JP2019509643A - 電子デバイスのための防水方法および装置、並びに電子デバイス - Google Patents
電子デバイスのための防水方法および装置、並びに電子デバイス Download PDFInfo
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- JP2019509643A JP2019509643A JP2018555803A JP2018555803A JP2019509643A JP 2019509643 A JP2019509643 A JP 2019509643A JP 2018555803 A JP2018555803 A JP 2018555803A JP 2018555803 A JP2018555803 A JP 2018555803A JP 2019509643 A JP2019509643 A JP 2019509643A
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- 238000000034 method Methods 0.000 title claims abstract description 23
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims abstract description 42
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 39
- 229910000077 silane Inorganic materials 0.000 claims abstract description 38
- 238000002347 injection Methods 0.000 claims abstract description 27
- 239000007924 injection Substances 0.000 claims abstract description 27
- 238000004078 waterproofing Methods 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 24
- 239000012528 membrane Substances 0.000 claims abstract description 22
- 238000006243 chemical reaction Methods 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 7
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 229920005862 polyol Polymers 0.000 claims description 3
- 150000003077 polyols Chemical class 0.000 claims description 3
- VIFIHLXNOOCGLJ-UHFFFAOYSA-N trichloro(3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-heptadecafluorodecyl)silane Chemical group FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CC[Si](Cl)(Cl)Cl VIFIHLXNOOCGLJ-UHFFFAOYSA-N 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 10
- 238000010586 diagram Methods 0.000 description 11
- 239000000243 solution Substances 0.000 description 7
- 238000005507 spraying Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- XPBBUZJBQWWFFJ-UHFFFAOYSA-N fluorosilane Chemical compound [SiH3]F XPBBUZJBQWWFFJ-UHFFFAOYSA-N 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0004—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
- H05K5/0095—Housing specially adapted for small components hermetically-sealed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/066—Hermetically-sealed casings sealed by fusion of the joining parts without bringing material; sealed by brazing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
- Telephone Set Structure (AREA)
- Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
第1のハウジングの内壁および第2のハウジングの内壁上にシランを被覆するステップと、
第1のハウジング、第2のハウジングおよびメインボードを組み立てて、第1のハウジング上の液体注入孔を通して電子デバイスの空洞内にフッ化物を注入するステップと、
シランとフッ化物との間の化学反応を通して、第1のハウジングの内壁および第2のハウジングの内壁上に、一体的連続的防水膜を形成するステップとを含む。
メインボードは、第1のハウジングと第2のハウジングとを結合することによって形成された空洞の内側に配置されている。
22 第2のハウジング
23 シラン
24 メインボード
25 液体注入孔
26 空洞
27 フッ化物
28 防水膜
31 ハウジング
32 防水膜
Claims (5)
- 電子デバイスのための防水方法であって、
前記電子デバイスは、第1のハウジングと、第2のハウジングと、メインボードとを含み、前記方法は、
前記第1のハウジングの内壁および前記第2のハウジングの内壁上にシランを被覆するステップと、
前記第1のハウジング、前記第2のハウジングおよび前記メインボードを組み立てて、前記第1のハウジング上の液体注入孔を通して前記電子デバイスの空洞内にフッ化物を注入するステップと、
前記シランと前記フッ化物との間の化学反応を通して、前記第1のハウジングの内壁および前記第2のハウジングの内壁上に、一体的連続的防水膜を形成するステップとを含む、方法。 - 前記シランは、(ヘプタデカフルオロ−1,1,2,2−テトラヒドロデシル)−1−トリクロロシランである、請求項2に記載の方法。
- 前記フッ化物が、ポリフルオロオクタンまたはフッ化ポリオールである、請求項1または2に記載の方法。
- 電子デバイスのための防水装置であって、電子デバイスのための前記防水装置のハウジングの内壁は、前記ハウジングの内壁全体を被覆している防水膜を有しており、前記防水膜は、シランがフッ化物と反応した後に生成される、電子デバイスのための防水装置。
- 第1のハウジングと、第2のハウジングと、メインボードとを含む電子デバイスであって、
前記第1のハウジングは液体注入孔を有しており、前記第1のハウジングと前記第2のハウジングとを結合することによって形成されたハウジングの内壁は防水膜によって被覆されており、前記防水膜はシランがフッ化物と反応した後に生成され、
前記メインボードは、前記第1のハウジングと前記第2のハウジングとを結合することによって形成された空洞の内側に配置されている、電子デバイス。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2016/071385 WO2017124306A1 (zh) | 2016-01-19 | 2016-01-19 | 电子设备防水方法、装置及电子设备 |
Publications (2)
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JP2019509643A true JP2019509643A (ja) | 2019-04-04 |
JP6593903B2 JP6593903B2 (ja) | 2019-10-23 |
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Country Status (5)
Country | Link |
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US (1) | US10531584B2 (ja) |
EP (1) | EP3393220B1 (ja) |
JP (1) | JP6593903B2 (ja) |
CN (1) | CN107615900B (ja) |
WO (1) | WO2017124306A1 (ja) |
Families Citing this family (2)
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CN108873678B (zh) * | 2018-07-27 | 2023-12-26 | 歌尔科技有限公司 | 一种可穿戴设备及其外壳 |
CN113453476B (zh) * | 2021-06-29 | 2023-02-28 | 成都千嘉科技有限公司 | 一种局部灌封防水结构及方法 |
Citations (2)
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JP2014003206A (ja) * | 2012-06-20 | 2014-01-09 | Hitachi Automotive Systems Ltd | 車載電子機器および防水シール |
WO2016017075A1 (ja) * | 2014-08-01 | 2016-02-04 | 信越ポリマー株式会社 | 防水嵌合体及び防水嵌合体の製造方法 |
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- 2016-01-19 CN CN201680028355.9A patent/CN107615900B/zh active Active
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Patent Citations (2)
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JP2014003206A (ja) * | 2012-06-20 | 2014-01-09 | Hitachi Automotive Systems Ltd | 車載電子機器および防水シール |
WO2016017075A1 (ja) * | 2014-08-01 | 2016-02-04 | 信越ポリマー株式会社 | 防水嵌合体及び防水嵌合体の製造方法 |
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JP6593903B2 (ja) | 2019-10-23 |
WO2017124306A1 (zh) | 2017-07-27 |
EP3393220B1 (en) | 2021-04-21 |
EP3393220A4 (en) | 2019-01-16 |
CN107615900A (zh) | 2018-01-19 |
EP3393220A1 (en) | 2018-10-24 |
CN107615900B (zh) | 2019-12-24 |
US10531584B2 (en) | 2020-01-07 |
US20190037717A1 (en) | 2019-01-31 |
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