CN204030547U - 电路保护器件 - Google Patents
电路保护器件 Download PDFInfo
- Publication number
- CN204030547U CN204030547U CN201420481154.2U CN201420481154U CN204030547U CN 204030547 U CN204030547 U CN 204030547U CN 201420481154 U CN201420481154 U CN 201420481154U CN 204030547 U CN204030547 U CN 204030547U
- Authority
- CN
- China
- Prior art keywords
- electrode
- diode
- fuse
- electrically connected
- thermo
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000004888 barrier function Effects 0.000 claims abstract description 43
- 238000010586 diagram Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/62—Protection against overvoltage, e.g. fuses, shunts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0255—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Fuses (AREA)
- Emergency Protection Circuit Devices (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
Abstract
Description
Claims (13)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420481154.2U CN204030547U (zh) | 2014-08-25 | 2014-08-25 | 电路保护器件 |
EP15181918.2A EP2991110B1 (en) | 2014-08-25 | 2015-08-21 | Circuit protection device |
JP2015164361A JP2016048680A (ja) | 2014-08-25 | 2015-08-24 | 回路保護デバイス |
US14/835,150 US9484337B2 (en) | 2014-08-25 | 2015-08-25 | Circuit protection device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420481154.2U CN204030547U (zh) | 2014-08-25 | 2014-08-25 | 电路保护器件 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN204030547U true CN204030547U (zh) | 2014-12-17 |
Family
ID=52070376
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201420481154.2U Expired - Lifetime CN204030547U (zh) | 2014-08-25 | 2014-08-25 | 电路保护器件 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9484337B2 (zh) |
EP (1) | EP2991110B1 (zh) |
JP (1) | JP2016048680A (zh) |
CN (1) | CN204030547U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105552064A (zh) * | 2016-01-20 | 2016-05-04 | 深圳市槟城电子有限公司 | 一种电路保护器件 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6700766B2 (en) * | 2000-09-14 | 2004-03-02 | Sony Corporation | Overvoltage protection circuit with thermal fuse, zener diode, and posistor |
JP4487635B2 (ja) * | 2004-05-26 | 2010-06-23 | 日産自動車株式会社 | 半導体装置 |
US7193292B2 (en) * | 2004-12-02 | 2007-03-20 | Taiwan Semiconductor Manufacturing Co., Ltd | Fuse structure with charge protection circuit |
CN202307878U (zh) * | 2011-03-18 | 2012-07-04 | 泰科电子公司 | 片型电路保护器件 |
-
2014
- 2014-08-25 CN CN201420481154.2U patent/CN204030547U/zh not_active Expired - Lifetime
-
2015
- 2015-08-21 EP EP15181918.2A patent/EP2991110B1/en active Active
- 2015-08-24 JP JP2015164361A patent/JP2016048680A/ja not_active Withdrawn
- 2015-08-25 US US14/835,150 patent/US9484337B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105552064A (zh) * | 2016-01-20 | 2016-05-04 | 深圳市槟城电子有限公司 | 一种电路保护器件 |
Also Published As
Publication number | Publication date |
---|---|
US9484337B2 (en) | 2016-11-01 |
EP2991110B1 (en) | 2019-01-30 |
EP2991110A2 (en) | 2016-03-02 |
EP2991110A3 (en) | 2016-03-09 |
US20160056139A1 (en) | 2016-02-25 |
JP2016048680A (ja) | 2016-04-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 200131 Shanghai city Hedan Waigaoqiao Free Trade Zone No. 142 first floor Patentee after: LITTELFUSE ELECTRONICS (SHANGHAI) CO.,LTD. Address before: 200131 Shanghai city Hedan Waigaoqiao Free Trade Zone No. 142 first floor Patentee before: Tyco Electronics (Shanghai) Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180118 Address after: The Caohejing Development Zone of Shanghai City, Qinzhou road 200233 No. 287 Patentee after: RAYCHEM ELECTRONICS (SHANGHAI) Ltd. Address before: 200131 Shanghai city Hedan Waigaoqiao Free Trade Zone No. 142 first floor Patentee before: LITTELFUSE ELECTRONICS (SHANGHAI) CO.,LTD. |
|
CX01 | Expiry of patent term |
Granted publication date: 20141217 |