JP2019516818A - 熱硬化性二成分系エポキシ樹脂 - Google Patents
熱硬化性二成分系エポキシ樹脂 Download PDFInfo
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- JP2019516818A JP2019516818A JP2018551294A JP2018551294A JP2019516818A JP 2019516818 A JP2019516818 A JP 2019516818A JP 2018551294 A JP2018551294 A JP 2018551294A JP 2018551294 A JP2018551294 A JP 2018551294A JP 2019516818 A JP2019516818 A JP 2019516818A
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- epoxy resin
- thermosetting
- resin system
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- Prior art date
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- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 119
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 39
- 239000003085 diluting agent Substances 0.000 claims abstract description 81
- 239000003054 catalyst Substances 0.000 claims abstract description 66
- 239000000203 mixture Substances 0.000 claims description 35
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 22
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 15
- 239000002841 Lewis acid Substances 0.000 claims description 14
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- 238000006243 chemical reaction Methods 0.000 description 20
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- 239000003431 cross linking reagent Substances 0.000 description 7
- LWAVGNJLLQSNNN-UHFFFAOYSA-N (2,5-dioxopyrrolidin-1-yl) 4-azidobenzoate Chemical compound C1=CC(N=[N+]=[N-])=CC=C1C(=O)ON1C(=O)CCC1=O LWAVGNJLLQSNNN-UHFFFAOYSA-N 0.000 description 6
- 239000002585 base Substances 0.000 description 6
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- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- FKBMTBAXDISZGN-UHFFFAOYSA-N 5-methyl-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1C(C)CCC2C(=O)OC(=O)C12 FKBMTBAXDISZGN-UHFFFAOYSA-N 0.000 description 2
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- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
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- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910000085 borane Inorganic materials 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
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- 150000002170 ethers Chemical class 0.000 description 2
- UXOLDCOJRAMLTQ-UHFFFAOYSA-N ethyl 2-chloro-2-hydroxyiminoacetate Chemical compound CCOC(=O)C(Cl)=NO UXOLDCOJRAMLTQ-UHFFFAOYSA-N 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 229910052740 iodine Inorganic materials 0.000 description 2
- 239000011630 iodine Substances 0.000 description 2
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- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
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- RSWGJHLUYNHPMX-UHFFFAOYSA-N 1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylic acid Chemical compound C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
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- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
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- PVFQHGDIOXNKIC-UHFFFAOYSA-N 4-[2-[3-[2-(4-hydroxyphenyl)propan-2-yl]phenyl]propan-2-yl]phenol Chemical compound C=1C=CC(C(C)(C)C=2C=CC(O)=CC=2)=CC=1C(C)(C)C1=CC=C(O)C=C1 PVFQHGDIOXNKIC-UHFFFAOYSA-N 0.000 description 1
- RBHIUNHSNSQJNG-UHFFFAOYSA-N 6-methyl-3-(2-methyloxiran-2-yl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2(C)OC2CC1C1(C)CO1 RBHIUNHSNSQJNG-UHFFFAOYSA-N 0.000 description 1
- YWFPGFJLYRKYJZ-UHFFFAOYSA-N 9,9-bis(4-hydroxyphenyl)fluorene Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 YWFPGFJLYRKYJZ-UHFFFAOYSA-N 0.000 description 1
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- TVJRZKOMYDCLFX-UHFFFAOYSA-N B.ClC(CCCCCCCN(C)C)(Cl)Cl Chemical compound B.ClC(CCCCCCCN(C)C)(Cl)Cl TVJRZKOMYDCLFX-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 1
- HTVITOHKHWFJKO-UHFFFAOYSA-N Bisphenol B Chemical compound C=1C=C(O)C=CC=1C(C)(CC)C1=CC=C(O)C=C1 HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 1
- GIXXQTYGFOHYPT-UHFFFAOYSA-N Bisphenol P Chemical compound C=1C=C(C(C)(C)C=2C=CC(O)=CC=2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 GIXXQTYGFOHYPT-UHFFFAOYSA-N 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
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- 239000000370 acceptor Substances 0.000 description 1
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- 239000004327 boric acid Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
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- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
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- MUTGBJKUEZFXGO-UHFFFAOYSA-N hexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21 MUTGBJKUEZFXGO-UHFFFAOYSA-N 0.000 description 1
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- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
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Abstract
Description
−エポキシ樹脂を含む第1成分;および
−第1成分とは分離した状態で存在する第2成分
を含み、第2成分が単独重合用触媒および反応性希釈剤を含むことを特徴とする。
−単独重合用触媒;および
−反応性希釈剤
を含む熱硬化性二成分系エポキシ樹脂システムのための混合物を提供する。
エポキシ樹脂をベースとし、無機物を充填した電子部品封止用樹脂が提供される。この樹脂成分は、無機充填剤を含む。ハロゲン化難燃剤、硬化性成分としての酸無水物はいずれも含まれていない。100重量%のWEVOPOX VP GE 7314/6−3(樹脂成分または第1成分)に10重量%のWEVODUR VP GE 7314/6−3(単独重合用触媒および反応性希釈剤を含む第2成分)を加え、80℃まで徐々に加熱して樹脂成分の粘度を下げた後、混合する。得られた混合物は、封止用コンパウンドとしてそのまま使用することができる。上記の二成分を1〜5mbarであらかじめ脱気することにより、最終的に得られるエポキシ樹脂システムの電気的特性を向上させることができる。250gの本発明のエポキシ樹脂システムが生成される。
実施例1において100重量%のWEVOPOX VP GE 7314/6−3および10重量%のWEVODUR VP GE 7314/6−3から調製した本発明の熱硬化性二成分系エポキシ樹脂システムの特性と、従来のエポキシ樹脂システムの特性を比較する。100重量%のWEVOPOX VP GE 06−2012/4−6(エポキシ樹脂含有成分)および24重量%のWEVODUR VP GE 06−2012/4−6(酸無水物含有成分)からなる従来のエポキシ樹脂システムも二成分系システムであるが、酸無水物を硬化剤として使用している(比較例)。
Claims (12)
- エポキシ樹脂を含む第1成分;および
第1成分とは分離した状態で存在する第2成分
を含み、第2成分が単独重合用触媒および反応性希釈剤を含むことを特徴とする熱硬化性二成分系エポキシ樹脂システム。 - 前記エポキシ樹脂が、ビスフェノール系エポキシ樹脂、ノボラックエポキシ樹脂、脂肪族エポキシ樹脂、ハロゲン化エポキシ樹脂およびこれらの組み合わせからなる群から選択される、請求項1に記載の熱硬化性二成分系エポキシ樹脂システム。
- 第1成分が反応性希釈剤を含む、先行する請求項のいずれか1項に記載の熱硬化性二成分系エポキシ樹脂システム。
- 第1成分の反応性希釈剤および/または第2成分の反応性希釈剤が、グリシジルエーテル類およびそれらの組み合わせからなる群から選択される、先行する請求項のいずれか1項に記載の熱硬化性二成分系エポキシ樹脂システム。
- 前記単独重合用触媒が、ルイス酸、ルイス塩基およびそれらの組み合わせからなる群から選択される、先行する請求項のいずれか1項に記載の熱硬化性二成分系エポキシ樹脂システム。
- 第1成分および/または第2成分が、熱伝導性粒子、充填剤、色素およびこれらの組み合わせからなる群から選択される構成要素を含む、先行する請求項のいずれか1項に記載の熱硬化性二成分系エポキシ樹脂システム。
- 第1成分が、その全重量100重量%に対して、30〜40重量%のエポキシ樹脂、5〜10重量%の反応性希釈剤、40〜60重量%の充填剤および0.5〜1.5重量%の顔料ペーストを含む、先行する請求項のいずれか1項に記載の熱硬化性二成分系エポキシ樹脂システム。
- 第2成分が、その全重量100重量%に対して、70〜90重量%の反応性希釈剤および10〜30重量%の単独重合用触媒を含む、先行する請求項のいずれか1項に記載の熱硬化性二成分系エポキシ樹脂システム。
- 80〜98重量%の第1成分および2〜20重量%の第2成分を含む、先行する請求項のいずれか1項に記載の熱硬化性二成分系エポキシ樹脂システム。
- 先行する請求項のいずれか1項に記載の熱硬化性二成分系エポキシ樹脂システムの、封止樹脂、複合繊維の構成成分、腐食防止剤または接着剤としての使用。
- 単独重合用触媒および反応性希釈剤を含む、熱硬化性二成分系エポキシ樹脂システムのための混合物。
- 10〜30重量%の単独重合用触媒および70〜90重量%の反応性希釈剤を含む、請求項11に記載の熱硬化性二成分系エポキシ樹脂システムのための混合物。
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DE102016106031.3A DE102016106031A1 (de) | 2016-04-01 | 2016-04-01 | Heißhärtendes Zweikomponenten-Epoxidharz |
DE102016106031.3 | 2016-04-01 | ||
PCT/EP2017/057452 WO2017167825A1 (de) | 2016-04-01 | 2017-03-29 | Heisshärtendes zweikomponenten-epoxidharz |
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CA3019263C (en) | 2022-09-20 |
ZA201806573B (en) | 2021-02-24 |
RU2710557C1 (ru) | 2019-12-27 |
MX2018011924A (es) | 2019-03-28 |
SG11201808591RA (en) | 2018-10-30 |
JP6753947B2 (ja) | 2020-09-09 |
BR112018069988A2 (pt) | 2019-04-30 |
DE102016106031A1 (de) | 2017-10-05 |
EP3436466A1 (de) | 2019-02-06 |
KR102220274B1 (ko) | 2021-02-24 |
US20190031819A1 (en) | 2019-01-31 |
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