TWI716614B - 用於發光裝置封裝材料之調配物 - Google Patents

用於發光裝置封裝材料之調配物 Download PDF

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TWI716614B
TWI716614B TW106123566A TW106123566A TWI716614B TW I716614 B TWI716614 B TW I716614B TW 106123566 A TW106123566 A TW 106123566A TW 106123566 A TW106123566 A TW 106123566A TW I716614 B TWI716614 B TW I716614B
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Taiwan
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group
formulation
led
polymer
repeating unit
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TW106123566A
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Chinese (zh)
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TW201823330A (zh
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拉福 葛洛坦紐勒
亞伯拉罕 卡沙斯 葛西亞-明奎蘭
北文雄
迪特 華格納
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德商馬克專利公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/04Ingredients treated with organic substances
    • C08K9/06Ingredients treated with organic substances with silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/22Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/54Nitrogen-containing linkages
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/28Nitrogen-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • C08L83/08Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10Block- or graft-copolymers containing polysiloxane sequences
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/854Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2237Oxides; Hydroxides of metals of titanium
    • C08K2003/2241Titanium dioxide
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/28Nitrogen-containing compounds
    • C08K2003/282Binary compounds of nitrogen with aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/011Nanostructured additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/019Specific properties of additives the composition being defined by the absence of a certain additive
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0362Manufacture or treatment of packages of encapsulations

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
  • Electroluminescent Light Sources (AREA)
TW106123566A 2016-07-18 2017-07-14 用於發光裝置封裝材料之調配物 TWI716614B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662363502P 2016-07-18 2016-07-18
US62/363,502 2016-07-18

Publications (2)

Publication Number Publication Date
TW201823330A TW201823330A (zh) 2018-07-01
TWI716614B true TWI716614B (zh) 2021-01-21

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US (1) US10822459B2 (cg-RX-API-DMAC7.html)
EP (1) EP3485520B1 (cg-RX-API-DMAC7.html)
JP (1) JP6801077B2 (cg-RX-API-DMAC7.html)
KR (1) KR102191894B1 (cg-RX-API-DMAC7.html)
CN (1) CN109564961A (cg-RX-API-DMAC7.html)
SG (1) SG11201900395VA (cg-RX-API-DMAC7.html)
TW (1) TWI716614B (cg-RX-API-DMAC7.html)
WO (1) WO2018015284A1 (cg-RX-API-DMAC7.html)

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* Cited by examiner, † Cited by third party
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US11098068B2 (en) * 2017-06-06 2021-08-24 Dow Silicones Corporation Method of making a halosiloxane
US10921261B2 (en) * 2019-05-09 2021-02-16 Kla Corporation Strontium tetraborate as optical coating material
CN117304696A (zh) * 2023-09-12 2023-12-29 广东微观科技有限公司 一种应用于led灯带的光扩散封装材料及其制备方法

Citations (2)

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TW200721556A (en) * 2005-10-17 2007-06-01 3M Innovative Properties Co Method of making light emitting device with silicon-containing encapsulant
US20150188006A1 (en) * 2013-12-30 2015-07-02 Cree, Inc. Silazane-containing materials for light emitting diodes

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US6274924B1 (en) 1998-11-05 2001-08-14 Lumileds Lighting, U.S. Llc Surface mountable LED package
US6204523B1 (en) 1998-11-06 2001-03-20 Lumileds Lighting, U.S., Llc High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range
US6534184B2 (en) 2001-02-26 2003-03-18 Kion Corporation Polysilazane/polysiloxane block copolymers
US7737187B2 (en) 2003-12-19 2010-06-15 Nissan Chemical Industries, Ltd. Process for producing inorganic oxide organosol
US20070092736A1 (en) * 2005-10-21 2007-04-26 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
DE102005061965A1 (de) 2005-12-23 2007-07-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Oxidische Agglomeratpartikel, Verfahren zur Herstellung von Nanokompositen sowie deren Verwendung
US9287469B2 (en) 2008-05-02 2016-03-15 Cree, Inc. Encapsulation for phosphor-converted white light emitting diode
US20100213415A1 (en) * 2009-02-26 2010-08-26 Nitto Denko Corporation Metal oxide fine particles, silicone resin composition and use thereof
WO2010110204A1 (ja) * 2009-03-27 2010-09-30 コニカミノルタオプト株式会社 蛍光体部材、蛍光体部材の製造方法、及び照明装置
US9041034B2 (en) 2010-11-18 2015-05-26 3M Innovative Properties Company Light emitting diode component comprising polysilazane bonding layer
WO2013008982A1 (ko) 2011-07-14 2013-01-17 엘티씨 (주) 높은 광추출 성능을 갖는 무기 산란막 {inorganic scattering films having high light extraction performance}
JP2014077117A (ja) 2012-09-21 2014-05-01 Dow Corning Toray Co Ltd 高屈折性表面処理剤、それを用いて表面処理された微細部材および光学材料
WO2014062871A1 (en) 2012-10-19 2014-04-24 Osram Sylvania Inc. Index matched composite materials and light sources incorporating the same
CN103322525B (zh) 2013-06-17 2015-04-22 深圳市源磊科技有限公司 Led灯及其灯丝
EP3022249A1 (en) 2013-07-19 2016-05-25 AZ Electronic Materials (Luxembourg) S.à.r.l. Encapsulation material for light emitting diodes
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TW200721556A (en) * 2005-10-17 2007-06-01 3M Innovative Properties Co Method of making light emitting device with silicon-containing encapsulant
US20150188006A1 (en) * 2013-12-30 2015-07-02 Cree, Inc. Silazane-containing materials for light emitting diodes

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CN109564961A (zh) 2019-04-02
US20200181332A1 (en) 2020-06-11
SG11201900395VA (en) 2019-02-27
EP3485520B1 (en) 2022-01-26
JP6801077B2 (ja) 2020-12-16
KR20190031289A (ko) 2019-03-25
EP3485520A1 (en) 2019-05-22
KR102191894B1 (ko) 2020-12-17
TW201823330A (zh) 2018-07-01
WO2018015284A1 (en) 2018-01-25
US10822459B2 (en) 2020-11-03
JP2019524931A (ja) 2019-09-05

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