JP2019515504A5 - - Google Patents

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Publication number
JP2019515504A5
JP2019515504A5 JP2018557409A JP2018557409A JP2019515504A5 JP 2019515504 A5 JP2019515504 A5 JP 2019515504A5 JP 2018557409 A JP2018557409 A JP 2018557409A JP 2018557409 A JP2018557409 A JP 2018557409A JP 2019515504 A5 JP2019515504 A5 JP 2019515504A5
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JP
Japan
Prior art keywords
ground
chassis
electrode
layer
circuit board
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Application number
JP2018557409A
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English (en)
Japanese (ja)
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JP6972016B2 (ja
JP2019515504A (ja
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Publication date
Priority claimed from KR1020160053962A external-priority patent/KR102580988B1/ko
Application filed filed Critical
Publication of JP2019515504A publication Critical patent/JP2019515504A/ja
Publication of JP2019515504A5 publication Critical patent/JP2019515504A5/ja
Application granted granted Critical
Publication of JP6972016B2 publication Critical patent/JP6972016B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018557409A 2016-05-02 2017-05-02 印刷回路基板およびこれを含む電子部品パッケージ Active JP6972016B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020160053962A KR102580988B1 (ko) 2016-05-02 2016-05-02 인쇄회로기판 및 이를 포함하는 전자부품패키지
KR10-2016-0053962 2016-05-02
PCT/KR2017/004639 WO2017191968A2 (ko) 2016-05-02 2017-05-02 인쇄회로기판 및 이를 포함하는 전자부품패키지

Publications (3)

Publication Number Publication Date
JP2019515504A JP2019515504A (ja) 2019-06-06
JP2019515504A5 true JP2019515504A5 (enExample) 2020-06-18
JP6972016B2 JP6972016B2 (ja) 2021-11-24

Family

ID=60203036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018557409A Active JP6972016B2 (ja) 2016-05-02 2017-05-02 印刷回路基板およびこれを含む電子部品パッケージ

Country Status (6)

Country Link
US (1) US10660195B2 (enExample)
EP (1) EP3454630A4 (enExample)
JP (1) JP6972016B2 (enExample)
KR (1) KR102580988B1 (enExample)
CN (1) CN109076697B (enExample)
WO (1) WO2017191968A2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102628354B1 (ko) * 2018-09-27 2024-01-24 엘지이노텍 주식회사 충전 제어 모듈 및 이를 포함하는 전자부품패키지
CN114567963A (zh) * 2020-11-27 2022-05-31 中车时代电动汽车股份有限公司 一种电机控制器控制板及其接地方法
CN114269064B (zh) * 2021-12-03 2025-03-18 上海宏英智能科技股份有限公司 电源控制模块及电源控制模块的制备方法
CN119882311A (zh) * 2024-12-31 2025-04-25 惠科股份有限公司 阵列基板的制备方法、阵列基板以及显示装置

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JP2001102517A (ja) 1999-09-30 2001-04-13 Sony Corp 回路装置
JP4129110B2 (ja) * 2000-03-22 2008-08-06 三菱電機株式会社 半導体装置
US6525622B1 (en) * 2000-11-17 2003-02-25 Sun Microsystems, Inc. Adding electrical resistance in series with bypass capacitors to achieve a desired value of electrical impedance between conducts of an electrical power distribution structure
US7064723B2 (en) * 2003-10-20 2006-06-20 Next-Rf, Inc. Spectral control antenna apparatus and method
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JP2004303812A (ja) * 2003-03-28 2004-10-28 Toshiba Corp 多層回路基板および同基板の電磁シールド方法
US6949810B2 (en) * 2003-10-14 2005-09-27 Intel Corporation Active phase cancellation for power delivery
US7453363B2 (en) * 2005-08-19 2008-11-18 Thingmagic, Inc. RFID reader system incorporating antenna orientation sensing
US8063480B2 (en) * 2006-02-28 2011-11-22 Canon Kabushiki Kaisha Printed board and semiconductor integrated circuit
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KR100985889B1 (ko) * 2008-06-25 2010-10-08 엘지엔시스(주) 매체감별장치 및 그 감별방법
JP4399019B1 (ja) * 2008-07-31 2010-01-13 株式会社東芝 電子機器、フレキシブルプリント配線板、およびフレキシブルプリント配線板の製造方法
KR101068583B1 (ko) * 2009-01-09 2011-09-30 부산대학교 산학협력단 하이브리드 자동차의 안전 시스템 및 그 제어방법
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JP2013084729A (ja) * 2011-10-07 2013-05-09 Fujitsu Ltd 多層配線基板、電子装置、及び多層配線基板の製造方法
CN103052254A (zh) * 2011-10-17 2013-04-17 鸿富锦精密工业（深圳）有限公司 可抑制电磁干扰的电路板
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