JP2019505097A5 - - Google Patents
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- Publication number
- JP2019505097A5 JP2019505097A5 JP2018541110A JP2018541110A JP2019505097A5 JP 2019505097 A5 JP2019505097 A5 JP 2019505097A5 JP 2018541110 A JP2018541110 A JP 2018541110A JP 2018541110 A JP2018541110 A JP 2018541110A JP 2019505097 A5 JP2019505097 A5 JP 2019505097A5
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- light emitting
- device package
- emitting device
- inner body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000002310 reflectometry Methods 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160016104A KR102562091B1 (ko) | 2016-02-12 | 2016-02-12 | 발광 소자 패키지 |
| KR10-2016-0016104 | 2016-02-12 | ||
| KR10-2016-0021779 | 2016-02-24 | ||
| KR1020160021779A KR102509312B1 (ko) | 2016-02-24 | 2016-02-24 | 발광 소자 패키지 |
| PCT/KR2017/001498 WO2017138779A1 (ko) | 2016-02-12 | 2017-02-10 | 발광 소자 패키지 및 이를 포함하는 조명 장치 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019505097A JP2019505097A (ja) | 2019-02-21 |
| JP2019505097A5 true JP2019505097A5 (OSRAM) | 2020-02-27 |
| JP6901490B2 JP6901490B2 (ja) | 2021-07-14 |
Family
ID=59563219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018541110A Expired - Fee Related JP6901490B2 (ja) | 2016-02-12 | 2017-02-10 | 発光素子パッケージ及びこれを含む照明装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10557596B2 (OSRAM) |
| EP (1) | EP3416202B1 (OSRAM) |
| JP (1) | JP6901490B2 (OSRAM) |
| CN (1) | CN108633317B (OSRAM) |
| WO (1) | WO2017138779A1 (OSRAM) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102335216B1 (ko) * | 2017-04-26 | 2021-12-03 | 삼성전자 주식회사 | 발광소자 패키지 |
| US11677059B2 (en) | 2017-04-26 | 2023-06-13 | Samsung Electronics Co., Ltd. | Light-emitting device package including a lead frame |
| GB201717950D0 (en) * | 2017-10-31 | 2017-12-13 | Rentokil Initial 1927 Plc | A light for an insect light trap, and an insect light trap |
| KR102472710B1 (ko) * | 2018-06-05 | 2022-11-30 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 패키지 |
| KR102746562B1 (ko) * | 2019-03-22 | 2024-12-24 | 삼성전자주식회사 | 발광 소자 패키지 |
| US11329206B2 (en) * | 2020-09-28 | 2022-05-10 | Dominant Opto Technologies Sdn Bhd | Lead frame and housing sub-assembly for use in a light emitting diode package and method for manufacturing the same |
| CN112599695B (zh) * | 2020-12-10 | 2022-11-04 | 深圳市华星光电半导体显示技术有限公司 | 显示装置 |
| KR20220095289A (ko) | 2020-12-29 | 2022-07-07 | 삼성전자주식회사 | 발광소자 패키지 |
| JP2023072239A (ja) * | 2021-11-12 | 2023-05-24 | スタンレー電気株式会社 | 発光装置及びリードフレーム |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4916464A (en) * | 1987-04-22 | 1990-04-10 | Oki Electric Industry Co., Ltd. | Light emitting diode array print head having no bonding wire connections |
| US5416871A (en) * | 1993-04-09 | 1995-05-16 | Sumitomo Electric Industries, Ltd. | Molded optical connector module |
| US5951152A (en) * | 1997-06-17 | 1999-09-14 | Lumex, Inc. | Light source housing apparatus and method of manufacture |
| US6116946A (en) * | 1998-07-27 | 2000-09-12 | Lewis; Daniel Raymond | Surface mounted modular jack with integrated magnetics and LEDS |
| EP1107321A4 (en) | 1999-06-23 | 2006-08-30 | Citizen Electronics | LIGHT-EMITTING DIODE |
| US6349105B1 (en) * | 2000-04-07 | 2002-02-19 | Stratos Lightwave, Inc. | Small format optical subassembly |
| JP4045781B2 (ja) | 2001-08-28 | 2008-02-13 | 松下電工株式会社 | 発光装置 |
| JP4269709B2 (ja) * | 2002-02-19 | 2009-05-27 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
| JP2003304000A (ja) * | 2002-04-08 | 2003-10-24 | Citizen Electronics Co Ltd | 発光ダイオード用パッケージの製造方法 |
| KR100567559B1 (ko) * | 2002-07-25 | 2006-04-05 | 마츠시다 덴코 가부시키가이샤 | 광전소자부품 |
| JP4691955B2 (ja) * | 2003-10-28 | 2011-06-01 | 日亜化学工業株式会社 | 蛍光物質および発光装置 |
| JP2007073575A (ja) | 2005-09-05 | 2007-03-22 | Matsushita Electric Ind Co Ltd | 半導体発光装置 |
| JP4798000B2 (ja) * | 2007-01-15 | 2011-10-19 | パナソニック電工株式会社 | Ledパッケージ |
| JP5125450B2 (ja) | 2007-03-13 | 2013-01-23 | 日立化成工業株式会社 | 熱硬化性光反射用樹脂組成物、光半導体素子搭載用基板とその製造方法および光半導体装置 |
| JP2010153666A (ja) * | 2008-12-25 | 2010-07-08 | Showa Denko Kk | 発光装置、発光モジュール、発光装置の製造方法 |
| JP5488326B2 (ja) | 2009-09-01 | 2014-05-14 | 信越化学工業株式会社 | 光半導体装置用白色熱硬化性シリコーンエポキシ混成樹脂組成物及びその製造方法並びにプレモールドパッケージ及びled装置 |
| US9733357B2 (en) * | 2009-11-23 | 2017-08-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Infrared proximity sensor package with improved crosstalk isolation |
| TW201128812A (en) | 2009-12-01 | 2011-08-16 | Lg Innotek Co Ltd | Light emitting device |
| DE102009058421A1 (de) * | 2009-12-16 | 2011-06-22 | OSRAM Opto Semiconductors GmbH, 93055 | Verfahren zur Herstellung eines Gehäuses für ein optoelektronisches Halbleiterbauteil, Gehäuse und optoelektronisches Halbleiterbauteil |
| JP5347953B2 (ja) * | 2009-12-28 | 2013-11-20 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
| JP5710128B2 (ja) | 2010-01-19 | 2015-04-30 | 大日本印刷株式会社 | 樹脂付リードフレームの製造方法 |
| MY155671A (en) * | 2010-01-29 | 2015-11-13 | Toshiba Kk | LED package and method for manufacturing same |
| US9882094B2 (en) * | 2011-03-14 | 2018-01-30 | Intellectual Discovery Co., Ltd. | Light source with inner and outer bodies comprising three different encapsulants |
| JP5119364B1 (ja) | 2011-09-16 | 2013-01-16 | 積水化学工業株式会社 | 光半導体装置用白色硬化性組成物及び光半導体装置用成形体 |
| KR101347454B1 (ko) | 2012-05-02 | 2014-01-03 | 김미숙 | 발광 다이오드 패키지 및 그 제조 방법 |
| CN202695533U (zh) * | 2012-06-29 | 2013-01-23 | 四川柏狮光电技术有限公司 | 热电分离的led支架 |
| KR101973395B1 (ko) * | 2012-08-09 | 2019-04-29 | 엘지이노텍 주식회사 | 발광 모듈 |
| JP6476567B2 (ja) | 2013-03-29 | 2019-03-06 | 日亜化学工業株式会社 | 発光装置 |
| JP6323217B2 (ja) * | 2013-07-10 | 2018-05-16 | 日亜化学工業株式会社 | 発光装置 |
| KR102160775B1 (ko) | 2014-03-20 | 2020-09-29 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
| KR20150127433A (ko) | 2014-05-07 | 2015-11-17 | 서울반도체 주식회사 | 발광 다이오드 패키지 |
| US20150330772A1 (en) * | 2014-05-15 | 2015-11-19 | Nataporn Charusabha | Proximity Sensor Having a Daughterboard-Mounted Light Detector |
| KR102252156B1 (ko) * | 2014-07-08 | 2021-05-17 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
| KR102323593B1 (ko) * | 2014-07-23 | 2021-11-17 | 엘지이노텍 주식회사 | 광원 모듈 및 이를 구비한 표시 모듈 |
| US10217918B2 (en) * | 2014-08-26 | 2019-02-26 | Lg Innotek Co., Ltd. | Light-emitting element package |
-
2017
- 2017-02-10 CN CN201780010898.2A patent/CN108633317B/zh active Active
- 2017-02-10 EP EP17750471.9A patent/EP3416202B1/en active Active
- 2017-02-10 US US16/077,360 patent/US10557596B2/en active Active
- 2017-02-10 JP JP2018541110A patent/JP6901490B2/ja not_active Expired - Fee Related
- 2017-02-10 WO PCT/KR2017/001498 patent/WO2017138779A1/ko not_active Ceased
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