JP2019510368A5 - - Google Patents
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- Publication number
- JP2019510368A5 JP2019510368A5 JP2018540419A JP2018540419A JP2019510368A5 JP 2019510368 A5 JP2019510368 A5 JP 2019510368A5 JP 2018540419 A JP2018540419 A JP 2018540419A JP 2018540419 A JP2018540419 A JP 2018540419A JP 2019510368 A5 JP2019510368 A5 JP 2019510368A5
- Authority
- JP
- Japan
- Prior art keywords
- integrated
- michipa
- kkeji
- layer
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 9
- 239000002184 metal Substances 0.000 claims 6
- 239000004642 Polyimide Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 2
- 229920001721 polyimide Polymers 0.000 claims 2
- 238000009825 accumulation Methods 0.000 claims 1
- 239000003989 dielectric material Substances 0.000 claims 1
- CBFCDTFDPHXCNY-UHFFFAOYSA-N octyldodecane Natural products CCCCCCCCCCCCCCCCCCCC CBFCDTFDPHXCNY-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/040,881 | 2016-02-10 | ||
| US15/040,881 US9633950B1 (en) | 2016-02-10 | 2016-02-10 | Integrated device comprising flexible connector between integrated circuit (IC) packages |
| PCT/US2017/016864 WO2017139285A1 (en) | 2016-02-10 | 2017-02-07 | Integrated device comprising flexible connector between integrated circuit (ic) packages |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019510368A JP2019510368A (ja) | 2019-04-11 |
| JP2019510368A5 true JP2019510368A5 (https=) | 2020-02-27 |
| JP6956095B2 JP6956095B2 (ja) | 2021-10-27 |
Family
ID=58057302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018540419A Active JP6956095B2 (ja) | 2016-02-10 | 2017-02-07 | 集積回路（ｉｃ）パッケージ間にフレキシブルコネクタを備える集積デバイス |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US9633950B1 (https=) |
| EP (1) | EP3414776B1 (https=) |
| JP (1) | JP6956095B2 (https=) |
| KR (1) | KR20180111840A (https=) |
| CN (1) | CN108604585B (https=) |
| AU (1) | AU2017217375A1 (https=) |
| BR (1) | BR112018016132B1 (https=) |
| TW (1) | TWI601217B (https=) |
| WO (1) | WO2017139285A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11581261B2 (en) * | 2018-06-12 | 2023-02-14 | Novatek Microelectronics Corp. | Chip on film package |
| US11342268B2 (en) * | 2020-01-29 | 2022-05-24 | Amkor Technology Singapore Holding Pte. Ltd. | Semiconductor devices and methods of manufacturing semiconductor devices |
| US12074077B2 (en) * | 2020-11-19 | 2024-08-27 | Apple Inc. | Flexible package architecture concept in fanout |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4246595A (en) * | 1977-03-08 | 1981-01-20 | Matsushita Electric Industrial Co., Ltd. | Electronics circuit device and method of making the same |
| JP3280394B2 (ja) * | 1990-04-05 | 2002-05-13 | ロックヒード マーティン コーポレーション | 電子装置 |
| US5527741A (en) * | 1994-10-11 | 1996-06-18 | Martin Marietta Corporation | Fabrication and structures of circuit modules with flexible interconnect layers |
| CN1186971C (zh) | 1999-04-22 | 2005-01-26 | 罗姆股份有限公司 | 印刷电路板、电池组件和印刷电路板的制造方法 |
| FR2793352B1 (fr) | 1999-05-07 | 2006-09-22 | Sagem | Composant electrique a nappe souple de conducteurs de raccordement |
| US6940729B2 (en) | 2001-10-26 | 2005-09-06 | Staktek Group L.P. | Integrated circuit stacking system and method |
| CN1711636A (zh) | 2002-10-11 | 2005-12-21 | 德塞拉股份有限公司 | 用于多芯片封装的元件、方法和组件 |
| US6862191B1 (en) * | 2003-08-19 | 2005-03-01 | Cardiac Pacemakers, Inc. | Volumetrically efficient electronic circuit module |
| US20060033217A1 (en) * | 2004-08-10 | 2006-02-16 | Brian Taggart | Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same |
| KR100659826B1 (ko) | 2005-12-20 | 2006-12-19 | 삼성에스디아이 주식회사 | 배터리 팩의 회로 기판 |
| DE102006004321A1 (de) * | 2006-01-31 | 2007-08-16 | Häusermann GmbH | Biegbare Leiterplatte mit zusätzlichem funktionalem Element und einer Kerbfräsung und Herstellverfahren und Anwendung |
| JP2008034433A (ja) * | 2006-07-26 | 2008-02-14 | Cmk Corp | リジッドフレックスプリント配線板の製造方法及びリジッドフレックスプリント配線板 |
| WO2008036726A2 (en) | 2006-09-19 | 2008-03-27 | Ibiden Co., Ltd. | Optical interconnect device and method for manufacturing the same |
| US8031475B2 (en) * | 2007-07-12 | 2011-10-04 | Stats Chippac, Ltd. | Integrated circuit package system with flexible substrate and mounded package |
| TWI365524B (en) * | 2007-10-04 | 2012-06-01 | Unimicron Technology Corp | Stackable semiconductor device and fabrication method thereof |
| JP4975584B2 (ja) * | 2007-10-26 | 2012-07-11 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の製造方法。 |
| KR20090078124A (ko) * | 2008-01-14 | 2009-07-17 | 한국광기술원 | 연성 광전배선을 이용한 시스템 패키지 및 그의 신호 처리방법 |
| FI122216B (fi) * | 2009-01-05 | 2011-10-14 | Imbera Electronics Oy | Rigid-flex moduuli |
| US20110194240A1 (en) * | 2010-02-05 | 2011-08-11 | Broadcom Corporation | Waveguide assembly and applications thereof |
| KR101078743B1 (ko) | 2010-04-14 | 2011-11-02 | 주식회사 하이닉스반도체 | 스택 패키지 |
| US9190380B2 (en) * | 2012-12-06 | 2015-11-17 | Intel Corporation | High density substrate routing in BBUL package |
| JP2014192476A (ja) | 2013-03-28 | 2014-10-06 | Fujitsu Ltd | プリント基板の半田実装方法及び半田実装構造 |
| KR102135415B1 (ko) | 2013-06-28 | 2020-07-17 | 엘지이노텍 주식회사 | 회로기판 및 상기 회로기판을 포함하는 조명장치 |
| WO2015166588A1 (ja) * | 2014-05-02 | 2015-11-05 | 株式会社メイコー | 部品内蔵リジッドフレックス基板 |
-
2016
- 2016-02-10 US US15/040,881 patent/US9633950B1/en active Active
-
2017
- 2017-02-06 TW TW106103767A patent/TWI601217B/zh not_active IP Right Cessation
- 2017-02-07 BR BR112018016132-2A patent/BR112018016132B1/pt active IP Right Grant
- 2017-02-07 EP EP17706067.0A patent/EP3414776B1/en active Active
- 2017-02-07 KR KR1020187022909A patent/KR20180111840A/ko not_active Ceased
- 2017-02-07 JP JP2018540419A patent/JP6956095B2/ja active Active
- 2017-02-07 WO PCT/US2017/016864 patent/WO2017139285A1/en not_active Ceased
- 2017-02-07 AU AU2017217375A patent/AU2017217375A1/en not_active Abandoned
- 2017-02-07 CN CN201780010368.8A patent/CN108604585B/zh active Active
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