JP2019524931A5 - - Google Patents

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Publication number
JP2019524931A5
JP2019524931A5 JP2019502204A JP2019502204A JP2019524931A5 JP 2019524931 A5 JP2019524931 A5 JP 2019524931A5 JP 2019502204 A JP2019502204 A JP 2019502204A JP 2019502204 A JP2019502204 A JP 2019502204A JP 2019524931 A5 JP2019524931 A5 JP 2019524931A5
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JP
Japan
Prior art keywords
repeating unit
formulation
led
formulation according
metal element
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JP2019502204A
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English (en)
Japanese (ja)
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JP6801077B2 (ja
JP2019524931A (ja
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Priority claimed from PCT/EP2017/067809 external-priority patent/WO2018015284A1/en
Publication of JP2019524931A publication Critical patent/JP2019524931A/ja
Publication of JP2019524931A5 publication Critical patent/JP2019524931A5/ja
Application granted granted Critical
Publication of JP6801077B2 publication Critical patent/JP6801077B2/ja
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JP2019502204A 2016-07-18 2017-07-14 Led封止材料のための配合物 Active JP6801077B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662363502P 2016-07-18 2016-07-18
US62/363,502 2016-07-18
PCT/EP2017/067809 WO2018015284A1 (en) 2016-07-18 2017-07-14 Formulation for an led encapsulation material

Publications (3)

Publication Number Publication Date
JP2019524931A JP2019524931A (ja) 2019-09-05
JP2019524931A5 true JP2019524931A5 (cg-RX-API-DMAC7.html) 2020-10-08
JP6801077B2 JP6801077B2 (ja) 2020-12-16

Family

ID=59363146

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019502204A Active JP6801077B2 (ja) 2016-07-18 2017-07-14 Led封止材料のための配合物

Country Status (8)

Country Link
US (1) US10822459B2 (cg-RX-API-DMAC7.html)
EP (1) EP3485520B1 (cg-RX-API-DMAC7.html)
JP (1) JP6801077B2 (cg-RX-API-DMAC7.html)
KR (1) KR102191894B1 (cg-RX-API-DMAC7.html)
CN (1) CN109564961A (cg-RX-API-DMAC7.html)
SG (1) SG11201900395VA (cg-RX-API-DMAC7.html)
TW (1) TWI716614B (cg-RX-API-DMAC7.html)
WO (1) WO2018015284A1 (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11098068B2 (en) * 2017-06-06 2021-08-24 Dow Silicones Corporation Method of making a halosiloxane
US10921261B2 (en) * 2019-05-09 2021-02-16 Kla Corporation Strontium tetraborate as optical coating material
CN117304696A (zh) * 2023-09-12 2023-12-29 广东微观科技有限公司 一种应用于led灯带的光扩散封装材料及其制备方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6274924B1 (en) 1998-11-05 2001-08-14 Lumileds Lighting, U.S. Llc Surface mountable LED package
US6204523B1 (en) 1998-11-06 2001-03-20 Lumileds Lighting, U.S., Llc High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range
US6534184B2 (en) 2001-02-26 2003-03-18 Kion Corporation Polysilazane/polysiloxane block copolymers
US7737187B2 (en) 2003-12-19 2010-06-15 Nissan Chemical Industries, Ltd. Process for producing inorganic oxide organosol
US20070092736A1 (en) * 2005-10-21 2007-04-26 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
WO2007047260A1 (en) * 2005-10-17 2007-04-26 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
DE102005061965A1 (de) 2005-12-23 2007-07-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Oxidische Agglomeratpartikel, Verfahren zur Herstellung von Nanokompositen sowie deren Verwendung
US9287469B2 (en) 2008-05-02 2016-03-15 Cree, Inc. Encapsulation for phosphor-converted white light emitting diode
US20100213415A1 (en) * 2009-02-26 2010-08-26 Nitto Denko Corporation Metal oxide fine particles, silicone resin composition and use thereof
WO2010110204A1 (ja) * 2009-03-27 2010-09-30 コニカミノルタオプト株式会社 蛍光体部材、蛍光体部材の製造方法、及び照明装置
US9041034B2 (en) 2010-11-18 2015-05-26 3M Innovative Properties Company Light emitting diode component comprising polysilazane bonding layer
WO2013008982A1 (ko) 2011-07-14 2013-01-17 엘티씨 (주) 높은 광추출 성능을 갖는 무기 산란막 {inorganic scattering films having high light extraction performance}
JP2014077117A (ja) 2012-09-21 2014-05-01 Dow Corning Toray Co Ltd 高屈折性表面処理剤、それを用いて表面処理された微細部材および光学材料
WO2014062871A1 (en) 2012-10-19 2014-04-24 Osram Sylvania Inc. Index matched composite materials and light sources incorporating the same
CN103322525B (zh) 2013-06-17 2015-04-22 深圳市源磊科技有限公司 Led灯及其灯丝
EP3022249A1 (en) 2013-07-19 2016-05-25 AZ Electronic Materials (Luxembourg) S.à.r.l. Encapsulation material for light emitting diodes
US9935246B2 (en) * 2013-12-30 2018-04-03 Cree, Inc. Silazane-containing materials for light emitting diodes
EP3110881B1 (en) * 2014-02-28 2018-06-06 AZ Electronic Materials (Luxembourg) S.à.r.l. Hybrid material for optoelectronic applications
EP3174948B1 (de) 2014-07-29 2021-06-09 Merck Patent GmbH Hybridmaterial zur verwendung als beschichtungsmittel in optoelektronischen bauteilen

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