JP2019511832A5 - - Google Patents
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- Publication number
- JP2019511832A5 JP2019511832A5 JP2018538737A JP2018538737A JP2019511832A5 JP 2019511832 A5 JP2019511832 A5 JP 2019511832A5 JP 2018538737 A JP2018538737 A JP 2018538737A JP 2018538737 A JP2018538737 A JP 2018538737A JP 2019511832 A5 JP2019511832 A5 JP 2019511832A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive bump
- passivation layer
- passive substrate
- conductive
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002161 passivation Methods 0.000 claims 19
- 239000000758 substrate Substances 0.000 claims 14
- 238000000034 method Methods 0.000 claims 8
- 238000000151 deposition Methods 0.000 claims 7
- 229910000679 solder Inorganic materials 0.000 claims 5
- 239000004020 conductor Substances 0.000 claims 2
- 239000011521 glass Substances 0.000 claims 1
- 230000000873 masking effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021202487A JP2022027893A (ja) | 2016-02-01 | 2021-12-14 | オープンパッシベーションボールグリッドアレイパッド |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662289636P | 2016-02-01 | 2016-02-01 | |
| US62/289,636 | 2016-02-01 | ||
| US15/077,869 US10103116B2 (en) | 2016-02-01 | 2016-03-22 | Open-passivation ball grid array pads |
| US15/077,869 | 2016-03-22 | ||
| PCT/US2016/068033 WO2017136061A1 (en) | 2016-02-01 | 2016-12-21 | Open-passivation ball grid array pads |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021202487A Division JP2022027893A (ja) | 2016-02-01 | 2021-12-14 | オープンパッシベーションボールグリッドアレイパッド |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019511832A JP2019511832A (ja) | 2019-04-25 |
| JP2019511832A5 true JP2019511832A5 (enExample) | 2020-01-23 |
| JP7033069B2 JP7033069B2 (ja) | 2022-03-09 |
Family
ID=59387081
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018538737A Active JP7033069B2 (ja) | 2016-02-01 | 2016-12-21 | オープンパッシベーションボールグリッドアレイパッド |
| JP2021202487A Pending JP2022027893A (ja) | 2016-02-01 | 2021-12-14 | オープンパッシベーションボールグリッドアレイパッド |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021202487A Pending JP2022027893A (ja) | 2016-02-01 | 2021-12-14 | オープンパッシベーションボールグリッドアレイパッド |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10103116B2 (enExample) |
| EP (1) | EP3412122A1 (enExample) |
| JP (2) | JP7033069B2 (enExample) |
| KR (1) | KR102760882B1 (enExample) |
| CN (2) | CN116321799A (enExample) |
| CA (1) | CA3010589A1 (enExample) |
| TW (1) | TWI769145B (enExample) |
| WO (1) | WO2017136061A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140052420A1 (en) * | 2012-08-20 | 2014-02-20 | Ingrain Inc. | Digital Rock Analysis Systems and Methods that Estimate a Maturity Level |
| CN109548320B (zh) * | 2018-12-29 | 2020-05-12 | 广州兴森快捷电路科技有限公司 | 具有阶梯式焊盘的线路板及其成型方法 |
| US11804428B2 (en) * | 2020-11-13 | 2023-10-31 | Qualcomm Incorporated | Mixed pad size and pad design |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5414297A (en) | 1989-04-13 | 1995-05-09 | Seiko Epson Corporation | Semiconductor device chip with interlayer insulating film covering the scribe lines |
| KR0178134B1 (ko) | 1996-10-01 | 1999-04-15 | 삼성전자주식회사 | 불연속 절연층 영역을 갖는 반도체 집적회로 소자 및 그 제조방법 |
| US5997907A (en) * | 1997-03-12 | 1999-12-07 | Rhodia Inc. | Enhancement of guar solution stability |
| JP3880150B2 (ja) * | 1997-06-02 | 2007-02-14 | 松下電器産業株式会社 | 弾性表面波素子 |
| KR100297451B1 (ko) | 1999-07-06 | 2001-11-01 | 윤종용 | 반도체 패키지 및 그의 제조 방법 |
| JP2001135597A (ja) | 1999-08-26 | 2001-05-18 | Fujitsu Ltd | 半導体装置の製造方法 |
| US6676878B2 (en) * | 2001-01-31 | 2004-01-13 | Electro Scientific Industries, Inc. | Laser segmented cutting |
| WO2004097916A1 (ja) | 2003-04-30 | 2004-11-11 | Fujitsu Limited | 半導体装置の製造方法、半導体ウエハおよび半導体装置 |
| US7049216B2 (en) * | 2003-10-14 | 2006-05-23 | Unitive International Limited | Methods of providing solder structures for out plane connections |
| JP2007059470A (ja) | 2005-08-22 | 2007-03-08 | Sony Corp | 半導体装置およびその製造方法 |
| JP4354469B2 (ja) | 2006-08-11 | 2009-10-28 | シャープ株式会社 | 半導体装置および半導体装置の製造方法 |
| WO2012043615A1 (ja) * | 2010-09-28 | 2012-04-05 | 株式会社村田製作所 | 圧電デバイスの製造方法 |
| US20120190152A1 (en) * | 2011-01-25 | 2012-07-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods for Fabricating Integrated Passive Devices on Glass Substrates |
| US20120202561A1 (en) * | 2011-02-07 | 2012-08-09 | Qualcomm Incorporated | Cdma transceiver with cdma diversity receiver path shared with time duplexed receiver |
| WO2012144370A1 (ja) | 2011-04-19 | 2012-10-26 | 京セラ株式会社 | 電子部品および弾性波装置 |
| US10115671B2 (en) | 2012-08-03 | 2018-10-30 | Snaptrack, Inc. | Incorporation of passives and fine pitch through via for package on package |
| US9425153B2 (en) | 2013-04-04 | 2016-08-23 | Monolith Semiconductor Inc. | Semiconductor devices comprising getter layers and methods of making and using the same |
-
2016
- 2016-03-22 US US15/077,869 patent/US10103116B2/en active Active
- 2016-12-21 KR KR1020187021672A patent/KR102760882B1/ko active Active
- 2016-12-21 CA CA3010589A patent/CA3010589A1/en not_active Abandoned
- 2016-12-21 EP EP16825661.8A patent/EP3412122A1/en not_active Withdrawn
- 2016-12-21 CN CN202310295969.5A patent/CN116321799A/zh active Pending
- 2016-12-21 JP JP2018538737A patent/JP7033069B2/ja active Active
- 2016-12-21 CN CN201680080133.1A patent/CN108605414A/zh active Pending
- 2016-12-21 WO PCT/US2016/068033 patent/WO2017136061A1/en not_active Ceased
- 2016-12-22 TW TW105142835A patent/TWI769145B/zh active
-
2021
- 2021-12-14 JP JP2021202487A patent/JP2022027893A/ja active Pending
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