JP2019198938A5 - - Google Patents

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Publication number
JP2019198938A5
JP2019198938A5 JP2018096000A JP2018096000A JP2019198938A5 JP 2019198938 A5 JP2019198938 A5 JP 2019198938A5 JP 2018096000 A JP2018096000 A JP 2018096000A JP 2018096000 A JP2018096000 A JP 2018096000A JP 2019198938 A5 JP2019198938 A5 JP 2019198938A5
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JP
Japan
Prior art keywords
polishing
reference height
head
polishing head
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018096000A
Other languages
English (en)
Japanese (ja)
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JP2019198938A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2018096000A priority Critical patent/JP2019198938A/ja
Priority claimed from JP2018096000A external-priority patent/JP2019198938A/ja
Priority to US16/408,960 priority patent/US20190351526A1/en
Priority to CN201910404342.2A priority patent/CN110497307A/zh
Priority to TW108116736A priority patent/TW202003157A/zh
Priority to KR1020190056958A priority patent/KR20190132245A/ko
Publication of JP2019198938A publication Critical patent/JP2019198938A/ja
Publication of JP2019198938A5 publication Critical patent/JP2019198938A5/ja
Pending legal-status Critical Current

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JP2018096000A 2018-05-18 2018-05-18 研磨ヘッドを用いて研磨パッドの研磨面を検出する方法、および研磨装置 Pending JP2019198938A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018096000A JP2019198938A (ja) 2018-05-18 2018-05-18 研磨ヘッドを用いて研磨パッドの研磨面を検出する方法、および研磨装置
US16/408,960 US20190351526A1 (en) 2018-05-18 2019-05-10 Method of detecting a polishing surface of a polishing pad using a polishing head, and polishing apparatus
CN201910404342.2A CN110497307A (zh) 2018-05-18 2019-05-15 使用研磨头对研磨垫的研磨面进行检测的方法以及研磨装置
TW108116736A TW202003157A (zh) 2018-05-18 2019-05-15 使用研磨頭檢測研磨墊的研磨面的方法，以及研磨裝置
KR1020190056958A KR20190132245A (ko) 2018-05-18 2019-05-15 연마 헤드를 이용하여 연마 패드의 연마면을 검출하는 방법, 및 연마 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018096000A JP2019198938A (ja) 2018-05-18 2018-05-18 研磨ヘッドを用いて研磨パッドの研磨面を検出する方法、および研磨装置

Publications (2)

Publication Number Publication Date
JP2019198938A JP2019198938A (ja) 2019-11-21
JP2019198938A5 true JP2019198938A5 (enExample) 2021-02-18

Family

ID=68534563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018096000A Pending JP2019198938A (ja) 2018-05-18 2018-05-18 研磨ヘッドを用いて研磨パッドの研磨面を検出する方法、および研磨装置

Country Status (5)

Country Link
US (1) US20190351526A1 (enExample)
JP (1) JP2019198938A (enExample)
KR (1) KR20190132245A (enExample)
CN (1) CN110497307A (enExample)
TW (1) TW202003157A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2021011834A (es) 2019-03-29 2022-02-22 Saint Gobain Abrasives Inc Soluciones de rectificación de rendimiento.
US12226876B2 (en) 2019-04-03 2025-02-18 Saint-Gobain Abrasives, Inc. Abrasive article, abrasive system and method for using and forming same
CN111085931A (zh) * 2019-12-31 2020-05-01 浙江芯晖装备技术有限公司 一种抛光头驱动装置及抛光设备
EP3919192B1 (en) * 2020-06-04 2023-11-29 Sugino Machine Limited Cleaning apparatus
KR102762332B1 (ko) * 2020-09-02 2025-02-03 에스케이하이닉스 주식회사 기판의 평탄화 장치 및 방법
JP7709281B2 (ja) 2021-01-14 2025-07-16 株式会社荏原製作所 研磨装置、研磨方法、および基板の膜厚分布の可視化情報を出力する方法
CN113458972A (zh) * 2021-07-28 2021-10-01 北京烁科精微电子装备有限公司 一种抛光垫修整装置及抛光设备
CN114633206A (zh) * 2022-04-25 2022-06-17 北京烁科精微电子装备有限公司 一种修整装置及晶圆抛光系统
CN114918832B (zh) * 2022-05-20 2023-07-28 湖州师范学院 一种高精密的砂轮修整设备
CN117718876B (zh) 2024-02-07 2024-06-18 华海清科股份有限公司 用于化学机械抛光的监测方法和化学机械抛光设备

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2629746B1 (fr) * 1988-04-06 1991-01-25 Bertin & Cie Procede et dispositif de polissage d'un composant optique
US6855032B1 (en) * 2003-11-24 2005-02-15 Nikon Corporation Fine force control of actuators for chemical mechanical polishing apparatuses
US7172493B2 (en) * 2003-11-24 2007-02-06 Nikon Corporation Fine force actuator assembly for chemical mechanical polishing apparatuses
US20050197045A1 (en) * 2003-11-24 2005-09-08 Novak W. T. Fine force control of actuators for chemical mechanical polishing apparatuses
US7059939B2 (en) * 2004-09-02 2006-06-13 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing pad conditioner and monitoring method therefor
WO2006049269A1 (en) * 2004-11-01 2006-05-11 Ebara Corporation Polishing apparatus
JP4597634B2 (ja) * 2004-11-01 2010-12-15 株式会社荏原製作所 トップリング、基板の研磨装置及び研磨方法
JP4817687B2 (ja) * 2005-03-18 2011-11-16 株式会社荏原製作所 研磨装置
CN2807472Y (zh) * 2005-08-02 2006-08-16 童德黉 压力旋臂结构
CN102101265B (zh) * 2010-12-16 2012-05-16 浙江工业大学 一种检测抛光工件受力及定位抛光工具工作原点的夹具
JP5454513B2 (ja) * 2011-05-27 2014-03-26 信越半導体株式会社 研磨ヘッドの高さ方向の位置の調整方法及びワークの研磨方法
JP2013111701A (ja) * 2011-11-29 2013-06-10 Hitachi Koki Co Ltd 携帯用切断機
JP5973883B2 (ja) 2012-11-15 2016-08-23 株式会社荏原製作所 基板保持装置および研磨装置
JP6012104B2 (ja) * 2012-12-18 2016-10-25 三菱日立パワーシステムズ株式会社 バニシング装置及びそれを用いたバニシング方法
JP6357260B2 (ja) * 2016-09-30 2018-07-11 株式会社荏原製作所 研磨装置、及び研磨方法

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