JP2019517736A5 - - Google Patents
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- Publication number
- JP2019517736A5 JP2019517736A5 JP2018562373A JP2018562373A JP2019517736A5 JP 2019517736 A5 JP2019517736 A5 JP 2019517736A5 JP 2018562373 A JP2018562373 A JP 2018562373A JP 2018562373 A JP2018562373 A JP 2018562373A JP 2019517736 A5 JP2019517736 A5 JP 2019517736A5
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- coupled
- transfer
- plasma cleaning
- processing system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 210000002381 Plasma Anatomy 0.000 claims 25
- 238000004140 cleaning Methods 0.000 claims 19
- 239000000758 substrate Substances 0.000 claims 18
- 229910052904 quartz Inorganic materials 0.000 claims 5
- 239000010453 quartz Substances 0.000 claims 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 5
- 238000010438 heat treatment Methods 0.000 claims 4
- 238000004805 robotic Methods 0.000 claims 4
- 230000001808 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 238000000407 epitaxy Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662345160P | 2016-06-03 | 2016-06-03 | |
US62/345,160 | 2016-06-03 | ||
US201762491143P | 2017-04-27 | 2017-04-27 | |
US62/491,143 | 2017-04-27 | ||
US15/499,100 US20170350038A1 (en) | 2016-06-03 | 2017-04-27 | Vacuum platform with process chambers for removing carbon contaminants and surface oxide from semiconductor substrates |
US15/499,100 | 2017-04-27 | ||
PCT/US2017/031590 WO2017209900A1 (en) | 2016-06-03 | 2017-05-08 | A vacuum platform with process chambers for removing carbon contaminants and surface oxide from semiconductor substrates |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2019517736A JP2019517736A (ja) | 2019-06-24 |
JP2019517736A5 true JP2019517736A5 (ko) | 2020-06-18 |
JP7190905B2 JP7190905B2 (ja) | 2022-12-16 |
Family
ID=61725115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018562373A Active JP7190905B2 (ja) | 2016-06-03 | 2017-05-08 | 半導体基板から炭素汚染物質及び表面酸化物を除去するための処理チャンバを有する真空プラットフォーム |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7190905B2 (ko) |
KR (1) | KR102196746B1 (ko) |
TW (1) | TWI703665B (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7114384B2 (ja) * | 2018-07-26 | 2022-08-08 | 株式会社アルバック | 酸化膜除去方法、および、酸化膜除去装置 |
US20200411342A1 (en) | 2019-06-27 | 2020-12-31 | Applied Materials, Inc. | Beamline architecture with integrated plasma processing |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070020890A1 (en) * | 2005-07-19 | 2007-01-25 | Applied Materials, Inc. | Method and apparatus for semiconductor processing |
US7658802B2 (en) * | 2005-11-22 | 2010-02-09 | Applied Materials, Inc. | Apparatus and a method for cleaning a dielectric film |
US7942969B2 (en) * | 2007-05-30 | 2011-05-17 | Applied Materials, Inc. | Substrate cleaning chamber and components |
JP6114698B2 (ja) * | 2011-03-01 | 2017-04-12 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | デュアルロードロック構成内の除害及びストリップ処理チャンバ |
KR102245729B1 (ko) * | 2013-08-09 | 2021-04-28 | 어플라이드 머티어리얼스, 인코포레이티드 | 에피택셜 성장 이전에 기판 표면을 사전 세정하기 위한 방법 및 장치 |
KR102133895B1 (ko) * | 2013-11-06 | 2020-07-15 | 어플라이드 머티어리얼스, 인코포레이티드 | Dc 바이어스 변조에 의한 입자 발생 억제기 |
TWI643971B (zh) * | 2014-01-05 | 2018-12-11 | 美商應用材料股份有限公司 | 使用空間原子層沉積或脈衝化學氣相沉積之薄膜沉積 |
US9508561B2 (en) * | 2014-03-11 | 2016-11-29 | Applied Materials, Inc. | Methods for forming interconnection structures in an integrated cluster system for semicondcutor applications |
-
2017
- 2017-05-08 KR KR1020197000133A patent/KR102196746B1/ko active IP Right Grant
- 2017-05-08 JP JP2018562373A patent/JP7190905B2/ja active Active
- 2017-05-11 TW TW106115538A patent/TWI703665B/zh active
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