JP4274935B2 - 発光ユニット用ケースおよび発光ユニット製造方法 - Google Patents
発光ユニット用ケースおよび発光ユニット製造方法 Download PDFInfo
- Publication number
- JP4274935B2 JP4274935B2 JP2003435748A JP2003435748A JP4274935B2 JP 4274935 B2 JP4274935 B2 JP 4274935B2 JP 2003435748 A JP2003435748 A JP 2003435748A JP 2003435748 A JP2003435748 A JP 2003435748A JP 4274935 B2 JP4274935 B2 JP 4274935B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting unit
- hollow portion
- fluid material
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/10—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/04—Provision of filling media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2121/00—Use or application of lighting devices or systems for decorative purposes, not provided for in codes F21W2102/00 – F21W2107/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
Claims (5)
- 発光素子が搭載された基板を覆うケースであって、
前記基板を挟持するとともにその基板が位置するための中空部が間に形成されるよう互いに係合した状態で接合される略皿状の第1部材と第2部材で構成され、
前記第2部材は、前記第1部材に挿入される突出片を有し、その突出片の内部にはその先端近傍から末端にかけて貫通して前記中空部と当該ケース外部を連通させる流通路が形成され、
前記流通路が当該ケース外部へ接続する位置には、流体材料を前記流通路を介して前記中空部へ注入するための注入口が形成され、
前記注入口の近傍には、前記注入された前記流体材料を前記中空部から排出するための排出口が設けられ、
前記第2部材と前記第1部材が接合されて係合した状態において、前記中空部は前記基板を境に前記第1部材側の空間と前記第2部材側の空間に分けられ、前記突出片の先端は前記第1部材側の空間に位置し、前記排出口は前記第2部材側の空間に近接し、
前記中空部は、前記注入口から注入された前記流体材料が前記第1部材側の空間から前記第2部材側の空間に流れて前記排出口から排出されるような形状にて形成されることを特徴とする発光ユニット用ケース。 - 前記第1部材は、当該発光ユニット用ケースの使用時において表側に位置する部材であり、前記発光素子が発する光が透過する略透明の部位を有し、
前記第2部材は、当該発光ユニット用ケースの使用時において裏側に位置する部材であり、前記注入口は前記使用時において表側に面しない位置に設けられていることを特徴とする請求項1に記載の発光ユニット用ケース。 - 前記第2部材の外表面に凹部が設けられ、その凹部の底面の一部に前記排出口が設けられていることを特徴とする請求項1または2に記載の発光ユニット用ケース。
- 前記排出口の開口面積は、前記注入口の開口面積より広く形成されていることを特徴とする請求項1から3のいずれかに記載の発光ユニット用ケース。
- 発光素子が搭載された基板を挟持するとともに前記基板が位置するための中空部が間に形成されるよう略皿状の第1部材と第2部材を互いに係合させた状態で接合する工程と、
前記第2部材に設けられて前記中空部へ接続された注入口に、流体材料を注入するための注入器を挿入する工程と、
前記注入器から前記注入口に対して前記流体材料の注入を開始する工程と、
前記中空部において前記基板を境に形成された前記第1部材側の空間から前記第2部材側の空間にかけて前記流体材料を充満させる工程と、
前記充満した流体材料が前記第2部材の外表面に設けられた排出口から排出され、前記流体材料が前記第2部材の外表面において前記排出口の周囲に設けられた凹部を充満したときに、前記流体材料の注入を停止する工程と、
を含むことを特徴とする発光ユニット製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003435748A JP4274935B2 (ja) | 2003-12-26 | 2003-12-26 | 発光ユニット用ケースおよび発光ユニット製造方法 |
US10/780,764 US7253444B2 (en) | 2003-12-26 | 2004-02-19 | Silicone-filled casing for use with light-emitting unit and method of manufacturing the light-emitting unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003435748A JP4274935B2 (ja) | 2003-12-26 | 2003-12-26 | 発光ユニット用ケースおよび発光ユニット製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005197006A JP2005197006A (ja) | 2005-07-21 |
JP4274935B2 true JP4274935B2 (ja) | 2009-06-10 |
Family
ID=34697826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003435748A Expired - Fee Related JP4274935B2 (ja) | 2003-12-26 | 2003-12-26 | 発光ユニット用ケースおよび発光ユニット製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7253444B2 (ja) |
JP (1) | JP4274935B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230120719A (ko) * | 2022-02-10 | 2023-08-17 | 주식회사 블루이엔지 | 투명에폭시로 마감된 태양광용 바닥등 |
Families Citing this family (21)
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KR100761387B1 (ko) * | 2005-07-13 | 2007-09-27 | 서울반도체 주식회사 | 몰딩부재를 형성하기 위한 몰드 및 그것을 사용한 몰딩부재형성방법 |
US7554792B2 (en) * | 2007-03-20 | 2009-06-30 | Avx Corporation | Cathode coating for a wet electrolytic capacitor |
US7766536B2 (en) | 2008-02-15 | 2010-08-03 | Lunera Lighting, Inc. | LED light fixture |
US20100085762A1 (en) * | 2008-10-03 | 2010-04-08 | Peifer Donald A | Optimized spatial power distribution for solid state light fixtures |
US20100110658A1 (en) * | 2008-10-08 | 2010-05-06 | Peifer Donald A | Semi-direct solid state lighting fixture and distribution |
DE202009000236U1 (de) * | 2009-01-09 | 2010-06-17 | Ledon Lighting Jennersdorf Gmbh | Gehäustes LED-Modul |
DE102009014514B4 (de) * | 2009-03-23 | 2013-11-21 | Insta Elektro Gmbh | Beleuchtungseinrichtung |
DE102009024828A1 (de) * | 2009-06-13 | 2010-12-23 | Adolf Maier | Feuchtigkeitsdichte Beleuchtungsanordnung und Verfahren zu dessen Herstellung |
US20110031329A1 (en) * | 2009-08-07 | 2011-02-10 | Bertram Balch | Vapor transfer hand piece |
JP5311674B2 (ja) * | 2010-01-14 | 2013-10-09 | パナソニック株式会社 | 発光装置 |
DE102011003608A1 (de) * | 2010-08-20 | 2012-02-23 | Tridonic Gmbh & Co. Kg | Gehäustes LED-Modul |
CN102401252A (zh) * | 2010-09-10 | 2012-04-04 | 欧司朗有限公司 | Led模块、led灯条以及led模块的制造方法 |
US10532693B2 (en) | 2013-08-30 | 2020-01-14 | Itc Incorporated | Diffused flexible LED linear light assembly |
US9909719B2 (en) | 2013-08-30 | 2018-03-06 | Itc Incorporated | LED linear light assemblies with transparent bottoms |
US9695991B2 (en) | 2013-08-30 | 2017-07-04 | Itc Incorporated | Diffused flexible LED linear light assembly |
JP2015219378A (ja) * | 2014-05-19 | 2015-12-07 | ウシオ電機株式会社 | 発光表示装置 |
US9927092B2 (en) | 2014-10-31 | 2018-03-27 | Itc Incorporated | LED linear light assembly with reflectance members |
US10531584B2 (en) | 2016-01-19 | 2020-01-07 | Huawei Technologies Co., Ltd. | Waterproofing method for electronic device |
USD891646S1 (en) | 2018-06-28 | 2020-07-28 | Vista Manufacturing Inc | Light assembly |
CN110094653A (zh) * | 2018-09-10 | 2019-08-06 | 宋磊 | 一种高防护led模组制作方法及其led模组 |
KR102341319B1 (ko) * | 2020-03-16 | 2021-12-21 | (주) 헥사이노힐 | 저출력 레이저 치료 요법(lllt)을 위한 일체형 칩온보드 타입의 의료용 발광 소자 제조 방법 및 이를 이용한 의료용 발광 소자 |
Family Cites Families (10)
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JPH0832120A (ja) * | 1994-07-19 | 1996-02-02 | Rohm Co Ltd | 面発光表示器 |
JP2000149151A (ja) * | 1998-11-11 | 2000-05-30 | Nippon Koki Kogyo Kk | 発光ダイオード灯器の放熱構造 |
DE10117889A1 (de) * | 2001-04-10 | 2002-10-24 | Osram Opto Semiconductors Gmbh | Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement sowie Verfahren zu dessen Herstellung |
JP2003059335A (ja) | 2001-08-13 | 2003-02-28 | Eitekkusu Kk | Led照明装置 |
US6949808B2 (en) * | 2001-11-30 | 2005-09-27 | Matsushita Electric Industrial Co., Ltd. | Solid-state imaging apparatus and manufacturing method thereof |
JP2003178602A (ja) * | 2001-12-10 | 2003-06-27 | Koito Mfg Co Ltd | 照明装置 |
JP2003303504A (ja) * | 2002-04-10 | 2003-10-24 | Meiji Natl Ind Co Ltd | 発光ダイオードを用いた照明器具 |
US7692206B2 (en) * | 2002-12-06 | 2010-04-06 | Cree, Inc. | Composite leadframe LED package and method of making the same |
JP2004265724A (ja) * | 2003-02-28 | 2004-09-24 | Toshiba Lighting & Technology Corp | 照明器具 |
DE102005043928B4 (de) * | 2004-09-16 | 2011-08-18 | Sharp Kk | Optisches Halbleiterbauteil und Verfahren zu dessen Herstellung |
-
2003
- 2003-12-26 JP JP2003435748A patent/JP4274935B2/ja not_active Expired - Fee Related
-
2004
- 2004-02-19 US US10/780,764 patent/US7253444B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230120719A (ko) * | 2022-02-10 | 2023-08-17 | 주식회사 블루이엔지 | 투명에폭시로 마감된 태양광용 바닥등 |
KR102651067B1 (ko) * | 2022-02-10 | 2024-03-25 | 주식회사 블루이엔지 | 투명에폭시로 마감된 태양광용 바닥등 |
Also Published As
Publication number | Publication date |
---|---|
JP2005197006A (ja) | 2005-07-21 |
US20050139850A1 (en) | 2005-06-30 |
US7253444B2 (en) | 2007-08-07 |
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