JP2019198938A - 研磨ヘッドを用いて研磨パッドの研磨面を検出する方法、および研磨装置 - Google Patents

研磨ヘッドを用いて研磨パッドの研磨面を検出する方法、および研磨装置 Download PDF

Info

Publication number
JP2019198938A
JP2019198938A JP2018096000A JP2018096000A JP2019198938A JP 2019198938 A JP2019198938 A JP 2019198938A JP 2018096000 A JP2018096000 A JP 2018096000A JP 2018096000 A JP2018096000 A JP 2018096000A JP 2019198938 A JP2019198938 A JP 2019198938A
Authority
JP
Japan
Prior art keywords
polishing
head
polishing head
strain sensor
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018096000A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019198938A5 (enExample
Inventor
正雄 梅本
Masao Umemoto
正雄 梅本
隆一 小菅
Ryuichi Kosuge
隆一 小菅
修一 鎌田
Shuichi Kamata
修一 鎌田
健人 吉田
Taketo Yoshida
健人 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2018096000A priority Critical patent/JP2019198938A/ja
Priority to US16/408,960 priority patent/US20190351526A1/en
Priority to CN201910404342.2A priority patent/CN110497307A/zh
Priority to TW108116736A priority patent/TW202003157A/zh
Priority to KR1020190056958A priority patent/KR20190132245A/ko
Publication of JP2019198938A publication Critical patent/JP2019198938A/ja
Publication of JP2019198938A5 publication Critical patent/JP2019198938A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G01B7/22—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/32—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring the deformation in a solid

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2018096000A 2018-05-18 2018-05-18 研磨ヘッドを用いて研磨パッドの研磨面を検出する方法、および研磨装置 Pending JP2019198938A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018096000A JP2019198938A (ja) 2018-05-18 2018-05-18 研磨ヘッドを用いて研磨パッドの研磨面を検出する方法、および研磨装置
US16/408,960 US20190351526A1 (en) 2018-05-18 2019-05-10 Method of detecting a polishing surface of a polishing pad using a polishing head, and polishing apparatus
CN201910404342.2A CN110497307A (zh) 2018-05-18 2019-05-15 使用研磨头对研磨垫的研磨面进行检测的方法以及研磨装置
TW108116736A TW202003157A (zh) 2018-05-18 2019-05-15 使用研磨頭檢測研磨墊的研磨面的方法，以及研磨裝置
KR1020190056958A KR20190132245A (ko) 2018-05-18 2019-05-15 연마 헤드를 이용하여 연마 패드의 연마면을 검출하는 방법, 및 연마 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018096000A JP2019198938A (ja) 2018-05-18 2018-05-18 研磨ヘッドを用いて研磨パッドの研磨面を検出する方法、および研磨装置

Publications (2)

Publication Number Publication Date
JP2019198938A true JP2019198938A (ja) 2019-11-21
JP2019198938A5 JP2019198938A5 (enExample) 2021-02-18

Family

ID=68534563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018096000A Pending JP2019198938A (ja) 2018-05-18 2018-05-18 研磨ヘッドを用いて研磨パッドの研磨面を検出する方法、および研磨装置

Country Status (5)

Country Link
US (1) US20190351526A1 (enExample)
JP (1) JP2019198938A (enExample)
KR (1) KR20190132245A (enExample)
CN (1) CN110497307A (enExample)
TW (1) TW202003157A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022108789A (ja) * 2021-01-14 2022-07-27 株式会社荏原製作所 研磨装置、研磨方法、および基板の膜厚分布の可視化情報を出力する方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR112021019580A2 (pt) 2019-03-29 2021-12-14 Saint Gobain Abrasifs Sa Desempenho de soluções de retificação
CA3135979C (en) 2019-04-03 2023-12-19 Saint-Gobain Abrasives, Inc. Abrasive article, abrasive system and method for using and forming same
CN111085931A (zh) * 2019-12-31 2020-05-01 浙江芯晖装备技术有限公司 一种抛光头驱动装置及抛光设备
EP3919192B1 (en) * 2020-06-04 2023-11-29 Sugino Machine Limited Cleaning apparatus
KR102762332B1 (ko) * 2020-09-02 2025-02-03 에스케이하이닉스 주식회사 기판의 평탄화 장치 및 방법
CN113458972A (zh) * 2021-07-28 2021-10-01 北京烁科精微电子装备有限公司 一种抛光垫修整装置及抛光设备
CN114633206A (zh) * 2022-04-25 2022-06-17 北京烁科精微电子装备有限公司 一种修整装置及晶圆抛光系统
CN114918832B (zh) * 2022-05-20 2023-07-28 湖州师范学院 一种高精密的砂轮修整设备
CN117718876B (zh) 2024-02-07 2024-06-18 华海清科股份有限公司 用于化学机械抛光的监测方法和化学机械抛光设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006128582A (ja) * 2004-11-01 2006-05-18 Ebara Corp 研磨装置
JP2013111701A (ja) * 2011-11-29 2013-06-10 Hitachi Koki Co Ltd 携帯用切断機
JP2014117784A (ja) * 2012-12-18 2014-06-30 Hitachi Ltd バニシング装置及びそれを用いたバニシング方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2629746B1 (fr) * 1988-04-06 1991-01-25 Bertin & Cie Procede et dispositif de polissage d'un composant optique
US20050197045A1 (en) * 2003-11-24 2005-09-08 Novak W. T. Fine force control of actuators for chemical mechanical polishing apparatuses
US7172493B2 (en) * 2003-11-24 2007-02-06 Nikon Corporation Fine force actuator assembly for chemical mechanical polishing apparatuses
US6855032B1 (en) * 2003-11-24 2005-02-15 Nikon Corporation Fine force control of actuators for chemical mechanical polishing apparatuses
US7059939B2 (en) * 2004-09-02 2006-06-13 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing pad conditioner and monitoring method therefor
EP2838110B1 (en) * 2004-11-01 2016-04-27 Ebara Corporation Polishing apparatus
JP4817687B2 (ja) * 2005-03-18 2011-11-16 株式会社荏原製作所 研磨装置
CN2807472Y (zh) * 2005-08-02 2006-08-16 童德黉 压力旋臂结构
CN102101265B (zh) * 2010-12-16 2012-05-16 浙江工业大学 一种检测抛光工件受力及定位抛光工具工作原点的夹具
JP5454513B2 (ja) * 2011-05-27 2014-03-26 信越半導体株式会社 研磨ヘッドの高さ方向の位置の調整方法及びワークの研磨方法
JP5973883B2 (ja) 2012-11-15 2016-08-23 株式会社荏原製作所 基板保持装置および研磨装置
JP6357260B2 (ja) * 2016-09-30 2018-07-11 株式会社荏原製作所 研磨装置、及び研磨方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006128582A (ja) * 2004-11-01 2006-05-18 Ebara Corp 研磨装置
JP2013111701A (ja) * 2011-11-29 2013-06-10 Hitachi Koki Co Ltd 携帯用切断機
JP2014117784A (ja) * 2012-12-18 2014-06-30 Hitachi Ltd バニシング装置及びそれを用いたバニシング方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022108789A (ja) * 2021-01-14 2022-07-27 株式会社荏原製作所 研磨装置、研磨方法、および基板の膜厚分布の可視化情報を出力する方法
US12083646B2 (en) 2021-01-14 2024-09-10 Ebara Corporation Polishing apparatus, polishing method and method for outputting visualization information of film thickness distribution on substrate
JP7709281B2 (ja) 2021-01-14 2025-07-16 株式会社荏原製作所 研磨装置、研磨方法、および基板の膜厚分布の可視化情報を出力する方法

Also Published As

Publication number Publication date
TW202003157A (zh) 2020-01-16
KR20190132245A (ko) 2019-11-27
CN110497307A (zh) 2019-11-26
US20190351526A1 (en) 2019-11-21

Similar Documents

Publication Publication Date Title
JP2019198938A (ja) 研磨ヘッドを用いて研磨パッドの研磨面を検出する方法、および研磨装置
JP6196858B2 (ja) 研磨方法および研磨装置
US10987776B2 (en) Calibration method and non-transitory computer-readable storage medium storing a program of calibration
KR101512427B1 (ko) 드레싱장치, 드레싱방법, 및 폴리싱장치
JP5161294B2 (ja) 化学機械研磨装置および化学機械研磨方法
US11679472B2 (en) Method for CMP pad conditioning
TW411299B (en) Wafer polishing apparatus and polishing quantity detection method
CN111230733A (zh) 包括抛光垫监测方法的制造方法以及抛光设备
TW202231404A (zh) 拋光頭扣環傾斜力矩控制
US20200368874A1 (en) Polishing apparatus and polishing method
JP7696473B2 (ja) 研磨パッドの厚み測定装置
JP7155035B2 (ja) 研磨装置および研磨方法
JP6961343B2 (ja) 研磨装置
TW201741071A (zh) 研磨裝置
JP7590913B2 (ja) 研磨方法
JP7689937B2 (ja) 研磨パッド寿命推定方法および研磨装置
WO2024095997A1 (ja) 研磨装置、情報処理装置及びプログラム
JP2005081461A (ja) ウェハ等の研磨方法およびその装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180621

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210105

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210105

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20211210

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220118

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20220712