials, Inc. | Deposition system with multi-cathode and method of manufacture thereof |
-
2017
- 2017-09-14 JP JP2019515490A patent/JP7175266B2/ja active Active
- 2017-09-14 US US15/704,850 patent/US10577689B2/en active Active
- 2017-09-14 WO PCT/US2017/051614 patent/WO2018057396A1/en not_active Ceased
- 2017-09-14 CN CN201780044489.4A patent/CN109477207A/zh active Pending
- 2017-09-14 KR KR1020197004630A patent/KR102195798B1/ko active Active
- 2017-09-22 TW TW106132596A patent/TWI691607B/zh active
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