TWI716614B - 用於發光裝置封裝材料之調配物 - Google Patents
用於發光裝置封裝材料之調配物 Download PDFInfo
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- TWI716614B TWI716614B TW106123566A TW106123566A TWI716614B TW I716614 B TWI716614 B TW I716614B TW 106123566 A TW106123566 A TW 106123566A TW 106123566 A TW106123566 A TW 106123566A TW I716614 B TWI716614 B TW I716614B
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/019—Specific properties of additives the composition being defined by the absence of a certain additive
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
- Electroluminescent Light Sources (AREA)
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| US201662363502P | 2016-07-18 | 2016-07-18 | |
| US62/363,502 | 2016-07-18 |
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| TW201823330A TW201823330A (zh) | 2018-07-01 |
| TWI716614B true TWI716614B (zh) | 2021-01-21 |
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| TW106123566A TWI716614B (zh) | 2016-07-18 | 2017-07-14 | 用於發光裝置封裝材料之調配物 |
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| US11098068B2 (en) * | 2017-06-06 | 2021-08-24 | Dow Silicones Corporation | Method of making a halosiloxane |
| US10921261B2 (en) * | 2019-05-09 | 2021-02-16 | Kla Corporation | Strontium tetraborate as optical coating material |
| CN117304696A (zh) * | 2023-09-12 | 2023-12-29 | 广东微观科技有限公司 | 一种应用于led灯带的光扩散封装材料及其制备方法 |
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| TW200721556A (en) * | 2005-10-17 | 2007-06-01 | 3M Innovative Properties Co | Method of making light emitting device with silicon-containing encapsulant |
| US20150188006A1 (en) * | 2013-12-30 | 2015-07-02 | Cree, Inc. | Silazane-containing materials for light emitting diodes |
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| US6274924B1 (en) | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
| US6204523B1 (en) | 1998-11-06 | 2001-03-20 | Lumileds Lighting, U.S., Llc | High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range |
| US6534184B2 (en) | 2001-02-26 | 2003-03-18 | Kion Corporation | Polysilazane/polysiloxane block copolymers |
| US7737187B2 (en) | 2003-12-19 | 2010-06-15 | Nissan Chemical Industries, Ltd. | Process for producing inorganic oxide organosol |
| US20070092736A1 (en) * | 2005-10-21 | 2007-04-26 | 3M Innovative Properties Company | Method of making light emitting device with silicon-containing encapsulant |
| DE102005061965A1 (de) | 2005-12-23 | 2007-07-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Oxidische Agglomeratpartikel, Verfahren zur Herstellung von Nanokompositen sowie deren Verwendung |
| US9287469B2 (en) | 2008-05-02 | 2016-03-15 | Cree, Inc. | Encapsulation for phosphor-converted white light emitting diode |
| US20100213415A1 (en) * | 2009-02-26 | 2010-08-26 | Nitto Denko Corporation | Metal oxide fine particles, silicone resin composition and use thereof |
| WO2010110204A1 (ja) * | 2009-03-27 | 2010-09-30 | コニカミノルタオプト株式会社 | 蛍光体部材、蛍光体部材の製造方法、及び照明装置 |
| US9041034B2 (en) | 2010-11-18 | 2015-05-26 | 3M Innovative Properties Company | Light emitting diode component comprising polysilazane bonding layer |
| WO2013008982A1 (ko) | 2011-07-14 | 2013-01-17 | 엘티씨 (주) | 높은 광추출 성능을 갖는 무기 산란막 {inorganic scattering films having high light extraction performance} |
| JP2014077117A (ja) | 2012-09-21 | 2014-05-01 | Dow Corning Toray Co Ltd | 高屈折性表面処理剤、それを用いて表面処理された微細部材および光学材料 |
| WO2014062871A1 (en) | 2012-10-19 | 2014-04-24 | Osram Sylvania Inc. | Index matched composite materials and light sources incorporating the same |
| CN103322525B (zh) | 2013-06-17 | 2015-04-22 | 深圳市源磊科技有限公司 | Led灯及其灯丝 |
| EP3022249A1 (en) | 2013-07-19 | 2016-05-25 | AZ Electronic Materials (Luxembourg) S.à.r.l. | Encapsulation material for light emitting diodes |
| EP3110881B1 (en) * | 2014-02-28 | 2018-06-06 | AZ Electronic Materials (Luxembourg) S.à.r.l. | Hybrid material for optoelectronic applications |
| EP3174948B1 (de) | 2014-07-29 | 2021-06-09 | Merck Patent GmbH | Hybridmaterial zur verwendung als beschichtungsmittel in optoelektronischen bauteilen |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200721556A (en) * | 2005-10-17 | 2007-06-01 | 3M Innovative Properties Co | Method of making light emitting device with silicon-containing encapsulant |
| US20150188006A1 (en) * | 2013-12-30 | 2015-07-02 | Cree, Inc. | Silazane-containing materials for light emitting diodes |
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| CN109564961A (zh) | 2019-04-02 |
| US20200181332A1 (en) | 2020-06-11 |
| SG11201900395VA (en) | 2019-02-27 |
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| EP3485520A1 (en) | 2019-05-22 |
| KR102191894B1 (ko) | 2020-12-17 |
| TW201823330A (zh) | 2018-07-01 |
| WO2018015284A1 (en) | 2018-01-25 |
| US10822459B2 (en) | 2020-11-03 |
| JP2019524931A (ja) | 2019-09-05 |
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